JP2007287654A - Connection unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection unit capable of improving migration resistant property, specially for narrow pitching between a plurality of conductive patterns, and capable of assuring conductivity between electrodes and efficient insulation property between above adjacent conductive patterns on a support. <P>SOLUTION: A coating film 10 containing first conductive particles 12, insulation particles 13 and a resin layer 11 filling the periphery of the first conductive particles 12 and the insulation particles 13, covers over conductive patterns 7 and an insulation substrate 3 between the conductive patterns 7. With this, migration resistant property can be effectively improved even with narrow pitching between the conductive patterns 7. And also, the first electrode 7a and the second electrode 14 can be electrically connected by the first conductive particles 12 appropriately, as well as the conductive patterns can be appropriately insulated. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  In particular, the present invention can improve the migration resistance even when the pitch between a plurality of conductive patterns formed on a support is narrowed, and the conduction between electrodes arranged opposite to each other on the conductive pattern at the time of connection. The present invention relates to a connection device capable of sufficiently ensuring the insulation and the insulation between the conductive patterns adjacent on the support.

  Conventionally, connectors are used to connect electric circuits of various electronic devices. The connector includes a first connector (male connector) formed by forming a plurality of conductive patterns (wiring members) on the surface of an insulating substrate, and a second connector (female connector) having an insertion portion. Is done.

  With the miniaturization of the connector, a narrow pitch between the conductive patterns is promoted. At this time, conventionally, for example, the conductive pattern is formed of a conductive coating film including Ag particles as conductive particles and a polyester resin as a binder resin.

However, migration due to Ag particles occurs in the presence of current and voltage, and the above-described narrowing of the pitch is promoted, thereby causing a problem that the conductive patterns are short-circuited or disconnected. Moreover, since the surface of the conductive pattern formed of the conductive coating film is soft, there is a problem that the conductive coating film is easily peeled off by inserting and removing the connector.
JP 2004-319882 A JP 2002-75488 A JP 2002-285135 A JP 2001-135141 A

  Therefore, conventionally, a conductive coating film having excellent migration resistance has been used for the conductive pattern. For example, a conductive coating comprising Ni particles and phenolic resin with Au plating on the surface, and a conductive coating comprising Ni particles, acrylic resin and block isocyanate (curing agent) with Au plating on the surface. A coating film or the like was used.

  However, in the conductive film, the specific resistance is higher than that in the case of the conductive film having Ag particles and the polyester resin, so that the width dimension of the conductive pattern cannot be effectively reduced. It was not possible to promote downsizing. There was also a problem that the bendability was poor.

  Patent Document 1 discloses an invention in which an anisotropic conductive film having water resistance is pressure-bonded onto a connection terminal exposed on a base body and a base body.

  However, Patent Document 1 does not disclose a specific means for improving the dispersibility of the conductive particles contained in the anisotropic conductive film. That is, when the conductive particles contained in the anisotropic conductive film are in contact with each other, the conductive patterns are short-circuited by the conductive particles. Therefore, although the dispersibility of the conductive particles is extremely important, it is not certain how the dispersibility of the conductive particles is enhanced.

  Moreover, in patent document 1, content of the electroconductive particle contained in the said anisotropically conductive film cannot be increased so much. This is because if the number is increased, sufficient insulation between the conductive patterns cannot be secured. However, since the contact between the conductive particles and the contacted body (the connection terminal 12 shown in Patent Document 1) is reduced by reducing the content of the conductive particles, the conductive particles and the contacted body are reduced. It is necessary to devise a way to ensure sufficient contact between them.

  The inventions described in Patent Documents 2 to 4 are all inventions related to anisotropic conductive adhesives, and are not used for connectors that can be inserted and removed as described above.

  Therefore, the present invention solves the above-described conventional problems, and in particular, it is possible to improve migration resistance even in a narrow pitch between a plurality of conductive patterns formed on a support, and at the time of connection, It is an object of the present invention to provide a connection device capable of sufficiently ensuring the conductivity between electrodes arranged opposite to each other on a conductive pattern and the insulation between adjacent conductive patterns on the support.

The connection device in the present invention is
A first support and a plurality of conductive patterns having at least a first electrode formed on the first support;
The conductive pattern and the first support between the conductive patterns are covered with a coating film having first conductive particles, insulating particles, and a resin layer, and the first conductive The particles and the insulating particles are scattered on the conductive pattern and the first support, and the resin layer fills the periphery of the first conductive particles and the insulating particles,
The first electrode can be electrically connected to the second electrode opposed to the first electrode via the first conductive particles, and the conductive pattern is formed between the resin layer and the insulating layer. It is characterized by being insulated by particles.

