CN204482149U - Flexible PCB - Google Patents
Flexible PCB Download PDFInfo
- Publication number
- CN204482149U CN204482149U CN201420854728.6U CN201420854728U CN204482149U CN 204482149 U CN204482149 U CN 204482149U CN 201420854728 U CN201420854728 U CN 201420854728U CN 204482149 U CN204482149 U CN 204482149U
- Authority
- CN
- China
- Prior art keywords
- flexible pcb
- groove
- conductive circuit
- circuit layer
- reinforcing chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 14
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 13
- -1 PI) Polymers 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
A kind of flexible PCB, this flexible PCB comprise one first side, second side parallel with this first side, one with the first surface of this first lateral vertical and a second surface parallel with this first surface, this first side and this second side are formed with the groove that at least two run through this first surface and this second surface respectively, and the position of every two these grooves is relative; The edge of this groove each is formed with one around this groove and the reinforcing chip of this first surface parallel, and this reinforcing chip each comprises a main part, and this main part comprises one first medial surface, the inwall copline of this groove that this first medial surface is corresponding with it.The flexible PCB that the utility model provides can accurate position of broken line, and after reducing again folding, risk is torn in bounce-back risk and bending place.
Description
Technical field
The utility model relates to circuit board technology field, particularly relates to a kind of flexible PCB.
Background technology
At present, many flexible PCBs have high complexity, high accuracy, the broken line requirement of high density.In theory, flexible PCB should be bent along the folding line that presets, and the distance departing from the folding line that this is preset during bending should in a bending accuracy rating, but in fact, this type of flexible PCB is when using bending jig to bend flexible PCB, often run into actual position of broken line and exceed accuracy rating required by product, do not reach the problem of the Product Precision of customer requirement.In addition, in bending process, rebound after the bending place of flexible PCB also exists folding and tear risk.
Utility model content
In view of this, the utility model provides one can accurate position of broken line, and after reducing again folding, the flexible PCB of risk is torn in bounce-back risk and bending place.
A kind of flexible PCB, this flexible PCB comprise one first side, second side parallel with this first side, one with the first surface of this first lateral vertical and a second surface parallel with this first surface, this first side and this second side are formed with the groove that at least two run through this first surface and this second surface respectively, and the position of every two these grooves is relative; The edge of this groove each is formed with one around this groove and the reinforcing chip of this first surface parallel, and this reinforcing chip each comprises a main part, and this main part comprises one first medial surface, the inwall copline of this groove that this first medial surface is corresponding with it.
The flexible PCB that the utility model provides, this flexible PCB increases at least one pair of groove, can the position of broken line of accurate this flexible PCB, and rebound after reducing again the folding of this flexible PCB risk.This flexible PCB increases at least one pair of reinforcing chip, and risk is torn in the bending place that can reduce this flexible PCB.
Accompanying drawing explanation
Fig. 1 is the vertical view of the flexible PCB of the utility model first embodiment.
Fig. 2 is the cutaway view of the II-II along the flexible PCB shown in Fig. 1.
Fig. 3 is the cutaway view of the flexible PCB of the second embodiment.
Fig. 4 is the bending action reference diagram of the flexible PCB shown in Fig. 2.
Main element symbol description
| Flexible PCB | 100、200 |
| Substrate layer | 10 |
| 3rd surface | 101 |
| 4th surface | 102 |
| First conductive circuit layer | 11 |
| Second conductive circuit layer | 12 |
| First cover layer | 13 |
| Second cover layer | 14 |
| First side | 15 |
| Second side | 16 |
| First surface | 17 |
| Second surface | 18 |
| Groove | 19 |
| Sidewall | 191 |
| Diapire | 192 |
| First reinforcing chip | 20、30 |
| Second reinforcing chip | 21、31 |
| Main part | 22 |
| First medial surface | 221 |
| First lateral surface | 222 |
| Extension | 23 |
| Second medial surface | 231 |
| Second lateral surface | 232 |
Following embodiment will further illustrate the utility model in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 to Fig. 4, the structure of the utility model to a kind of flexible PCB is further described.
