CN105430883B - Flexible PCB and mobile terminal - Google Patents
Flexible PCB and mobile terminal Download PDFInfo
- Publication number
- CN105430883B CN105430883B CN201511026507.5A CN201511026507A CN105430883B CN 105430883 B CN105430883 B CN 105430883B CN 201511026507 A CN201511026507 A CN 201511026507A CN 105430883 B CN105430883 B CN 105430883B
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- Prior art keywords
- layer
- line
- flex area
- flexible pcb
- line layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
Abstract
The invention discloses a kind of flexible PCB and mobile terminals,The first medium layer includes non-flex area and is arranged at the flex area of the non-flex area one side,The flexible PCB includes first medium layer,First line layer and the second line layer,The first line layer corresponds to the first terminals of setting at the non-flex area,And the second connecting line for connecting first terminals is set at the correspondence flex area,It is corresponded to using second line layer and covers the non-flex area,And the first conduct piece is set between second circuit and first terminals,The first line layer corresponds to and is further opened with slot at the flex area,The length direction of the slot and the length direction of first connecting line are set in the same direction,And the slot is between first connecting line and second connecting line,So that flexibility of the flexible PCB in flex area improves.
Description
Technical field
The present invention relates to display area more particularly to a kind of flexible PCBs and mobile terminal.
Background technology
The application of flexible PCB is more and more extensive at present, so as to more and more stringenter to the flexibility requirements of flexible PCB,
However many flexible PCBs use multilayer wiring structure to meet a variety of electric conductivities at present, however by the conduction of multilayer line
Line is guided to the flex area of individual layer line layer, can improve the flexibility of flexible PCB, but due on individual layer line layer
There are spacing between multiple conductor wires, thus in the substrate layer part opposite with the spacing there are stress, so as to cause soft
Property circuit board flexibility it is bad, and then influence flexible PCB use.
The content of the invention
In view of this, the present invention provides a kind of flexible PCB and movement for meeting a variety of electric conductivities and improving flexibility again
Terminal.
The present invention provides a kind of flexible PCB, wherein, the flexible PCB includes first medium layer, first line layer
With the second line layer, the first medium layer includes non-flex area and is arranged at the flex area of the non-flex area one side, described
First line layer fits in the first medium layer one side, and covers the non-flex area and the flex area, the First Line
It is equipped with first line and the first terminals for mutually being disconnected with the first line at the relatively described non-flex area of road floor, described first
The first connecting line for connecting the first line is equipped at the relatively described flex area of line layer and connects first terminals
Second connecting line, second connecting line and first connecting line are arranged side by side, and first connecting line and described second
Towards the direction linear extension away from the non-flex area, the first line layer corresponds to be further opened with connecting line at the flex area
Multiple slots being arranged side by side, the length direction of the slot and the length direction of first connecting line are set in the same direction, and institute
The first connecting line and second connecting line are stated between multiple slots, it is described non-that second line layer corresponds to covering
Flex area, and the second circuit is equipped with, the first terminals of the second circuit of second line layer and the first line layer connect
It is connected to the first conduct piece through the first medium layer.
Wherein, the flexible PCB further includes first protective layer and the second protective layer, first protective layer and
Second protective layer covers the flex area and the non-flex area, and first protective layer fits in the first line
For layer away from the first medium layer one side, second protective layer fits in second line layer away from the first medium layer
One side.
Wherein, the flexible PCB further includes second dielectric layer and tertiary circuit layer, the second dielectric layer and described
Tertiary circuit layer is laminated between the first line layer and first protective layer, the corresponding covering non-flex area, and
And respectively close to the first line layer and first protective layer, the tertiary circuit layer is equipped with tertiary circuit, described first
The second terminals are equipped at the relatively described non-flex area of line layer, and electrical connection described second is equipped at relatively described flex area and is connect
It is conductive to be connected with second for 3rd connecting line of line end between the second terminals and the tertiary circuit of the first line layer
Part.
Wherein, the flexible PCB further includes the 3rd dielectric layer and the 4th line layer, the 3rd dielectric layer and described
4th line layer is laminated between the tertiary circuit layer and first protective layer, the corresponding covering non-flex area, and
And respectively close to the tertiary circuit layer and first protective layer, the 4th line layer is equipped with the 4th circuit, described first
The 3rd terminals are equipped at the relatively described non-flex area of line layer, and electrical connection the described 3rd is equipped at relatively described flex area and is connect
3rd connecting line of line end connects the 3rd conduct piece between the 3rd terminals and the 4th circuit of the first line layer.
Wherein, the flexible PCB further includes the 3rd dielectric layer and the 4th line layer, the 3rd dielectric layer and described
4th line layer is laminated between second line layer and second protective layer, the corresponding covering non-flex area, and
And respectively close to second line layer and second protective layer, the 4th line layer is equipped with the 4th circuit, described first
The 3rd terminals are equipped at the relatively described non-flex area of line layer, and electrical connection the described 3rd is equipped at relatively described flex area and is connect
It is conductive to be connected with the 3rd for 3rd connecting line of line end between the 3rd terminals and the 4th circuit of the first line layer
Part.
Wherein, the flexible PCB further includes second dielectric layer and tertiary circuit layer, the second dielectric layer and described
Tertiary circuit layer is laminated between second line layer and second protective layer, the corresponding covering non-flex area, and
And respectively close to second line layer and second protective layer, the tertiary circuit layer is equipped with tertiary circuit, described first
The second terminals are equipped at the relatively described non-flex area of line layer, and electrical connection described second is equipped at relatively described flex area and is connect
It is conductive to be connected with second for 3rd connecting line of line end between the second terminals and the tertiary circuit of the first line layer
Part.
Wherein, the flexible PCB further includes the 3rd dielectric layer and the 4th line layer, the 3rd dielectric layer and described
4th line layer is laminated between the tertiary circuit layer and second protective layer, the corresponding covering non-flex area, and
And respectively close to the tertiary circuit layer and second protective layer, the 4th line layer is equipped with the 4th circuit, described first
The 3rd terminals are equipped at the relatively described non-flex area of line layer, and electrical connection the described 3rd is equipped at relatively described flex area and is connect
3rd connecting line of line end connects the 3rd conduct piece between the 3rd terminals and the 4th circuit of the first line layer.
Wherein, viscose glue is adhered on the first line layer and institute respectively for first protective layer and second protective layer
It states on the second line layer.
Wherein, the first line layer, which opens up to be through on second line layer at first terminals, connects institute
The via of the second circuit is stated, first conduct piece is fixed in the via.
The present invention also provides a kind of mobile terminal, wherein, the mobile terminal includes body, arranged on the body interior
Flexible PCB described in mainboard and above-mentioned any one, the flexible PCB be arranged on the body interior, and with the master
Plate is electrically connected.
The flexible PCB and mobile terminal of the present invention corresponds to the first connecting line of flex area by the first line layer
It is arranged side by side with second connecting line, extends towards the direction away from the non-flex area, and then reduce the first connecting line and the
Spacing between two connecting lines, so that flexibility of the flexible PCB in flex area improves, the slot is opened in institute
First line layer is stated to correspond at the flex area, it is described soft so as to improve so as to reduce the folding stress of the first line layer
Property circuit board bending it is flexible, and the flexible PCB allow to utilize the first line layer and second circuit
Layer improves electric conductivity.
Description of the drawings
In order to illustrate more clearly of technical scheme, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings are can also be obtained according to these attached drawings.
Fig. 1 is the schematic diagram of the flexible PCB of first embodiment provided by the invention;
Fig. 2 is the top view of the first line layer of the flexible PCB of Fig. 1;
Fig. 3 is the schematic diagram of the flexible PCB of second embodiment;
Fig. 4 is the top view of the first line layer of the flexible PCB of Fig. 3;
Fig. 5 is the schematic diagram of the flexible PCB of 3rd embodiment;
Fig. 6 is the schematic diagram of the flexible PCB of fourth embodiment;
Fig. 7 is the schematic diagram of the flexible PCB of the 5th embodiment;
Fig. 8 is the schematic diagram of the flexible PCB of sixth embodiment.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
It please refers to Fig.1 and Fig. 2, the present invention provides a kind of flexible PCB 100 of first embodiment, the flexible PCB
100 include first medium layer 10, first line layer 20, the second line layer 30, the first protective layer 40 and the second protective layer 50.It is described
First medium layer 10 includes non-flex area 11 and is arranged at the flex area 12 of 11 one side of non-flex area.The first line layer
20 fit in 10 one side of first medium layer, and cover the non-flex area 11 and the flex area 12;The first line
Layer is equipped with first line (not shown) and the first wiring mutually disconnected with the first line at 20 relatively described non-flex area 11
It holds (not shown);The first connecting line for connecting the first line is equipped at the relatively described flex area 12 of the first line layer 20
21 and the second connecting line 22 of first terminals is connected, second connecting line 22 and first connecting line 21 are set side by side
It puts, and first connecting line 21 and second connecting line 22 are towards the direction linear extension away from the non-flex area, it is described
First line layer 20, which corresponds to, is further opened with multiple slots 13 being arranged side by side, the length direction of the slot 13 at the flex area
It is set in the same direction with the length direction of first connecting line 21, and first connecting line 21 and second connecting line 22 are located at
Between multiple slots 13, second line layer 30, which corresponds to, covers the non-flex area 11, and (does not scheme equipped with the second circuit
Show), the first terminals of the second circuit of second line layer 30 and the first line layer 20 are connected with the first conduct piece
31.First protective layer 40 and second protective layer 50 cover the flex area 12 and the non-flex area 11, described
First protective layer 40 fits in the first line layer 20 away from 10 one side of first medium layer, and second protective layer 50 pastes
Deviate from 10 one side of first medium layer together in second line layer 30.
The first terminals of setting at the non-flex area 11 are corresponded to by the first line layer 20, and in the correspondence folding
The second connecting line 22 for connecting first terminals at curved area 12 is set, is corresponded to using second line layer 30 described in covering
Non- flex area 11, and the first conduct piece 31 is set between second circuit 30 and first terminals, so that institute
The flex area 12 for stating flexible PCB 100 carries out connection merely with the first line layer 20, so that the flexibility
Flexibility of the circuit board 100 in flex area 12 improves, and the flexible PCB 100 is allowd to utilize the first line layer
20 and second line layer 20 improve electric conductivity.
In the present embodiment, polyimides or the double stupid diformates of polyethylene can be used in the first medium layer 10
Materials such as (Polyethylene terephthalate PET), in order to set described first on the first medium layer 10
Line layer 20 and second line layer 30, and the first medium layer 10 can be the first line layer 20 and described the
Three line layers 40 provide insulation environment, in order to the etching of the first line layer 20 and second line layer 30.Preferably,
The thickness of the first medium layer 10 can be 20 μm.The non-flex area 11 can be opposite positioned at the both sides of the flex area 12
It sets, so that the flexible PCB 100 realizes the conducting between multiple electronic components and multiple electronic components.
In this embodiment party example, the first line layer 20 is sets the plate of copper foil, the first line layer 20 on film
On first line and the first connecting line 21 be that copper foil is formed according to the etched technique of prescribed route structure.The first line
Layer and first connecting line 21 can be wholely set, and the first line layer and first connecting line 21 form conductor wire
Road, so as to fulfill the conduction between electric elements.First terminals are mutually disconnected with the first line, first wiring
End can be disposed on one end of the second connecting line 22, so as to which first terminals are not interfere with each other with the first line, with
It can be that other more electric elements realizations are conductively connected that toilet, which states the second connecting line 22,.First connecting line 21 and described
Two connecting lines 22 are arranged in the first circuit board and correspond at the flex area 12, so that the first line layer 20 corresponds to
Wiring at the flex area 12 is close, so as to reduce the width that the first line layer 20 corresponds to the flex area 12, so as to
So that the bending part width of the flexible PCB 100 reduces, the flexibility of the flexible PCB 100 is further improved.It is multiple
The slot 13 can run through the first medium layer 10, the first protective layer 40 and second protective layer 50, so that institute
It states the folding stress at the flex area 12 of flexible PCB 100 further to reduce, so as to improve the flexible PCB 100
Bending flexibility.In other embodiments, the first line and first connecting line 21 can also be by more phases
Cable with attribute forms, and the number of first terminals and second connecting line 22 can also be multiple.
In the present embodiment, second line layer 30 is sets the plate of copper foil on film, on second line layer 30
The second circuit formed according to the etched technique of prescribed route structure for copper foil.One end relatively described first of second circuit
Terminals are set, so as to which one end of second circuit be facilitated to be electrically connected first conduct piece 31, first conduct piece
31 one end away from second circuit are electrically connected first terminals.First conduct piece 31 runs through second line
Road floor 30, first medium floor 10 and the first line floor 20, so as to which the second circuit of second line layer 30 electrically be connected
It is connected on the second connecting line 22 on the first line layer 20, so that the first line layer 20 is in the correspondence bending
Multiple circuits at area 12 can be set, so as to which that improves the flexible PCB 100 is conductively connected performance, and improved described soft
The flex capability of property circuit board 100.In other embodiments, the number of second circuit and first conduct piece 211
Can also be multiple.
In the present embodiment, first protective layer 40 and second protective layer 50 may be employed polyester material and carry out hot pressing
Shaping.First protective layer 40 and second protective layer 50 are pasted on the first line layer 20 and institute by viscose glue respectively
It states on the second line layer 30.Specifically, described fit in completely on the first line layer 20, and cover the first line layer
First line, the first connecting line 21 and the second connecting line 22 on 20, to protect the first line, the first connecting line 21 and
The cabling of two connecting lines 22 is not lost or is damaged, meanwhile, by the way of paste adhesive, it is also possible that described first
Protective layer 40 and the connection of the first line layer 20 are closer, prevent first protective layer 40 from shifting and can not be to exposing the
The part first line of one protective layer 40, the first connecting line 21 and the second connecting line 22 are protected.Second protective layer 50
Setting identical with 40 structure of the first protective layer, unlike, second protective layer 50 is except fitting in second line
It on road floor 30, also fits on the flex area 12 of the first medium layer 10, so as to fulfill the leakproofness to second circuit
More preferably, and the switching performance of second circuit is improved.In other embodiments, first protective layer 40 and described second
Protective layer 50 can also be to be carved using spraying plated film mode and be plated on the first line layer 20 and second line layer 30.
In the present embodiment, the first line layer 20 opens up at first terminals is through to second line layer
The via 20a of second circuit is connected on 30, first conduct piece 31 is fixed in the via 20a.It is specifically, described
Via 20a also extends through the first medium layer 10 and second line layer 30, and first conduct piece 31 is through the mistake
The copper post of hole 20a.First conduct piece 31 sequentially passes through the first line layer 20, first medium layer 10 and second line
Road floor 30, so that the second circuit of second line layer 30 can be connected to the second connection of the first line layer 20
Line 22, so as to ensure that the cabling requirement of the multi-line of the flexible PCB 100.
Further, Fig. 3 and Fig. 4 are referred to, it is and described the present invention also provides the flexible PCB 200 of second embodiment
Flexible PCB 100 is roughly the same, the difference is that the flexible PCB 200 further includes second dielectric layer 210 and tertiary circuit
Layer 230, the second dielectric layer 210 and the tertiary circuit layer 230 are laminated in the first line layer 20 and described first
It is corresponding to cover the non-flex area 11 between protective layer 40, and protected respectively close to the first line layer 20 and described first
Sheath 40.The tertiary circuit layer 40 is equipped with tertiary circuit (not indicating), the relatively described non-flex area of the first line layer 20
The second terminals (not indicating) are equipped at 11, and is equipped at relatively described flex area 12 and is electrically connected the 3rd of second terminals
Connecting line 23 is connected with the second conduct piece 41 between second terminals 22 of the first line layer 20 and the tertiary circuit.
Specifically, the second dielectric layer 210 is roughly the same with 10 structure of first medium layer, unlike, it is described
The only corresponding non-flex area 11 for covering the first medium layer 10 of second dielectric layer 210.The second dielectric layer 210 is described the
Three line layers 230 and the first line layer 20 provide insulation environment.The second dielectric layer 210 can be use it is hot-forming
Technique is fitted on the first line layer 20.The tertiary circuit layer 230 is only corresponding to cover the non-of the first medium layer 10
Flex area 11, the tertiary circuit on the tertiary circuit layer 230 can be distinguished with the first line on the first line layer 20
Connect different electronic components.Second terminals 22 of the first line layer 20 are electrically connected by second conduct piece 41
The tertiary circuit is connect, so that the tertiary circuit is electrically connected on the 3rd connecting line 23, and then ensure that institute
More electronic components can further be connected by stating flexible PCB 100, improved electric conductivity, while caused the flexible circuit
Plate 100 can bending part merely with 20 cabling of first line layer so that the flexible PCB 100 is in bending part
Flexibility improves.3rd connecting line 23 is arranged side by side with second connecting line 22 and first connecting line 21, and in the same direction
Extension, so as to reduce 12 width of flex area of the flexible PCB 200, so as to improve the bending of the flexible PCB 200
It is flexible.Second conduct piece 41 setting identical with 31 structure of the first conduct piece, the tertiary circuit layer 230, second are situated between
Matter layer 210 and first line layer 20 set the via (not indicating) to connect, and two conduct piece 41 is arranged in the via,
Second conduct piece 41 sequentially passes through the tertiary circuit layer 230, second dielectric layer 210 and first line layer 20, and described
Second conduct piece 41 is disconnected with 31 phase of the first conduct piece, so as to ensure that the conduction property of the flexible PCB 100.
Further, referring to Fig. 5, the present invention also provides 3rd embodiment flexible PCB 300, with the flexible electrical
Road plate 200 is roughly the same, the difference is that the flexible PCB 300 further includes the 3rd dielectric layer 310 and the 4th line layer 340,
3rd dielectric layer 310 and the 4th line layer 340 are laminated in the tertiary circuit layer 230 and first protective layer
It is corresponding to cover the non-flex area 11 between 40, and respectively close to the tertiary circuit layer 230 and first protective layer
40.4th line layer 340 is equipped with the 4th circuit (not indicating), at the relatively described non-flex area 11 of the first line layer 20
The 3rd company for being electrically connected the 3rd terminals 23 is equipped with equipped with the 3rd terminals (not shown), and at relatively described flex area 12
Wiring connects the 3rd conduct piece 51 between the 3rd terminals and the 4th circuit of the first line layer 20.
Specifically, the 3rd dielectric layer 310 setting identical with 210 structure of second dielectric layer, the 3rd medium
Layer 310 is hot-forming between three line layer 230 and the 4th line layer 340.4th line layer 340 fits in
Between 3rd dielectric layer 310 and first protective layer 40.4th circuit of the 4th line layer 340 is through the described 3rd
Conduct piece 51 is connected to the 3rd connecting line on the first line layer 20, so that the flexible PCB 100 can be into
One step connects more electronic components, so as to improve the performance of the flexible PCB 100, and the flexible PCB
100 can bending part individual layer line layer is still set into walking line, ensure the flexibility of the flexible PCB 100.Described 3rd
The setting identical with 41 structure of the second conduct piece of conduct piece 51, the 3rd conduct piece 51 sequentially pass through the 4th line layer
340th, the 3rd dielectric layer 310, tertiary circuit layer 230, second dielectric layer 210 and the first line layer 20.
Further, referring to Fig. 6, the present invention also provides fourth embodiment flexible PCB 400, with the flexible electrical
Road plate 300 is roughly the same, unlike, the 3rd dielectric layer 410 and the 4th line layer 440 are laminated in described second
It is corresponding to cover the non-flex area 11 between line layer 30 and second protective layer 50, and respectively close to second line
Road floor 30 and second protective layer 50, the 4th line layer 440 are equipped with the 4th circuit, and the first line layer 20 is with respect to institute
It states and the 3rd terminals 423 is equipped at non-flex area 11, and be equipped at relatively described flex area 12 and be electrically connected the 3rd terminals
423 the 3rd connecting line is connected with the 3rd between the 3rd terminals 423 and the 4th circuit of the first line layer 20 and leads
Electric part 451.3rd conduct piece 451 setting identical with 41 structure of the second conduct piece, the 3rd conduct piece 451 is successively
Through the 4th line layer 440, the 3rd dielectric layer 410, the second line layer 30, first medium layer 10 and the first line layer
20.3rd dielectric layer 410 and the 4th line layer 440 are arranged at second line layer 30 and second protection
Between layer 50 so that the both sides of the first medium layer 10 set the line layer of the identical number of plies, so that the first medium
The consistency of thickness of 10 both sides of layer, so that the connection mode at non-flex area of the flexible PCB 100 increases, described in raising
The use function of flexible PCB 100.
Further, referring to Fig. 7, the present invention also provides the 5th embodiment flexible PCB 500, with the flexible electrical
Road plate 200 is roughly the same, unlike, 530 layers of the second dielectric layer 510 and the tertiary circuit are laminated in described second
It is corresponding to cover the non-flex area 11 between line layer 30 and second protective layer 50, and respectively close to second line
Road floor 30 and second protective layer 50, the tertiary circuit layer 530 are equipped with tertiary circuit, and the first line layer 20 is with respect to institute
It states and the second terminals (not indicating) is equipped at non-flex area 11, and electrical connection described second is equipped at relatively described flex area 12 and is connect
It is conductive to be connected with second for 3rd connecting line of line end between the second terminals and the tertiary circuit of the first line layer 20
Part 541.Second conduct piece 541 sequentially passes through the tertiary circuit layer 530,510 second line layer of the second dielectric layer
30th, the first medium layer 10 and the first line layer 20.
Further, referring to Fig. 8, the present invention also provides the 5th embodiment flexible PCB 600, with the flexible electrical
Road plate 300 is roughly the same, unlike, the 3rd dielectric layer 610 and the 4th line layer 640 are laminated in the described 3rd
It is corresponding to cover the non-flex area 11 between line layer 630 and second protective layer 50, and respectively close to the 3rd line
Road floor 630 and second protective layer 50, the 4th line layer 640 are equipped with the 4th circuit, and the first line layer 20 is opposite
The 3rd terminals (not indicating) are equipped at the non-flex area 11, and electrical connection the described 3rd is equipped at relatively described flex area 12
It is conductive to connect the 3rd for 3rd connecting line of terminals between the 3rd terminals and the 4th circuit of the first line layer 20
Part 61.3rd conduct piece 61 sequentially passes through the 4th line layer 640, the 3rd dielectric layer 610, tertiary circuit layer 630, institute
State second dielectric layer 610, the second line layer 30, the first medium layer 10 and the first line layer 20.
The present invention also provides a kind of mobile terminal (not shown), the mobile terminal includes body (not shown), arranged on institute
The mainboard (not shown) of body interior and the flexible PCB 100 are stated, the flexible PCB 100 is arranged in the body
Portion, and be electrically connected with the mainboard.The mobile terminal can be mobile phone, computer, tablet, handheld device or media player
Deng.
The flexible PCB and mobile terminal of the present invention is corresponded to by the first line layer and set at the non-flex area
First terminals, and the second connecting line for connecting first terminals is set at the correspondence flex area utilize described the
Two line layers, which correspond to, covers the non-flex area, and the first conduction is set between second circuit and first terminals
Part, so that the flex area of the flexible PCB carries out connection merely with the first line layer, so that institute
It states flexibility of the flexible PCB in flex area to improve, and then reduces width of the flexible PCB in flex area, so that
Flexibility of the flexible PCB in flex area improves, and the slot is opened in the first line layer and corresponds to the flex area
Place so as to reduce the folding stress of the first line layer, so as to improve the bending of flexible PCB flexibility, and causes
The flexible PCB can utilize the first line layer and second line layer to improve electric conductivity.
The above are the preferred embodiment of the present invention, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (10)
1. a kind of flexible PCB, which is characterized in that the flexible PCB includes first medium layer, first line layer and second
Line layer, the first medium layer include non-flex area and are arranged at the flex area of the non-flex area one side, the First Line
Road floor fits in the first medium floor one side, and covers the non-flex area and the flex area, the first line layer phase
To being equipped with first line and the first terminals mutually disconnected with the first line, the first line layer at the non-flex area
The first connecting line for connecting the first line is equipped at relatively described flex area and connects the second of first terminals and is connected
Wiring, second connecting line and first connecting line are arranged side by side, and first connecting line and second connecting line
Towards the direction linear extension away from the non-flex area, the first line layer corresponds to and is further opened with slot at the flex area,
The length direction of the slot and the length direction of first connecting line are set in the same direction, and the slot is located at described first and connects
Between wiring and second connecting line, second line layer, which corresponds to, covers the non-flex area, and equipped with the second circuit, institute
First terminals of the second circuit and the first line layer of stating the second line layer are connected with through the first medium layer
First conduct piece.
2. flexible PCB according to claim 1, which is characterized in that the flexible PCB further includes the first protective layer
With the second protective layer, first protective layer and second protective layer cover the flex area and the non-flex area, institute
It states the first protective layer and fits in the first line layer away from the first medium layer one side, second protective layer fits in institute
The second line layer is stated away from the first medium layer one side.
3. flexible PCB according to claim 2, which is characterized in that the flexible PCB further includes second dielectric layer
With tertiary circuit layer, the second dielectric layer and the tertiary circuit layer are laminated in the first line layer and described first and protect
It is corresponding to cover the non-flex area between sheath, and respectively close to the first line layer and first protective layer, it is described
Tertiary circuit layer is equipped with tertiary circuit, and the second terminals are equipped at the relatively described non-flex area of the first line layer, and opposite
Be equipped with the 3rd connecting line for being electrically connected second terminals at the flex area, the second terminals of the first line layer and
The second conduct piece is connected between the tertiary circuit.
4. flexible PCB according to claim 3, which is characterized in that the flexible PCB further includes the 3rd dielectric layer
With the 4th line layer, the 3rd dielectric layer and the 4th line layer are laminated in the tertiary circuit layer and described first and protect
It is corresponding to cover the non-flex area between sheath, and respectively close to the tertiary circuit layer and first protective layer, it is described
4th line layer is equipped with the 4th circuit, and the 3rd terminals are equipped at the relatively described non-flex area of the first line layer, and opposite
Be equipped with the 3rd connecting line for being electrically connected the 3rd terminals at the flex area, the 3rd terminals of the first line layer and
The 3rd conduct piece is connected between 4th circuit.
5. flexible PCB according to claim 3, which is characterized in that the flexible PCB further includes the 3rd dielectric layer
With the 4th line layer, the 3rd dielectric layer and the 4th line layer are laminated in second line layer and described second and protect
It is corresponding to cover the non-flex area between sheath, and respectively close to second line layer and second protective layer, it is described
4th line layer is equipped with the 4th circuit, and the 3rd terminals are equipped at the relatively described non-flex area of the first line layer, and opposite
Be equipped with the 3rd connecting line for being electrically connected the 3rd terminals at the flex area, the 3rd terminals of the first line layer and
The 3rd conduct piece is connected between 4th circuit.
6. flexible PCB according to claim 2, which is characterized in that the flexible PCB further includes second dielectric layer
With tertiary circuit layer, the second dielectric layer and the tertiary circuit layer are laminated in second line layer and described second and protect
It is corresponding to cover the non-flex area between sheath, and respectively close to second line layer and second protective layer, it is described
Tertiary circuit layer is equipped with tertiary circuit, and the second terminals are equipped at the relatively described non-flex area of the first line layer, and opposite
Be equipped with the 3rd connecting line for being electrically connected second terminals at the flex area, the second terminals of the first line layer and
The second conduct piece is connected between the tertiary circuit.
7. flexible PCB according to claim 6, which is characterized in that the flexible PCB further includes the 3rd dielectric layer
With the 4th line layer, the 3rd dielectric layer and the 4th line layer are laminated in the tertiary circuit layer and described second and protect
It is corresponding to cover the non-flex area between sheath, and respectively close to the tertiary circuit layer and second protective layer, it is described
4th line layer is equipped with the 4th circuit, and the 3rd terminals are equipped at the relatively described non-flex area of the first line layer, and opposite
Be equipped with the 3rd connecting line for being electrically connected the 3rd terminals at the flex area, the 3rd terminals of the first line layer and
The 3rd conduct piece is connected between 4th circuit.
8. flexible PCB according to claim 2, which is characterized in that first protective layer and second protective layer
Respectively viscose glue be adhered on the first line layer and second line layer on.
9. flexible PCB according to claim 1, which is characterized in that the first line layer is in first terminals
Place opens up the via for being through to and second circuit being connected on second line layer, and first conduct piece is fixed on the mistake
In hole.
10. a kind of mobile terminal, which is characterized in that the mobile terminal include body, arranged on the body interior mainboard with
And the flexible PCB as described in claim 1~9 any one, the flexible PCB be arranged on the body interior, and with institute
State mainboard electrical connection.
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CN201511026507.5A CN105430883B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB and mobile terminal |
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CN105430883A CN105430883A (en) | 2016-03-23 |
CN105430883B true CN105430883B (en) | 2018-05-29 |
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CN107801295A (en) * | 2017-10-16 | 2018-03-13 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
CN110248502A (en) * | 2019-07-02 | 2019-09-17 | 高德(无锡)电子有限公司 | A kind of processing technology of the Rigid Flex of multilayer soft board |
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CN1956619A (en) * | 2005-10-26 | 2007-05-02 | 恩益禧电子股份有限公司 | Flexible board |
CN204482149U (en) * | 2014-12-30 | 2015-07-15 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible PCB |
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CN205335029U (en) * | 2013-02-19 | 2016-06-22 | 株式会社村田制作所 | Inductance bridge and electronic equipment |
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CN1956619A (en) * | 2005-10-26 | 2007-05-02 | 恩益禧电子股份有限公司 | Flexible board |
CN204482149U (en) * | 2014-12-30 | 2015-07-15 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible PCB |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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