CN202085399U - Shielded type printed circuit board - Google Patents
Shielded type printed circuit board Download PDFInfo
- Publication number
- CN202085399U CN202085399U CN2011201604157U CN201120160415U CN202085399U CN 202085399 U CN202085399 U CN 202085399U CN 2011201604157 U CN2011201604157 U CN 2011201604157U CN 201120160415 U CN201120160415 U CN 201120160415U CN 202085399 U CN202085399 U CN 202085399U
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- Prior art keywords
- circuit board
- printed circuit
- cement
- strengthening part
- insulating barrier
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a shielded type printed circuit board, which comprises a printed circuit board, a shielding film and a strengthening component. The printed circuit board comprises a base component and an insulation film, wherein a circuit pattern used for ground connection is formed on the base component, the insulation film is arranged on the base component, the circuit pattern used for ground connection is covered by the insulation film, and an electronic component is connected at the installation place of the lower surface of the base component. The shielding film arranged on the printed circuit board comprises an electric conduction layer and an insulation layer, wherein the electric conduction layer is equipotential with the circuit pattern used for ground connection, and the electric conduction layer is arranged on the printed circuit board and is used for covering a part of a zone or the whole zone opposite to the installation place; and the insulation layer is arranged at the electric conduction layer. The strengthening component has electroconductivity and is arranged on the shielding film at the zone opposite to the installation place. The strengthening component is jointed with the insulation layer by electric conductivity cement containing spherical electric conductivity particles. The thickness of the insulation layer is less than the raising length of the electric conductivity particles from the electric conductivity cement under the joint state of the electric conductivity cement and the insulation layer, and the electric conductivity particles are in contact with the electric conduction layer under the joint state of the electric conductivity cement and the insulation layer.
Description
Technical field
The utility model relates to the shielded printed circuit board that is used for portable phone, computer etc.
Background technology
In the past, electronic equipments such as portable phone, computer were owing to reasons such as miniaturization and high speed processingization, were subjected to the noise effect from mainboard or outside electromagnetic wave etc. easily.Therefore, the demand to the printed circuit board (PCB) of screened film with noises such as shielding electromagnetic wave is increasing.In addition, the electronic unit that uses in this printed circuit board (PCB) and portable phone, the computer etc. links together and uses, because the bending when using etc., and the installation position that electronic unit is installed the sometimes distortion that can be distorted.Therefore, solve the problems referred to above by strengthening part being set in the position relative with the installation position that electronic unit is installed.
For example, Fig. 5 is the schematic diagram of existing shielded printed circuit board 100.As shown in Figure 5, shielded printed circuit board 100 comprises printed circuit board (PCB) 110, and printed circuit board (PCB) 110 comprises: substrate parts 112 is formed with earthy circuit pattern 114,115; Dielectric film 111 is arranged on the substrate parts 112 and covers earthy circuit pattern 114,115 by cement layer 113.In addition, the dielectric film 111 of shielded printed circuit board 100 is provided with the screened film 120 that comprises that successively electric conducting material 123, conductive layer 122 and insulating barrier 121 form.At this, be formed with the hole portion 140 of exposing in the dielectric film 111 of printed circuit board (PCB) 110 and the cement layer 113 for earthy circuit pattern 114.Because the electric conducting material 123 of screened film 120 is filled in this hole portion 140, thereby conductive layer 122 and 114 conductings of earthy circuit pattern, makes both sides keep equipotential.Thus, can be by the electromagnetic wave 90a of screened film 120 shieldings to printed circuit board (PCB) 110 radiation.And electronic unit 150 is connected with the installation position of the lower surface that is arranged at printed circuit board (PCB) 110.And position relative with the installation position of electronic unit 150 on printed circuit board (PCB) 110 is provided with strengthening part 135.
At this, printed circuit board (PCB) 110 and connected electronic unit 150 may be subjected to the noise effect from electromagnetic wave 90b of outside etc., and therefore, the position that this electronic unit 150 is installed also needs to have shield effectiveness.Therefore, in strengthening part 135, use to have the material of conductivity, thereby make strengthening part 135 realize stiffening effect and these two kinds of functions of shield effectiveness so that strengthening part 135 has shield effectiveness.
At this, have sufficient shield effectiveness in order to make strengthening part 135, need make strengthening part 135 and earthy circuit pattern 114,115 keep equipotential.For this reason, in the prior art, be provided with not shown earthy parts in addition, make strengthening part 135 and earthy circuit pattern 114,115 keep equipotential by these earthy parts in the outside of shielded printed circuit board 100.Yet, when the earthy parts of outer setting of shielded printed circuit board 100, for example, following problem will be produced, promptly, because need be provided for connecting the wiring of strengthening part 135 and earthy parts etc., the area of shielded printed circuit board will correspondingly increase, thereby causes design freedom limited.
Therefore, in existing shielded printed circuit board 100, by the earthy circuit pattern 115 of configuration under strengthening part 135, form hole portion 160 to expose this earthy circuit pattern 115 at dielectric film 111 and cement layer 113, and in this hole portion 160, fill the conductivity cement 130 of branch shape, thereby make strengthening part 135 and earthy circuit pattern 115 keep equipotentials.
For example, disclose in the patent documentation 1 and a kind ofly make strengthening part and earthy circuit pattern keep equipotential flexible printed circuit board by said method.In this flexible printed circuit board,, make metal reinforcing plates and earthed circuit keep equipotential, thereby make metal reinforcing plates have shield effectiveness by at the opening filled conductive cement that is used for exposing earthed circuit.
Patent documentation 1: the open communique " spy opens 2009-218443 number " of Japan's patent application
The utility model content
Yet as mentioned above, if conductivity cement 130 is filled in hole portion 160, the connecting portion at conductivity cement 130 and earthy circuit pattern 115 can produce space 160a, 160b sometimes.The reason that this situation occurs is, the connecting portion of conductivity cement 130 and earthy circuit pattern 115 is by clamping up and down such as the hard material of strengthening part 135 and substrate parts 112 etc., and conductivity cement 130 does not fully cater to the step of hole portion 160 when mounting strengthening part 135.In this case, on the mainboard of portable phone, computer etc., install in the reflow step of shielded printed circuit board 100, space 160a, space 160b are heated and expand, thereby cause can not realizing sufficient electrical connection between conductivity cement 130 and the earthy circuit pattern 115.Its result produces following problem, for example, causes bad outward appearance, strengthening part 135 can not be held at ground current potential, is difficult to guarantee sufficient shield effectiveness etc.
In addition, in order to make the connecting portion between conductivity cement 130 and the earthy circuit pattern 115 not produce space 160a, space 160b, need thicken the thickness of conductivity cement 130 as far as possible, in this case, in order to keep conductivity, need to improve the ratio of the electroconductive particle that contains in the conductivity cement 130, this will cause the corresponding rising of cost, and efficient is not good.And, if adopt said method, also need dispose strengthening part 135 under the earthy circuit pattern 115 of configuration, have the limited problem of design freedom.
The utility model is made in view of the above problems, even its purpose is to provide a kind of shielded printed circuit board that can not only guarantee design freedom but also can keep shield effectiveness to the installation position of electronic unit that is provided with in the position relative with electronic unit under the situation of strengthening part also in being connected with the printed circuit board (PCB) of electronic unit.
Shielded printed circuit board of the present utility model comprises: printed circuit board (PCB), screened film and strengthening part, and wherein, described printed circuit board (PCB) comprises: substrate parts is formed with earthy circuit pattern; And dielectric film, be arranged on this substrate parts and cover described earthy circuit pattern, and, be connected with electronic unit in the installation position of the lower surface that is arranged at substrate parts; Described screened film is arranged on the described printed circuit board (PCB), and comprises: conductive layer with described earthy circuit pattern equipotential, is configured in part or all of the upper surface of described printed circuit board (PCB) and the covering zone relative with described installation position; And insulating barrier, be arranged on the described conductive layer; Described strengthening part has conductivity, and is arranged on zone relative with described installation position on the described screened film; Shielded printed circuit board of the present utility model is characterised in that: described strengthening part is engaged on the described insulating barrier by the conductivity cement that comprises spherical electroconductive particle; The bed thickness of described insulating barrier less than described electroconductive particle under described conductivity cement and state that described insulating barrier engages from the outstanding outstanding length of described conductivity cement, described electroconductive particle contacts with described conductive layer under the state of described conductivity cement and described insulating barrier joint.
According to formation as above, on printed circuit board (PCB), dispose part or all of the zone relative with the installation position of the equipotential conductive layer of earthy circuit pattern and covering of this conductive layer and electronic unit.Thus, can shield by the electromagnetic wave of outside by screened film with conductive layer to the installation position radiation of electronic unit.In addition, reinforce the zone relative by the strengthening part that is arranged on the screened film with the installation position of electronic unit.Thus, can prevent by strengthening part former thereby produce distortion etc. in the installation position because of bending etc.In addition, strengthening part is engaged on the insulating barrier of screened film by the conductivity cement, and the electroconductive particle that the conductivity cement comprises contacts with the conductive layer of screened film under the state that conductivity cement and insulating barrier engage, therefore can become equipotential with having the current potential of strengthening part of conductivity and the current potential of conductive layer, can also make strengthening part have shield effectiveness like this.Thus, can provide shield effectiveness to the installation position of electronic unit more reliably by double effects, described double effects comprises the shield effectiveness of screened film and the shield effectiveness of strengthening part.Therefore, need not to resemble the prior art to the current potential that makes strengthening part equals earthing potential and expose earthy circuit pattern and strengthening part and earthy circuit pattern are linked together by the conductivity cement, so, just do not need to form earthy circuit pattern yet, thereby improved design freedom according to the allocation position of strengthening part.In addition, owing to do not need by the conductivity cement strengthening part and earthy circuit pattern to be linked together, therefore, the defective in the time of also can not taking place because of the caused backflow in the space that in this coupling part, takes place.As described above, not only can guarantee design freedom but also can keep shield effectiveness.In addition, because electroconductive particle is spherical, therefore, in the conductivity cement, no matter electroconductive particle to which direction tilts, and the length outstanding from the conductivity cement is roughly certain on the bed thickness direction.Thus, for example, compare to laminar or dendroid, spherical electroconductive particle is easier to break through insulating barrier, contacts with conductive layer easily.Its result can make strengthening part and conductive layer keep equipotential more reliably.
In addition, in shielded printed circuit board of the present utility model, described strengthening part can also be connected with the earthy parts of outside, and wherein, the earthy parts of described outside and described earthy circuit pattern keep equipotential.
According to above-mentioned formation, strengthening part keeps equipotential by the electroconductive particle that the conductivity cement comprises at inner and earthy circuit pattern, and, also keep equipotential by outside earthy parts and earthy circuit pattern, therefore, can further improve shield effectiveness.
In addition, in the shielded printed circuit board of the present utility model, the described insulating barrier of described screened film is coated on the described conductive layer.
According to above-mentioned formation, because therefore the insulating barrier of screened film is coated on the conductive layer,, for example, compare to membranaceous insulating barrier, the insulating barrier of described screened film is thinner, contacts with conductive layer thereby break through insulating barrier easily from the outstanding electroconductive particle of conductivity cement.
In addition, in the shielded printed circuit board of the present utility model, described strengthening part is formed by stainless steel material.
According to above-mentioned formation because that stainless steel material has the hardness and the corrosion resistance of be fit to reinforcing is outstanding, therefore, can be more effectively not only the ruggedized electronics parts the installation position but also provide shield effectiveness to the installation position.
According to shielded printed circuit board of the present utility model, can shield by the electromagnetic wave of outside by screened film with conductivity to the installation position radiation of electronic unit.In addition, can prevent by bending etc. former thereby distortion that take place in the installation position etc. by strengthening part.In addition, can make the current potential of strengthening part and the current potential of conductive layer be in equipotential, can make strengthening part also have shield effectiveness with conductivity.Thus, can be more reliably provide shield effectiveness to the installation position of electronic unit according to double effects, described double effects comprises the shield effectiveness of screened film and the shield effectiveness of strengthening part.So, do not need to resemble the prior art for making strengthening part be in earthing potential and expose earthy circuit pattern and strengthening part and earthy circuit pattern are linked together by the conductivity cement, therefore, do not need to form earthy circuit pattern, thereby improved design freedom according to the allocation position of strengthening part.In addition, owing to do not need strengthening part and earthy circuit pattern to be linked together the defective in the time of therefore yet can not taking place because of the caused backflow in the space that in this coupling part, takes place by the conductivity cement.As described above, not only can guarantee design freedom but also can keep shield effectiveness.In addition, for example, compare to laminar or dendroid, spherical electroconductive particle will be easier to break through insulating barrier, contact with conductive layer 22 easily.Its result can make strengthening part and conductive layer keep equipotential more reliably.
Description of drawings
Fig. 1 is the partial section of the shielded printed circuit board of present embodiment.
Fig. 2 (a) is the figure that the manufacture method mesopore portion of the shielded printed circuit board of expression present embodiment forms step.Fig. 2 (b) is the figure of screened film engagement step in the manufacture method of shielded printed circuit board of expression present embodiment.Fig. 2 (c) is the figure of the peel ply strip step of screened film in the manufacture method of shielded printed circuit board of expression present embodiment.
Fig. 3 (d) is the figure of conductivity cement engagement step in the manufacture method of shielded printed circuit board of expression present embodiment.Fig. 3 (e) is the figure of strengthening part engagement step in the manufacture method of shielded printed circuit board of expression present embodiment.Fig. 3 (f) is illustrated in the figure that connects the electronic unit Connection Step of electronic unit on the shielded printed circuit board of present embodiment.
Fig. 4 is the figure of the experimental result that embodiment and comparative example obtained of the expression shielded printed circuit board that uses present embodiment.
Fig. 5 is the partial section of existing shielded printed circuit board.
Description of reference numerals
1: shielded printed circuit board 10: printed circuit board (PCB)
11: dielectric film 12: substrate parts
13: cement layer 14: earthy circuit pattern
20: screened film 21: insulating barrier
22: conductive layer 23: electric conducting material
30: conductivity cement 31: cement
32: electroconductive particle 35: strengthening part
40: hole portion 50: electronic unit
90a: electromagnetic wave 90b: electromagnetic wave
Embodiment
Below, preferred implementation of the present utility model is described with reference to the accompanying drawings.
(overall structure of shielded printed circuit board 1)
At first, use Fig. 1 that the shielded printed circuit board 1 of present embodiment is described.As shown in Figure 1, shielded printed circuit board 1 comprises printed circuit board (PCB) 10, screened film 20 and strengthening part 35.And the installation position that is arranged at the lower surface of printed circuit board (PCB) 10 is connected with electronic unit 50.In addition, part or all of the zone that screened film 20 is arranged on the printed circuit board (PCB) 10 and covering is relative with the installation position that connects electronic unit 50.Thus, utilize screened film 20 shielding by the noise of outside to the electromagnetic wave 90b of the installation position radiation of electronic unit 50 etc.
And strengthening part 35 is arranged on the screened film 20, and its that position is set is relative with the installation position that connects electronic unit 50.Strengthening part 35 engages with conductivity cement 30 with contact condition, and is mounted on by this conductivity cement 30 on the insulating barrier 21 of screened film 20.At this, the enlarging section a of Fig. 1 amplifies the figure of expression to the engagement state between the insulating barrier 21 of conductivity cement 30 and screened film 20, and wherein, conductivity cement 30 engages with strengthening part 35 with contact condition.Shown in a of enlarging section, conductivity cement 30 comprises electroconductive particle 32 and cement 31, and electroconductive particle 32 is outstanding from cement 31.And, contact with electroconductive particle 32 with the strengthening part 35 that the upper surface of conductivity cement 30 engages with contact condition.On the other hand, break through the insulating barrier 21 of screened films 20, and contact with conductive layer 22 under it from the outstanding electroconductive particle 32 of the lower surface of conductivity cement 30.Thus, the conductive layer 22 of strengthening part 35 and screened film 20 is in conducting state by the electroconductive particle 32 of conductivity cement 30, thereby can make the strengthening part 35 with conductivity be in equipotential with conductive layer 22.Therefore, can make strengthening part 35 that shield effectiveness is provided with conductivity.
Thus, the strengthening part 35 of shielded printed circuit board 1 will can have following double action at least, that is, effect that the installation position of electronic unit 50 is strengthened and shielding are by the noise of outside to the electromagnetic wave 90b of the installation position radiation of electronic unit 50 etc.
Below, specify each structure.
(printed circuit board (PCB) 10)
Printed circuit board (PCB) 10 comprises: substrate parts 12 is formed with a plurality of circuit patterns, as not shown signal circuit pattern and earthy circuit pattern 14 etc.; Cement layer 13 is arranged on the substrate parts 12; And dielectric film 11, engage with cement layer 13.
Not shown signal is formed at the upper surface of substrate parts 12 with circuit pattern and earthy circuit pattern 14 etc.These circuit patterns form by conductive material is implemented etch processes.In addition, earthy circuit pattern 14 wherein is meant the pattern that keeps earthing potential.
In addition, in above-mentioned dielectric film 11 and cement layer 13, form porose 40 by modes such as laser processings.Hole portion 40 is used to make and is selected from a plurality of earthy circuit patterns and signal exposes with the subregion of the circuit pattern of circuit pattern.In the present embodiment, in dielectric film 11 and cement layer 13, form porose 40, so that outside the subregion of earthy circuit pattern 14 is exposed to along stacked direction.In addition, hole portion 40 is provided with suitable aperture so that other contiguous circuit patterns do not expose.
(strengthening part 35)
(conductivity cement 30)
In addition, conductivity cement 30 can also form with the electroconductive particle 32 and the cement 31 resulting conductivity cements of soft magnetic material as principal component by mixing.In this case, by the high magnetization of electroconductive particle 32 performances,, thereby can absorb electric wave even also can suppress the decline of magnetic permeability for the high-frequency electromagnetic wave.Thus, by the combination of itself and strengthening part 35, except function, also has the function that absorbs electric wave with shield effectiveness.
Particularly, conductivity cement 30 forms the mixture of electroconductive particle 32 and cement 31.That is, conductivity cement 30 constitutes by making electroconductive particle 32 be scattered in cement 31.The electrical connection of conductivity cement 30 is to realize in the thickness direction Continuous Contact of conductivity cement 30 by one or more electroconductive particle 32 in the cement 31, and keeps by the engaging force of cement 31.
The cement 31 that conductivity cement 30 comprises for example can enumerate acrylic resin, epoxylite, silicones, thermoplastic elastomer (TPE) resinoid, rubber resin, polyester resin, carbamate resinoid etc.In addition, cement 31 can be the monomer of above-mentioned resin, can also be the mixture of above-mentioned resin.In addition, cement 31 can also comprise tackifier.As tackifier, for example, can enumerate tackifier such as aliphatic acid hydrocarbon resins, C5/C9 hybrid resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resinoid, heat reactivity resin.
Part or all of the electroconductive particle 32 that conductivity cement 30 comprises formed by metal material.For example, electroconductive particle 32 has copper powder, silver powder, nickel powder, covers the silver-bearing copper powder, covers gold copper powder, covers silver-colored nickel powder, covers golden nickel powder, and these metal powders can prepare by atomizing (atomization) method, carbonylation (carbonylation) method.In addition, except the above, can also use the particle that obtained by the resin clad metal powder, by the resin-coated particle that obtains of metal powder.In addition, electroconductive particle 32 is preferably and covers the silver-bearing copper powder or cover silver-colored nickel powder.Its reason is because can be obtained the electroconductive particle 32 of stable conductivity by the material of cheapness.In addition, the shape of electroconductive particle 32 is not limited to spherical, for example can also be formed with projection on sphere with spherical as the basis.In this case, electroconductive particle 32 will be easier to break through insulating barrier 21.In addition, under the spherical situation of being shaped as of electroconductive particle 32, in conductivity cement 30, no matter electroconductive particle to which direction tilts, and the length that electroconductive particle is given prominence to from conductivity cement 30 is roughly certain on the bed thickness direction.Thus, for example compare with chip shape or branch shape, electroconductive particle 32 will be easier to break through insulating barrier 21, be easy to contact with conductive layer 22.
In having the conductivity cement 30 of structure as mentioned above, the thickness of cement 31 is 5 μ m to 40 μ m, and the average grain diameter of electroconductive particle 32 is 10 μ m to 100 μ m.In addition, the average grain diameter of electroconductive particle 32 is 1.5 times to 3 times of cement 31 thickness.Therefore, the part of electroconductive particle 32 is outstanding from the cement 31 of conductivity cement 30.In addition, the deviation of the average grain diameter of electroconductive particle 32 be preferably ± 5 μ m in.In this case owing to do not have big deviation from the outstanding length of the outstanding electroconductive particle 32 of conductivity cement 30, therefore with conductive layer 22 between be connected resistance stabilization.Thus, can stably strengthening part 35 and conductive layer 22 be kept equipotential.And electroconductive particle 32 is 30wt% to 70wt% with respect to the combined amount of cement 31, from engaging force and conductivity angle, is preferably 50wt%.
