CN211297125U - Printed circuit board with heat dissipation copper column - Google Patents
Printed circuit board with heat dissipation copper column Download PDFInfo
- Publication number
- CN211297125U CN211297125U CN201922476774.2U CN201922476774U CN211297125U CN 211297125 U CN211297125 U CN 211297125U CN 201922476774 U CN201922476774 U CN 201922476774U CN 211297125 U CN211297125 U CN 211297125U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- copper
- heat
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model belongs to the technical field of circuit board processing, specifically a printed circuit board of area heat dissipation copper post, including base plate, pad and copper post, the pad sets up on the base plate, and the welding of copper post realizes zonulae occludens on the pad and with the pad, is equipped with the threaded insulating layer in the copper post, and the copper post is provided with the fin with the position of being connected of pad, and it is fixed to utilize the insulating layer in this copper post to realize printed circuit board's installation, simplifies production technology and reduction in production cost, and the copper post bottom is provided with the fin simultaneously, helps improving circuit board reliability.
Description
Technical Field
The utility model relates to a belong to printed circuit board technical field, especially, relate to a printed circuit board of area heat dissipation copper post.
Background
Printed Circuit Boards (PCBs) are providers of electrical connections for electronic components. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. The printed circuit board needs to be connected with other electrical components and mounted and fixed inside the electrical equipment, and the conventional means is to mount and fix the printed circuit board by screws, however, the conventional printed circuit board has the problems of complicated production process and high production cost when being mounted and fixed.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a printed circuit board with copper post to there are the problem that production technology is complicated and manufacturing cost is high when solving current printed circuit board and installing fixedly among the prior art, possess simultaneously and be provided with the fin, improve the circuit board reliability.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a printed circuit board of area heat dissipation copper post, its characterized in that, includes base plate, pad, copper post, mounting and fin, the pad sets up on the base plate, the welding of copper post is in on the pad and with zonulae occludens is realized to the pad, be equipped with the mounting in the copper post, the copper post with the junction of pad is provided with the fin, fin and copper post welded connection.
Further, the fixing piece is an internal thread insulating piece.
Furthermore, the copper column is of a hollow cylinder structure.
Further, the fin includes installation end and heat dissipation end, and the round hole connection copper post bottom has been seted up to the installation end, and the heat dissipation end is the chevron shape and extends to the base plate outside, exports inside heat outside the board.
Further, the pad penetrates through the communication substrate.
Further, the radiating end of the radiating fin is provided with at least three protrusions.
Furthermore, the inner diameter of the copper column is 5-8mm, and the height of the copper column is 2-3 mm.
Further, the radiating fin is an aluminum sheet with an oxide film on the surface.
The utility model has the advantages that
The utility model provides a printed circuit board with copper post to there are the problem that production technology is complicated and manufacturing cost is high when solving current printed circuit board and installing fixedly among the prior art, possesses simultaneously and is provided with the fin, improvement circuit board reliability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
description of reference numerals: pad 1, copper post 2, mounting 3, fin 4, base plate 5.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout, which are exemplary and are intended to be illustrative only and not to be construed as limiting the invention, and, accordingly, the description is for the purpose of illustration only and the practice of the inventive concepts herein is not intended to be limited solely to the exemplary embodiments described herein and the illustrations in the drawings, which are not intended to be limiting.
As shown in fig. 1:
example 1
The utility model provides a printed circuit board of area heat dissipation copper post, its characterized in that, includes base plate, pad, copper post, mounting and fin, the pad sets up on the base plate, the welding of copper post is in on the pad and with zonulae occludens is realized to the pad, be equipped with the mounting in the copper post, the copper post with the junction of pad is provided with the fin, fin and copper post welded connection.
The fixing piece is an internal thread insulating piece.
The copper column is a hollow cylinder structure.
The radiating fin comprises a mounting end and a radiating end, the mounting end is provided with a round hole to be connected with the bottom end of the copper column, and the radiating end is in a shape like a Chinese character 'shan' and extends to the outside of the substrate to conduct internal heat out of the substrate.
The bonding pad penetrates through the communication substrate.
The radiating end of the radiating fin is provided with three bulges.
The inner diameter of the copper column is 5mm, and the height of the copper column is 2 mm.
The radiating fin is an aluminum sheet with an oxide film on the surface.
Example 2
The utility model provides a printed circuit board of area heat dissipation copper post, its characterized in that, includes base plate, pad, copper post, mounting and fin, the pad sets up on the base plate, the welding of copper post is in on the pad and with zonulae occludens is realized to the pad, be equipped with the mounting in the copper post, the copper post with the junction of pad is provided with the fin, fin and copper post welded connection.
The fixing piece is an internal thread insulating piece.
The copper column is a hollow cylinder structure.
The radiating fin comprises a mounting end and a radiating end, the mounting end is provided with a round hole to be connected with the bottom end of the copper column, and the radiating end is in a shape like a Chinese character 'shan' and extends to the outside of the substrate to conduct internal heat out of the substrate.
The bonding pad penetrates through the communication substrate.
The radiating end of the radiating fin is provided with four bulges.
The inner diameter of the copper column is 8mm, and the height of the copper column is 3 mm.
The radiating fin is an aluminum sheet with an oxide film on the surface.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (8)
1. The utility model provides a printed circuit board of area heat dissipation copper post, its characterized in that, includes base plate, pad, copper post, mounting and fin, the pad sets up on the base plate, the welding of copper post is in on the pad and with zonulae occludens is realized to the pad, be equipped with the mounting in the copper post, the copper post with the junction of pad is provided with the fin, fin and copper post welded connection.
2. The printed circuit board with the heat-dissipating copper pillars as claimed in claim 1, wherein the fixing member is an internally threaded insulator.
3. The printed circuit board with the heat dissipation copper pillar as recited in claim 1, wherein the copper pillar is a hollow cylinder structure.
4. The printed circuit board with the heat dissipating copper pillar as claimed in claim 1, wherein the heat sink includes a mounting end and a heat dissipating end, the mounting end is formed with a circular hole to connect to the bottom end of the copper pillar, and the heat dissipating end extends to the outside of the substrate in a shape of a Chinese character 'shan'.
5. The printed circuit board with the heat-dissipating copper pillars as claimed in claim 1, wherein the pads penetrate through the communication substrate.
6. The printed circuit board with the heat-dissipating copper pillar as recited in claim 1, wherein the heat-dissipating end of the heat sink is provided with at least three protrusions.
7. The printed circuit board with the heat dissipation copper cylinder as recited in claim 1, wherein the copper cylinder has an inner diameter of 5-8mm and a height of 2-3 mm.
8. The printed circuit board with the heat-dissipating copper pillars as claimed in claim 1, wherein the heat-dissipating fins are aluminum sheets with an oxide film on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922476774.2U CN211297125U (en) | 2019-12-31 | 2019-12-31 | Printed circuit board with heat dissipation copper column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922476774.2U CN211297125U (en) | 2019-12-31 | 2019-12-31 | Printed circuit board with heat dissipation copper column |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211297125U true CN211297125U (en) | 2020-08-18 |
Family
ID=72015929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922476774.2U Active CN211297125U (en) | 2019-12-31 | 2019-12-31 | Printed circuit board with heat dissipation copper column |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211297125U (en) |
-
2019
- 2019-12-31 CN CN201922476774.2U patent/CN211297125U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20070010086A1 (en) | Circuit board with a through hole wire and manufacturing method thereof | |
| JP4992532B2 (en) | Heat dissipation board and manufacturing method thereof | |
| CN213847398U (en) | Circuit board heat radiation structure and electrical equipment | |
| KR102415087B1 (en) | LED Module with Heat Radiation Construction for PCB | |
| CN211297125U (en) | Printed circuit board with heat dissipation copper column | |
| CN212910169U (en) | Anti-electromagnetic interference multilayer circuit board structure | |
| CN103118486B (en) | A kind of aluminum-based circuit board with element spliced eye and preparation method thereof | |
| CN207692154U (en) | A kind of heat radiating type high density interconnection pcb board | |
| CN206401355U (en) | A kind of anti-static LED aluminium substrate | |
| CN204894670U (en) | LED lamps and lanterns are with aluminium base two -sided copper -clad plate | |
| KR20110085121A (en) | Light emitting apparatus | |
| CN113727515A (en) | Metal copper-clad plate | |
| CN210042369U (en) | Multilayer circuit board with good stability | |
| CN210840197U (en) | High-efficient heat dissipation printed circuit board structure | |
| CN210245421U (en) | Class 2 solid relay with staggered structure | |
| CN210093654U (en) | Double-sided PCB with stable bonding pad structure | |
| CN213244448U (en) | Radiating circuit board structure | |
| CN209861249U (en) | Pre-filled hole insulation heat conduction composite aluminum-based copper-clad plate | |
| CN211047366U (en) | Double-layer circuit board | |
| CN213988867U (en) | Infrared module | |
| CN214481477U (en) | High-voltage-resistant insulating printed circuit board | |
| CN217064092U (en) | Circuit board structure capable of avoiding electroplated copper nodules | |
| CN211656523U (en) | Heat dissipation type PCB board | |
| CN217011281U (en) | Nickel-copper combined heat dissipation module board | |
| CN209462694U (en) | A kind of microphone pcb board of antistatic |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |