CN217064092U

CN217064092U - Circuit board structure capable of avoiding electroplated copper nodules

Info

Publication number: CN217064092U
Application number: CN202220620811.1U
Authority: CN
Inventors: 龙光泽
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-07-26
Anticipated expiration: 2032-03-21

Abstract

The utility model provides a pair of avoid circuit board structure of copper facing tumour, including first copper foil circuit layer, top plate, second copper foil circuit layer, PP intermediate layer, third copper foil circuit layer, lower plate, the fourth copper foil circuit layer that from the top down set gradually, be equipped with first blind hole on the top plate, be equipped with first heat conduction post in the first blind hole, the external diameter of first heat conduction post is less than the internal diameter of first blind hole, first heat conduction post with the clearance intussuseption that forms between the first blind hole is filled with first conductive adhesive, both ends respectively with first copper foil circuit layer, second copper foil circuit layer are connected about the first conductive adhesive. The utility model discloses a circuit board structure adopts the conducting resin to replace traditional blind hole copper facing, can avoid the electroplating in-process because the existence of burr leads to the phenomenon of appearing the copper bloom, has guaranteed the quality of circuit board.

Description

Circuit board structure capable of avoiding electroplated copper nodules

Technical Field

The utility model relates to a circuit board technical field, concretely relates to avoid circuit board structure of copper facing tumour.

Background

Circuit boards are providers of electrical connections for electronic components. The circuit board is developed from a single layer to a double-sided board and a multilayer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine lead, small space, high reliability, multilayering, high-speed transmission, light weight and thinness in performance. In the circuit board in the prior art, in order to realize the electrical connection between layers, a plurality of blind holes are required to be arranged usually, and a layer of conductive copper foil is formed in the blind holes in a copper plating mode.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides an avoid circuit board structure of copper facing, adopt the conducting resin to replace traditional blind hole copper-plating, can avoid the electroplating in-process because the existence of burr leads to the phenomenon of copper facing to appear, guaranteed the quality of circuit board.

In order to achieve the above object, the present invention provides the following technical solutions:

a circuit board structure for avoiding electroplated copper bumps comprises a first copper foil circuit layer, an upper plate, a second copper foil circuit layer, a PP interlayer, a third copper foil circuit layer, a lower plate and a fourth copper foil circuit layer which are sequentially arranged from top to bottom, wherein a first blind hole is formed in the upper plate, a first heat conduction column is arranged in the first blind hole, the outer diameter of the first heat conduction column is smaller than the inner diameter of the first blind hole, first conductive adhesive is filled in a gap formed between the first heat conduction column and the first blind hole, the upper end and the lower end of the first conductive adhesive are respectively connected with the first copper foil circuit layer and the second copper foil circuit layer, a second blind hole is formed in the upper plate and the PP interlayer, a second heat conduction column is arranged in the second blind hole, the outer diameter of the second heat conduction column is smaller than the inner diameter of the second blind hole, and a gap formed between the second heat conduction column and the second blind hole is filled with second conductive adhesive, the middle part and the lower end of the second conductive adhesive are respectively connected with the second copper foil circuit layer and the third copper foil circuit layer, a third blind hole is formed in the lower layer plate, a third heat conduction column is arranged in the third blind hole, the outer diameter of the third heat conduction column is smaller than the inner diameter of the third blind hole, third conductive adhesive is filled in a gap formed between the third heat conduction column and the third blind hole, and the upper end and the lower end of the third conductive adhesive are respectively connected with the third copper foil circuit layer and the fourth copper foil circuit layer.

Specifically, the lower end of the first heat-conducting column is connected with a first limiting portion, and a first limiting groove for inserting the first limiting portion is formed in the upper end of the PP interlayer.

Specifically, the lower end of the second heat-conducting column is connected with a second limiting portion, and a second limiting groove for inserting the second limiting portion is formed in the upper end of the lower plate.

Specifically, the upper end of the third heat-conducting column is connected with a third limiting portion, and a third limiting groove for inserting the third limiting portion is formed in the lower end of the PP interlayer.

Specifically, an anti-interference layer and a ceramic heat conduction layer are further arranged on the inner side of the PP interlayer.

Specifically, a first waterproof layer covers the upper end of the first copper foil circuit layer.

Specifically, the lower end of the fourth copper foil circuit layer is covered with a second waterproof layer.

The utility model has the advantages that:

the utility model discloses a circuit board, at first blind hole, the second blind hole, first heat conduction post has been increased respectively in the third blind hole, the second heat conduction post, the third heat conduction post, the heat conductivility of circuit board has been promoted, furthermore, the clearance intussuseption that forms between first heat conduction post and first blind hole is filled with first conductive adhesive, the clearance intussuseption that forms between second heat conduction post and second blind hole is filled with the second conductive adhesive, the clearance intussuseption that forms between third heat conduction post and third blind hole is filled with the third conductive adhesive, adopt the conductive adhesive to replace traditional blind hole copper-plating, can avoid the electroplating process because the existence of burr leads to appearing the phenomenon of copper nodule, the quality of circuit board has been guaranteed.

Drawings

Fig. 1 is a schematic structural view of the circuit board structure for avoiding electroplated copper nodules according to the present invention.

The reference signs are: the heat-conducting plate comprises a first copper foil circuit layer 1, an upper plate 2, a second copper foil circuit layer 3, a PP interlayer 4, a third copper foil circuit layer 5, a lower plate 6, a fourth copper foil circuit layer 7, a first heat-conducting column 8, first conductive adhesive 9, a second heat-conducting column 10, second conductive adhesive 11, a third heat-conducting column 12, third conductive adhesive 13, a first limiting part 14, a second limiting part 15, a third limiting part 16, an anti-interference layer 17, a ceramic heat-conducting layer 18, a first waterproof layer 19 and a second waterproof layer 20.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1:

a circuit board structure for avoiding electroplated copper nodules comprises a first copper foil circuit layer 1, an upper layer board 2, a second copper foil circuit layer 3, a PP interlayer 4, a third copper foil circuit layer 5, a lower layer board 6 and a fourth copper foil circuit layer 7 which are sequentially arranged from top to bottom, wherein a first blind hole is formed in the upper layer board 2, a first heat conduction column 8 is arranged in the first blind hole, the outer diameter of the first heat conduction column 8 is smaller than the inner diameter of the first blind hole, a first conductive adhesive 9 is filled in a gap formed between the first heat conduction column 8 and the first blind hole, the upper end and the lower end of the first conductive adhesive 9 are respectively connected with the first copper foil circuit layer 1 and the second copper foil circuit layer 3, a second blind hole is formed in the upper layer board 2 and the PP interlayer 4, a second heat conduction column 10 is arranged in the second blind hole, the outer diameter of the second heat conduction column 10 is smaller than the inner diameter of the second blind hole, a second conductive adhesive 11 is filled in a gap formed between the second heat conduction column 10 and the second blind hole, the middle part of second conducting resin 11, the lower extreme respectively with second copper foil circuit layer 3, third copper foil circuit layer 5 is connected, be equipped with the third blind hole on the lower floor's board 6, be equipped with third heat conduction post 12 in the third blind hole, the external diameter of third heat conduction post 12 is less than the internal diameter of third blind hole, the clearance intussuseption that forms between third heat conduction post 12 and the third blind hole is filled with third conducting resin 13, third conducting resin 13 upper and lower both ends are connected with third copper foil circuit layer 5, fourth copper foil circuit layer 7 respectively, on the one hand increased first heat conduction post 8, second heat conduction post 10, third heat conduction post 12, the heat conductivility of circuit board has been promoted, on the other hand adopts first conducting resin 9, second conducting resin 11, third conducting resin 13 to replace traditional copper facing blind hole, can avoid because the existence of burr leads to the phenomenon of appearing in the electroplating process, the quality of circuit board has been guaranteed.

Preferably, the lower end of the first heat-conducting post 8 is connected with a first limiting part 14, and the upper end of the PP interlayer 4 is formed with a first limiting groove for the first limiting part 14 to insert.

Preferably, the lower end of the second heat-conducting pillar 10 is connected to a second limiting portion 15, and a second limiting groove for inserting the second limiting portion 15 is formed at the upper end of the lower plate 6.

Preferably, the upper end of the third heat conducting column 12 is connected with a third limiting portion 16, and a third limiting groove for inserting the third limiting portion 16 is formed at the lower end of the PP interlayer 4.

Preferably, in order to improve the electromagnetic interference resistance and the heat conduction and dissipation capability of the circuit board, an anti-interference layer 17 and a ceramic heat conduction layer 18 are further arranged on the inner side of the PP interlayer 4.

Preferably, in order to improve the waterproof capability of the upper end of the circuit board, the upper end of the first copper foil circuit layer 1 is covered with a first waterproof layer 19.

Preferably, in order to improve the waterproof capability of the lower end of the circuit board, the lower end of the fourth copper foil wiring layer 7 is covered with a second waterproof layer 20.

The above embodiment only expresses one implementation manner of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A circuit board structure for avoiding electroplated copper nodules is characterized by comprising a first copper foil circuit layer (1), an upper board (2), a second copper foil circuit layer (3), a PP interlayer (4), a third copper foil circuit layer (5), a lower board (6) and a fourth copper foil circuit layer (7) which are sequentially arranged from top to bottom, wherein a first blind hole is formed in the upper board (2), a first heat conduction column (8) is arranged in the first blind hole, the outer diameter of the first heat conduction column (8) is smaller than the inner diameter of the first blind hole, a first conductive adhesive (9) is filled in a gap formed between the first heat conduction column (8) and the first blind hole, the upper end and the lower end of the first conductive adhesive (9) are respectively connected with the first copper foil circuit layer (1) and the second copper foil circuit layer (3), and second blind holes are formed in the upper board (2) and the PP interlayer (4), a second heat-conducting column (10) is arranged in the second blind hole, the outer diameter of the second heat-conducting column (10) is smaller than the inner diameter of the second blind hole, a gap formed between the second heat-conducting column (10) and the second blind hole is filled with second conductive adhesive (11), the middle part and the lower end of the second conductive adhesive (11) are respectively connected with the second copper foil circuit layer (3) and the third copper foil circuit layer (5), a third blind hole is arranged on the lower layer plate (6), a third heat-conducting column (12) is arranged in the third blind hole, the outer diameter of the third heat-conducting column (12) is smaller than the inner diameter of the third blind hole, a gap formed between the third heat-conducting column (12) and the third blind hole is filled with third conductive adhesive (13), and the upper end and the lower end of the third conductive adhesive (13) are respectively connected with the third copper foil circuit layer (5) and the fourth copper foil circuit layer (7).

2. The circuit board structure for avoiding electroplated copper nodules according to claim 1, characterized in that the lower end of the first heat-conducting pillar (8) is connected with a first limiting portion (14), and the upper end of the PP interlayer (4) is formed with a first limiting groove for the first limiting portion (14) to insert.

3. The circuit board structure for avoiding electroplated copper nodules according to claim 1, wherein the second heat-conducting pillar (10) is connected with a second limiting portion (15) at the lower end thereof, and a second limiting groove for inserting the second limiting portion (15) is formed at the upper end of the lower board (6).

4. The circuit board structure for avoiding electroplated copper nodules according to claim 1, characterized in that the upper end of said third heat-conducting pillar (12) is connected with a third limiting portion (16), and the lower end of said PP interlayer (4) is formed with a third limiting groove for inserting said third limiting portion (16).

5. A circuit board structure for avoiding electroplated copper nodules according to claim 1, characterized in that the PP interlayer (4) is further provided with an anti-interference layer (17) and a ceramic heat conduction layer (18) on the inner side.

6. A circuit board structure for avoiding electroplated copper nodules according to claim 1, characterized in that the upper end of the first copper foil circuit layer (1) is covered with a first waterproof layer (19).

7. A circuit board structure avoiding electroplated flashes as claimed in claim 1, characterized in that the fourth copper foil track layer (7) is covered at its lower end with a second waterproof layer (20).