(screened film 20)
Screened film 20 comprises: conductive layer 22 is engaged in electric conducting material 23 with contact condition; And insulating barrier 21, be arranged on the conductive layer 22.
Electric conducting material 23 is formed by isotropic conductivity cement or anisotropic conductive cement.The isotropic conductivity cement has the electrical properties identical with having scolder now.Therefore, form with the isotropic conductivity cement under the situation of electric conducting material 23, can guarantee on the three-dimensional whole directions that constitute by thickness direction and Width, length direction, to be in conduction state.On the other hand, form with the anisotropic conductive cement under the situation of electric conducting material 23, can guarantee only on the two-dimensional directional that constitutes by thickness direction, to be in conduction state.In addition, under the situation that electric conducting material 23 is formed by the isotropic conductivity cement,, therefore also conductive layer 22 can be set sometimes because electric conducting material 23 can have the function of conductive layer 22.
In addition, electric conducting material 23 is made of insulating properties cement and the electroconductive particle that is scattered in the insulating properties cement.Particularly, the insulating properties cement can be made of following material as the zygosity resin: thermoplastic resin such as polystyrene type, vinyl acetate class, polyesters, polyethylene kind, polypropylene type, polyamide-based, rubber-like, acrylic compounds, perhaps, thermosetting resins such as phenols, epoxies, carbamates, melamine class, alcohol acids.In addition, thus electroconductive particles such as hybrid metal, carbon form the conductivity cement with conductivity in these zygosity resins.Preferred employing is not subjected to the polyesters thermoplastic resin of restriction such as maintaining requirement under the stable on heating situation of special requirement not, is requiring the preferred high epoxies thermosetting resin of reliability that adopts under thermal endurance or the outstanding flexual situation.In addition, it is preferred in either case, oozing out (resin flow, resin flow) little material during hot pressing.In addition, the thickness of electric conducting material 23 is 3 μ m to 30 μ m, but can suitably be provided with and do not need to do special qualification.
In addition, the electroconductive particle that comprises of electric conducting material 23 has than the little average grain diameter in the aperture of hole portion 40 so that electroconductive particle enters in the described hole portion 40.And some or all of electroconductive particle is formed by metal material.For example, electroconductive particle has copper powder, silver powder, nickel powder, covers the silver-bearing copper powder, covers gold copper powder, covers silver-colored nickel powder, covers golden nickel powder, and these metal powders can wait by atomization, carbonylation method and prepare.In addition, except the above, can also use the particle that obtained by the resin clad metal powder, by the resin-coated particle that obtains of metal powder.In addition, electroconductive particle is preferably and covers the silver-bearing copper powder or cover silver-colored nickel powder.Its reason is because can be obtained the electroconductive particle of stable conductivity by the material of cheapness.In addition, the shape of the electroconductive particle of electric conducting material 23 is not necessarily limited to spherical, for example also can be laminar or dendroid.
Conductive layer 22 has shield effectiveness, that is, and and the unnecessary radiation in the signal of telecommunication that shielding is sent by mainboard and from the noise of the electromagnetic wave of outside etc.Conductive layer 22 is metal levels, this metal level is formed by nickel, copper, silver, tin, gold, palladium, aluminium, chromium, titanium or zinc, perhaps, is formed by the alloy that contains any material in these materials, perhaps, form by the alloy that contains the two or more materials in these materials.In addition, as metal material, suitably select to get final product according to required shield effectiveness, yet there is the problem that oxidation takes place easily in copper when contacting with atmosphere, golden costs an arm and a leg, and therefore cheap aluminium or the high silver of reliability are preferred.In addition,, suitably select to get final product, but thickness is preferably 0.01 μ m to 10 μ m according to required shield effectiveness and to the tolerance of alternating bending, slip for the thickness of film.Thickness can not obtain sufficient shield effectiveness during less than 0.01 μ m, and bendability will become problem when surpassing 10 μ m.In addition, the formation method of conductive layer 22 has vacuum deposition method, sputtering method, CVD method, MO (the organic method of metal) method, plating method, slice method etc., if consider batch process, then vacuum deposition method is preferred, can obtain cheap and stable conductive layer 22.In addition, as mentioned above, under the situation that electric conducting material 23 is formed by the isotropic conductivity cement, also conductive layer 22 can be set sometimes.
Insulating barrier 21 is formed by the mixture of resin such as epoxies, polyesters, acrylic compounds, phenols and carbamates or these resins, plays to keep insulating properties and cover so that conductive layer 22 is not directly exposed to outer effect.In addition, the thickness of insulating barrier 21 is 1 μ m to 10 μ m, forms insulating barrier 21 by directly coating conductive layer 22, and this mode for example compares to and membranaceously can form thinlyyer, thereby can make electroconductive particle 32 be easier to break through insulating barrier 21.
In addition, when strengthening part 35 was arranged on the screened film 20 by conductivity cement 30, conductivity cement 30 was engaged on the insulating barrier 21 in the screened film 20.When carrying out above-mentioned joint, from strengthening part 35 sides insulating barrier 21 is heated and to make it softening.So, soften insulating barrier 21 by heating, the electroconductive particle 32 of conductivity cement 30 will be easy to break through insulating barrier 21.Therefore, under the heating-up temperature of the resins such as epoxies that form insulating barrier 21 by can on insulating barrier 21 strengthening part 35 be set the time softening resin taking place forms.
At this, shown in the enlarging section a of Fig. 1, when engaging conductivity cement 30 and insulating barrier 21, the part of the electroconductive particle 32 that conductivity cement 30 comprises is outstanding from the lower surface of cement 31, and the protuberance of this electroconductive particle 32 is broken through insulating barrier 21 and contacted with conductive layer 22.Therefore, the bed thickness L1 of insulating barrier 21 is set to the outstanding length L 2 of giving prominence to from conductivity cement 30 less than electroconductive particle 32.Particularly, at the thickness of the cement 31 of conductivity cement 30 is that the average grain diameter of 5 μ m to 15 μ m, electroconductive particle 32 is under the situation of 10 μ m to 20 μ m, the outstanding length L 2 of electroconductive particle 32 is 5 μ m to 15 μ m, and therefore, the thickness of insulating barrier 21 is in the scope of 2 μ m to 12 μ m.In addition, as shown in Figure 1, electroconductive particle 32 be configured in one by one on the bed thickness direction of conductivity cement 30 and with the direction of described bed thickness direction quadrature on form a line.For example, also can on the bed thickness direction of conductivity cement 30, superpose two row or three row electroconductive particles 32.Promptly, in the present embodiment, on the bed thickness direction of conductivity cement 30, strengthening part 35 and conductive layer 22 are realized being electrically connected by an electroconductive particle 32, but be not limited to this, also can be on the bed thickness direction of conductivity cement 30 a plurality of electroconductive particles 32 of superposed configuration, by these a plurality of electroconductive particles 32 strengthening part 35 and conductive layer 22 are electrically connected.As long as the bed thickness of insulating barrier 21 is set to littler from the outstanding outstanding length of conductivity cement 30 than electroconductive particle 32.
Have as mentioned above in the screened film 20 that constitutes, electric conducting material 23 enter in the hole portion 40 and be exposed to outer earthy circuit pattern 14 and contact.Thus, conductive layer 22 by the electric conducting material 23 that engages with contact condition and earthy circuit pattern 14 conductings and with its maintenance equipotential.Thus, screened film 20 has shield effectiveness, thereby can shield the noises such as electromagnetic wave 90a from the outside.
In addition, screened film 20 is configured part or all that makes its covering zone relative with the installation position of electronic unit, described electronic unit connects printed circuit board (PCB) 10 in described installation position.Thus, can utilize screened film 20 shielding by the noise of outside to the electromagnetic wave 90b of the installation position radiation of electronic unit 50 etc.
In addition, can break through the insulating barrier 21 of screened film 20 and contact from the outstanding electroconductive particle 32 of the lower surface of conductivity cement 30 with conductive layer 22 under it.Thus, the conductive layer 22 of strengthening part 35 and screened film 20 becomes conducting state by the electroconductive particle 32 of conductivity cement 30, thereby can make strengthening part 35 and conductive layer 22 with conductivity be in equipotential.
As mentioned above, the shielded printed circuit board 1 of present embodiment comprises: printed circuit board (PCB) 10, screened film 20 and strengthening part 35, wherein, printed circuit board (PCB) 10 comprises the substrate parts 12 that is formed with earthy circuit pattern 14 and is arranged on the substrate parts 12 and covers the dielectric film 11 of earthy circuit pattern 14, and is connected with electronic unit 50 in the installation position of the lower surface that is arranged at substrate parts 12; Screened film 20 is arranged on the printed circuit board (PCB) 10, comprising: with earthy circuit pattern 14 be in the relative zone of equipotential and covering and installation position part or all conductive layer 22 and be arranged at insulating barrier 21 on the conductive layer 22; Strengthening part 35 is disposed at zone relative with the installation position on the screened film 20 and has conductivity; In this shielded printed circuit board 1, strengthening part 35 is engaged on the insulating barrier 21 by the conductivity cement 30 that comprises spherical electroconductive particle 32, the bed thickness of insulating barrier 21 less than electroconductive particle 32 under conductivity cement 30 and state that insulating barrier 21 engages from the outstanding outstanding length of conductivity cement 30, electroconductive particle 32 contacts with conductive layer 22 under the state of conductivity cement 30 and insulating barrier 21 joints.
According to said structure, on printed circuit board (PCB) 10, dispose with earthy circuit pattern 14 and be in part or all that equipotential conductive layer 22 and this conductive layer 22 covers the zone relative with the installation position of electronic unit 50.Thus, can shield by the electromagnetic wave 90a of outside by screened film 20 the installation position radiation of electronic unit 50 with conductive layer 22.In addition, relative with the installation position of electronic unit 50 zone is strengthened by the strengthening part 35 that is arranged on the screened film 20.Thus, can prevent distortion that results from the installation position of being caused by bending etc. etc. by strengthening part 35.And, the electroconductive particle 32 that conductivity cement 30 comprises contacts with the conductive layer 22 of screened film 20 under the state that conductivity cement 30 and insulating barrier 21 engages, wherein, described conductivity cement 30 is used for strengthening part 35 is engaged in the insulating barrier 21 of screened film 20.Therefore, can make the current potential of strengthening part 35 and the current potential of conductive layer 22 be in equipotential, can make strengthening part 35 also have shield effectiveness with conductivity.Thus, this double effects of shield effectiveness of shield effectiveness by screened film 20 and strengthening part 35 can be more reliably provides shield effectiveness to the installation position of electronic unit 50.Therefore, do not need to resemble and expose earthy circuit pattern 14 and strengthening part 35 is connected with earthy circuit pattern 14 in order to make strengthening part 35 be in earthing potential the prior art by the conductivity cement, therefore, do not need to form earthy circuit pattern 14, thereby improved design freedom according to the allocation position of strengthening part 35.In addition, owing to do not need by the conductivity cement strengthening part 35 to be connected with earthy circuit pattern 14, therefore the defective when the caused backflow in space occurring in this coupling part can not take place yet.As mentioned above, not only can guarantee design freedom but also can keep shield effectiveness.In addition, because electroconductive particle 32 is spherical, therefore no matter electroconductive particle 32 to which direction tilts in conductivity cement 30, and the length that electroconductive particle 32 is given prominence to from conductivity cement 30 is roughly certain on the bed thickness direction.Thus, for example, compare to laminar or dendroid, be easy to contact with conductive layer 22 thereby electroconductive particle 32 will be easier to break through insulating barrier 21.Its result can remain on equipotential with strengthening part 35 and conductive layer 22 more reliably.
In addition, in the shielded printed circuit board 1 of present embodiment, printed circuit board (PCB) 10 also comprises: be formed with the substrate parts 12 of earthy circuit pattern 14 and be arranged on the substrate parts 12 and cover the dielectric film 11 of earthy circuit pattern 14, in dielectric film 11, be formed with the hole portion 40 of exposing with circuit pattern 14 for partial earthing, the conductive layer 22 of screened film 20 is arranged on the electric conducting material 23 and contacts this electric conducting material 23, wherein, electric conducting material 23 is arranged on the insulating barrier 11 and is filled in the hole portion 40.
According to above-mentioned formation, can the current potential of the conductive layer 22 of screened film 20 and the current potential of earthy circuit pattern 14 be become equipotential by electric conducting material 23, wherein, described electric conducting material 23 is filled in the hole portion 40 that is formed at dielectric film 11.Thus, need not be in earthing potential and specially connect the external ground parts for the current potential that makes conductive layer 22.
In addition, in the shielded printed circuit board 1 of present embodiment, the insulating barrier 21 of screened film 20 is coated on the conductive layer 22.
According to above-mentioned formation, because the insulating barrier 21 of screened film 20 is coated on the conductive layer, therefore, for example can make it thinner, thereby will be easy to break through insulating barrier 21 and contact with conductive layer 22 from the outstanding electroconductive particles 32 of conductivity cement 30 than membranaceous insulating barrier 21.
In addition, in the shielded printed circuit board 1 of present embodiment, strengthening part 35 is formed by stainless steel material.
According to above-mentioned formation since stainless steel material to have the hardness and the corrosion resistance that are suitable for reinforcing outstanding, therefore can be more effectively not only ruggedized electronics parts 50 the installation position but also provide shield effectiveness to the installation position.
In addition, in the present embodiment, strengthening part 35 can also further connect with earthy circuit pattern 14 and keep equipotential external ground parts.That is, also can constitute, externally prepare separately to be in equipotential earthy parts with earthy circuit pattern 14, use wiring etc. further is connected strengthening part 35 with earthy parts.In view of the above, strengthening part 35 keeps equipotential by the electroconductive particle 32 that conductivity cement 30 comprises at inner and earthy circuit pattern 14, and, also can keep equipotential by outside earthy parts and earthy circuit pattern 14, therefore can further improve shield effectiveness.
(manufacture method of shielded printed circuit board 1)
Next, use Fig. 2 and Fig. 3 that the manufacture method of the shielded printed circuit board 1 of present embodiment is described.As Fig. 2 and shown in Figure 3, the manufacture method of the shielded printed circuit board 1 of present embodiment comprises: hole portion forms step, forms hole portion 40 in the dielectric film 11 of printed circuit board (PCB) 10; The screened film engagement step is provided with screened film 20 at the upper surface of printed circuit board (PCB) 10; The peel ply strip step is peeled off the uppermost peel ply 28 that is positioned at screened film 20; Conductivity cement engagement step engages conductivity cement 30 at the upper surface of the insulating barrier 21 of screened film 20; The strengthening part engagement step is engaged in strengthening part 35 on the conductivity cement 30; And the electronic unit Connection Step, position relative with strengthening part 35 on the lower surface of printed circuit board (PCB) 10 connects electronic unit 50.
Below, specify each step.Shown in Fig. 2 (a), form in the step in hole portion, at first prepare printed circuit board (PCB) 10.Then, by being carried out modes such as laser processing, the dielectric film 11 of printed circuit board (PCB) 10 and cement layer 13 form hole portion 40.By this step, be selected from outside a plurality of signals are exposed to logical via portion 40 such as the subregion of the earthy circuit pattern 14 of circuit pattern and earthy circuit pattern etc.
Next, shown in Fig. 2 (b), in the screened film engagement step, on the dielectric film 11 of printed circuit board (PCB) 10, engage screened film 20.In this engaging process, pass through forcing press P pressing printed circuit board (PCB) 10 and screened film 20 on above-below direction while pass through the electric conducting material 23 of heater h heating screened film 20.Thus, the electric conducting material of screened film 20 23 deliquescing by the heating of heater h, and be engaged on the dielectric film 11 by forcing press P institute applied pressure, and be filled in the hole portion 40.Then, the very fast and earthy circuit pattern 14 of electric conducting material 23 that is filled in the hole portion 40 contacts.By this step, on the dielectric film 11 of printed circuit board (PCB) 10, screened film 20 is set, and the conductive layer 22 of screened film 20 and earthy circuit pattern 14 are by electric conducting material 23 conductings.Thus, the conductive layer 22 of screened film 20 and earthy circuit pattern 14 keep equipotential, can be by the noises such as electromagnetic wave 90a of screened film 20 shieldings from the outside.
Next, shown in Fig. 2 (c), in the peel ply strip step, peel off the uppermost peel ply 28 that sets in advance in screened film 20.
Next, shown in Fig. 3 (d), in conductivity cement engagement step, conductivity cement 30 is engaged on the insulating barrier 21 of screened film 20.In addition, in this step, conductivity cement 30 is engaged on the insulating barrier 21 temporarily.
Next, shown in Fig. 3 (e), in the strengthening part engagement step, on conductivity cement 30, engage strengthening part 35.In this engaging process, by heater h electric conduction of heating cement 30 on one side by forcing press P by padded coaming 60 at above-below direction will be arranged at screened film 20 and strengthening part 35 pressings of printed circuit board (PCB) 10 on one side.Thus, cement 31 deliquescing of conductivity cement 30 by the heating of heater h, electroconductive particle 32 is outstanding from cement 31 by forcing press P institute applied pressure.And, break through insulating barrier 21 from the outstanding electroconductive particles 32 of conductivity cement 30 by forcing press P institute applied pressure, and contact very soon with conductive layer 22 because of the heating deliquescing of heater h.In addition, the heating-up temperature of heater h is 150 ℃ to 190 ℃, and the pressure of forcing press P is 2MPa to 5MPa.In addition, forcing press P time of pressurizeing is 5 minutes to 60 minutes.By this step, the conductive layer 22 that strengthening part 35 and strengthening part 35 and screened film 20 are set on screened film 20 is switched on by electroconductive particle 32.Thus, strengthening part 35 keeps equipotential with conductive layer 22 and earthy circuit pattern 14, can make strengthening part 35 also have shield effectiveness.
At last, shown in Fig. 3 (f), in the electronic unit Connection Step, connect electronic unit 50 in the installation position of printed circuit board (PCB) 10 lower surfaces (downside surface among the figure).At this moment, the upper surface (uper side surface among the figure) at printed circuit board (PCB) 10 disposes the conductive layer 22 of screened film 20 and part or all that this conductive layer 22 covers the zone relative with the installation position of electronic unit 50.Thus, can utilize screened film 20 shieldings by the electromagnetic wave 90b of outside to the installation position radiation of electronic unit 50.In addition, at the upper surface (uper side surface in the accompanying drawing) of screened film 20 strengthening part 35 and its being set, that the position is set is relative with the installation position of electronic unit 50.Thus, the shield effectiveness by strengthening part 35 can shield more reliably by the electromagnetic wave 90b of outside to the installation position radiation of electronic unit 50.
In addition, in the strengthening part engagement step shown in the conductivity cement engagement step shown in Fig. 3 (d) and Fig. 3 (e), earlier conductivity cement 30 is affixed on the insulating barrier 21, makes strengthening part 35 be engaged in conductivity cement 30 then.Also can earlier strengthening part 35 and conductivity cement 30 be engaged, then conjugant is affixed on the insulating barrier 21.But, comparing to and make conductivity cement 30 be engaged in strengthening part 35, the adaptation when making conductivity cement 30 be engaged in insulating barrier 21 is better, and therefore, the good operability of the manufacture method of present embodiment is easy to make.
(embodiment and comparative example)
Next, use the embodiment and the comparative example of the shielded printed circuit board 1 of present embodiment to specify the utility model.The detailed content and the experimental result of embodiment and comparative example are shown among Fig. 4.
As shown in Figure 4, use the shielded printed circuit board have with shielded printed circuit board 1 same structure of the utility model execution mode shown in Figure 1 in embodiment 1 to 5 and comparative example 1 and 2, use the shielded printed circuit board that has with existing shielded printed circuit board 100 same structures shown in Figure 5 in the comparative example 3.More specifically, for the connection form between strengthening part and the earthy circuit pattern, embodiment 1 to 5 and comparative example 1 and 2 have shielded printed circuit board 1 with present embodiment identical be connected form, have only comparative example 3 to have the connection form identical with existing shielded printed circuit board 100.At this, the printed circuit board (PCB) 10,110 that is used for embodiment and comparative example, the thickness of substrate parts 12,112 are 25 μ m, and the thickness of earthy circuit pattern 14,114,115 is 18 μ m, the thickness of cement layer 13,113 is 25 μ m, and the thickness of dielectric film 11,111 is 12 μ m.In addition, be used for the screened film 20,120 of embodiment and comparative example, the thickness of electric conducting material 23,123 is 10 μ m, and the thickness of conductive layer 22,122 is 0.1 μ m, and the thickness of insulating barrier 21,121 is 5 μ m.In addition, strengthening part 35,135 use have conductivity by the stainless steel material of nickel plating, its thickness is 0.2mm.
