CN212910168U

CN212910168U - Multilayer circuit board that roughness is high

Info

Publication number: CN212910168U
Application number: CN202021124334.7U
Authority: CN
Inventors: 龙光泽
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2020-06-17
Filing date: 2020-06-17
Publication date: 2021-04-06
Anticipated expiration: 2030-06-17

Abstract

The utility model provides a multilayer circuit board that roughness is high, including multilayer circuit board, multilayer circuit board includes upper plate, first thermal insulation layer, double sided board, second thermal insulation layer, lower floor's board, the upper plate upper end is equipped with first outer circuit, both ends are equipped with first inlayer circuit, second inlayer circuit respectively about the double sided board, lower floor's board lower extreme is equipped with the outer circuit of second, first inlayer circuit with still be connected with between the second inlayer circuit and bury the hole, bury the copper facing of downthehole wall, both ends all are equipped with loudspeaker form opening about burying the hole, upper plate lower extreme, lower floor's board upper end edge all are equipped with the spacing groove, the section of spacing groove is the trapezium structure. The utility model discloses a multilayer circuit board has increased the spacing groove, has promoted the degree of cooperation between the board, prevents the off normal to design into the section with the spacing groove and be trapezoidal structure, can avoid appearing resin material and fill discontented phenomenon, guaranteed the planarization of circuit board.

Description

Multilayer circuit board that roughness is high

Technical Field

The utility model relates to a circuit board technical field, concretely relates to multilayer circuit board that roughness is high.

Background

Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board. In the prior art, a rectangular limiting groove is added inside the circuit board to improve the matching degree between layers and prevent deviation. However, in general, as shown in fig. 1, the first gap 16 is formed at the upper end of the limiting groove after pressing, and the upper end is easily recessed during the forming process, thereby causing the uneven surface of the circuit board. In addition, as shown in fig. 2, the above problem also occurs at the position of the buried hole of the inner plate, the second gap 17 is formed inside the buried hole, and in order to avoid the second gap 17, the resin material is filled in the position of the buried hole in advance, and the end face is flattened and then press-molded, but this method has complicated process and low processing efficiency.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a multilayer circuit board that roughness is high has increased the spacing groove, has promoted the degree of cooperation between the board, prevents the off normal to design into the section with the spacing groove and be trapezoidal structure, can avoid appearing resin material and fill discontented phenomenon, guaranteed the planarization of circuit board.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model provides a multilayer circuit board that roughness is high, includes multilayer circuit board, multilayer circuit board includes top plate, first heat conduction insulating layer, double sided board, second heat conduction insulating layer, the lower floor's board that from the top down set gradually, the top plate upper end is equipped with first outer circuit, both ends are equipped with first inlayer circuit, second inlayer circuit respectively about the double sided board, the lower floor's board lower extreme is equipped with the outer circuit of second, first inlayer circuit with still be connected with between the second inlayer circuit and bury the hole, bury the copper-plating of downthehole wall, both ends all are equipped with loudspeaker form opening about burying the hole, top plate lower extreme, lower floor's board upper end edge all are equipped with spacing groove, the section in spacing groove is the trapezium structure.

Specifically, be connected with first blind hole between first outer layer circuit and the first inlayer circuit, copper-plating in first blind hole inner wall.

Specifically, a second blind hole is connected between the second inner layer circuit and the second outer layer circuit, and the inner wall of the second blind hole is plated with copper.

Specifically, the upper end face of the first outer layer circuit is covered with a first waterproof paint film.

Specifically, the lower end face of the second outer layer circuit is covered with a second waterproof paint film.

The utility model has the advantages that:

the utility model discloses a multilayer circuit board has all increased the spacing groove at upper end plate lower extreme, lower floor's board upper end edge, has promoted the degree of cooperation between the board, prevents the off normal to design into the section with the spacing groove and be trapezoidal structure, can avoid appearing hot pressing in-process resin material and fill discontented phenomenon, guaranteed the planarization of circuit board both ends face.

Drawings

Fig. 1 is a schematic structural diagram of a conventional circuit board, in which a first gap appears at the position of a limiting groove after lamination.

Fig. 2 is a schematic structural diagram of a conventional circuit board, in which a second gap appears inside a buried via after press-fitting.

Fig. 3 is a schematic structural diagram of the multilayer circuit board with high flatness of the present invention.

The reference signs are: the composite board comprises an upper board 1, a first heat-conducting insulating layer 2, a double-sided board 3, a second heat-conducting insulating layer 4, a lower board 5, a first outer-layer circuit 6, a first inner-layer circuit 7, a second inner-layer circuit 8, a second outer-layer circuit 9, a buried hole 10, a limiting groove 11, a first blind hole 12, a second blind hole 13, a first waterproof paint film 14, a second waterproof paint film 15, a first gap 16 and a second gap 17.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

Referring to FIG. 3:

the utility model provides a multilayer circuit board that roughness is high, including multilayer circuit board, multilayer circuit board includes top plate 1 that from the top down set gradually, first heat conduction insulation layer 2, double sided board 3, second heat conduction insulation layer 4, plywood 5 down, 1 upper end of top plate is equipped with first outer circuit 6, both ends are equipped with first inlayer circuit 7 respectively about the double sided board 3,

second inlayer circuit

8, 5 lower extremes of lower floor's board are equipped with second outer circuit 9, still be connected with between first inlayer circuit 7 and the second inlayer circuit 8 and bury hole 10, bury hole 10 inner wall copper-plating, both ends all are equipped with loudspeaker form opening about burying hole 10, hot pressing in-process first heat conduction insulation layer 2, the resin material of second heat conduction insulation layer 4 can get into through loudspeaker form opening and fill buried hole 10 in burying hole 10, need not to carry out resin consent process in advance, machining efficiency has been promoted. 1 lower extreme of upper plate, 5 upper end edges of lower floor's board all are equipped with spacing groove 11, after the hot pressing, first heat conduction insulating layer 2, the spacing groove 11 is filled with to the resin material of second heat conduction insulating layer 4, can prevent the phenomenon of each sheet layer off normal, in addition, in order to make first heat conduction insulating layer 2, the resin material of second heat conduction insulating layer 4 can fill up and be full of spacing groove 11, prevent that spacing groove 11 is inside to appear the space, the section of spacing groove 11 is the trapezium structure, after follow-up pressfitting shaping, the upper and lower both ends face roughness of multilayer circuit board is high.

Preferably, a first blind hole 12 is connected between the first outer layer circuit 6 and the first inner layer circuit 7, copper is plated on the inner wall of the first blind hole 12, and the first outer layer circuit 6 and the first inner layer circuit 7 are electrically connected through the first blind hole 12.

Preferably, a second blind hole 13 is connected between the second inner layer circuit 8 and the second outer layer circuit 9, the inner wall of the second blind hole 13 is plated with copper, and the second inner layer circuit 8 and the second outer layer circuit 9 are electrically connected through the second blind hole 13.

Preferably, in order to improve the waterproof performance of the upper end face of the multilayer board, the upper end face of the first outer layer circuit 6 is covered with a first waterproof paint film 14.

Preferably, in order to improve the waterproof performance of the lower end face of the multilayer board, the lower end face of the second outer layer circuit 9 is covered with a second waterproof paint film 15.

The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A multilayer circuit board with high flatness comprises a multilayer circuit board, wherein the multilayer circuit board comprises an upper layer board (1), a first heat-conducting insulating layer (2), a double-sided board (3), a second heat-conducting insulating layer (4) and a lower layer board (5) which are sequentially arranged from top to bottom, and is characterized in that a first outer layer circuit (6) is arranged at the upper end of the upper layer board (1), a first inner layer circuit (7) and a second inner layer circuit (8) are respectively arranged at the upper end and the lower end of the double-sided board (3), a second outer layer circuit (9) is arranged at the lower end of the lower layer board (5), a buried hole (10) is further connected between the first inner layer circuit (7) and the second inner layer circuit (8), copper is plated on the inner wall of the buried hole (10), horn-shaped openings are respectively arranged at the upper end and the lower end of the buried hole (10), and limiting grooves (11) are respectively arranged at the upper end of the, the section of the limiting groove (11) is of a trapezoidal structure.

2. The multilayer circuit board with high flatness according to claim 1, characterized in that a first blind hole (12) is connected between the first outer layer circuit (6) and the first inner layer circuit (7), and the inner wall of the first blind hole (12) is plated with copper.

3. The multilayer circuit board with high flatness according to claim 1, characterized in that a second blind hole (13) is connected between the second inner layer circuit (8) and the second outer layer circuit (9), and the inner wall of the second blind hole (13) is plated with copper.

4. A multilayer circuit board having high flatness according to claim 1, characterized in that the upper end surface of the first outer layer wire (6) is covered with a first waterproof paint film (14).

5. A multilayer circuit board having high flatness according to claim 1, characterized in that the lower end surface of the second outer layer wire (9) is covered with a second waterproof paint film (15).