Refer to Fig. 1 and Fig. 2, a kind of flexible PCB 100 that the utility model first embodiment provides, this flexible PCB 100 comprises substrate layer 10,1 first conductive circuit layer 11,1 second conductive circuit layer 12,1 first cover layer 13 and one second cover layer 14.
Refer to Fig. 1, this flexible PCB 100 also comprises one first side 15, one and opposing the second side 16, this first side 15, one and the first surface 17 that intersects vertically of this first side 15 and one and the opposing second surface 18 of this first surface 17.
The material of this substrate layer 10 is selected from polyimides (polyimide, PI), PETG (Polyethylene Terephthalate, PET) one, in the material such as PEN (Polyethylene Naphthalate, PEN).
This substrate layer 10 comprises the 4th opposing surface 102 of the one the 3rd surperficial 101 and the one and the 3rd surface 101.This first conductive circuit layer 11 is formed on the 3rd surface 101, and this second conductive circuit layer 12 is formed on the 4th surface 102.This first conductive circuit layer 11 and this second conductive circuit layer 12 include many conducting wires.
This first cover layer 13 is formed on the face away from the 3rd surface 101 of this first conductive circuit layer 11, and this second cover layer 14 is formed on the face away from the 4th surface 102 of this second conductive circuit layer 12.
The same position of this flexible PCB 100 from this first side 15 and this second side 16 extends to the internal vertical of this flexible PCB 100 and is formed with a groove 19 respectively.Two these grooves 19 all run through this first surface 17 and this second surface 18 of this flexible PCB 100.The line of centres A of the opening of the opening of this groove 19 of this side, the first side 15 and this groove 19 of this side, the second side 16 and described first side 15 and the second side 16 all perpendicular.
The shape of two these grooves 19 and size are all identical.In the present embodiment, this groove 19 is roughly U-shaped, and it comprises two relatively and the sidewall 191 roughly paralleled and a diapire 192, defines the inwall that two these sidewalls 191 and this diapire 192 are this groove 19.Two these sidewalls 191 and this first side 15 and this second side 16 perpendicular, and two of this groove 19 of this side, the first side 15 these sidewalls 191 smoothly connect with this first side 15 respectively, two these sidewalls 191 of this groove 19 of this side, the second side 16 smoothly connect with this second side 16 respectively, this diapire 192 is the part on the face of cylinder, and this diapire 192 of homonymy smoothly connects with this sidewall 191.
In other embodiments, two of this side, the first side 15 these sidewalls 191 also can be connected with this first side 15 is directly vertical, and two of this side, the second side 16 these sidewalls 191 also can be connected with this second side 16 is directly vertical.
In other embodiments, this groove 19 also can other shapes, as being semi-cylindrical, namely do not comprise this two sidewalls 191.
This flexible PCB 100 also comprises two the first reinforcing chips 20 and two the second reinforcing chips 21.This first reinforcing chip 20 and this second reinforcing chip 21 be respectively formed at two these grooves 19 edge and around covering this groove 19.In the present embodiment, the material of this first reinforcing chip 20 and the second reinforcing chip 21 is copper.Two these the first reinforcing chips 20 are formed at the 3rd surface 101, two these the second reinforcing chips 21 are formed at the 4th surface 102, and this first reinforcing chip 20 and this second reinforcing chip 21 are all formed with these many conducting wires of position and this substrate layer 10 homonymy simultaneously, and be positioned on same layer, also namely this first reinforcing chip 20 is formed with this first conductive circuit layer 11 simultaneously, and be positioned on same layer with this first conductive circuit layer 11, this second reinforcing chip 21 is formed with this second conductive circuit layer 12 simultaneously, and is positioned on same layer with this second conductive circuit layer 12.
Two these the first reinforcing chips 20 are formed around the opening of these two grooves 19 on the 3rd surface 101 respectively, and the position of two these the first reinforcing chips 20 and two these the second reinforcing chips 21 is corresponding respectively.
