CN101772257A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN101772257A CN101772257A CN200810188882A CN200810188882A CN101772257A CN 101772257 A CN101772257 A CN 101772257A CN 200810188882 A CN200810188882 A CN 200810188882A CN 200810188882 A CN200810188882 A CN 200810188882A CN 101772257 A CN101772257 A CN 101772257A
- Authority
- CN
- China
- Prior art keywords
- jointing
- circuit board
- printed circuit
- pcb
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Disclosed is a printed circuit board, comprising a base plate, a printed wire, a connecting section, an insulating layer and a conductive material. The printed wire is positioned on the base plate. The connecting section is positioned on the printed wire. The insulating layer is covered on the printed wire and reveals a connecting section. The conductive material is positioned on the insulating layer and the connecting section, and is only electrically connected with the connecting section to increase the sectional area of the connecting section so as to increase the admissible magnitude of current of the connecting section. The line section requiring bigger current flow exposes copper on the printed circuit board, and the printed circuit board is electrically connected with the copper-exposed line section through the conductive material to increase the sectional area of the line section, so as to increase the admissible magnitude of current of the line section.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly a kind of printed circuit board (PCB) in order to the allowed magnitude of current that increases the specific circuit section.
Background technology
Along with science and technology is constantly progressive, many electronic installations more and more are inclined to compact volume design.Because compactization of electronic installation makes the printed circuit plate bulk of electronic installation and then diminish relatively.And along with electronic installation develops, emphasizes multimedia function towards the multiplex (MUX), therefore the number of electronic components on printed circuit board (PCB) is also more and more.
When printed circuit board (PCB) was more and more littler, the electronic component on printed circuit board (PCB) was more and more, makes electronic component closely be arranged on the printed circuit board (PCB).Simultaneously the printed wire on printed circuit board (PCB) also all the more closely with complicated.
Owing to dwindle increase with electronic component on the printed circuit board (PCB), make wiring installation teacher of printed circuit board (PCB) when design, increased the difficulty in many designs.Especially many electronic components need bigger electric current to drive, and just thicker printed wire must be arranged, and can cause the electric current of flowing through to be restricted to avoid less printed wire, can cause less printed wire overheated and cause situation such as damage simultaneously.But because gathered various electronic components and printed wire on the printed substrate, want to increase thicker printed wire, just must when designing, go for the position especially and connect up, increase wiring installation's teacher difficulty in design by wiring installation teacher.
Summary of the invention
The invention provides a kind of printed circuit board (PCB), can avoid because need the big drive current of electronic component needs, and cause the difficulty of wiring installation teacher when design.
A kind of printed circuit board (PCB) disclosed according to the present invention includes: substrate, printed wire, jointing, insulating barrier and conduction material.
Printed wire is positioned on the substrate.
Jointing is positioned on the printed wire.
Insulating barrier is covered on the printed wire and exposes jointing.
The conduction material is positioned on insulating barrier and the jointing, and only electrically connects jointing, increases the open ended magnitude of current of jointing in order to the sectional area that increases jointing.
Wherein, the conduction material can be scolder or conductor.Scolder can be tin cream etc.Conductor can be copper bar and copper cash at least one of them.
A kind of printed circuit board (PCB) disclosed according to the present invention, the material that wherein conducts electricity includes: electric conductor and scolder.
Electric conductor is positioned on insulating barrier and the jointing, and electrically connects jointing, increases the open ended magnitude of current of jointing in order to the sectional area that increases jointing.
Scolder and only electrically connects electric conductor and jointing between electric conductor and jointing, conduct in the electric conductor in order to the electric current of the jointing of will flowing through and transmit.
Wherein, scolder can be tin cream etc.Electric conductor can be copper bar and copper cash at least one of them.
A kind of printed circuit board (PCB) disclosed according to the present invention will need the jointing than in the printed wire of big current flowing to be exposed on the printed circuit board (PCB) separately on the printed circuit board (PCB).Utilize scolder or conductor to be electrically connected at and be exposed to the jointing in the printed wire on the printed circuit board (PCB) separately.Because scolder or conductor and the jointing electric connection that is exposed to printed circuit board (PCB) separately can be considered an integral body.Because the increase of sectional area makes the magnitude of current that can hold also and then increase.Therefore flow through when being exposed to the jointing of printed circuit board (PCB) separately when electric current, can not cause the electric current of flowing through to be restricted because of less printed wire, simultaneously can be overheated and cause situations such as damage, more can reduce wiring installation's teacher difficulty in design, not need painstakingly on printed circuit board (PCB), to find out the position and hold thicker printed wire.
Relevant characteristics and implementation of the present invention cooperate diagram to be described in detail as follows as most preferred embodiment now.
Description of drawings
Fig. 1 is according to the printed circuit board (PCB) first embodiment schematic diagram of the present invention;
Fig. 2 is according to the printed circuit board (PCB) first embodiment sectional view of the present invention;
Fig. 3 is according to the printed circuit board (PCB) second embodiment schematic diagram of the present invention; And
Fig. 4 is according to the printed circuit board (PCB) second embodiment sectional view of the present invention.
Wherein, Reference numeral
20 substrates
30 printed wires
40 jointings
50 insulating barriers
60 conduction materials
61 electric conductors
62 scolders
100 printed circuit board (PCB)s
Embodiment
Fig. 1 is according to the printed circuit board (PCB) first embodiment schematic diagram of the present invention.Fig. 2 is according to the printed circuit board (PCB) first embodiment sectional view of the present invention.
Please merge with reference to Fig. 1 and Fig. 2, in the present embodiment, printed circuit board (PCB) 100 includes substrate 20, printed wire 30, jointing 40, insulating barrier 50 and conduction material 60.
Printed wire 30 is positioned on the substrate 20.
Insulating barrier 50 is covered on the printed wire 30 and exposes jointing 40.
Printed circuit board (PCB) 100 can be hardboard or bendable soft board, and wherein the material of hardboard is other materials such as glass fibre or bakelite; The material of bendable soft board is that polyimides (PI) or polyethylene terephthalate (PET) wait other materials.
Insulating barrier 50 has functions such as protection against the tide, insulation in order to the printed wire on protection printed circuit board (PCB) and the printed circuit board (PCB).Insulating barrier 50 can be transparent insulation protection glue.
At this, will need jointing 40 to be exposed to separately on the printed circuit board (PCB) 100 on the printed circuit board (PCB) 100 than in the printed wire 30 of big current flowing.Being about to scolder earlier is welded on the jointing or with conductor and is electrically connected on the jointing 40.Because scolder or conductor electrically connect with the jointing 40 that is exposed to printed circuit board (PCB) 100 separately, jointing 40 and scolder or conductor can be considered as an integral body.Because the sectional area of jointing 40 is varied to the sectional area that is connected with scolder or conductor, make that 40 magnitudes of current that can hold of jointing increase along with the increase of sectional area thereupon originally.When therefore being exposed to the jointing 40 of printed circuit board (PCB) 100 separately when flowing through than big electric current, can not cause the electric current of flowing through to be restricted because of less printed wire 30, simultaneously can be because of not overheated and cause situation such as damage yet, more can reduce wiring installation's teacher difficulty in design, not need painstakingly on printed circuit board (PCB) 100, to find out the jointing 40 that the position holds thicker printed wire 30.
Fig. 3 is according to the printed circuit board (PCB) second embodiment schematic diagram of the present invention.Fig. 4 is according to the printed circuit board (PCB) second embodiment sectional view of the present invention.
Please refer to Fig. 3 and Fig. 4, and merge with reference to previous embodiment.Present embodiment and previous embodiment are roughly identical, and difference is that the conduction material 60 of present embodiment includes: electric conductor 61 and scolder 62.
In this, will need jointing 40 to be exposed to separately on the printed circuit board (PCB) 100 on the printed circuit board (PCB) 100 than in the printed wire 30 of big current flowing.Utilize in advance scolder 62 is welded in electric conductor 61 on the jointing 40.Because other sections on the printed wire have the insulation protection of insulating barrier 50, therefore can not make scolder 62 in welding process with printed wire in other sections electrically connect.
Because electric conductor 61, scolder 62 and the jointing 40 that is exposed to printed circuit board (PCB) 100 separately electrically connect, and jointing 40, scolder 62 can be considered as an integral body with electric conductor 61.Because the sectional area of jointing 40 is varied to the sectional area that is connected with scolder 62 and electric conductor 61, make that 40 magnitudes of current that can hold of jointing increase along with the increase of sectional area thereupon originally.When therefore being exposed to the jointing 40 of printed circuit board (PCB) 100 separately when flowing through than big electric current, can not cause the electric current of flowing through to be restricted because of less printed wire 30, simultaneously can be because of not overheated and cause situation such as damage yet, more can reduce wiring installation's teacher difficulty in design, not need painstakingly on printed circuit board (PCB) 100, to find out the jointing 40 that the position holds thicker printed wire 30.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (6)
1. a printed circuit board (PCB) is characterized in that, includes:
One substrate;
One printed wire is positioned on this substrate;
One jointing is positioned on this printed wire;
One insulating barrier is covered on this printed wire and exposes this jointing; And
One conduction material is positioned on this insulating barrier and this jointing, and only electrically connects this jointing, increases the open ended magnitude of current of this jointing in order to the sectional area that increases this jointing.
2. printed circuit board (PCB) according to claim 1 is characterized in that, this conduction material is a scolder.
3. printed circuit board (PCB) according to claim 1 is characterized in that, this conduction material is a tin cream.
4. printed circuit board (PCB) according to claim 1 is characterized in that, this conduction material includes:
One electric conductor is positioned on this insulating barrier and this jointing, and electrically connects this jointing, increases the open ended magnitude of current of this jointing in order to the sectional area that increases this jointing; And
One scolder between this electric conductor and this jointing, and only electrically connects this electric conductor and this jointing, conducts in this electric conductor in order to the electric current of this jointing of will flowing through and transmits.
5. printed circuit board (PCB) according to claim 4 is characterized in that, this electric conductor be in copper cash and the copper bar at least one of them.
6. printed circuit board (PCB) according to claim 4 is characterized in that, this scolder is a tin cream.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810188882A CN101772257A (en) | 2008-12-30 | 2008-12-30 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810188882A CN101772257A (en) | 2008-12-30 | 2008-12-30 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101772257A true CN101772257A (en) | 2010-07-07 |
Family
ID=42504716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810188882A Pending CN101772257A (en) | 2008-12-30 | 2008-12-30 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101772257A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101925259A (en) * | 2010-08-02 | 2010-12-22 | 浪潮电子信息产业股份有限公司 | Method for increasing current carrying capacity of PCB (Printed Circuit Board) line conductor through patch |
CN103974532A (en) * | 2014-04-30 | 2014-08-06 | 苏州倍辰莱电子科技有限公司 | Rotation type spherical barrel of circuit control panels |
CN106973494A (en) * | 2017-04-27 | 2017-07-21 | 新华三技术有限公司 | A kind of cabling processing method and printed circuit board (PCB) |
CN109587937A (en) * | 2018-12-14 | 2019-04-05 | 广东浪潮大数据研究有限公司 | A kind of current conducting device and equipment |
-
2008
- 2008-12-30 CN CN200810188882A patent/CN101772257A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101925259A (en) * | 2010-08-02 | 2010-12-22 | 浪潮电子信息产业股份有限公司 | Method for increasing current carrying capacity of PCB (Printed Circuit Board) line conductor through patch |
CN103974532A (en) * | 2014-04-30 | 2014-08-06 | 苏州倍辰莱电子科技有限公司 | Rotation type spherical barrel of circuit control panels |
CN106973494A (en) * | 2017-04-27 | 2017-07-21 | 新华三技术有限公司 | A kind of cabling processing method and printed circuit board (PCB) |
CN109587937A (en) * | 2018-12-14 | 2019-04-05 | 广东浪潮大数据研究有限公司 | A kind of current conducting device and equipment |
CN109587937B (en) * | 2018-12-14 | 2021-12-17 | 广东浪潮大数据研究有限公司 | Current conduction device and equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100464617C (en) | Interconnection structure of electric conductive wirings | |
CN202085399U (en) | Shielded type printed circuit board | |
CN101375412B (en) | In solder covered copper foil ribbon conductor wire and its connection method | |
CN101296556B (en) | Flexible circuit board | |
CN101653052B (en) | Circuit connecting method | |
CN200953687Y (en) | Collecting device and circuit board with the same device | |
CN102316664A (en) | Flexible circuit board and manufacture method thereof | |
CN101455132A (en) | Interconnection arrangement and method for interconnecting a high-current carrying cable with a metal thin-film | |
CN101056512B (en) | Device with circuit board | |
CN110337178A (en) | A kind of circuit board assemblies and electronic equipment | |
CN101772257A (en) | Printed circuit board | |
CN201234406Y (en) | Flexible printed circuit board | |
CN101621045B (en) | Circuit substrate and its formation method and semiconductor encapsulation | |
CN202737135U (en) | Electric connection structure and piezoceramic transducer using electric connection structure | |
EP1104046A3 (en) | Circuit forming method and circuit connection structure in electrical connection box | |
CN211531415U (en) | High-reliability miniaturized thick film circuit module | |
CN201207298Y (en) | Flexible flat cable capable of bearing high temperature | |
CN218768575U (en) | Display panel and display device | |
CN105430888B (en) | Flexible PCB and mobile terminal | |
CN105430883B (en) | Flexible PCB and mobile terminal | |
CN101022189A (en) | Electric connector | |
CN105578724B (en) | Flexible PCB and mobile terminal | |
CN101937900A (en) | Micro and millimeter wave circuit | |
CN209488907U (en) | A kind of bend-resistance flexible circuitry soft board | |
CN105430880A (en) | Flexible circuit board and mobile terminal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100707 |