CN108401366A - A kind of production method of high-density printed circuit board and its disk mesoporous - Google Patents
A kind of production method of high-density printed circuit board and its disk mesoporous Download PDFInfo
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- CN108401366A CN108401366A CN201810456525.4A CN201810456525A CN108401366A CN 108401366 A CN108401366 A CN 108401366A CN 201810456525 A CN201810456525 A CN 201810456525A CN 108401366 A CN108401366 A CN 108401366A
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- Prior art keywords
- circuit board
- printed circuit
- disk
- mesoporous
- disk mesoporous
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910052802 copper Inorganic materials 0.000 claims abstract description 71
- 239000010949 copper Substances 0.000 claims abstract description 71
- 238000007747 plating Methods 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 30
- 238000012545 processing Methods 0.000 claims abstract description 29
- 230000008569 process Effects 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000005553 drilling Methods 0.000 claims abstract description 14
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000000227 grinding Methods 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 230000008719 thickening Effects 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000004745 nonwoven fabric Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 28
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The production method of a kind of high-density printed circuit board and its disk mesoporous, the mesoporous production method include the following steps：S1：Make drilling processing on a printed circuit board, drills out disk mesoporous and non-disk mesoporous on a printed circuit board；S2：Copper plating treatment is carried out to the printed circuit board in S1, last layer metal copper layer is deposited on the inner wall of disk mesoporous and non-disk mesoporous；S3：Plating Copper treatment is carried out to the printed circuit board in S2, the metal copper layer of one layer of thickening of electroplating deposition on the hole wall of the plate face of printed circuit board, disk mesoporous and non-disk mesoporous；S4：Consent processing is done to the printed circuit board in S3, metal conductive paste is set in disk mesoporous；S5：Curing process is done to the printed circuit board in S4, after printed circuit board is toasted, metallic conduction block is obtained in disk mesoporous, grinding process finally is done to printed circuit board again.The present invention saves the consumption of material, reduces production cost by reducing the processes such as heavy copper, plating in disk mesoporous.
Description
Technical field
The present invention relates to printed circuit board manufacture fields, in particular to a kind of high-density printed circuit board and its disk
The production method of mesoporous.
Background technology
BGA, that is, ball grid array encapsulation technology comes out in the 1990s, the packing forms both have very high encapsulation
Density, and have many advantages, such as excellent electrical property, low noise, low parasitic inductance capacitance, while being set with existing SMT surface-assembleds
It is standby completely compatible, thus become one of the mainstream technology that future electronic encapsulates together with wafer-level package.The height of printed board assembly
Densification, high reliability and unleaded development keep it further harsh to requirements such as the package dimension performances of application element thereof.With
The further development of high-density interconnection technology, the encapsulation spacing of BGA develops to 0.5mm even to 0.3mm, constantly by 1.0mm
The encapsulation spacing of diminution brings higher challenge to the design and making of PCB.
Pad in PCB is not only the function of a solder joint, it is often more important that realize the connection of printed board electric property
Function, substantially three kinds of BGA connection types：1. lead type, this connection type is to connect pad with the conducting wire of same line layer, such as
Attached drawing 1A.This connection type is most commonly seen, but can only connect the circuit that same layer is in pad, usually connects with others
The mode of connecing is used together.2. dog bone type, this connection type is to connect pad with neighbouring pad, is drilled on the pad of connection
All other routes layer is connected, such as attached drawing 1B.This connection type avoids drilling on pad and causes bond pad surface out-of-flatness, and can
To achieve the purpose that other layers are connected.But this method needs to design two pads, pad density is reduced in this way, with core
The raising of piece integration degree, this connection type cannot increasingly meet the development of Packaging Industry.3. disk central hole type, this connection
Mode is that directly levels are connected in drilling on pad, is filled in hole with resin, then in resin table during following process
Face plates last layer metallic copper and forms pad, such as Fig. 1 C.Refer to the attached drawing 2A~2G, general disk mesoporous production process are as follows：
It bores disk mesoporous → heavy copper → plating → filling holes with resin → nog plate → and subtracts copper → bis- drill → heavy copper → plating.This processing method needs
To need to do after filling holes with resin it is primary subtract copper, it is not no it will cause the blocked up etching difficulty of layers of copper is too big, while drilling, sinking copper, electricity
Plating process has carried out the increase for the complicated and cost for causing process so twice.
Making for disk mesoporous is proposed disk mesoporous and non-disk mesoporous one in Chinese invention patent CN104349589B
It is secondary to drill out, pad pasting, exposure, development are carried out after heavy copper, only exposes disk mesoporous, and the filling holes with resin after of plating puts plating again after moving back film
Non-disk mesoporous.In this way this approach reduces primary drilling and heavy copper process, it need not also subtract copper after filling holes with resin.But increase
Pad pasting, exposure, developing procedure, there is no optimised the processing flow of disk mesoporous.Meanwhile plated hole is easy when electroplated discs mesoporous
Protrusion is formed in aperture, burr is formed after polishing, influence filling holes with resin quality and then the soldering reliability of chip can be influenced.
Invention content
The purpose of the present invention is to provide the production methods of a kind of high-density printed circuit board and its disk mesoporous, can solve
The defect of the disk mesoporous production method certainly referred in background technology so that the disk mesoporous production method process letter in the technical program
List, flow are less, and the flow for solving traditional disk mesoporous manufacture craft well is complicated, the low problem of production efficiency, simultaneously
Reduce once heavy copper, electroplating work procedure, saves the consumption of material, reduce production cost.
What the embodiment of the present invention was realized in：
The production method of a kind of high-density printed circuit board and its disk mesoporous, the mesoporous production method include the following steps：
S1：Make drilling processing on a printed circuit board, drills out disk mesoporous and non-disk mesoporous on a printed circuit board；
S2：Copper plating treatment is carried out to the printed circuit board in S1, upper one is deposited on the inner wall of disk mesoporous and non-disk mesoporous
Layer metal copper layer；
S3：Plating Copper treatment is carried out to the printed circuit board in S2, in the plate face of printed circuit board, disk mesoporous and non-disk
The metal copper layer of one layer of thickening of electroplating deposition on the hole wall in hole；
S4：Consent processing is done to the printed circuit board in S3, metal conductive paste is set in disk mesoporous；
S5：Curing process is done to the printed circuit board in S4, obtaining metal after printed circuit board is toasted, in disk mesoporous leads
Electric block, finally does grinding process to printed circuit board again.
In preferred embodiments of the present invention, above-mentioned consent processing includes the following steps：
S41：On the basis of S3, metal conductive paste will be filled in the disk mesoporous on printed circuit board；
S42：On the basis of S41, aluminium flake web plate is arranged in side on a printed circuit board, and it is logical that first is provided on aluminium flake web plate
Hole, first through hole are corresponded with disk pore location；Aeroscopic plate is set in the lower section of printed circuit board, the is provided on aeroscopic plate
Two through-holes, the second through-hole are corresponded with disk pore location.
In preferred embodiments of the present invention, above-mentioned metal conductive paste is any one in conductive copper paste and conductive silver paste
Kind.
In preferred embodiments of the present invention, the big 0.1mm in aperture of the aperture ratio disk mesoporous of above-mentioned first through hole, second is logical
The aperture in hole is 3mm.
In preferred embodiments of the present invention, the pore diameter range of the disk mesoporous in above-mentioned drilling processing is 0.15mm-
The pore diameter range of 0.5mm, non-disk mesoporous are 0.15mm-6.5mm.
In preferred embodiments of the present invention, copper plating treatment in above-mentioned S2 is electroless copper, electro-coppering or organic leads
Any one copper facing mode in electrolemma copper facing.
In preferred embodiments of the present invention, the plating Copper treatment in above-mentioned S3 includes sight rail electric wire plating or vertical
Any one plating mode in continuous electroplating line.
In preferred embodiments of the present invention, curing process its processing mode in above-mentioned S5 is：By printed circuit board into
Row baking, baking temperature are 150 DEG C, baking time 60min-70min.
In preferred embodiments of the present invention, the grinding process in above-mentioned S5 is：It is first polished using ceramic polish-brush, is then made
With non-woven fabrics polish-brush nog plate.
In preferred embodiments of the present invention, above-specified high density printed circuit board is according to the disk mesoporous production method system
.
The advantageous effect of the embodiment of the present invention is：Use 2 heavy copper and plating mode to printing electricity compared with the existing technology
Road plate is processed, and obtained printed circuit plate surface layers of copper is thicker, and only needs to carry out once drilling, chemical plating in the present invention
Copper and plating, and without subtract copper process while Optimizing Flow, reduce the waste of metallic copper, save material
Consumption, greatly reduces production cost.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Figure 1A -1C are three kinds of BGA connected mode schematic diagrams in background technology；
Fig. 2A -2G are the processing flow schematic diagram of prior art mid-game mesoporous；
Fig. 3 A-3D are the disk mesoporous processing flow schematic diagram in the embodiment of the present invention；
Fig. 4 is the disk mesoporous jack device in the embodiment of the present invention.
Icon：Fig. 2A -2G：101- dielectric layers；102- copper foils；103- disk mesoporous；104- layers of copper；105- plug socket resins；
106- disk mesoporous；107- layers of copper 107；
Fig. 3 A-3D and Fig. 4：201- dielectric layers；202- copper foils；203- disk mesoporous；204- non-disk mesoporous；205- metallic coppers
Layer；206- metal conductive pastes；304- aluminium flake web plates；303- aeroscopic plates；301- first through hole；The second through-holes of 302-.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
The every other embodiment that technical staff is obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
In the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, or be somebody's turn to do
Invention product using when the orientation or positional relationship usually put, be merely for convenience of description of the present invention and simplification of the description, without
It is instruction or implies that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore not
It can be interpreted as limitation of the present invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and cannot manage
Solution is instruction or implies relative importance.
In addition, the terms such as term "horizontal", "vertical", " pendency " are not offered as requiring component abswolute level or pendency, and
It is that can be slightly tilted.It is not to indicate the structure if "horizontal" refers to only that its direction is more horizontal with respect to for "vertical"
It has to fully horizontally, but can be slightly tilted.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, can also be electrical connection；It can be directly connected, it can also be indirect by intermediary
It is connected, can is the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
First embodiment
The processing flow schematic diagram that Fig. 2A -2G are prior art mid-game mesoporous is referred to, it is the prior art to refer to Fig. 2A
In printed circuit board, use double face copper as processing raw material, the centre of printed circuit board be copper-clad plate Jie
Matter layer 101, on copper-clad plate top and bottom is the copper foil 102 of copper-clad plate；Fig. 2 B are referred to, are drilled out in disk on a printed circuit board
Hole 103；Fig. 2 C are referred to, heavy copper electroplating processes are done on the inner wall of disk mesoporous 103 and the surface layer of printed circuit board, make disk mesoporous
All has layers of copper 104 on the surface layer of 103 inner walls and printed circuit board；Fig. 2 D are referred to, plug socket resin is utilized in disk mesoporous 103
105 do filling holes with resin processing；Fig. 2 E are referred to, doing nog plate to printed circuit board subtracts Copper treatment；Fig. 2 F are referred to, to printed circuit
Plate does secondary drilling processing, obtains non-disk mesoporous 106；Fig. 2 G are referred to, secondary heavy copper and electroplating processes are done to printed circuit board,
Obtain the layers of copper 107 after second of heavy copper and plating, it can be seen that the prior art needs to repeat to drill to printed circuit board
The processing such as plating, it is complicated to the processing operation of disk mesoporous 103.
The disk mesoporous processing flow schematic diagram in Fig. 3 A-3D is referred to, the present embodiment provides a kind of high-density printed circuits
The production method of plate and its disk mesoporous, the disk mesoporous production method include the following steps：
S1：Fig. 3 B are referred to, make drilling processing on a printed circuit board, drill out 203 He of disk mesoporous on a printed circuit board
Non-disk mesoporous 204；The printed circuit board used in the present embodiment refers to Fig. 3 A, and it is to cover copper to make the raw material used
Board laminate, 201 both sides of dielectric layer have been laminated copper foil 202.It illustrates, if processing is multi-layer board, medium
There may also be internal layer circuits in layer 201.But this has no effect on the bright process of this law, and in this embodiment, selection
Double face copper is as processing raw material.
S2：Fig. 3 C are referred to, copper plating treatment are carried out to the printed circuit board in S1, in disk mesoporous 203 and non-disk mesoporous 204
Inner wall on deposition last layer metal copper layer 205；It illustrates, the chemical-copper-plating process during being somebody's turn to do can use other
Directly electroplating technology, chemical plating is used to the selection of the copper plating treatment of 204 inner wall of disk mesoporous 203 and non-disk mesoporous in the present embodiment
Copper.
S3：Fig. 3 C are referred to, plating Copper treatment is carried out to the printed circuit board in S2, plate face, disk in printed circuit board
The metal copper layer 205 of one layer of thickening of electroplating deposition on the hole wall of mesoporous 203 and non-disk mesoporous 204；To the printing after electroless copper
Circuit board is electroplated, and one layer thicker of metal copper layer 205 is deposited in hole wall and panel plating, to meet the electric conductivity in hole.
It illustrates, the mode being electroplated in the present invention can be that gantry plating line is electroplated or is carried out using vertical continuous plating lines
It is electroplated, employing mode is vertical continuous plating in this embodiment.
S4：Fig. 3 D are referred to, consent processing is done to the printed circuit board in S3, metallic conduction is set in disk mesoporous 203
Slurry 206；
S5：Curing process is done to the printed circuit board in S4, after printed circuit board is toasted, the metal in disk mesoporous 203
Electrocondution slurry 206 is converted into metallic conduction block, finally does grinding process to printed circuit board again.
In preferred embodiments of the present invention, above-mentioned consent processing includes the following steps：
S41：On the basis of S3, metal conductive paste 206 will be filled in the disk mesoporous 203 on printed circuit board；
S42：On the basis of S41, aluminium flake web plate is arranged in side on a printed circuit board, and it is logical that first is provided on aluminium flake web plate
Hole, first through hole are corresponded with 203 position of disk mesoporous；Aeroscopic plate is set in the lower section of printed circuit board, is arranged on aeroscopic plate
There are the second through-hole, the second through-hole to be corresponded with 203 position of disk mesoporous.
In preferred embodiments of the present invention, above-mentioned metal conductive paste 206 is appointing in conductive copper paste and conductive silver paste
Meaning is a kind of.
In preferred embodiments of the present invention, the big 0.1mm in aperture of the aperture ratio disk mesoporous 203 of above-mentioned first through hole, the
The aperture of two through-holes is 3mm.
In preferred embodiments of the present invention, the pore diameter range of the disk mesoporous 203 in above-mentioned drilling processing is 0.15mm-
The pore diameter range of 0.5mm, non-disk mesoporous 204 are 0.15mm-6.5mm.
In preferred embodiments of the present invention, copper plating treatment in above-mentioned S2 is electroless copper, electro-coppering or organic leads
Any one copper facing mode in electrolemma copper facing.
In preferred embodiments of the present invention, curing process its processing mode in above-mentioned S5 is：By printed circuit board into
Row baking, baking temperature are 150 DEG C, baking time 60min-70min.
In preferred embodiments of the present invention, the grinding process in above-mentioned S5 is：It is first polished using ceramic polish-brush, is then made
With non-woven fabrics polish-brush nog plate.
Refer to the 203 jack device schematic diagram of disk mesoporous in Fig. 4, a kind of disk mesoporous 203 of high-density printed circuit board
Jack device, on the printed circuit board setting having disk mesoporous 203 and non-disk mesoporous 204, which includes
The aeroscopic plate 303 that aluminium flake web plate 304 on a printed circuit board is set and is arranged below printed circuit board, aluminium flake web plate 304
On be provided with first through hole 301, the position of first through hole 301 is corresponded with the position of disk mesoporous 203, is set on aeroscopic plate 303
It is equipped with the second through-hole 302, the position of the second through-hole 302 is corresponded with the position of disk mesoporous 203, the aperture of first through hole 301
Bigger 0.1mm than the aperture of disk mesoporous 203, the aperture of the second through-hole 302 is 3mm.
There is consent aluminium flake during consent in the present embodiment in printed board, aeroscopic plate 303 be lined with below printed circuit board,
Aluminium flake and aeroscopic plate 303 drill on position corresponding with disk mesoporous 203, and non-disk mesoporous 204 is covered by aluminium flake.In consent hub disk
Full electrocondution slurry 206 is filled in hole 203.It illustrates, the slurry that consent uses can be conductive copper paste or conductive silver
It starches, conductive silver paste is used in this embodiment.
In conclusion being processed compared with the existing technology to printed circuit board using 2 heavy copper and plating mode, obtain
Printed circuit plate surface layers of copper 104 it is thicker, and only need to carry out once drilling, electroless copper and plating in the present invention, and
Without subtract copper process, while Optimizing Flow, reduces the waste of metallic copper, save the consumption of material, substantially reduce
Production cost.
Present specification describes the example of the embodiment of the present invention, it is not meant to that these embodiments illustrate and describe this
The be possible to form of invention.It should be understood that the embodiment in specification can be implemented with a variety of alternative forms.Attached drawing is without in proportion
It draws；Some features can be zoomed in or out to show the details of particular elements.Disclosed specific structure and function details should not
It is construed as limiting explanation, those skilled in the art is only instructed to implement the representative basis of the present invention in a variety of forms.In the art
It should be understood to the one skilled in the art that can be said with one or more of the other attached drawing with reference to multiple features that either figure illustrates and describes
Bright feature is combined to form the embodiment for not yet explicitly illustrating or describing.The assemblage characteristic of explanation provides the generation for typical case
Table embodiment.However, the multiple combinations of the feature consistent with the teachings of the present invention and modification can be used for specific answer as needed
With or implement.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. the production method of a kind of high-density printed circuit board and its disk mesoporous, which is characterized in that the disk mesoporous production method
Include the following steps：
S1：Make drilling processing on a printed circuit board, disk mesoporous and non-disk mesoporous are drilled out on the printed circuit board；
S2：Copper plating treatment is carried out to the printed circuit board in S1, is deposited on the inner wall of hole and the non-disk mesoporous in the disc
Last layer metal copper layer；
S3：Plating Copper treatment is carried out to the printed circuit board in S2, in the plate face of the printed circuit board, the disk mesoporous and institute
State the metal copper layer of one layer of thickening of electroplating deposition on the hole wall of non-disk mesoporous；
S4：Consent processing is done to the printed circuit board in S3, metal conductive paste is set in hole in the disc；
S5：Curing process is done to the printed circuit board in S4, after the printed circuit board is toasted, gold is obtained in the disk mesoporous
Belong to conducting block, grinding process finally is done to the printed circuit board again.
2. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, which is characterized in that described
Consent processing includes the following steps：
S41：On the basis of S3, metal conductive paste will be filled in the disk mesoporous on the printed circuit board；
S42：On the basis of S41, aluminium flake web plate is set above the printed circuit board, the is provided on the aluminium flake web plate
One through-hole, the first through hole are corresponded with the disk pore location；In the lower section of the printed circuit board, aeroscopic plate is set,
The second through-hole is provided on the aeroscopic plate, second through-hole is corresponded with the disk pore location.
3. the production method of high-density printed circuit board according to claim 2 and its disk mesoporous, which is characterized in that described
Metal conductive paste is any one in conductive copper paste and conductive silver paste.
4. the production method of high-density printed circuit board according to claim 2 and its disk mesoporous, which is characterized in that described
The aperture of the big 0.1mm in the aperture of disk mesoporous described in the aperture ratio of first through hole, second through-hole are 3mm.
5. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, which is characterized in that described
The pore diameter range of the disk mesoporous in drilling processing is 0.15mm-0.5mm, and the pore diameter range of the non-disk mesoporous is
0.15mm-6.5mm。
6. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, which is characterized in that in S2
The copper plating treatment be electroless copper, electro-coppering or Organic Conductive Films copper facing in any one copper facing mode.
7. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, which is characterized in that in S3
The plating Copper treatment include sight rail electric wire plating and vertical continuous plating lines in any one plating mode.
8. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, which is characterized in that in S5
The curing process its processing mode be：The printed circuit board is toasted, baking temperature is 150 DEG C, when baking
Between be 60min-70min.
9. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, which is characterized in that in S5
Grinding process be：It is first polished using ceramic polish-brush, then uses non-woven fabrics polish-brush nog plate.
10. the production method of high-density printed circuit board according to claim 1 and its disk mesoporous, on the printed circuit board
Setting is having disk mesoporous and non-disk mesoporous, which is characterized in that the high-density printed circuit board is according to disk mesoporous making side
Method is made.
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| CN112616259A (en) * | 2021-02-25 | 2021-04-06 | 四川英创力电子科技股份有限公司 | Printed circuit board with step plug-in hole and manufacturing method thereof |
| CN113686557A (en) * | 2021-10-27 | 2021-11-23 | 四川英创力电子科技股份有限公司 | Copper deposition backlight slice preparation method and detection method |
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