In the present embodiment, this first reinforcing chip 20 is roughly strip, and it comprises the extension 23 that a main part 22 and two are connected to these main part 22 two ends.
This main part 22 roughly takes the shape of the letter U, this main part 22 and this two extensions 23 smooth connection.This main part 22 comprises one first medial surface 221 and first lateral surface 222 relative and parallel with this first medial surface 221, distance between this first medial surface 221 and this first lateral surface 222 is more than or equal to 0.2 millimeter, also namely, the width of this first reinforcing chip 20 is more than or equal to 0.2 millimeter.In the present embodiment, this first medial surface 221 is directly connected with the inwall of this groove 19, also, and the inwall copline of this first medial surface 221 and this groove 19.
This extension 23 comprises one second medial surface 231 and second lateral surface 232 relative and parallel with this second medial surface 231, this second medial surface 231 and this first medial surface 221 smooth connection, this second lateral surface 232 and this first lateral surface 222 smooth connection, this second medial surface 231 and this corresponding with it first side 15 or this second side 16 copline.
Please refer to Fig. 4, when broken line, along two these sidewall 191 places of two these grooves 19 face between arbitrary line this flexible PCB 100 is bent, all can meet the bending required precision of this flexible PCB 100.The bending angle of the flexible PCB that the utility model provides is not limit, and in the present embodiment, this flexible PCB 100 bending angle is 180 degree.Two these the first reinforcing chips 20 and two these the second reinforcing chips 21 coordinate, and can reduce this flexible PCB 100 and tear risk at broken line place.
In other embodiments, this flexible PCB 100 can not also comprise this second reinforcing chip 21.
Incorporated by reference to Fig. 3, a kind of flexible PCB 200 that the utility model second embodiment provides, the difference of this flexible PCB 100 in this flexible PCB 200 and the first embodiment is: two the first reinforcing chips 30 of this flexible PCB 200 and two the second reinforcing chips 31 be respectively formed at this first cover layer 13 away from the surface of this first substrate layer 10 and on the surface away from this first substrate layer 10 of this second cover layer 14, the medial surface of this first reinforcing chip 30 and the medial surface of this second reinforcing chip 31 concordant with the medial surface of this groove 19.The material of this first reinforcing chip 30 and this second reinforcing chip 31 can be polyimides (polyimide, PI), PETG (Polyethylene Terephthalate, or the flexible material such as PEN (Polyethylene Naphthalate, PEN) PET).
In the first embodiment of the present utility model and the second embodiment, this flexible PCB is double sided board, and in other embodiments, this flexible PCB also can be single sided board or multi-layer sheet.The quantity of groove is also not limited to two, can increase according to actual needs, as long as ensure that these grooves occur in pairs.The quantity of reinforcing chip can be equal with the quantity of groove, also can be 2 times of groove quantity.
The described flexible PCB that the utility model provides, when bending, only need to ensure that broken line can meet the required precision of product broken line position between the face at two these sidewall places of two these grooves, thus make the location of the position of broken line of this flexible PCB more accurate, and, because defining groove on this flexible PCB, the width of flexible PCB bending place being reduced, thus the bounce-back stress after this flexible PCB broken line can be reduced; In addition, increase reinforcing chip in the outer rim of the groove of this flexible PCB, reduce this flexible PCB and tear risk at broken line place.
Be understandable that, above embodiment is only used for the utility model is described, is not used as restriction of the present utility model.For the person of ordinary skill of the art, according to other various corresponding change and distortion that technical conceive of the present utility model is made, within the protection range all dropping on the utility model claim.
Claims (10)
1. a flexible PCB, this flexible PCB comprise one first side, second side parallel with this first side, one with the first surface of this first lateral vertical and a second surface parallel with this first surface, it is characterized in that, this first side and this second side are formed with the groove that at least two run through this first surface and this second surface respectively, and the position of every two these grooves is relative; The edge of this groove each is formed with one around this groove and the reinforcing chip parallel with this first surface, and this reinforcing chip each comprises a main part, and this main part comprises one first medial surface, the inwall copline of this groove that this first medial surface is corresponding with it.
2. flexible PCB as claimed in claim 1, it is characterized in that, this flexible PCB also comprises a substrate layer, and is formed in the first conductive circuit layer on opposing two surfaces of this substrate layer and the second conductive circuit layer, and is formed in this first conductive circuit layer is formed on this substrate layer away from first cover layer, on the surface of this substrate layer and is formed in the second cover layer away from the surface of this substrate layer in this second conductive circuit layer away from second conductive circuit layer and on the surface of this first conductive circuit layer.
3. flexible PCB as claimed in claim 2, it is characterized in that, the material of this reinforcing chip is copper.
4. flexible PCB as claimed in claim 3, is characterized in that, this reinforcing chip and this first conductive circuit layer or this second conductive circuit layer are formed simultaneously.
5. flexible PCB as claimed in claim 3, it is characterized in that, this reinforcing chip is positioned at this first cover layer away from this first conductive circuit layer or this surface of the second cover layer away from this second conductive circuit layer.
6. flexible PCB as claimed in claim 1, it is characterized in that, this groove is roughly U-shaped, it comprises two relatively and the sidewall roughly paralleled and a diapire, two these sidewalls respectively with this first side and this second lateral vertical, this diapire is the part on the face of cylinder, and this diapire of this groove each connects with this smooth-sided of this groove each.
7. flexible PCB as claimed in claim 6, it is characterized in that, two these sidewalls of this groove of this first side are connected with this first lateral vertical, and two these sidewalls of this groove of this second side are connected with this second lateral vertical.
8. flexible PCB as claimed in claim 6, is characterized in that, two these sidewalls of this groove of this first side respectively with this first side smooth connection, two these sidewalls of this groove of this second side respectively with this second side smooth connection.
9. flexible PCB as claimed in claim 1, it is characterized in that, this reinforcing chip each also comprises the smooth connection of two difference in the extension at these main part two ends, this extension comprises one second medial surface, this second medial surface and this first medial surface smooth connection, and with this corresponding with it first side or this second side copline.
10. flexible PCB as claimed in claim 1, it is characterized in that, this reinforcing chip width is more than or equal to 0.2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420854728.6U CN204482149U (en) | 2014-12-30 | 2014-12-30 | Flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420854728.6U CN204482149U (en) | 2014-12-30 | 2014-12-30 | Flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204482149U true CN204482149U (en) | 2015-07-15 |
Family
ID=53637918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420854728.6U Expired - Fee Related CN204482149U (en) | 2014-12-30 | 2014-12-30 | Flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204482149U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430883A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN106060734A (en) * | 2016-07-27 | 2016-10-26 | 歌尔股份有限公司 | FPCB structure, loudspeaker module and manufacturing method of FPCB |
| CN107919061A (en) * | 2016-10-05 | 2018-04-17 | 三星显示有限公司 | Display device |
-
2014
- 2014-12-30 CN CN201420854728.6U patent/CN204482149U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430883A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN105430883B (en) * | 2015-12-29 | 2018-05-29 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| CN106060734A (en) * | 2016-07-27 | 2016-10-26 | 歌尔股份有限公司 | FPCB structure, loudspeaker module and manufacturing method of FPCB |
| WO2018018837A1 (en) * | 2016-07-27 | 2018-02-01 | 歌尔股份有限公司 | Fpcb structure, speaker module, and manufacturing method for fpcb structure |
| CN107919061A (en) * | 2016-10-05 | 2018-04-17 | 三星显示有限公司 | Display device |
| CN107919061B (en) * | 2016-10-05 | 2021-11-09 | 三星显示有限公司 | Display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170630 Address after: 066000 No. 18 Tengfei Road, Qinhuangdao Economic Development Zone, Hebei, China Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Co-patentee before: Zhen Ding Technology Co.,Ltd. Patentee before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |