CN209488907U - A kind of bend-resistance flexible circuitry soft board - Google Patents
A kind of bend-resistance flexible circuitry soft board Download PDFInfo
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- CN209488907U CN209488907U CN201822277015.9U CN201822277015U CN209488907U CN 209488907 U CN209488907 U CN 209488907U CN 201822277015 U CN201822277015 U CN 201822277015U CN 209488907 U CN209488907 U CN 209488907U
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- layer
- copper foil
- foil layer
- wiring board
- bent area
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Abstract
The utility model discloses a kind of bend-resistance flexible circuitry soft boards, including wiring board ontology, the wiring board ontology includes bent area, the wiring board ontology includes PET base, the first copper foil layer and following layer are disposed on the inside of PET base at the bent area, PET base has been orderly arranged outside each following layer at the bent area, second copper foil layer, insulating layer, third copper foil layer and protective film layer, with splendid heat dissipation effect, heat conduction and heat radiation is carried out to wiring board by the first copper foil layer and the second copper foil layer and heat release hole, long service life, and wiring board is bent to double-layered circuit board at bent area, reduce volume, improve practicability, the cost of material is low, stability is good.
Description
Technical field
The utility model relates to flexible circuit board field, specially a kind of bend-resistance flexible circuitry soft board and its preparation side
Method.
Background technique
Flexible circuit board is also known as " soft board ", is the printed circuit made of insulating substrate flexible.Flexible circuit provides excellent
Good electrical property is able to satisfy smaller and more high-density installation design needs, it helps reduces assembling procedure and enhancing can
By property.Flexible circuit board is the only solution for meeting miniaturization of electronic products and movement requirement.It can be with free bend, volume
Around, fold, millions of time dynamic bendings can be born without damaging conducting wire, any arrangement can be required according to space layout, and
It is arbitrarily moved and flexible in three-dimensional space, to reach the integration that components and parts assembling is connected with conducting wire；Flexible circuit board can be big
The big volume and weight for reducing electronic product, is applicable in the needs that electronic product develops to high density, miniaturization, highly reliable direction.
Traditional flexible circuit board heat dissipation effect is poor, and service life is short, although being able to carry out bending, for opposite practicability, but
Be single-layer flexible wiring board bending after practicability it is not high, in addition, material cost is high, therefore, it is necessary to a kind of bend-resistance flexible wires
Road soft board and preparation method thereof.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of bend-resistance flexible circuitry soft board and preparation method thereof
The problem of being proposed in background technique.
To achieve the above object, the utility model provides the following technical solutions:
A kind of bend-resistance flexible circuitry soft board, including wiring board ontology, the wiring board ontology includes bent area, the line
Road plate ontology includes PET base, is disposed with the first copper foil layer and following layer on the inside of PET base at the bent area, described
PET base has been orderly arranged outside each following layer, the second copper foil layer, insulating layer, third copper foil layer and protective film layer at bent area.
As a further solution of the present invention: being provided on first copper foil layer, PET base and the second copper foil layer
Several heat release holes, PET base is provided with several heat release holes at the bent area.
As a further solution of the present invention: first copper foil layer and the second copper foil layer disconnect at bent area
Setting.
As a further solution of the present invention: the insulating layer passes through with the second copper foil layer and third copper foil layer respectively
Following layer connection, the third copper foil layer are connected with protective film layer by following layer, and first copper foil layer and PET base pass through
Following layer connection.
As a further solution of the present invention: the following layer uses epoxy resin adhesive.
As a further solution of the present invention: the insulating layer uses PI insulation film.
It is a kind of based on a kind of above-mentioned bend-resistance flexible circuitry soft board and preparation method thereof, it is characterised in that: specifically include
Following steps:
S1: coiled flexible PET coiled material is cut into monolithic PET wiring board base；
S2: following layer is covered in the wiring board base two sides of monolithic；
S3: bonding the first copper foil layer of setting and the second copper foil layer outside the following layer of the wiring board base two sides of monolithic, the
One copper foil layer and the second copper foil layer two sides at bent area bond respectively；
S4: it drills to the single sheet line plate that S3 is obtained；
S5: following layer, PI layers, following layer, third copper foil layer, then are successively covered on the outside of the single sheet line plate that S4 is obtained
Layer, protective film layer；
S6: the single sheet line plate that S5 is obtained is pressed；
S7: covering following layer on the inside of the single sheet line plate in S6, bent at bent area, and by following layer into
Row connection；
S8: the single sheet line plate that S8 is obtained is pressed.
As a further solution of the present invention: the bit diameter of drilling is 0.6mm-0.8mm.
Compared with prior art, the utility model has the beneficial effects that the utility model has splendid heat dissipation effect, lead to
It crosses the first copper foil layer and the second copper foil layer and heat release hole and heat conduction and heat radiation, long service life, and in bent area is carried out to wiring board
Wiring board is bent to double-layered circuit board by place, reduces volume, improves practicability, the cost of material is low, and stability is good.
Detailed description of the invention
Fig. 1 is a kind of deployed configuration schematic diagram of bend-resistance flexible circuitry soft board and preparation method thereof；
Fig. 2 is a kind of bending structure schematic diagram of bend-resistance flexible circuitry soft board and preparation method thereof.
In figure: 1- protective film layer, 2- third copper foil layer, 3- insulating layer, the second copper foil layer of 4-, 5- wiring board ontology, 6-PET
Base, the first copper foil layer of 7-, 8- following layer, 9- heat release hole, the bent area 10-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1~2 are please referred to, the utility model provides a kind of technical solution: a kind of bend-resistance flexible circuitry soft board, including line
Road plate ontology 5, the wiring board ontology 5 include bent area 10, and the wiring board ontology 5 includes PET base 6, the bent area
The first copper foil layer 7 and following layer 8 are disposed at 10 on the inside of PET base 6, at the bent area 10 on the outside of PET base 6 successively
It is provided with following layer 8, the second copper foil layer 4, insulating layer 3, third copper foil layer 2 and protective film layer 1.
First copper foil layer 7 and the second copper foil layer 4 are for the conductive force that radiates, and insulating layer 4 is for separating 4 He of the second copper foil layer
Third copper foil layer 2, protective film layer 1 have good insulation protection, and bent area 5 is bent into bilayer as single layer wiring board
Place.
It may be preferred that being provided with several heat release holes 9, institute on first copper foil layer 7, PET base 6 and the second copper foil layer 4
It states PET base 6 at bent area 10 and is provided with several heat release holes 9.
First copper foil layer 7 and the second copper foil layer 4 have good thermal conductivity, along with heat release hole 9 further increase it is thermally conductive
Heat dissipation effect improves the service life of wiring board.
It may be preferred that first copper foil layer 7 and the second copper foil layer 4 are arranged at bent area 10 to disconnect, wiring board exists
Bent area 10 is bent, and is avoided the reduction of 5 inside heat dissipation effect of wiring board ontology, is arranged so disconnecting in bent area 10, and
Reduce material cost.
It may be preferred that the insulating layer 3 is connect with the second copper foil layer 4 and third copper foil layer 2 by following layer 8 respectively, institute
It states third copper foil layer 2 and protective film layer 1 to connect by following layer 8, first copper foil layer 7 and PET base 6 pass through following layer 8
Connection.
It may be preferred that the following layer 8 uses epoxy resin adhesive, each layer of wiring board ontology 5 is close-coupled at
Together, epoxy resin adhesive is current common adhesive, and bonding effect is good.
It may be preferred that the insulating layer 3 uses PI insulation film, PI Kapton is best thin of performance in the world
Film class insulating materials.
It is a kind of based on a kind of above-mentioned bend-resistance flexible circuitry soft board and preparation method thereof, it is characterised in that: specifically include
Following steps:
S1: coiled flexible PET coiled material is cut into monolithic PET wiring board base；
S2: following layer is covered in the wiring board base two sides of monolithic；
S3: bonding the first copper foil layer of setting and the second copper foil layer outside the following layer of the wiring board base two sides of monolithic, the
One copper foil layer and the second copper foil layer two sides at bent area bond respectively；
S4: it drills to the single sheet line plate that S3 is obtained；
S5: following layer, PI layers, following layer, third copper foil layer, then are successively covered on the outside of the single sheet line plate that S4 is obtained
Layer, protective film layer；
S6: the single sheet line plate that S5 is obtained is pressed；
S7: covering following layer on the inside of the single sheet line plate in S6, bent at bent area, and by following layer into
Row connection；
S8: the single sheet line plate that S8 is obtained is pressed.
The bit diameter of drilling is 0.6mm-0.8mm.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. a kind of bend-resistance flexible circuitry soft board, including wiring board ontology (5), it is characterised in that: wiring board ontology (5) packet
Include bent area (10), the wiring board ontology (5) includes PET base (6), at the bent area (10) on the inside of PET base (6) according to
Secondary to be provided with the first copper foil layer (7) and following layer (8), PET base (6) has been orderly arranged outside each then at the bent area (10)
Layer (8), the second copper foil layer (4), insulating layer (3), third copper foil layer (2) and protective film layer (1).
2. a kind of bend-resistance flexible circuitry soft board according to claim 1, it is characterised in that: first copper foil layer (7),
It is provided with several heat release holes (9) on PET base (6) and the second copper foil layer (4), PET base (6) is arranged at the bent area (10)
There are several heat release holes (9).
3. a kind of bend-resistance flexible circuitry soft board according to claim 1, it is characterised in that: first copper foil layer (7)
Setting is disconnected at bent area (10) with the second copper foil layer (4).
4. a kind of bend-resistance flexible circuitry soft board according to claim 1, it is characterised in that: the insulating layer (3) is respectively
It is connect with the second copper foil layer (4) and third copper foil layer (2) by following layer (8), the third copper foil layer (2) and protective film layer
(1) it is connected by following layer (8), first copper foil layer (7) and PET base (6) are connected by following layer (8).
5. a kind of bend-resistance flexible circuitry soft board according to claim 1, it is characterised in that: the following layer (8) uses
Epoxy resin adhesive.
6. a kind of bend-resistance flexible circuitry soft board according to claim 1, it is characterised in that: the insulating layer (3) uses
PI insulation film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822277015.9U CN209488907U (en) | 2018-12-29 | 2018-12-29 | A kind of bend-resistance flexible circuitry soft board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822277015.9U CN209488907U (en) | 2018-12-29 | 2018-12-29 | A kind of bend-resistance flexible circuitry soft board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209488907U true CN209488907U (en) | 2019-10-11 |
Family
ID=68129751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822277015.9U Active CN209488907U (en) | 2018-12-29 | 2018-12-29 | A kind of bend-resistance flexible circuitry soft board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209488907U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548277A (en) * | 2018-12-29 | 2019-03-29 | 万奔电子科技股份有限公司 | A kind of bend-resistance flexible circuitry soft board and preparation method thereof |
-
2018
- 2018-12-29 CN CN201822277015.9U patent/CN209488907U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548277A (en) * | 2018-12-29 | 2019-03-29 | 万奔电子科技股份有限公司 | A kind of bend-resistance flexible circuitry soft board and preparation method thereof |
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