CN109056015A - The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method - Google Patents
The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method Download PDFInfo
- Publication number
- CN109056015A CN109056015A CN201811220924.7A CN201811220924A CN109056015A CN 109056015 A CN109056015 A CN 109056015A CN 201811220924 A CN201811220924 A CN 201811220924A CN 109056015 A CN109056015 A CN 109056015A
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- Prior art keywords
- circuit board
- plating
- printed circuit
- blind
- smart home
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Abstract
The present invention discloses the mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method, device includes two pieces of fixed plates disposed in parallel, the relative inner face of two fixed plates is separately installed with multiple groups spray nozzle device along circuit board direction of travel, there are circuit boards to walk sheet separation between the spray nozzle device of two fixed plates, the spray nozzle device of fixed plate is laid with area and is greater than board area, every group of spray nozzle device includes drug liquid tube and multiple nozzles, drug liquid tube is installed in fixed plate and is arranged perpendicular to circuit board direction of travel, drug liquid tube corresponding nozzle is equipped with multiple connectors, one end of nozzle is towards circuit board surface, the other end of nozzle is connected to drug liquid tube.Blind hole plate of the present invention uses the way of electric plating of whole board using pattern plating substitution tradition HDI, and using the technique of Organic Conductive Films substitution tradition PTH, the cost for reducing electro-coppering reduces by 50%, improves order structure and company competitiveness is substantially improved in order ability.
Description
Technical field
The present invention relates to the mechanical blind brill pattern plating sprays in printed circuit board field more particularly to smart home printed circuit board
Flow devices and methods therefor.
Background technique
Traditional printed circuit board producer does not have laser drilling machine, can not produce the product of the radium-shine processing of HDI.Purchase one
The expense of laser drilling machine and the expense of maintenance are 7-8 times of traditional machine drill, and expense is too high.Traditional blind hole plate is all made of PTH
Adding the process of positive, plating uses electric plating of whole board, and the place for needing to make route spacing after plating etches to adjust again to be wasted very much,
And increase processing cost.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide the mechanical blind brill patterns of smart home printed circuit board
Jet apparatus and its method is electroplated.
The technical solution adopted by the present invention is that:
The mechanical blind brill pattern electroplanting device of printed circuit board comprising two pieces of fixed plates disposed in parallel, two fixed plates
Relative inner face be separately installed with multiple groups spray nozzle device along circuit board direction of travel, between the spray nozzle device of two fixed plates
There are circuit boards to walk sheet separation, and the spray nozzle device of fixed plate is laid with area and is greater than board area, and every group of spray nozzle device includes medicine
Liquid pipe and multiple nozzles, drug liquid tube are installed in fixed plate and are arranged perpendicular to circuit board direction of travel, drug liquid tube corresponding nozzle
Equipped with multiple connectors, towards circuit board surface, the other end of nozzle is connected to drug liquid tube for one end of nozzle.
Further, drug liquid tube is connect with a solution feed pump.
Further the axis of the blind hole of the exit direction and circuit board of nozzle is at an acute angle.
The mechanical blind jet flow electro-plating method for boring pattern plating jet apparatus of smart home printed circuit board, using described
Mechanical blind the brills pattern plating jet apparatus of smart home printed circuit board, electro-plating method the following steps are included:
Step 1, L1-L2 layers or L4-L3 layers are drilled through to form blind hole by the way of machine drilling, mechanical blind brill walks tradition
Zong Heng Bi≤2 is electroplated in pattern plating, electroplating hole Jing≤7.8mil, mechanical blind brill；
Specifically, electroplating hole Jing≤7.8mil why is required, as long as the hole traditional HDI plate radium-shine aperture 4mil is too small, is walked
Pattern plating breaks problem because Kong Tai little causes the circulation difference of electroplating liquid medicine to be easy hole when electro-coppering and electrotinning, even if being
Ensure in plate quality for jet flow or wave that increasing has or there are this risks, while being easy to cause dry film to float off after increasing jet flow,
The problems such as route sawtooth.
Step 2, using L1-L2 layers or L4-L3 layers of plating mode connection, plating uses organic conductive membrane process；So that hole
Wall conducting, and Organic Conductive Films and acid etc. do not react can not carry out electric plating of whole board, and to figure after outer layer
Electricity carries out pattern plating can be to avoid the waste of electro-coppering and the cost of wastewater treatment.
Step 2 specifically includes the following steps:
Step 2.1, slotted nozzle successively carries out whole hole to blind hole, the technological parameter in whole hole: linear speed 2m/min, flow are
The value of 40-60L/min, PH be 10-11, temperature be 55 ± 2 DEG C, when slot value be 5.5wkft2,
Step 2.2, the blind hole behind whole hole is washed, the technological parameter of washing: linear speed 2m/min, flow 40-
60L/min, spillway discharge 3-7L/min,
Step 2.3, oxidation trough processing is carried out to the blind hole after washing, the technological parameter of oxidation trough: linear speed 2m/min, pump
Pu total flow is 30-42m3/H, and the value of PH is 5-7, and temperature is 85 ± 2 DEG C, when the value of slot is 12.1wft2,
Step 2.4, oxidation trough is washed, the technological parameter of washing: linear speed 2m/min, flow 40-60L/
Min, spillway discharge 3-6L/min,
Step 2.5, catalysis slot processing is carried out, the technological parameter of slot: linear speed 2m/min, flow 40-60L/ are catalyzed
The value of min, PH be 1.7-2.2, temperature be 18 ± 3 DEG C, when slot value be 7.5wft2,
Step 2.6, catalysis slot is washed, the technological parameter of washing: linear speed 2m/min, flow 40-60L/
Min, spillway discharge 3-7L/min,
Specifically, production conventional via plank uses immersion type or punched holes type device, and mechanical blind brill plate is obstructed, medicine
Water coke slurry ability is weak, because doing the product of mechanical blind brill, using being unable to fully exchange in traditional rocking equipment hole and be electroplated
Upper copper, mechanical blind brill plate must add with slotted nozzle operation.
Step 3, lead to and carry out a copper facing, copper plating groove pressure is 2.2-2.5kg/cm2；
Step 4, the microetch trench etch of figure electricity pre-treatment is carried out, microetch trench etch SPS concentration is 65-95g/l；
Step 5, secondary copper facing and tin plating is carried out, copper facing and pot pressure are 2.2-2.5kg/cm2；
Step 6, the copper bottom of circuit board is etched；
Step 7, every batch of takes out 5 conductions for measuring mechanical blind hole after etching, confirms normal rear shipment.
Further, mechanical blind brill hole diameter 9.8MIL, drilling depth control 8.4MIL in step 1；Mechanical blind brill plating
Aspect ratio controls in 1.5.
Further, the Organic Conductive Films liquid medicine of productions is held etc. in step 2 using Le Si or day.
Further, keep the axis of the exit direction of nozzle and the blind hole of circuit board at an acute angle in step 2.
As a kind of specific embodiment, settable plating aspect ratio=indulge for blind drilling depth 8.4mil/ it is horizontal be drilling hole
Diameter 9.8mil=0.86.
The invention adopts the above technical scheme, and 1. blind hole plates are using pattern plating substitution tradition HDI using electric plating of whole board
Way.2. using the technique of Organic Conductive Films substitution tradition PTH.The present invention is because using organic conductive membrane process, before walking outer layer
When reason, Organic Conductive Films are had good effect in acid, and will not be reacted with acid, and tradition PTH chemical copper meet acid will hole it is broken.Select negative film stream
The egative film of journey and contraposition tooling system are exposed copper face and are processed as conductor, after plank walks Organic Conductive Films after plank development
It is directly entered outer layer dust free room, the temperature of dust free room controls 20-24 degree, humid control 50%-60%, it can be ensured that plate face product
Matter, avoiding doing electric plating of whole board because of tradition leads to that plate face caused size under acidic environment, hot environment occurs, and plate face oxidation is asked
Topic.
The present invention is more environmentally friendly using Organic Conductive Films, and the cost for reducing electro-coppering reduces by 50%, improves order structure and connects
Company competitiveness is substantially improved in single ability.
Detailed description of the invention
The present invention is described in further details below in conjunction with the drawings and specific embodiments；
Fig. 1 be the mechanical blind structural schematic diagram for boring pattern plating jet apparatus of smart home printed circuit board of the present invention it
One；
Fig. 2 be the mechanical blind structural schematic diagram for boring pattern plating jet apparatus of smart home printed circuit board of the present invention it
Two；
Fig. 3 is that the mechanical blind nozzle exit direction for boring pattern plating jet apparatus of smart home printed circuit board of the present invention is shown
It is intended to；
Fig. 4 be printed circuit board of the present invention with blind hole when structural schematic diagram.
Specific embodiment
Shown in one of picture 1-4, the invention discloses the mechanical blind brill pattern electroplanting devices of printed circuit board comprising two pieces
The relative inner face of fixed plate 2 disposed in parallel, two fixed plates 2 is separately installed with multiple groups spray along 1 direction of travel of circuit board
Mouth device 3, there are circuit boards 1 to walk sheet separation between the spray nozzle device 3 of two fixed plates 2, and the spray nozzle device 3 of fixed plate 2 is laid with
Area is greater than 1 area of circuit board, and every group of spray nozzle device 3 includes drug liquid tube 4 and multiple nozzles 31, and drug liquid tube 4 is installed on fixed plate 2
Above and perpendicular to 1 direction of travel of circuit board it is arranged, 4 corresponding nozzle 31 of drug liquid tube is equipped with multiple connectors, one end court of nozzle 31
To 1 surface of circuit board, the other end of nozzle 31 is connected to drug liquid tube 4.
Specifically, the layered structure of the circuit board 1 in the present embodiment is the bottom ban of CU using the CU of 47mil as core bottom plate
Two sides are successively arranged the copper foil layer of the PP layer and 0.5OZ of 1080 3mil from the inside to the outside respectively.
Further, drug liquid tube 4 is connect with a solution feed pump.
Further, the exit direction of nozzle 31 and the axis of the blind hole 11 of circuit board 1 are at an acute angle.
The mechanical blind jet flow electro-plating method for boring pattern plating jet apparatus of printed circuit board 1, using the printing electricity
Mechanical blind the brills pattern plating jet apparatus of road plate 1, electro-plating method the following steps are included:
Step 1, L1-L2 layers or L4-L3 layers are drilled through to form blind hole 11 by the way of machine drilling, mechanical blind bore is walked to pass
Pattern of uniting is electroplated, electroplating hole Jing≤7.8mil, and Zong Heng Bi≤2 is electroplated in mechanical blind brill；
Specifically, electroplating hole Jing≤7.8mil why is required, as long as the hole traditional HDI plate radium-shine aperture 4mil is too small, is walked
Pattern plating breaks problem because Kong Tai little causes the circulation difference of electroplating liquid medicine to be easy hole when electro-coppering and electrotinning, even if being
Ensure in plate quality for jet flow or wave that increasing has or there are this risks, while being easy to cause dry film to float off after increasing jet flow,
The problems such as route sawtooth.As a kind of specific embodiment, settable plating aspect ratio=indulge is for blind drilling depth 8.4mil/ is horizontal
Boring aperture 9.8mil=0.86.
Step 2, using L1-L2 layers or L4-L3 layers of plating mode connection, plating uses organic conductive membrane process；So that hole
Wall conducting, and Organic Conductive Films and acid etc. do not react can not carry out electric plating of whole board, and to figure after outer layer
Electricity carries out pattern plating can be to avoid the waste of electro-coppering and the cost of wastewater treatment.
Step 2 specifically includes the following steps:
Step 2.1, slotted nozzle 31 successively carries out whole hole to blind hole 11, the technological parameter in whole hole: linear speed 2m/min, stream
Amount is 40-60L/min, and the value of PH is 10-11, and temperature is 55 ± 2 DEG C, when the value of slot is 5.5wkft2,
Step 2.2, wash to the blind hole 11 behind whole hole, the technological parameter of washing: linear speed 2m/min, flow are
40-60L/min, spillway discharge 3-7L/min,
Step 2.3, oxidation slot position processing is entered to the blind hole 11 after washing, aoxidizes the technological parameter of slot position: linear speed 2m/
Min, pumping total flow are 30-42m3/H, and the value of PH is 5-7, and temperature is 85 ± 2 DEG C, when the value of slot is 12.1wft2,
Step 2.4, wash to the blind hole 11 after oxidation, the technological parameter of washing: linear speed 2m/min, flow are
40-60L/min, spillway discharge 3-6L/min,
Step 2.5, catalytic treatment is carried out into catalysis slot position, is catalyzed the technological parameter of slot position: linear speed 2m/min, flow
For 40-60L/min, the value of PH is 1.7-2.2, and temperature is 18 ± 3 DEG C, when the value of slot is 7.5wft2,
Step 2.6, the washing after being catalyzed, the technological parameter of washing: linear speed 2m/min, flow 40-60L/
Min, spillway discharge 3-7L/min,
Table 1: process parameter's table of Organic Conductive Films
Specifically, production conventional via plank uses immersion type or punched holes type device, and mechanical blind brill plate is obstructed, medicine
Water coke slurry ability is weak, because doing the product of mechanical blind brill, using being unable to fully exchange and electricity in traditional 11 hole of rocking equipment blind hole
Plated with copper, mechanical blind brill plate must add with 31 operation of slotted nozzle.
Step 3, lead to and carry out a copper facing, copper plating groove pressure is 2.2-2.5kg/cm2；
Step 4, the microetch trench etch of figure electricity pre-treatment is carried out, microetch trench etch SPS concentration is 65-95g/l, and equipment works as machine
When plank need mark carry out mark, and be sliced confirm OK after just can shipment；
Step 5, secondary copper facing and tin plating is carried out, copper facing and pot pressure are 2.2-2.5kg/cm2；
Step 6, the copper bottom of circuit board 1 is etched；Plank etch copper is bottom CU, is not necessarily to electro-coppering, and etching speed is
Traditional one times or more, production efficiency greatly improves.
Step 7, every batch of takes out 5 conductions for measuring mechanical blind hole 11 after etching, confirms normal rear shipment.
Further, mechanical blind brill hole diameter 9.8MIL, drilling depth control 8.4MIL in step 1；Mechanical blind brill plating
Aspect ratio controls in 1.5.
Further, the Organic Conductive Films liquid medicine of productions is held etc. in step 2 using Le Si or day.
Further, keep the axis of the exit direction and the blind hole 11 of circuit board 1 of nozzle 31 at an acute angle in step 2.
The present invention is because using organic conductive membrane process, and when walking outer layer pre-treatment, Organic Conductive Films are had good effect in acid, and will not send out with acid
Raw reaction, and tradition PTH chemical copper meet acid will hole break.Select egative film and contraposition tooling system, the plank of negative film process aobvious
Movie queen exposes copper face and processes as conductor, and plank is directly entered outer layer dust free room, the temperature of dust free room after walking Organic Conductive Films
Control 20-24 degree, humid control 50%-60%, it can be ensured that plate face quality, avoiding doing electric plating of whole board because of tradition leads to generating plate
Face caused size under acidic environment, hot environment, plate face problem of oxidation.
The present invention is more environmentally friendly using Organic Conductive Films, and the cost for reducing electro-coppering reduces by 50%, improves order structure and connects
Company competitiveness is substantially improved in single ability.
Claims (7)
1. jet apparatus is electroplated in the mechanical blind brill pattern of smart home printed circuit board, it is characterised in that: it includes two pieces and sets in parallel
The fixed plate set, the relative inner faces of two fixed plates are separately installed with multiple groups spray nozzle device along circuit board direction of travel, and two
There are circuit boards to walk sheet separation between the spray nozzle device of a fixed plate, and the spray nozzle device of fixed plate is laid with area and is greater than circuit plate face
Product, every group of spray nozzle device includes drug liquid tube and multiple nozzles, and drug liquid tube is installed in fixed plate and perpendicular to circuit board traveling side
To setting, drug liquid tube corresponding nozzle is equipped with multiple connectors, and towards circuit board surface, the other end of nozzle is connected to for one end of nozzle
Drug liquid tube.
2. jet apparatus is electroplated in the mechanical blind brill pattern of smart home printed circuit board according to claim 1, feature exists
In: drug liquid tube is connect with a solution feed pump.
3. jet apparatus is electroplated in the mechanical blind brill pattern of smart home printed circuit board according to claim 1, feature exists
In: the axis of the blind hole of the exit direction and circuit board of nozzle is at an acute angle.
4. the mechanical blind jet flow electro-plating method for boring pattern plating jet apparatus of smart home printed circuit board, uses claim
Mechanical blind the brills pattern plating jet apparatus of smart home printed circuit board described in one of 1-3, electro-plating method the following steps are included:
Step 1, L1-L2 layers or L4-L3 layers are drilled through to form blind hole by the way of machine drilling, mechanical blind brill walks traditional figure
Zong Heng Bi≤2 is electroplated in type plating, electroplating hole Jing≤7.8mil, mechanical blind brill；
Step 2, using L1-L2 layers or L4-L3 layers of plating mode connection, plating uses organic conductive membrane process；
Step 2 specifically includes the following steps:
Step 2.1, slotted nozzle successively carries out whole hole to blind hole, the technological parameter in whole hole: linear speed is 2 m/min, flow 40-
The value of 60L/min, PH be 10-11, temperature be 55 ± 2 DEG C, when slot value be 5.5wkft2,
Step 2.2, wash to the blind hole behind whole hole, the technological parameter of washing: linear speed is 2 m/min, flow 40-60L/
Min, spillway discharge 3-7L/min,
Step 2.3, carry out oxidation trough processing to the blind hole after washing, the technological parameter of oxidation trough: linear speed is 2 m/min, pumping
Total flow is 30-42m3/H, and the value of PH is 5-7, and temperature is 85 ± 2 DEG C, when the value of slot is 12.1wft2,
Step 2.4, wash to oxidation trough, the technological parameter of washing: linear speed is 2 m/min, flow 40-60L/min, is overflow
Flow is 3-6L/min,
Step 2.5, catalysis slot processing is carried out, be catalyzed the technological parameter of slot: linear speed is 2 m/min, flow 40-60L/min, PH
Value be 1.7-2.2, temperature be 18 ± 3 DEG C, when slot value be 7.5wft2,
Step 2.6, wash to catalysis slot, the technological parameter of washing: linear speed is 2 m/min, flow 40-60L/min, is overflow
Flow is 3-7L/min,
Step 3, lead to and carry out a copper facing, copper plating groove pressure is 2.2-2.5 kg/cm2；
Step 4, the microetch trench etch of figure electricity pre-treatment is carried out, microetch trench etch SPS concentration is 65-95 g/l；
Step 5, secondary copper facing and tin plating is carried out, copper facing and pot pressure are 2.2-2.5 kg/cm2；
Step 6, the copper bottom of circuit board is etched；
Step 7, every batch of takes out 5 conductions for measuring mechanical blind hole after etching, confirms normal rear shipment.
5. the mechanical blind jet flow plating for boring pattern plating jet apparatus of smart home printed circuit board according to claim 4
Method, it is characterised in that: mechanical blind brill hole diameter 9.8MIL, drilling depth control 8.4MIL in step 1；Mechanical blind brill plating is vertical
Horizontal ratio control is in 1.5.
6. the mechanical blind jet flow plating for boring pattern plating jet apparatus of smart home printed circuit board according to claim 4
Method, it is characterised in that: hold etc. the Organic Conductive Films liquid medicine of productions in step 2 using Le Si or day.
7. the mechanical blind brill pattern plating jet apparatus of smart home printed circuit board according to claim 4 and its method,
It is characterized by: keeping the axis of the exit direction of nozzle and the blind hole of circuit board at an acute angle in step 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811220924.7A CN109056015A (en) | 2018-10-19 | 2018-10-19 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811220924.7A CN109056015A (en) | 2018-10-19 | 2018-10-19 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
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| CN201811220924.7A Pending CN109056015A (en) | 2018-10-19 | 2018-10-19 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640530A (en) * | 2018-12-29 | 2019-04-16 | 江苏贺鸿电子有限公司 | A kind of production method and its deep device of control of smart home printed wiring board |
| CN110257805A (en) * | 2019-06-27 | 2019-09-20 | 惠州竞铭机械有限公司 | A kind of liquid medicine reaction unit and PTH production line |
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Application publication date: 20181221 |