  In the present invention, as described above, the first conductive particles and the insulating particles scattered on the conductive pattern and the first support between the conductive patterns, and the first conductive particles and the insulating particles. It is covered with the coating film having an insulating layer filling the periphery, and it is possible to effectively improve the migration resistance even by narrowing the pitch between the conductive patterns.

  In addition, the coating film contains the first conductive particles, but the insulating film is further included so that the dispersibility of the first conductive particles in the coating film is more uniform. Become. Therefore, the first electrode and the second electrode can be appropriately electrically connected by the first conductive particles, and the adjacent conductive patterns on the first support can be appropriately insulated. . Therefore, it is possible to provide a connection device having excellent electrical stability.

  In the present invention, the average particle diameter of the first conductive particles is preferably larger than the average particle diameter of the insulating particles. As a result, the first electrode and the second electrode can be appropriately connected via the first conductive particles.

  Moreover, in this invention, it is preferable that the average particle diameter of a said 1st electroconductive particle is larger than the average film thickness of the said resin layer. That is, each 1st electroconductive particle arrange | positioned on an electroconductive pattern can be exposed from the surface of the said resin layer, without the some 1st electroconductive particle continuing in a film thickness direction. Therefore, the first electrode and the second electrode can be appropriately connected via the first conductive particles, and the contact resistance between the first electrode and the second electrode can be reduced.

  Moreover, in this invention, it is preferable that the average particle diameter of a said 1st electroconductive particle exists in the range of 5-15 micrometers. The first conductive particles include Ni particles plated with Au, Pd particles plated with Au, Ag-Pd alloy particles, Pd plated on the surface, and Au plated. It is preferably at least one selected from Ni particles formed, Pd particles plated with Au, Ag—Pd alloy particles, and resin plated with Au on the surface.

  In the present invention, the content of the first conductive particles is preferably in the range of 1 to 15% by volume in the coating film.

  The average particle diameter of the insulating particles is preferably in the range of 1 to 8 μm. Moreover, it is preferable that content of the said insulating particle is 5-40 volume% in the said coating film. The insulating particles preferably include at least one of silica, glass beads, and resin.

  Moreover, in this invention, it is preferable that the average film thickness of the said resin layer exists in the range of 3-10 micrometers. Thereby, the bendability can be improved.

  Moreover, in this invention, it is preferable that the said resin layer is harder than the said conductive pattern by at least any 1 type selected from the acrylic resin, the polyester resin, the epoxy resin, and the phenol resin. Thereby, the surface of the coating film can be hardened, and the peel resistance of the coating film can be improved.

  In the present invention, the conductive pattern includes second conductive particles made of Ag particles, and at least one binder resin of polyester resin, acrylic resin, epoxy resin, and phenol resin. It is preferable. The conductive pattern can be formed with low resistance. Therefore, even if the width dimension of the conductive pattern is reduced, an increase in resistance value can be suppressed, and as a result, downsizing of the connection device can be promoted. In addition, the bendability of the conductive pattern can be improved.

In the present invention, the connection device further includes the second electrode and a second support that supports the second electrode,
At least the second support and the coating film except on the first electrode may be bonded and fixed with a non-conductive thermosetting adhesive. At this time, the thermosetting adhesive is preferably a non-conductive paste (NCP) or a non-conductive film (NCF).

  In particular, in the present invention, the thermosetting adhesive can be configured to be interposed also in a gap between the coating film provided on the first electrode and the second electrode, whereby the first Adhesion between the support and the second support can be strengthened.

  In the present invention, a conductive surface member is provided on at least a part of the first electrode via the coating film, and the surface member has at least migration resistance better than Ag particles. It is preferable that the third conductive particles are contained. Thereby, the electrical connectivity between the first electrode and the second electrode can be improved. In addition, since the surface member includes conductive particles that have better migration resistance than Ag particles, the occurrence of migration of the surface member can be suppressed.

  In the present invention, an insulating film is formed on at least the first support excluding the first electrode, and the coating film is formed on the insulating film from the first electrode not covered with the insulating film. It is preferable that it is formed over. Thereby, the occurrence of migration of the conductive pattern can be suppressed more appropriately, and good insulation between the conductive patterns can be ensured.

  In the present invention, the first conductive particles and the insulating particles scattered on the conductive pattern and the first support between the conductive patterns, and the insulating layer filling the periphery of the first conductive particles and the insulating particles. Thus, it is possible to effectively improve the migration resistance even by narrowing the pitch between the conductive patterns.

  In addition, the coating film contains the first conductive particles, but the insulating film is further included so that the dispersibility of the first conductive particles in the coating film is more uniform. Become. Therefore, the first electrode and the second electrode can be appropriately electrically connected by the first conductive particles, and the conductive patterns can be appropriately insulated. Therefore, it is possible to provide a connection device having excellent electrical stability.

  FIG. 1 is a partial perspective view showing a first connector (connecting device) and a second connector for connecting the first connector, and FIG. FIG. 3 is a plan view of the first embodiment in which the first connector is connected to the second connector and is cut from the line AA shown in FIG. 4 is a partially enlarged sectional view of the first connector and the second connector in the embodiment, FIG. 4 is a partially enlarged sectional view of the first connector and the second connector in the second embodiment, and FIG. 5 is a partial plan view of the first connector shown in FIG. FIG. 6 is a partially enlarged sectional view of the first connector and the second connector in the third embodiment, and FIG. 7 is a partial plan view of the first connector shown in FIG. 6 (excluding the surface member and the coating film). The plan view in the state.

  An insulating substrate (first support) 3 constituting the first connector (male connector) 1 shown in FIG. 1 is formed by a laminated structure shown in FIG. That is, the insulating substrate 3 includes a flexible resin film 6 and a reinforcing plate (for example, a synthetic resin plate) 4 provided on the back surface of the resin film 6 through a bonding material 5 such as an adhesive or an adhesive. It is a laminated structure. The structure of the insulating substrate 3 is not limited to the structure shown in FIG.

  A large number of conductive patterns 7 are formed on the insulating substrate 3 by screen printing or the like.

  A protective member 8 made of an insulating material such as a resist is provided on the conductive pattern 7 except for the connection region B provided at the tip of the insulating substrate 3.

  Here, the area of the connection area B can be set arbitrarily. For example, a portion not covered with the protective member 8 is set as the connection region B. In FIG. 1, the connection region B is provided only at the tip of the first connector 1, but a plurality of connection regions B may be provided. For example, the connection region B is formed at the front end and the rear end of the first connector 1.

  As shown in FIG. 2, the conductive pattern 7 includes a first electrode 7a and a wiring part 7b connected to the first electrode 7a. The first electrode 7a and the wiring part 7b are integrally formed. Among these, the first electrode 7a appears in the connection region B. The first electrode 7 a is a portion that is electrically connected to the second electrode 14 provided in the insertion port 2 a of the second connector 2. Further, a part of the wiring portion 7b also appears in the connection region B.

  As shown in FIG. 3, the width of the first electrode 7a is T1, the width of the wiring part 7b is T2, and the distance between the first electrode 7a and the wiring part 7b is T3. It is formed.

  Although it is possible to form the first electrode 7a and the wiring part 7b with different conductive coating films (that is, not integrated), in the present embodiment, the first electrode 7a and the wiring part 7b are common. It is preferable that the conductive coating film be formed. The first electrode 7a and the wiring part 7b include second conductive particles made of Ag particles and at least one binder resin of polyester resin, acrylic resin, epoxy resin, and phenol resin. Composed. More preferably, the second conductive particles are formed of Ag particles, and the binder resin is formed of a polyester resin. Thereby, the specific resistance of the conductive pattern 7 can be lowered, and the bendability of the conductive pattern 7 can be improved. The second conductive particles are preferably included in the conductive pattern 7 by 30 to 50% by volume. The remaining volume% is almost the content of the binder resin. The average particle diameter of the second conductive particles is preferably in the range of 0.5 to 10 μm. Thus, the second conductive particles are sufficiently smaller than the average particle diameter of the first conductive particles described later. The second conductive particles and the binder resin are patterned in the shape of the conductive pattern 7 by screen printing or the like as a conductive paste mixed in a solvent, and then the solvent is removed by heat treatment to heat the binder resin. It is hardened. Thus, in this embodiment, since all the said conductive patterns 7 can be formed with the same material, a manufacturing process can be simplified. Moreover, by forming with an Ag coating film, various characteristics such as electrical characteristics and bendability of the conductive pattern 7 can be improved. The problem is migration, but in this embodiment, the migration problem is solved by providing a coating film 10 to be described later.

  A coating film 10 is provided on the conductive pattern 7 in the connection region B shown in FIG. 2 and on the insulating substrate 3 between the conductive patterns 7. The coating film 10 will be described in detail.

  In the present embodiment, the coating film 10 is configured to include first conductive particles 12, insulating particles 13, and a resin layer 11. As shown in FIG. 2, a large number of the first conductive particles 12 and the insulating particles 13 are scattered on the conductive pattern 7 and the insulating substrate 3, and the resin layer 11 is formed of the first conductive particles. The periphery of the particles 12 and the insulating particles 13 is buried. By covering the conductive pattern 7 in the connection region B and the insulating substrate 3 between the conductive patterns 7 with the coating film 10, even if an Ag coating film is used for the conductive pattern 7, Migration can be suppressed appropriately. The migration referred to here is ion migration.

  The first conductive particles 12 are evenly scattered throughout the connection region B. At least one first conductive particle 12 is provided on each first electrode 7a, and each first conductive particle 12 is in contact with the first electrode 7a. Further, the first conductive particles 12 are exposed from the surface of the coating film 10.

  As shown in FIG. 3, the average particle size T4 of the first conductive particles 12 is larger than the average particle size T5 of the insulating particles 13. Although all the particles are not labeled in FIG. 3, the particles having a large particle size are the first conductive particles 12 (indicated by hatching), and the particles having a small particle size are the insulating particles 13 (indicated by dots). ).

  The average particle diameter T4 of the first conductive particles 12 is preferably larger than the average film thickness T6 of the resin layer 11. The average particle diameter T4 of the first conductive particles 12 is preferably in the range of 5 to 15 μm. The first conductive particles 12 are preferably formed of a material that is superior in migration resistance as compared to the second conductive particles (for example, Ag particles) included in the conductive pattern 7. The first conductive particles 12 include Ni particles plated with Au on the surface, Ni particles plated with Pd on the surface and further plated with Au, Pd particles plated with Au on the surface, Ag -Pd alloy particles, preferably at least one selected from resins having Au plated on the surface. The resin is preferably a plastic.

  The first conductive particles 12 are evenly scattered in the coating film 10, and the first conductive particles 12 are not in contact with each other. In this embodiment, insulating particles 13 are added to the coating film 10 in order to improve the dispersibility of the first conductive particles 12 in the coating film 10. By adding the insulating particles 13, the dispersibility of the first conductive particles 12 in the conductive paste can be enhanced. For this reason, when the conductive paste is screen printed in the shape of the coating film 10 and heat-treated to form the coating film 10, the density of the first conductive particles 12 is dense in the coating film 10. There is no division into areas and sparse areas. A region in which the density of the first conductive particles 12 is dense may be formed only on the conductive pattern 7. Since it becomes easy to short-circuit, it is very important to improve the dispersibility of the first conductive particles 12.

  The content of the first conductive particles 12 in the coating film 10 is preferably in the range of 1 to 15% by mass. If the content of the first conductive particles 12 is too small, the number of the first conductive particles 12 on the first electrode 7a will be too small, and the distance between the first electrode 7a and the second electrode 14 will be reduced. The continuity of decreases. Moreover, when there is too much content of the said 1st electroconductive particle 12, between the said electroconductive patterns 7 will become easy to short-circuit via the said 1st electroconductive particle 12. FIG.

  As described above, the average particle diameter T4 of the first conductive particles 12 is larger than the average particle diameter T5 of the insulating particles 13 and larger than the average film thickness T6 of the resin layer 11. As a result, the surface of the first conductive particle 12 is exposed from the surface of the resin layer 11 and protrudes above the surface of the resin layer 11 and the surface of the insulating particles 13. As a result, the first electrode 7 a and the second electrode 14 are electrically connected to each other through the first conductive particles 12. In addition, the first electrode 7a and the second electrode 14 are not conductively connected in a state where the plurality of first conductive particles 12 are continuous in the film thickness direction, and the first electrode 7a and the second electrode are not electrically connected. Since there is at most one first conductive particle 12 in the film thickness direction between 14, the resistance value between the first electrode 7 a and the second electrode 14 through the coating film 10 does not increase so much ( Contact resistance can be reduced).

  The average particle diameter T5 of the insulating particles 13 is preferably in the range of 1 to 8 μm. When the insulating particles 13 are smaller than the above range, the dispersibility of the first conductive particles 12 in the conductive paste cannot be appropriately increased. As a result, the dispersibility of the first conductive particles 12 in the coating film 10 also decreases. Further, when the average particle size of the insulating particles 13 is larger than the above range, the protruding amount of the insulating particles 13 from the surface of the resin layer 11 increases, and the second electrode 14 and the first electrode 7a through the coating film 10 are increased. The continuity between them decreases.

  Moreover, it is preferable that content of the said insulating particle 13 is 5-40 volume% in the said coating film. When the content of the insulating particles 13 is less than the above range, the dispersibility of the first conductive particles 12 in the conductive paste cannot be improved appropriately. As a result, the dispersibility of the first conductive particles 12 in the coating film 10 decreases. Further, the insulation between the conductive patterns 7 is lowered. In addition, when the content of the insulating particles 13 is larger than the above range, the content of the first conductive particles 12 is reduced, and therefore, between the first electrode 7a and the second electrode 14 via the coating film 10. The continuity of decreases.

  In the present embodiment, the insulating particles 13 preferably include at least one of silica, glass beads, and resin. The resin is preferably a plastic. The insulating particles 13 may be an inorganic material or an organic material. The insulating particles referred to here are particles that do not conduct electricity. For example, the center is a conductive particle, the periphery of which is covered with an insulating layer, and a particle that does not conduct electricity becomes an insulating particle.

  In the embodiment shown in FIG. 3, the first conductive particles 12 and the insulating particles 13 are spherical, but are not limited to being spherical. For example, the shape is not particularly limited, such as an ellipsoid or a scale shape, but the first conductive particles 12 are particularly preferably spherical. Thereby, the electrical conductivity between the first electrode 7a and the second electrode 14 can be improved. The “average particle diameter” in the case of not being spherical is the average length of the longer side.

  The average film thickness T6 of the resin layer 11 is preferably in the range of 3 to 10 μm. If the average film thickness T6 of the resin layer 11 is too small, the resin layer 11 does not function properly as a binder resin, and the repeated insertion and removal of the connector makes the first conductive particles 12 brittle and easy to peel off. On the other hand, if the average film thickness T6 of the resin layer 11 is too large, the first conductive particles 12 are likely to be embedded in the resin layer 11 and poor conduction between the first electrode 7a and the second electrode 14 occurs. It becomes easy. Further, the bendability is lowered.

  The resin layer 11 fills the periphery of the first conductive particles 12 and the insulating particles 13, but may be further on the lower side of the insulating particles 13 and covers the upper side of the insulating particles 13. It may be. The resin layer 11 may cover the upper side of some of the first conductive particles 12, but many of the first conductive particles 12 are arranged in direct contact with the conductive pattern 7. In addition, the surface of the first conductive particles 12 is not covered with the resin layer 11.

  The resin layer 11 is preferably at least one selected from an acrylic resin, a polyester resin, an epoxy resin, and a phenol resin. The resin layer 11 is preferably made of a material harder than the conductive pattern 7. This is because the coating film 10 can be appropriately prevented from peeling off when the connector is repeatedly inserted and removed. When the resin layer 11 is hard and the average film thickness T6 is large, the bendability deteriorates as described above, and the coating film 10 breaks when the connection region B is bent. However, in the present embodiment, as described above, the average film thickness T6 of the resin layer 11 is set in the range of 3 to 10 μm, so that the resin layer 11 of the coating film 10 can be made of a hard material such as acrylic resin. , Bendability can be improved.

  In the present embodiment, as described above, the first conductive particles 12 and the insulating particles 13 are formed on the resin layer 11 on the conductive pattern 7 exposed in the connection region B and on the insulating substrate 3 between the conductive patterns 7. By providing the coating film 10 contained, the pitch between the conductive patterns 7 can be narrowed, and even when an Ag coating film or the like is used for the conductive patterns 7, the occurrence of migration of the conductive patterns 7 can be appropriately suppressed. Moreover, by forming the conductive pattern 7 with an Ag coating film or the like, an increase in the resistance value of the conductive pattern 7 can be suppressed even if the width dimensions T1 and T2 of the conductive pattern 7 are reduced. Can be promoted. Furthermore, the bendability of the conductive pattern 7 can be kept good by forming the conductive pattern 7 with an Ag coating film or the like.

  In this embodiment, the 1st electroconductive particle 12 contained in the said coating film 10 has high dispersibility because the said insulating particle 13 is further contained in the said coating film 10, and resin It can be scattered more uniformly in the layer 11. The first electrode 7 a and the second electrode 14 are electrically connected by the first conductive particles 12, and the conductive patterns 7 are appropriately insulated by the resin layer 11 and the insulating particles 13.

  When the width T8 of the second electrode 14 shown in FIG. 3 is smaller than the width T1 of the first electrode 7a, the number of contact points between the first electrode 7a and the first conductive particles 12 (or Contact area) decreases, and the electrical conductivity through the first conductive particles 12 between the first electrode 7a and the second electrode 14 becomes unstable. In the first place, the surface of the second electrode 14 facing the first electrode 7a is not a flattened surface, and has some unevenness, so that all the first conductive particles 12 on the first electrode 7a The second electrode 14 is not always in contact.

  Therefore, as shown in FIGS. 4 and 5, it is preferable to form a conductive surface member 20 on at least the first electrode 7a. The surface member 20 is a pattern formed by screen printing or the like. The size of the surface member 20 may not be the same as the size of the first electrode 7a, but is preferably the same. Even if the width dimension T9 of the surface member 20 is larger than the width dimension T1 of the first electrode 7a, the surface member 20 and the adjacent conductive pattern 7 are short-circuited via the coating film 10. do not do. That is, since the first conductive particles 12 are dispersedly arranged in the coating film 10 and other portions are insulative, the width T9 of the surface member 20 is slightly larger than that of the first electrode 7a. Even if formed, the adjacent conductive pattern 7 is not short-circuited through the first conductive particles 12.

  The surface member 20 is a conductive coating film, and the third conductive particles contained in the surface member 20 are at least compared to Ag particles (more preferably, second conductive particles contained in the conductive pattern 7). It is a material with excellent migration resistance. The third conductive particles include Ni particles plated with Au, Ni particles plated with Pd and plated with Au, Pd particles plated with Au, Ag- It is preferably at least one selected from Pd alloy particles and a resin whose surface is plated with Au. The resin is preferably a plastic. The binder resin contained in the surface member 20 is not particularly limited, such as a thermosetting resin or a thermoplastic resin, but is at least one selected from a phenol resin, an acrylic resin, a polyester resin, and an epoxy resin. Is preferred.

  By forming the surface member 20 by screen printing or the like, the surface member 20 appropriately covers the unevenness of the surface of the coating film 10, and the first conductive particles 12 on the first electrode 7a are appropriately It contacts the surface member 20. Therefore, the surface member 20 and the first electrode 7a are appropriately conductively connected via the first conductive particles 12. The second electrode 14 is in contact with the surface member 20. As a result, even if the width T8 of the second electrode 14 is reduced or the surface of the second electrode 14 is uneven, the gap between the second electrode 14 and the first electrode 7a is not reduced. The conductive connection can be appropriately established through the conductive particles 12 and the surface member 20.

  The surface member 20 needs to be formed of a material excellent in migration resistance. This is because if, for example, an Ag coating film having a low migration resistance is used, the same migration problem as in the conventional case occurs again. Therefore, the surface member 20 needs to be formed of a material excellent in migration resistance.

  6 and 7, an insulating film 21 is provided on the insulating substrate 3 on the first electrode 7a and between the first electrodes 7a in the connection region B except for a part on the first electrode 7a. The conductive film 7 is appropriately insulated by the insulating film 21.

  The insulating film 21 may be an organic material or an inorganic material, but it is preferable to form a resin by screen printing or the like because the insulating film 21 having a predetermined shape can be easily formed. The resin may be either a thermosetting resin or a thermoplastic resin. The resin is an acrylic resin, an epoxy resin, a phenol resin, polyester, or the like. In order to ensure good bendability, it is preferable to select a polyester resin as the resin. When the insulating film 21 is formed of an inorganic material, the insulating film 21 is formed by sputtering, for example, silica. As shown in FIG. 7, since the insulating film 21 is provided with a through hole 21a, when the insulating film 21 is formed by sputtering an inorganic material, the through hole 21a is formed using a photolithography technique.

  The through hole 21a is formed in a part on each first electrode 7a. The size of the through hole 21a in plan view may be the same size as that of the first electrode 7a. However, if the size of the through hole 21a is increased too much, the space between the conductive patterns 7 can be appropriately increased. Since it cannot be filled with the insulating part film 21, the size of the through hole 21a is preferably smaller than the size of the first electrode 7a.

  As shown in FIG. 6, the coating film 10 described in detail in FIG. 3 is formed from the through hole 21a to the insulating film 21, and in the embodiment shown in FIG. 6, the surface member 20 described in FIG. Is provided. By providing the insulating film 21 and the coating film 10, migration of the conductive pattern 7 can be more effectively suppressed in the embodiment shown in FIG. 6. Moreover, the insulation between the said conductive patterns 7 can be improved more appropriately.

  In the embodiment shown in FIG. 6, the surface member 20 may not be formed. However, in the embodiment in which the through hole 21a is formed smaller than the first electrode 7a, the surface member 20 is formed on the first electrode 7a. Since the number of the first conductive particles 12 mounted directly decreases, the conductivity between the second electrode 14 and the first electrode 7a is likely to decrease unless the surface member 20 is formed. Therefore, it is preferable to provide the surface member 20 as shown in FIG.

  When the surface member 20 is not provided, the size of the through hole 21a formed in the insulating film 21 in a plan view in order to ensure good electrical conductivity between the first electrode 7a and the second electrode 14. The thickness is preferably larger than that of the first electrode 7a. However, if the through hole 21a is too large, the insulating film 21 is not provided between the conductive patterns 7 so that the insulation cannot be properly improved. The size of the hole 21a is preferably about the same as that of the first electrode 7a.

  FIG. 8 is a partial cross-sectional view showing a cut surface when the connection device of the second embodiment is cut in the film thickness direction.

  In FIG. 8, a plurality of conductive patterns having first electrodes 31 are formed on a first support 30 having at least an insulating surface. The conductive pattern and the first support 30 are covered with the coating film 10 including the first conductive particles 12, the insulating particles 13, and the resin layer 11 described in FIG. .

  As shown in FIG. 8, the second electrode 32 arranged to face the first electrode 31 in the film thickness direction is supported by a second support 33, and the first electrode 31, the second electrode 32, Are electrically connected via the first conductive particles 12, and the second support 33 and the coating film 10 are bonded and fixed by a non-conductive thermosetting adhesive 34. ing.

  As shown in FIG. 8, the thermosetting adhesive 34 is also interposed in the gap C provided between the coating film 10 on the first electrode 31 and the second electrode 32, and the first electrode 31. The upper coating film 10 and the second electrode 32 are bonded and fixed. The thermosetting adhesive 34 is, for example, an epoxy type.

  It is preferable that the thermosetting adhesive 34 is a non-conductive paste (NCP; Non-Conductive Paste) because adhesion and fixing can be easily performed. The non-conductive paste is applied over the entire area of the coating film 10, and then the second support 33 is placed on the first electrode with the second electrode 32 facing the first electrode 31. When the pressure is applied in the direction of the support 30, the non-conductive paste on the first electrode 31 escapes to the side of the first electrode 31, and the first electrode 31 and the second electrode 32 are electrically connected. Part of the non-conductive paste is left in the gap C between the coating film 10 on the first electrode 31 and the second electrode 32. Then, the non-conductive paste is thermally cured by heat treatment, and the first support 30 and the second support 33 are bonded and fixed.

  The thermosetting adhesive 34 may be a non-conductive film (NCF; Non-Conductive Film).

  In the embodiment of FIG. 8, the insulating film 21 described in FIG. 6 may be provided. Further, in the embodiment of FIG. 8, the surface member 20 described in FIG. 4 may be provided, but in such a case, in order to appropriately ensure the conductivity between the surface member 20 and the second electrode 32, The non-conductive paste and non-conductive film are preferably provided on the coating film 10 excluding the surface member 20 and subjected to the pressure and heat treatment described above.

  The embodiment shown in FIG. 8 does not intend to be removed like the connector shown in FIG. 1, and for example, the support is fixed between the electrode provided on the electronic device side and the electrode of the flexible printed board. Applicable to the case.

  In the present embodiment, the insulating substrate 3 and the first support 30 may be flexible or rigid substrates.

  In the present embodiment, it is assumed that the conductive pattern is composed of an electrode and a wiring portion connected to the electrode. However, the “conductive pattern” only needs to have at least an electrode. In the form in which the part is provided inside the support and only the electrode is exposed on the support surface, the conductive pattern refers to the electrode.

  In addition, the present embodiment has been described with respect to the first connector (male connector) 1 in FIG. 1, but the second connector (female connector) 2 side has the same configuration as the present embodiment. Alternatively, both the first connector 1 and the second connector 2 may have this embodiment. Similarly, in FIG. 8, the coating film 10 of the present embodiment may be provided also on the second support 33 and the second electrode 32 side.

The fragmentary perspective view which shows the 1st connector (connection apparatus) and the 2nd connector which connects the said 1st connector, A partially enlarged plan view near the tip of the first connector (however, it is a plan view in a state where a coating film is removed); FIG. 2 is a partially enlarged cross-sectional view of the first connector and the second connector in the first embodiment, cut from the line A-A shown in FIG. 2 and shown from the arrow direction, in a state where the first connector is connected to the second connector; The partial expanded sectional view of the 1st connector and 2nd connector in a 2nd embodiment, FIG. 5 is a partial plan view of the first connector shown in FIG. The partial expanded sectional view of the 1st connector in the 3rd embodiment, and the 2nd connector, FIG. 6 is a partial plan view of the first connector shown in FIG. The fragmentary sectional view which shows the cut surface at the time of cut | disconnecting the connection apparatus of 2nd Embodiment to the film thickness direction,

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st connector 2 2nd connector 3 Insulation board | substrate (1st support body)
7 Conductive pattern 7a, 31 1st electrode 7b Wiring part 10 Cover film 11 Resin layer 12 First conductive particle 13 Insulating particle 14, 32 Second electrode 20 Surface member 21 Insulating film 30 First support 33 Second support Body 34 Thermosetting adhesive

Claims (17)

A first support and a plurality of conductive patterns having at least a first electrode formed on the first support;
The conductive pattern and the first support between the conductive patterns are covered with a coating film having first conductive particles, insulating particles, and a resin layer, and the first conductive The particles and the insulating particles are scattered on the conductive pattern and the first support, and the resin layer fills the periphery of the first conductive particles and the insulating particles,
The first electrode can be electrically connected to the second electrode opposed to the first electrode via the first conductive particles, and the conductive pattern is formed between the resin layer and the insulating layer. A connection device characterized by being insulated by particles.   The connection device according to claim 1, wherein an average particle diameter of the first conductive particles is larger than an average particle diameter of the insulating particles.   The connection device according to claim 1, wherein an average particle diameter of the first conductive particles is larger than an average film thickness of the resin layer.   4. The connection device according to claim 1, wherein an average particle size of the first conductive particles is in a range of 5 to 15 μm.   The first conductive particles include Ni particles plated with Au on the surface, Ni particles plated with Pd on the surface and further plated with Au, Pd particles plated with Au on the surface, Ag- The connection device according to any one of claims 1 to 4, wherein the connection device is at least one selected from Pd alloy particles and a resin whose surface is plated with Au.   6. The connection device according to claim 1, wherein the content of the first conductive particles is in the range of 1 to 15% by volume in the coating film.   The connection device according to claim 1, wherein an average particle diameter of the insulating particles is in a range of 1 to 8 μm.   The connection device according to claim 1, wherein a content of the insulating particles is 5 to 40% by volume in the coating film.   The connection device according to claim 1, wherein the insulating particles include at least one of silica, glass beads, and resin.   The connection device according to claim 1, wherein an average film thickness of the resin layer is in a range of 3 to 10 μm.   The connection device according to claim 1, wherein the resin layer is at least one selected from an acrylic resin, an epoxy resin, a polyester resin, and a phenol resin and is harder than the conductive pattern.   The said conductive pattern is comprised including the 2nd electroconductive particle which consists of Ag particle | grains, and at least 1 sort (s) of binder resin among a polyester resin, an acrylic resin, an epoxy resin, and a phenol resin. The connection device according to any one of 11. The connection device further includes the second electrode and a second support that supports the second electrode,
The connection according to any one of claims 1 to 12, wherein at least the second support and the coating film except on the first electrode are bonded and fixed with a non-conductive thermosetting adhesive. apparatus.   The connection device according to claim 13, wherein the thermosetting adhesive is a non-conductive paste (NCP) or a non-conductive film (NCF).   The connection device according to claim 13 or 14, wherein the thermosetting adhesive is also interposed in a gap between the coating film provided on the first electrode and the second electrode.   A conductive surface member is provided on at least a part of the first electrode via the coating film, and the surface member has a third conductivity that is at least more resistant to migration than Ag particles. The connection device according to claim 1, wherein conductive particles are contained.   An insulating film is formed on at least the first support except on the first electrode, and the covering film is formed on the insulating film from the first electrode not covered with the insulating film. The connection device according to claim 1.

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