In addition, in embodiment 1 to 5 and the comparative example 1,2, the thickness that makes strengthening part 35 be engaged in the conductivity cement 30 of insulating barrier 21 is 10 μ m, and the average grain diameter of electroconductive particle 32 is set respectively as shown in Figure 4.In addition, the average grain diameter deviation of the electroconductive particle 32 of embodiment is in ± 5 μ m.For example, in embodiment 1, the average grain diameter of electroconductive particle 32 is 5 μ m, and the thickness of conductivity cement 30 and electroconductive particle 32 is 10 μ m under strengthening part 35 and state that insulating barrier 21 engages.In this embodiment 1, because the average grain diameter (5 μ m) of electroconductive particle 32 is littler than the thickness (10 μ m) of conductivity cement 30, therefore, electroconductive particle 32 exists with the form that is embedded in the conductivity cement 30, and also the thickness with conductivity cement 30 is identical for the thickness under the engagement state (10 μ m).In addition, in embodiment 1, even owing to consider deviation, the particle diameter maximum of electroconductive particle 32 also is 10 μ m, and therefore, electroconductive particle 32 exists with the form that is embedded in conductivity cement 30.In addition, for example, in embodiment 2, the average grain diameter of electroconductive particle 32 is 10 μ m, and the thickness of conductivity cement 30 and electroconductive particle 32 is 10 μ m under strengthening part 35 and state that insulating barrier 21 engages.In this embodiment 2, the average grain diameter of electroconductive particle 32 is (if consider deviation, then be 15 μ m) bigger than the thickness (10 μ m) of conductivity cement 30, the outstanding length (5 μ m) that electroconductive particle 32 is given prominence to from conductivity cement 30 is identical with the thickness (5 μ m) of insulating barrier 21.Therefore,, then break through insulating barriers 21 just, and contact with conductive layer 22 under it from conductivity cement 30 outstanding electroconductive particles 32 if consider the deviation of the average grain diameter of electroconductive particle 32.
In addition, as shown in Figure 4, among the embodiment 1 to 5 electroconductive particle 32 of conductivity cement 30 be shaped as spherical.And, in the comparative example 1 electroconductive particle 32 of conductivity cement 30 be shaped as laminarly, the electroconductive particle 32 of conductivity cement 30 is shaped as dendroid in the comparative example 2.In addition, the shape of the electroconductive particle of conductivity cement 130 is set to dendroid in the comparative example 3.In addition, the unification of the combined amount of electroconductive particle is 50wt% in all embodiment and the comparative example.
Use embodiment and the comparative example as above set like that, measure the connection resistance between strengthening part and the earthy circuit pattern.In addition, judge that in conjunction with the measured value of the connection resistance that is measured to anti-backflow in the reflow step result who is obtained makes overall merit, heating-up temperature is about 260 ℃ in described reflow step.At this, measured value for the connection resistance between strengthening part and the earthy circuit pattern has been set up following criterion, that is, be " zero " during less than 0.5 Ω, during more than or equal to 0.5 Ω and less than 10.0 Ω is " △ ", is " * " during more than or equal to 10.0 Ω.In addition, about anti-backflow, according to the electrical of the outward appearance detection after installing, shield detection etc., to whether qualified judge and be denoted as " zero " respectively, " △ " reaches " * ".
Its result about anti-backflow, causes expansion owing to having produced the space in comparative example 3, be judged to be by outward appearance detection etc. defective, i.e. " * ".Can think as its reason: for the connection form between strengthening part and the earthy circuit pattern, because comparative example 3 has the connection form identical with existing shielded printed circuit board shown in Figure 5 100, therefore, produced the space in the connecting portion between conductivity cement 130 and earthy circuit pattern 115.That is, can think, in the existing shielded printed circuit board 100, because the connecting portion between strengthening part 135 and the earthy circuit pattern 115 is clamped with hard material up and down, therefore, when attaching strengthening part 135, conductivity cement 130 does not fully cater to the step of hole portion 160.Its result causes the connecting portion between conductivity cement 130 and earthy circuit pattern 115 that space 160a, 160b have taken place, and expands because of the heating of reflow step in this space, thereby takes place as bad order, do not keep defective such as shield effectiveness.In addition, about embodiment 5, because some spaces have taken place, cause in outward appearance detection etc., being judged as " △ ".Can think as its reason: under the situation of embodiment 5, because the average grain diameter of electroconductive particle 32 is 30 μ m, the average grain diameter of electroconductive particle 32 is excessive with respect to the thickness of conductivity cement 30 and insulating barrier 21, therefore, gap between conductivity cement 30 and the insulating barrier 21 is bigger, thereby may cause taking place some spaces.
On the other hand, in embodiment 1 to 4 and the comparative example 1,2, because the connection form between strengthening part and the earthy circuit pattern is the connection form identical with the shielded printed circuit board 1 of present embodiment, and the situation that the average grain diameter that does not also have electroconductive particle 32 is excessive, therefore, do not have the defective as comparative example 3 or embodiment 5, anti-backflow sexual satisfaction is labeled as the criterion of acceptability of " zero ".
In addition, about the connection resistance between strengthening part and the earthy circuit pattern, embodiment 2 to 5 and comparative example 3 satisfy " zero " standard, and embodiment 1 is " △ ", and comparative example 1,2 is " * ".Can think as its reason:, therefore,, strengthening part 35 can not be held at ground current potential owing to the heeling condition of electroconductive particle causes breaking through insulating barrier 21 because electroconductive particle is laminar or dendroid in the comparative example 1,2.In addition, in embodiment 1, also the thickness with conductivity cement 30 is identical or littler than the thickness of conductivity cement 30 even the average grain diameter of electroconductive particle 32 is considered the deviation of its existence, therefore, electroconductive particle 32 is fewly outstanding from conductivity cement 30, thereby is difficult to contact with conductive layer 22.
On the other hand, in embodiment 2 to 5, with respect to the thickness of conductivity cement 30 and the thickness of insulating barrier 21, the average grain diameter of electroconductive particle 32 is suitable, and therefore, strengthening part 35 is stable with the conducting state of conductive layer 22.Its result, being connected resistance and can maintaining below 0.5 Ω of strengthening part 35 and earthy circuit pattern 14.In addition, in the comparative example 3, though the connecting portion at conductivity cement 130 and earthy circuit pattern 115 has produced space 160a, 160b, but, strengthening part 135 is held by dendritic conductivity cement 130 with the conducting state of earthy circuit pattern 115, thereby strengthening part 135 can be maintained below 0.5 Ω with the resistance that is connected of earthy circuit pattern 115.
According to above experimental result, if overall merit is carried out in the judgement that is connected resistance of strengthening part and earthy circuit pattern and the judgement of anti-backflow with " zero ", " △ ", " * ", then evaluation result is as follows: embodiment 2 to 4 is " zero ", embodiment 1,5 is " △ ", and comparative example 1 to 3 is " * ".According to this result as can be known, if use the form that is connected of strengthening part 35 and earthy circuit pattern 14 in the shielded printed circuit board 1 of present embodiment, the criterion of acceptability more than the then anti-backflow sexual satisfaction " △ ".And, according to this result as can be known, in the shielded printed circuit board 1 of present embodiment, if contact with conductive layer 22 from the outstanding electroconductive particles 32 of conductivity cement 30, the criterion of acceptability more than strengthening part and being connected of earthy circuit pattern resistor satisfied " △ " so.In addition, according to this result also as can be known, even suitably and under the situation of the slit that produces between conductivity cement 30 and the insulating barrier 21 consideration deviation can not surpass 10 μ m (situation among the embodiment 4) if compare the average grain diameter of electroconductive particle 32 with the thickness of conductivity cement 30 and insulating barrier 21 yet, so, connecting resistance and anti-backflow is good result all also, satisfies the criterion of acceptability of " zero " in the overall merit.
More than, execution mode of the present utility model has been described.In addition, the utility model is not limited to above-mentioned execution mode.
For example, in the shielded printed circuit board 1 of present embodiment,, make strengthening part 35 contacts and earthy circuit pattern 14 equipotential conductive layers 22 by breaking through insulating barrier 21 from the protuberance of the outstanding electroconductive particle 32 of conductivity cement 30.Also can use additive method to make strengthening part 35 and conductive layer 22 keep equipotential.For example, can use laser etc. to be formed for making a plurality of hole portion of conductive layer 22 outside being exposed on the surface of insulating barrier 21, attach the conductivity cement that comprises the dendroid electroconductive particle thereon, thus, make electroconductive particle flow into this hole portion, electroconductive particle is contacted with conductive layer 22.Thus, can make strengthening part 35 and conductive layer 22 keep equipotential by the conductivity cement, described conductivity cement comprises the dendroid electroconductive particle that is filled in hole portion.
More than, embodiment of the present utility model is illustrated, yet this only is that specific embodiment is carried out exemplary illustration, be not to special restriction of the present utility model, can carry out suitable design alteration for concrete formation etc.In addition, effect of describing in the embodiment and effect have only been enumerated optimum effect and the effect that is produced by the utility model, and effect that the utility model produced and effect are not limited to the description of embodiment.
The industry utilizability
The utility model goes for the employed shielded printed circuit boards of electronic equipment such as portable phone, computer.
Claims (5)
1. shielded printed circuit board comprises:
Printed circuit board (PCB) comprises: substrate parts is formed with earthy circuit pattern; And dielectric film, be arranged on the described substrate parts and cover described earthy circuit pattern, and, be connected with electronic unit in the installation position of the lower surface that is arranged at described substrate parts;
Screened film is arranged on the described printed circuit board (PCB), and described screened film comprises: conductive layer with described earthy circuit pattern equipotential, is configured in part or all of the upper surface of described printed circuit board (PCB) and the covering zone relative with described installation position; And insulating barrier, be arranged on the described conductive layer; And
Strengthening part has conductivity, and is arranged at zone relative with described installation position on the described screened film,
It is characterized in that:
Described strengthening part is engaged on the described insulating barrier by the conductivity cement, and described conductivity cement comprises spherical electroconductive particle,
The bed thickness of described insulating barrier less than described electroconductive particle under described conductivity cement and state that described insulating barrier engages from the outstanding outstanding length of described conductivity cement,
Described electroconductive particle contacts with described conductive layer under described conductivity cement and state that described insulating barrier engages.
2. shielded printed circuit board according to claim 1 is characterized in that:
Described strengthening part also is connected with the earthy parts of outside, and wherein, the earthy parts of described outside and described earthy circuit pattern keep equipotential.
3. shielded printed circuit board according to claim 1 is characterized in that:
The described insulating barrier of described screened film is coated on the described conductive layer.
4. shielded printed circuit board according to claim 2 is characterized in that:
The described insulating barrier of described screened film is coated on the described conductive layer.
5. according to any described shielded printed circuit board in the claim 1 to 4, it is characterized in that:
Described strengthening part is formed by stainless steel material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011016554A JP5308465B2 (en) | 2011-01-28 | 2011-01-28 | Shield printed wiring board |
| JP2011-016554 | 2011-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202085399U true CN202085399U (en) | 2011-12-21 |
Family
ID=45346011
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110130678.8A Active CN102625564B (en) | 2011-01-28 | 2011-05-16 | Shielded printed circuit board |
| CN2011201604157U Expired - Lifetime CN202085399U (en) | 2011-01-28 | 2011-05-16 | Shielded type printed circuit board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110130678.8A Active CN102625564B (en) | 2011-01-28 | 2011-05-16 | Shielded printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5308465B2 (en) |
| KR (1) | KR101776711B1 (en) |
| CN (2) | CN102625564B (en) |
| TW (1) | TWI501708B (en) |
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-
2011
- 2011-01-28 JP JP2011016554A patent/JP5308465B2/en active Active
- 2011-04-15 TW TW100113141A patent/TWI501708B/en active
- 2011-05-12 KR KR1020110044562A patent/KR101776711B1/en active IP Right Grant
- 2011-05-16 CN CN201110130678.8A patent/CN102625564B/en active Active
- 2011-05-16 CN CN2011201604157U patent/CN202085399U/en not_active Expired - Lifetime
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| CN102625564A (en) * | 2011-01-28 | 2012-08-01 | 大自达电线股份有限公司 | Shielded type printed circuit board |
| CN102625564B (en) * | 2011-01-28 | 2016-05-04 | 大自达电线股份有限公司 | Shielded printed circuit board |
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| CN104885578B (en) * | 2013-02-26 | 2018-05-04 | 大自达电线股份有限公司 | Flexible printed circuit board reinforcement part, flexible printed circuit board and shielding printed wiring board |
| CN108132113A (en) * | 2018-01-31 | 2018-06-08 | 北京他山科技有限公司 | Sensor, electronic skin and the robot of electromagnetic shielding are realized using Multifunctional layered |
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
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| CN111312078A (en) * | 2020-03-05 | 2020-06-19 | 武汉华星光电半导体显示技术有限公司 | Display panel and side bonding method thereof |
| CN114286538A (en) * | 2020-09-28 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board with plugging fingers and manufacturing method thereof |
| CN114286538B (en) * | 2020-09-28 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board with inserted fingers and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102625564B (en) | 2016-05-04 |
| TWI501708B (en) | 2015-09-21 |
| JP5308465B2 (en) | 2013-10-09 |
| CN102625564A (en) | 2012-08-01 |
| KR101776711B1 (en) | 2017-09-08 |
| KR20120087753A (en) | 2012-08-07 |
| JP2012156457A (en) | 2012-08-16 |
| TW201233262A (en) | 2012-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Morimoto Syohei Inventor after: Tian Daohong Inventor after: Kamino Kenji Inventor before: Shohei Morimoto Inventor before: Tian Daohong Inventor before: Kamino Kenji |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20111221 Effective date of abandoning: 20160504 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |