CN213847115U - Multilayer circuit board of high roughness - Google Patents

Multilayer circuit board of high roughness Download PDF

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Publication number
CN213847115U
CN213847115U CN202022742823.5U CN202022742823U CN213847115U CN 213847115 U CN213847115 U CN 213847115U CN 202022742823 U CN202022742823 U CN 202022742823U CN 213847115 U CN213847115 U CN 213847115U
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layer
circuit board
hole
circuit layer
pressing block
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CN202022742823.5U
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Chinese (zh)
Inventor
张文平
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Digital Printed Circuit Board Co Ltd
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Digital Printed Circuit Board Co Ltd
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Priority to CN202022742823.5U priority Critical patent/CN213847115U/en
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Abstract

The utility model provides a high-flatness multilayer circuit board, which comprises a multilayer circuit board, wherein the multilayer circuit board comprises an upper plate, a first PP prepreg, an inner plate, a second PP prepreg and a lower plate which are arranged in sequence from top to bottom, the upper end and the lower end of the inner layer plate are respectively provided with a first inner circuit layer and a second inner circuit layer, a copper-plated buried hole is connected between the first inner circuit layer and the second inner circuit layer, the upper end of the first inner circuit layer is also provided with a first insulating heat-conducting thin plate, the lower end of the first insulating heat-conducting thin plate is connected with a first hole plugging pressing block, the lower end of the first hole plugging pressing block extends to the inner side of the copper-plated buried hole, a second insulating heat-conducting thin plate is further arranged at the lower end of the second inner circuit layer, and the upper end of the second insulating heat-conducting thin plate is connected with a second hole plugging pressing block, and the upper end of the second hole plugging pressing block extends to the inner side of the copper-plated buried hole. The utility model discloses a multilayer circuit board can solve the problem that traditional circuit board hot pressing back terminal surface produced the depressed part from top to bottom.

Description

Multilayer circuit board of high roughness
Technical Field
The utility model relates to a circuit board technical field, concretely relates to multilayer circuit board of high roughness.
Background
Circuit boards are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board is developed from a single layer to a double-sided board and a multi-layer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine wire, small space, high reliability, multilayering, high-speed transmission, light weight and thin type in performance. For the conventional circuit board 22 with multiple layers as shown in fig. 1, in order to realize electrical connection between the upper and lower ends of the inner layer board, a plurality of copper-plated buried holes are formed on the inner layer board, and after the inner layer board is manufactured, two PP prepregs are used for hot press forming, since the softened PP material flows into the copper-plated buried holes, and after curing, the upper end of the upper layer board and the lower end of the lower layer board generate the recessed portions 23, which affects the surface smoothness of the circuit board.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a multilayer circuit board of high roughness can solve the problem that the terminal surface produced the depressed part about traditional circuit board hot pressing back.
In order to achieve the above object, the present invention provides the following technical solutions:
a high-flatness multilayer circuit board comprises a multilayer circuit board, wherein the multilayer circuit board comprises an upper layer board, a first PP prepreg, an inner layer board, a second PP prepreg and a lower layer board which are arranged in sequence from top to bottom, the upper end and the lower end of the inner layer plate are respectively provided with a first inner circuit layer and a second inner circuit layer, a copper-plated buried hole is connected between the first inner circuit layer and the second inner circuit layer, the upper end of the first inner circuit layer is also provided with a first insulating heat-conducting thin plate, the lower end of the first insulating heat-conducting thin plate is connected with a first hole plugging pressing block, the lower end of the first hole plugging pressing block extends to the inner side of the copper-plated buried hole, a second insulating heat-conducting thin plate is further arranged at the lower end of the second inner circuit layer, the upper end of the second insulating heat-conducting thin plate is connected with a second hole plugging pressing block, the upper end of the second hole plugging pressing block extends to the inner side of the copper-plated buried hole, and an adhesive layer is further connected between the first hole plugging pressing block and the second hole plugging pressing block.
Specifically, four sides of multilayer circuit board have still covered the one deck insulation protection and have glued, upper strata board, inner plating, the lower floor's board outside all are equipped with the recess, the embedding of insulation protection glue one end the recess is inboard.
Specifically, the upper plate upper end is equipped with first outer circuit layer, first outer circuit layer with be connected with first copper-plated blind hole between the first inner circuit layer.
Specifically, the upper side of the first outer circuit layer is covered with a first waterproof film layer.
Specifically, the lower floor's board lower extreme is equipped with the second outside line layer, the second outside line layer with be connected with second copper facing blind hole between the second interior line layer.
Specifically, the upper side of the second outer circuit layer is covered with a second waterproof film layer.
The utility model has the advantages that:
the utility model discloses a multilayer circuit board, still be equipped with first insulation heat conduction sheet metal in first interior circuit layer upper end, first insulation heat conduction sheet metal lower extreme is connected with and extends to the inboard first plugged hole briquetting of copper facing buried via hole, circuit layer lower extreme still is equipped with the insulating heat conduction sheet metal of second in the second, second insulation heat conduction sheet metal upper end is connected with and extends to the inboard second plugged hole briquetting of copper facing buried via hole and passes through first insulation heat conduction sheet metal, the separation effect and the first plugged hole briquetting of the insulating heat conduction sheet metal of second, the plugged hole effect of second plugged hole briquetting, can avoid the problem that the upper and lower terminal surface that appears in multilayer circuit board hot briquetting process produced the depressed part.
Drawings
Fig. 1 is a schematic structural diagram of a conventional circuit board.
Fig. 2 is a schematic structural diagram of the multilayer circuit board with high flatness of the present invention.
The reference signs are: the multilayer printed circuit board comprises an upper plate 1, a first PP prepreg 2, an inner plate 3, a second PP prepreg 4, a lower plate 5, a first inner circuit layer 6, a second inner circuit layer 7, a copper-plated buried hole 8, a first insulation heat-conducting thin plate 9, a first hole-blocking pressing block 10, a second insulation heat-conducting thin plate 11, a second hole-blocking pressing block 12, an adhesive layer 13, insulation protective adhesive 14, a groove 15, a first outer circuit layer 16, a first copper-plated blind hole 17, a first waterproof film layer 18, a second outer circuit layer 19, a second copper-plated blind hole 20, a second waterproof film layer 21, a traditional circuit board 22 and a depressed part 23.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 2:
a multilayer circuit board with high flatness comprises a multilayer circuit board, the multilayer circuit board comprises an upper layer board 1, a first PP prepreg 2, an inner layer board 3, a second PP prepreg 4 and a lower layer board 5 which are sequentially arranged from top to bottom, the upper end and the lower end of the inner layer board 3 are respectively provided with a first inner circuit layer 6 and a second inner circuit layer 7, a copper-plated buried hole 8 is connected between the first inner circuit layer 6 and the second inner circuit layer 7, the upper end of the first inner circuit layer 6 is also provided with a first insulating heat-conducting thin plate 9, the lower end of the first insulating heat-conducting thin plate 9 is connected with a first hole-plugging pressing block 10, the lower end of the first hole-plugging pressing block 10 extends to the inner side of the copper-plated buried hole 8, the lower end of the second inner circuit layer 7 is also provided with a second insulating heat-conducting thin plate 11, the upper end of the second insulating heat-conducting thin plate 11 is connected with a second hole-plugging pressing block 12, the upper end of the second hole-plugging pressing block 12 extends to the inner side of the copper-plated buried hole 8, in the hot-pressing process of the multilayer circuit board, due to the blocking effect of the first insulating heat-conducting thin plate 9 and the second insulating heat-conducting thin plate 11 and the hole blocking effect of the first hole blocking pressing block 10 and the second hole blocking pressing block 12, the softened first PP prepreg 2 and the second PP prepreg 4 cannot enter the inner side of the copper-plated buried hole 8, so that the flatness of the multilayer circuit board after hot pressing is higher, in addition, the first insulating heat-conducting thin plate 9 and the second insulating heat-conducting thin plate 11 also have the heat-conducting function, can rapidly lead out the heat inside the multilayer circuit board, thereby improving the heat dissipation performance of the multilayer circuit board, an adhesive layer 13 is also connected between the first hole plugging pressing block 10 and the second hole plugging pressing block 12, the adhesive layer 13 is formed by curing an adhesive, the hole plugging device is used for connecting the first hole plugging pressing block 10 and the second hole plugging pressing block 12 and preventing the first hole plugging pressing block 10 and the second hole plugging pressing block 12 from being separated from the copper-plated buried hole 8.
Preferably, in order to improve the structural stability among all layers of the multilayer circuit board and protect the edge of the multilayer circuit board, a layer of insulating protective adhesive 14 covers four sides of the multilayer circuit board, grooves 15 are formed in the outer sides of the upper plate 1, the inner plate 3 and the lower plate 5, and one end of the insulating protective adhesive 14 is embedded into the inner side of each groove 15.
Preferably, the upper end of the upper plate 1 is provided with a first outer circuit layer 16, and a first copper-plated blind hole 17 is connected between the first outer circuit layer 16 and the first inner circuit layer 6.
Preferably, in order to improve the waterproof performance of the upper end face of the multilayer circuit board, the upper side of the first outer circuit layer 16 is covered with a first waterproof film layer 18.
Preferably, the lower end of the lower board 5 is provided with a second outer circuit layer 19, and a second copper-plated blind hole 20 is connected between the second outer circuit layer 19 and the second inner circuit layer 7.
Preferably, in order to improve the waterproof performance of the lower end face of the multilayer circuit board, the upper side of the second outer circuit layer 19 is covered with a second waterproof film layer 21.
The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (6)

1. A multilayer circuit board with high flatness comprises a multilayer circuit board, wherein the multilayer circuit board comprises an upper layer board (1), a first PP prepreg (2), an inner layer board (3), a second PP prepreg (4) and a lower layer board (5) which are sequentially arranged from top to bottom, and is characterized in that a first inner circuit layer (6) and a second inner circuit layer (7) are respectively arranged at the upper end and the lower end of the inner layer board (3), a copper-plated buried hole (8) is connected between the first inner circuit layer (6) and the second inner circuit layer (7), a first insulating heat-conducting thin plate (9) is further arranged at the upper end of the first inner circuit layer (6), a first hole-plugging pressing block (10) is connected at the lower end of the first insulating heat-conducting thin plate (9), the lower end of the first hole-plugging pressing block (10) extends to the inner side of the buried hole (8), a second insulating heat-conducting thin plate (11) is further arranged at the lower end of the second inner circuit layer (7), the upper end of the second insulating heat-conducting thin plate (11) is connected with a second hole plugging pressing block (12), the upper end of the second hole plugging pressing block (12) extends to the inner side of the copper-plated buried hole (8), and an adhesive layer (13) is further connected between the first hole plugging pressing block (10) and the second hole plugging pressing block (12).
2. The multilayer circuit board with high flatness according to claim 1, wherein four sides of the multilayer circuit board are further covered with a layer of insulation protection glue (14), grooves (15) are formed on the outer sides of the upper plate (1), the inner plate (3) and the lower plate (5), and one end of the insulation protection glue (14) is embedded into the inner sides of the grooves (15).
3. The multilayer circuit board with high flatness according to claim 1, characterized in that a first outer circuit layer (16) is arranged at the upper end of the upper plate (1), and a first copper-plated blind hole (17) is connected between the first outer circuit layer (16) and the first inner circuit layer (6).
4. A high-flatness multilayer circuit board according to claim 3, characterized in that the upper side of the first outer wiring layer (16) is covered with a first waterproof film layer (18).
5. A multi-layered circuit board with high flatness according to claim 1, characterized in that the lower end of the lower board (5) is provided with a second outer circuit layer (19), and a second copper-plated blind hole (20) is connected between the second outer circuit layer (19) and the second inner circuit layer (7).
6. A multi-layered circuit board of high flatness according to claim 5, characterized in that the upper side of the second outer wiring layer (19) is covered with a second waterproof film layer (21).
CN202022742823.5U 2020-11-24 2020-11-24 Multilayer circuit board of high roughness Active CN213847115U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022742823.5U CN213847115U (en) 2020-11-24 2020-11-24 Multilayer circuit board of high roughness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022742823.5U CN213847115U (en) 2020-11-24 2020-11-24 Multilayer circuit board of high roughness

Publications (1)

Publication Number Publication Date
CN213847115U true CN213847115U (en) 2021-07-30

Family

ID=76990601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022742823.5U Active CN213847115U (en) 2020-11-24 2020-11-24 Multilayer circuit board of high roughness

Country Status (1)

Country Link
CN (1) CN213847115U (en)

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