CN207692154U - A kind of heat radiating type high density interconnection pcb board - Google Patents
A kind of heat radiating type high density interconnection pcb board Download PDFInfo
- Publication number
- CN207692154U CN207692154U CN201820038825.6U CN201820038825U CN207692154U CN 207692154 U CN207692154 U CN 207692154U CN 201820038825 U CN201820038825 U CN 201820038825U CN 207692154 U CN207692154 U CN 207692154U
- Authority
- CN
- China
- Prior art keywords
- layer
- bulge loop
- pcb board
- conducting
- high density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model system provides a kind of heat radiating type high density interconnection pcb board, including the m sandwich circuits layer being stacked and n-layer insulating layer, a layer insulating is equipped between adjacent two layers line layer, m=n+1, running through in m sandwich circuits layer and n-layer insulating layer has x through-hole, a diameter of R of through-hole is equipped with a connecting pole in each through-hole；The outer diameter of the conducting post that connecting pole leads in including, conducting post is r, r<R, conducting post are externally provided with kyA conducting bulge loop, ky≤ m, 1≤y≤x, y are integer, and a diameter of R of bulge loop is connected, the position of bulge loop and the location matches of line layer is connected.Special interlayer interconnection structure is arranged in the utility model, has excellent heat dissipation performance；And interconnection structure can cross-layer realize interconnection, be conducive to pcb board design；In addition, the installation operation of interconnection structure is simple and convenient, additionally it is possible to dismantle, the interconnected relationship of interlayer can be adjusted at any time.
Description
Technical field
The utility model is related to pcb boards, specifically disclose a kind of heat radiating type high density interconnection pcb board.
Background technology
PCB (Printed Circuit Board, i.e. printed circuit board) is at least attached there are one conductive pattern thereon, and cloth
There is hole slot to realize the interconnection between electronic component, the basis of almost all electronic products.It is, in general, that if
There is electronic component in some equipment, then they are integrated on the pcb board of different sizes.Electronic component is increasingly light
The mode of thinning, multifunction and Integration Design, pcb board generally use laminated multi-layer circuit realizes highdensity integrate.
For existing pcb board, the medium holes being connected with each other are formed in interlayer by way of drilling between each layer circuit,
Again by forming the electroplated layer conducted in medium holes, this interconnection procedure of processing is complicated, needs the copper that successively drilled, sunk
To realize the conducting between each layer, it to be also packed into insulating resin in the coating hole of formation, heat dissipation performance is poor, is unfavorable for pcb board
The performance to work for a long time or under high temperature, and can only realize the interconnection of adjacent interlayer, the design of pcb board can be limited.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of heat radiating type high density interconnection pcb board, setting is special
Interlayer interconnection structure, perfect heat-dissipating, and can cross-layer realize interconnection, be conducive to pcb board design.
To solve prior art problem, the utility model discloses a kind of heat radiating type high density interconnection pcb board, including stacking is set
The m sandwich circuits layer and n-layer insulating layer set, a layer insulating is equipped between adjacent two layers line layer, and m=n+1, n are more than or equal to 2
Integer, through there is an x through-hole in m sandwich circuits layer and n-layer insulating layer, x is the integer more than 1, a diameter of R of through-hole, each
A connecting pole is equipped in through-hole；
The outer diameter of the conducting post that connecting pole leads in including, conducting post is r, r<R, conducting post are externally provided with kyA conducting
Bulge loop, ky≤ m, 1≤y≤x, y are integer, and a diameter of R of bulge loop is connected, the position of bulge loop and the position of line layer is connected
Match.
Further, insulating layer is heat conduction silicone.
Further, conducting bulge loop is metallic silver bulge loop.
Further, it is arranged with insulation bulge loop outside one end of conducting post, the outer diameter for the bulge loop that insulate is p, p>R, insulation are convex
Ring is located in one of outside outermost line layer.
Further, the one end of conducting post far from insulation bulge loop is connected with insulating nut, the outer diameter of insulating nut
For q, q>R, insulating nut are located at outside outermost line layer.
Further, the inner wall of conducting post is equipped with several radiating fins.
Further, radiating fin shifts to install.
The beneficial effects of the utility model are：The utility model discloses a kind of heat radiating type high density interconnection pcb board, and setting is special
Different interlayer interconnection structure, interconnection structure are equipped with the cavity of both ends connection, have excellent heat dissipation performance, it can be ensured that pcb board
The performance to work for a long time or under high temperature；And interconnection structure can cross-layer realize interconnection, be conducive to pcb board design；In addition,
The installation operation of interconnection structure is simple and convenient, additionally it is possible to dismantle, can adjust the interconnected relationship of interlayer at any time.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the cross-sectional view of connecting pole in the utility model.
Fig. 3 is the dimensional structure diagram of connecting pole in the utility model.
