CN213847325U

CN213847325U - Circuit board structure with inner cavity

Info

Publication number: CN213847325U
Application number: CN202022416145.3U
Authority: CN
Inventors: 王�锋
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2020-10-27
Filing date: 2020-10-27
Publication date: 2021-07-30
Anticipated expiration: 2030-10-27

Abstract

The utility model provides a pair of circuit board structure with inner chamber, including upper plate, lower plate, the upper plate with be equipped with first insulation cushion, the insulating cushion of second between the lower plate, first insulation cushion with be formed with a cavity between the insulating cushion of second, both ends are equipped with first outside line layer, first interior line layer respectively about the upper plate, first outside line layer lean on to the insulating cushion of second one side is equipped with first golden finger, second outside line layer lean on to the insulating cushion of second one side is equipped with the second golden finger, the upper plate, the lower plate both edges outside is equipped with first insulating frame, the insulating frame of second respectively, the insulating frame inboard of second is equipped with conductive terminal. The utility model discloses a circuit board structure has increased an inner chamber for all can weld electronic components on upper strata board lower extreme and the lower floor plate, make its design demand that needs arranged more electronic components.

Description

Circuit board structure with inner cavity

Technical Field

The utility model relates to a circuit board technical field, concretely relates to circuit board structure with inner chamber.

Background

Circuit boards are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board is developed from a single layer to a double-sided board and a multi-layer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine wire, small space, high reliability, multilayering, high-speed transmission, light weight and thin type in performance. The multilayer circuit board is formed by laminating multilayer boards, electronic components are usually arranged at the upper end and the lower end of the multilayer circuit board, however, for the design that a part of the multilayer circuit board needs to be provided with more electronic components, the conventional multilayer circuit board cannot meet the design requirement.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a circuit board structure with inner chamber has increased an inner chamber for all can weld electronic components on upper strata board lower extreme and the lower floor's board, make it satisfy the design demand that needs arranged more electronic components.

In order to achieve the above object, the present invention provides the following technical solutions:

a circuit board structure with an inner cavity comprises an upper plate and a lower plate, wherein a first insulating cushion block and a second insulating cushion block are arranged between the upper plate and the lower plate, a cavity is formed between the first insulating cushion block and the second insulating cushion block, a first outer circuit layer and a first inner circuit layer are respectively arranged at the upper end and the lower end of the upper plate, a first golden finger is arranged at one side, close to the second insulating cushion block, of the first outer circuit layer, a second inner circuit layer and a second outer circuit layer are respectively arranged at the upper end and the lower end of the lower plate, a second golden finger is arranged at one side, close to the second insulating cushion block, of the second outer circuit layer, a first insulating frame and a second insulating frame are respectively sleeved at the outer sides of the two edges of the upper plate and the lower plate, a conductive terminal is arranged at the inner side of the second insulating frame, a first elastic arm in elastic contact with the first golden finger is arranged at the upper end of the conductive terminal, and the lower end of the conductive terminal is provided with a second elastic arm which is in elastic contact with the second golden finger.

Specifically, a first metallization hole is formed in the upper plate, and the first outer circuit layer is electrically connected with the first inner circuit layer through the first metallization hole bridge.

Specifically, a second metallization hole is formed in the lower plate, and the second outer circuit layer is electrically connected with the second inner circuit layer through the second metallization hole bridge.

Specifically, a plurality of electronic components are welded on the upper plate.

Specifically, a chip is welded on the lower plate and is located on the inner side of the cavity.

Specifically, a radiating fin is further arranged between the first insulating cushion block and the second insulating cushion block.

The utility model has the advantages that:

the utility model discloses a circuit board structure has increased an inner chamber between upper plate and lower floor's board for all can weld electronic components on upper plate lower extreme and the lower floor's board, make it satisfy the design demand that needs arrange more electronic components, and increased a fin at the inner chamber inboard, promoted the heat dispersion of circuit board.

Drawings

Fig. 1 is an exploded view of a circuit board structure with an inner cavity according to the present invention.

Fig. 2 is a sectional structure diagram of a circuit board structure with an inner cavity according to the present invention.

The reference signs are: the structure comprises an upper plate 1, a first metalized hole 11, an electronic component 12, a lower plate 2, a second metalized hole 21, a chip 22, a first insulating cushion block 3, a second insulating cushion block 4, a cavity 5, a first gold finger 6, a first insulating frame 7, a second insulating frame 8, a conductive terminal 9, a first elastic arm 91, a second elastic arm 92 and a radiating fin 10.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

As shown in fig. 1-2:

a circuit board structure with an inner cavity comprises an upper board 1 and a lower board 2, wherein a first insulating cushion block 3 and a second insulating cushion block 4 are arranged between the upper board 1 and the lower board 2, a cavity 5 is formed between the first insulating cushion block 3 and the second insulating cushion block 4, a first outer circuit layer and a first inner circuit layer are respectively arranged at the upper end and the lower end of the upper board 1, a first golden finger 6 is arranged at one side of the first outer circuit layer close to the second insulating cushion block 4, a second inner circuit layer and a second outer circuit layer are respectively arranged at the upper end and the lower end of the lower board 2, a second golden finger is arranged at one side of the second outer circuit layer close to the second insulating cushion block 4, a first insulating frame 7 and a second insulating frame 8 are respectively sleeved at the outer sides of the two edges of the upper board 1 and the lower board 2, a conductive terminal 9 is arranged at the inner side of the second insulating frame 8, a first elastic arm 91 which is in elastic contact with the first golden finger 6 is arranged at the upper end of the conductive terminal 9, the lower end of the conductive terminal 9 is provided with a second elastic arm 92 elastically contacted with the second golden finger, and the first outer line layer and the second outer line layer are electrically connected through the conductive function of the conductive terminal 9.

Preferably, the upper plate 1 is provided with a first metalized hole 11, the first metalized hole 11 is a hole with a copper film plated on the inner wall, and the first outer circuit layer is electrically connected with the first inner circuit layer through the first metalized hole 11 bridge.

Preferably, the lower plate 2 is provided with a second metalized hole 21, the second metalized hole 21 is a hole with a copper film plated on the inner wall, and the second outer circuit layer is electrically connected with the second inner circuit layer through a bridge of the second metalized hole 21.

Preferably, a plurality of electronic components 12 are welded on the upper plate 1, and for the design that a part of the upper plate needs to be provided with more electronic components 12, the electronic components 12 can be arranged at the upper end and the lower end of the upper plate 1.

Preferably, the lower plate 2 is welded with the chip 22, the chip 22 is located inside the cavity 5, the chip 22 is placed inside the cavity 5, the chip 22 can be protected against collision, and the electronic component 12 can be arranged at the upper end and the lower end of the lower plate 2 according to the design requirement of the circuit board.

Preferably, in order to improve the heat dissipation performance of the circuit board, a heat sink 10 is further disposed between the first insulating pad 3 and the second insulating pad 4.

The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a circuit board structure with inner chamber, a serial communication port, including upper plate (1), lower floor plate (2), upper plate (1) with be equipped with first insulating cushion (3), second insulating cushion (4) down between floor plate (2), first insulating cushion (3) with be formed with a cavity (5) between second insulating cushion (4), both ends are equipped with first outer circuit layer, first inner circuit layer respectively about upper plate (1), first outer circuit layer lean on to second insulating cushion (4) one side is equipped with first golden finger (6), both ends are equipped with second inner circuit layer, second outer circuit layer respectively about lower floor plate (2), second outer circuit layer lean on to second insulating cushion (4) one side is equipped with the second golden finger, the both edges outside of upper plate (1), lower floor plate (2) overlaps respectively and is equipped with first insulating frame (7), The novel gold finger connector comprises a second insulating frame (8), wherein a conductive terminal (9) is arranged on the inner side of the second insulating frame (8), a first elastic arm (91) in elastic contact with a first gold finger (6) is arranged at the upper end of the conductive terminal (9), and a second elastic arm (92) in elastic contact with a second gold finger is arranged at the lower end of the conductive terminal (9).

2. A circuit board structure with an inner cavity according to claim 1, characterized in that the upper board (1) is provided with a first metallized hole (11), and the first outer circuit layer and the first inner circuit layer are electrically connected through the first metallized hole (11) bridge.

3. A circuit board structure with an inner cavity according to claim 1, characterized in that a second metallized hole (21) is provided on the lower board (2), and the second outer circuit layer and the second inner circuit layer are electrically connected through the second metallized hole (21) bridge.

4. A circuit board structure with an inner cavity according to claim 1, characterized in that a plurality of electronic components (12) are soldered on the upper board (1).

5. A circuit board structure with an inner cavity according to claim 1, characterized in that a chip (22) is soldered on the lower plate (2), the chip (22) being located inside the cavity (5).

6. The circuit board structure with an inner cavity according to claim 1, wherein a heat sink (10) is further arranged between the first insulating pad (3) and the second insulating pad (4).