Reference numeral is：Line layer 11, through-hole 13, connecting pole 20, conducting post 21, is connected bulge loop 22, is exhausted insulating layer 12
Edge bulge loop 23, insulating nut 24, radiating fin 25.
Specific implementation mode
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the utility model, below
The utility model is described in further detail with specific implementation mode in conjunction with attached drawing.
Referring to figs. 1 to Fig. 3.
The utility model embodiment discloses a kind of heat radiating type high density interconnection pcb board, including the m sandwich circuit layers being stacked
11 and n-layer insulating layer 12, a layer insulating 12, m=n+1 is equipped between adjacent two layers line layer 11, and n is whole more than or equal to 2
Number, i.e. the two of the utility model pcb board surface are line layer 11, and running through in m sandwich circuits layer 11 and n-layer insulating layer 12 has x
A through-hole 13, x are integer more than 1, a diameter of R of through-hole 13, and a connecting pole 20 is equipped in each through-hole 13；
The outer diameter of the conducting post 21 that connecting pole 20 leads in including, conducting post 21 is r, r<R, it is ensured that conducting post 21 exists
It will not be in direct contact under normal circumstances with line layer 11, y indicates that the number of x through-hole 13, conducting post 21 are externally provided with ky
A conducting bulge loop 22, ky≤ m, 1≤y≤x, y are integer, i.e., 22 quantity of conducting bulge loop that different connecting poles 20 is included is not
Together, the conducting bulge loop 22 being correspondingly connected in column 20 can be freely designed according to demand, a diameter of R of bulge loop 22 is connected, and bulge loop is connected
The location matches of 22 position and line layer 11, conducting bulge loop 22 are electrically connected for realizing corresponding line layer 11 and conducting post 21
It connects.
Special interlayer interconnection structure is arranged in the utility model, and interconnection structure is equipped with the cavity of both ends connection, has excellent
Heat dissipation performance, it can be ensured that pcb board performance for working for a long time or under high temperature；And interconnection structure can cross-layer realize interconnection lead
It is logical, it is conducive to the design of pcb board；In addition, the installation operation of interconnection structure is simple and convenient, additionally it is possible to it dismantles, it can adjustment layer at any time
Between interconnected relationship.
To improve the heat dissipation performance of pcb board entirety, it is based on above-described embodiment, insulating layer 12 is heat conduction silicone, thermal conductive silicon
Glue is high-end heat conduction compound, has remarkable cold-and-heat resistent alternation performance, ageing-resistant performance and electrical insulation capability, to most of
Metal and nonmetallic materials have good caking property, heat conductivility better than general resin.
To further increase the interconnection performance between each line layer 11, it is based on any of the above-described embodiment, conducting bulge loop 22 is gold
Belong to silver-colored bulge loop, the resistance of metallic silver is low, perfect heat-dissipating, can further increase the reliability and electric conductivity of interconnection structure.
To prevent conducting bulge loop 22 from misplacing, it is based on any of the above-described embodiment, is arranged with outside one end of conducting post 21
Insulate bulge loop 23, and the outer diameter of insulation bulge loop 23 is p, p>R, insulation bulge loop 23 are located in one of outside outermost line layer 11.
Based on above-described embodiment, the one end of conducting post 21 far from insulation bulge loop 23 is connected with insulating nut 24, absolutely
The outer diameter of edge nut 24 is q, q>R, insulating nut 24 are located at outside outermost line layer 11, that is, are located remotely from insulation bulge loop 23 1
Outside the outermost layer line layer 11 of side.24 coordinated insulation bulge loop 23 of insulating nut can effectively limit conducting post 21 and each interlayer
Relative position, so that it is guaranteed that conducting bulge loop 22 can contact connection with corresponding line layer 11.
To improve the heat dissipation performance of connecting pole 20, it is based on any of the above-described embodiment, the inner wall of conducting post 21 is equipped with several
Radiating fin 25.
To further increase the heat dissipation performance of connecting pole 20, it is based on above-described embodiment, radiating fin 25 shifts to install.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (7)
1. a kind of heat radiating type high density interconnects pcb board, including the m sandwich circuits layer (11) and n-layer insulating layer (12) being stacked, phase
One layer of insulating layer (12) is equipped between adjacent two layers of line layer (11), m=n+1, n are the integer more than or equal to 2, special
Sign is that running through in insulating layer (12) described in the m layers of line layer (11) and n-layer has x through-hole (13), and x is whole more than 1
Number, a diameter of R of the through-hole (13) are each equipped with a connecting pole (20) in the through-hole (13)；
The outer diameter of the conducting post (21) that the connecting pole (20) is led in including, the conducting post (21) is r, r<R, it is described to lead
Electric cylinder (21) is externally provided with kyA conducting bulge loop (22), ky≤ m, 1≤y≤x, y are integer, the diameter of the conducting bulge loop (22)
For R, the location matches of the position and the line layer (11) of the conducting bulge loop (22).
2. a kind of heat radiating type high density according to claim 1 interconnects pcb board, which is characterized in that the insulating layer (12)
For heat conduction silicone.
3. a kind of heat radiating type high density according to claim 1 or 2 interconnects pcb board, which is characterized in that the conducting bulge loop
(22) it is metallic silver bulge loop.
4. a kind of heat radiating type high density according to claim 1 interconnects pcb board, which is characterized in that the conducting post
(21) insulation bulge loop (23) is arranged with outside one end, the outer diameter of the insulation bulge loop (23) is p, p>R, the insulation bulge loop (23)
It is located in one of the outermost line layer (11) outside.
5. a kind of heat radiating type high density according to claim 4 interconnects pcb board, which is characterized in that the conducting post
(21) one end far from the insulation bulge loop (23) is connected with insulating nut (24), and the outer diameter of the insulating nut (24) is
Q, q>R, the insulating nut (24) are located at the outermost line layer (11) outside.
6. a kind of heat radiating type high density according to claim 1 interconnects pcb board, which is characterized in that the conducting post
(21) inner wall is equipped with several radiating fins (25).
7. a kind of heat radiating type high density according to claim 6 interconnects pcb board, which is characterized in that the radiating fin
(25) it shifts to install.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038825.6U CN207692154U (en) | 2018-01-08 | 2018-01-08 | A kind of heat radiating type high density interconnection pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820038825.6U CN207692154U (en) | 2018-01-08 | 2018-01-08 | A kind of heat radiating type high density interconnection pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207692154U true CN207692154U (en) | 2018-08-03 |
Family
ID=62991475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820038825.6U Expired - Fee Related CN207692154U (en) | 2018-01-08 | 2018-01-08 | A kind of heat radiating type high density interconnection pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207692154U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278237A (en) * | 2020-02-16 | 2020-06-12 | 苏州浪潮智能科技有限公司 | Through hole filling and HDI fusion processing technology |
| CN112040640A (en) * | 2020-09-16 | 2020-12-04 | 广州深卓信息科技有限公司 | Multilayer PCB circuit board and assembly device thereof |
-
2018
- 2018-01-08 CN CN201820038825.6U patent/CN207692154U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278237A (en) * | 2020-02-16 | 2020-06-12 | 苏州浪潮智能科技有限公司 | Through hole filling and HDI fusion processing technology |
| CN111278237B (en) * | 2020-02-16 | 2021-08-20 | 苏州浪潮智能科技有限公司 | Through hole filling and HDI fusion processing technology |
| CN112040640A (en) * | 2020-09-16 | 2020-12-04 | 广州深卓信息科技有限公司 | Multilayer PCB circuit board and assembly device thereof |
| CN112040640B (en) * | 2020-09-16 | 2021-11-26 | 宁波市国华光电科技有限公司 | Multilayer PCB circuit board and assembly device thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9185791B2 (en) | Manufacturing method of printing circuit board with micro-radiators | |
| US8315678B2 (en) | Systems, methods, and apparatus for multilayer superconducting printed circuit boards | |
| US20070010086A1 (en) | Circuit board with a through hole wire and manufacturing method thereof | |
| CN108364921A (en) | It is removed from the High Efficiency Thermal for the component load-bearing part for being embedded with diode | |
| JP6221221B2 (en) | Electronic component built-in substrate and manufacturing method thereof | |
| US20150382459A1 (en) | Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad | |
| CN207692154U (en) | A kind of heat radiating type high density interconnection pcb board | |
| JP2019145760A (en) | Interposer and printed circuit board including the same | |
| CN107734837B (en) | PCB capable of fast radiating | |
| CN207720519U (en) | A kind of High density of PCB harden structure being easy to interconnection | |
| CN104968138B (en) | A kind of printed circuit board (PCB) | |
| CN206686441U (en) | Flexible circuit board heat radiation structure and wearing equipment | |
| CN111010801A (en) | Double-side heat dissipation chip packaging structure, method and device | |
| CN107734838B (en) | PCB capable of fast radiating | |
| CN107708291A (en) | Printed circuit board (PCB) and mobile terminal | |
| CN205051965U (en) | Compound heat conduction circuit board | |
| CN210840197U (en) | High-efficient heat dissipation printed circuit board structure | |
| CN210351765U (en) | Multilayer rigid-flex printed circuit board | |
| CN209488907U (en) | A kind of bend-resistance flexible circuitry soft board | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN206365147U (en) | Multilayer board | |
| CN207766641U (en) | A kind of multi-layer H DI plates of high stability | |
| CN207692144U (en) | A kind of two-sided copper foil circuit adds aluminium to radiate layer circuit board | |
| CN102299080A (en) | Substrate and processing method thereof | |
| CN207692157U (en) | It is a kind of that there is the High density of PCB plate for stablizing interconnection structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180803 Termination date: 20210108 |