JP2001229998A - Heat-sealing connector and connecting structure of electrical circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-sealing connector, which can be equipped to a thin, light, and small electronic equipment at a low cost, and to provide a connecting structure of an electrical circuit. SOLUTION: On a surface of an insulating, flexible base material 1, plural wiring patterns 4 composed of a conductive metal layer are laid, and the plural wiring patterns 4 are arranged from one end of the flexible base material 1 toward the other end. Furthermore, each wiring pattern 4 is extended from one side 2 of the flexible base material 1 toward the other side 3. Then an insulation resisting layer 5, which provides coating on the approximate centers of the multiple wiring patterns 4, is deposited on the surface of the flexible base material 1. On side of the plural wiring patterns 4 is formed on the first connection 6, and the other side of the plural wiring patterns 4 is formed on the second connection 7. A reinforcing plate 8 is bonded to the other side end 3a on the back of the flexible base material 1, and an adjusting rubber 9 is filled in-between. The other side end 3a of the flexible base material 1 and the second connection 7 are made to well and to curve upwardly to form almost semicircular cross sections, and an elastic structure utilizing them, in which a resiliency against a pressing force added to the surface of the flexible base material 1 from above is generated, is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat seal connector and an electric circuit for use in electrically connecting a display such as a liquid crystal display panel or a plasma display panel to a circuit board on which a drive circuit is mounted. It relates to a connection structure.

[0002]

2. Description of the Related Art A heat seal connector includes a display such as a liquid crystal display panel (hereinafter, referred to as an LCD) or a plasma display panel (hereinafter, referred to as a PDP), and a printed circuit board (hereinafter, referred to as a PCB) on which a driving circuit is mounted.
), A flexible printed circuit board (hereinafter, referred to as FPC), or an electrical connection between a PCB and an FPC.

In this type of heat seal connector, for example, as shown in FIG. 9, a plurality of wiring patterns 4 made of a conductive metal layer are arranged in parallel on the surface of an insulating flexible base material 1. 4 is a flexible substrate 1 from one side 2 to the other side 3
An insulating resist layer 5 covering the center of the plurality of wiring patterns 4 is provided on the surface of the flexible substrate 1.
Are stacked, and one side of the plurality of wiring patterns 4 is formed in the first connection portion 6, and the other side of the plurality of wiring patterns 4 is formed in the second connection portion 7. , The second connecting portions 6 and 7 have L to be connected circuit components.
The CD 10 and the PCB 11 are electrically connected via an anisotropic conductive adhesive 12 which is an anisotropic conductive means. The plurality of wiring patterns 4 are juxtaposed by printing a conductive paste on the surface of the flexible base material 1 or etching a metal foil on the surface of the flexible base material 1. Anisotropic conductive adhesive 12
The conductive particles 14 are dispersed in the heat seal adhesive 13,
It is bonded by a thermocompression machine (not shown).

FIG. 10 shows another heat seal connector, which is basically the same as the above heat seal connector, except that conductive particles 14 are dispersed and fixed in a plurality of wiring patterns 4 in advance, and the first and second heat seal connectors are formed. A heat seal adhesive 13 is applied to each of the two connection portions 6 and 7, and the heat seal adhesive 13 and the conductive particles 14 form an anisotropic conductive means.

[0005]

The conventional heat seal connector is constructed as described above, and comprises an anisotropic conductive adhesive 12.
And anisotropic conductive means are bonded by a thermocompression bonding machine, so it can be bonded only to a flat circuit board. In the case of PCB11 or the like on which components are mounted, a jig for each product is made and flattened. If not, there is a problem that bonding cannot be performed. In view of this point, conventionally, as shown in FIG. 11, an LCD 10 on which no components are mounted on the first connection portion 6 is connected via an anisotropic conductive adhesive 12 and a component is mounted on the second connection portion 7. Printed circuit board connector 1
7 for electrical insertion connection. The printed circuit board connector 17 which is a substitute for the anisotropic conductive adhesive 12 is called a so-called ZIF connector or non-ZIF connector, and is, for example, FLconnector, FL
Zconnector (manufactured by Japan Crimp Terminal Manufacturing Co., Ltd .:
(Product name) is known.

However, the printed circuit board connector 1
No. 7 has a problem that it is as thick as 2 to 5 mm or more, the pitch can be manufactured only up to about 0.5 mm, and it is very expensive. Therefore, it is not preferable to use the printed circuit board connector 17 in a recent electronic device which aims at thinness, light weight, small size, high definition, and low cost, and an innovative connection method is demanded.

The present invention has been made in view of the above, and has as its object to provide an inexpensive heat seal connector and an electric circuit connection structure that can be mounted on a thin, lightweight, and small electronic device.

[0008]

As a result of various studies on the means for solving the above-mentioned problems, the present inventors have bent the side portion of the flexible base material and the connecting portion in the same direction, and have formed an elastic structure. By doing so, it has been found that a reliable connection between the heat seal connector and a circuit component that is not substantially planar can be obtained, and intensive research has been continued on its shape, connection structure, and manufacturing method, and the present invention has been completed. . That is, in the invention described in claim 1, in order to achieve the above object, a plurality of wiring patterns made of a conductive metal layer are provided on at least one surface of an insulating flexible base material, and the plurality of wiring patterns are formed. The wiring pattern is arranged from one end to the other end of the flexible base material, and each wiring pattern extends from one side of the flexible base material to the other side. The side portion is formed on the first connection portion, and the other side portion of the plurality of wiring patterns is formed on the second connection portion, and at least the other side portion of the flexible base material and the second connection portion are made the same. And a resilient structure that generates a repulsive force against a pressing force applied to one surface of the flexible substrate from a substantially vertical direction.

Further, in order to achieve the above object, in the invention according to the second aspect, the circuit component to be connected is electrically held at least at the second connection portion of the heat seal connector according to the first aspect. It is characterized by:

Here, the first and second connecting portions in the claims may have the same length and width, or may not. At least the other side portion of the flexible base material and the second connection portion are formed to be bent into a substantially semi-elliptical cross section, a substantially semi-oval cross section, or a substantially polygonal cross section such as a triangle or a quadrangle. The vertical direction includes, in addition to the vertical direction, a direction recognized as a substantially vertical direction.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. As shown in FIGS. A plurality of wiring patterns 4 made of a conductive metal layer are laid on one surface, and the plurality of wiring patterns 4 are moved from one end to the other end of the flexible base material 1 (see FIGS. 1 and 2).
, And each wiring pattern 4 extends linearly from one side 2 of the flexible base 1 to the other side 3 (the left-right direction in FIG. On the surface of 1,
A plurality of wiring patterns 4 are laminated with an insulating resist layer 5 having a plate-like cross section that covers a substantially central portion of the wiring patterns 4. One side of the plurality of wiring patterns 4 is used as the first connection portion 6, and the other side of the plurality of wiring patterns 4 is used. Parts are formed on the second connection parts 7 respectively, and a reinforcing plate 8 having a plate-like cross section is adhered (including adhesive) to the other end 3 a on the back surface of the flexible base material 1, and While filling the adjustment rubber 9, the other end 3a of the flexible substrate 1 and the second connecting portion 7 are respectively bulged upward and curved to form a three-dimensional substantially semicircular cross section. Is an elastic structure that generates a repulsive force against a pressing force that is applied to the surface of the flexible substrate 1, in other words, the surface on which the wiring pattern 4 is perpendicularly applied from above.

The flexible substrate 1 is made of polyethylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamide imide, polycarbonate, polyether ether ketone, polyphenylene sulfide, polyether sulfide which is excellent in insulation, dimensional stability, weather resistance and the like. It is formed in a cross-sectional band shape having a thickness of 10 to 100 μm using a phone or the like.

As a method of providing a plurality of wiring patterns 4, a conductive paste obtained by mixing a conductive agent such as silver powder or copper powder having a particle size of about 0.01 to 10 μm with an organic binder is formed by screen printing or the like. A method of laminating a metal foil such as copper or stainless steel on the flexible base material 1 and forming a pattern by etching or the like (subtractive method), and selectively forming a metal plating on the flexible base material 1 to form a pattern. (Additive method). When laying a plurality of wiring patterns 4 on the surface of the flexible substrate 1, the plurality of wiring patterns 4 may be laid directly on the flexible substrate 1, or the flexible substrate 1 may be laid. A coat layer such as an adhesive can be interposed at the interface between the wiring pattern and the plurality of wiring patterns 4.

When a metal foil is used as the plurality of wiring patterns 4, it is preferable to use a copper foil excellent in workability and conductivity. When a metal foil is used as the plurality of wiring patterns 4, a method of bonding metal plating to the flexible base material 1 with an adhesive, a solution of a resin material with an appropriate organic solvent, and coating on the metal foil to remove the solvent. When the flexible substrate 1 is made of a thermoplastic resin, it is melted to coat or adhere to a metal foil, and when the flexible substrate 1 is made of a thermosetting resin, it flows without solvent. If the material has properties, it is coated and cured directly on the metal foil.If the fluidity is poor, it is converted into a solution with a suitable solvent, and the metal foil is coated, removed, and cured. When polyimide is selected as the material of the body, for example, the flexible substrate 1, a metal foil is coated with a polyamic acid solution,
Drying and curing methods are applied.

The insulating resist layer 5 is made of a synthetic resin such as polyamide or polyester, various synthetic rubbers, or a mixture thereof.
An additive such as an anti-degradation agent was dissolved in the above-mentioned solvent and formed by screen printing or the like, and an adhesive such as an acrylic resin was applied to a film such as polyester or vinyl chloride, and this was adhered. There are things. These are selected in consideration of the required insulation, surface protection, and cost. Further, as shown in FIG. 4, the adjustment rubber 9 is made of an elastomer having a substantially semicircular cross section having excellent elasticity, such as silicone rubber, acrylic rubber, and butyl rubber, and functions to secure elasticity and adjust elastic pressure. .

As shown in FIG. 3, the other end 3a of the flexible substrate 1 and the second connecting portion 7 are each formed in a substantially semicircular cross section which bulges upward and is easily in surface contact. However, examples of the forming method include a method of press forming with a concave and convex mold, vacuum forming, and winding around a rod core made of metal or synthetic resin. In this operation, when heating is performed at about 100 ° C. to 200 ° C., the shape is easily maintained and the elasticity is easily provided. The other end 3a of the flexible substrate 1 and the second connecting portion 7
Has an elastic structure as described above, but the repulsive force when deformed is the contact force of the electrical connection with the PCB 11, so the repulsive force when deformed by 10% is 10 Pa or more and 1 MPa
It is preferable that it is not more than a. This requires some strong pressing force to get a good connection,
This is because if the repulsion is too strong, it will not be deformed at the point of contact with the connection terminal of the PCB 11, resulting in poor connection reliability.

The first and second connection portions 6 and 7 are selectively plated with a view to protecting the plurality of wiring patterns 4, preventing rust, and improving connection characteristics. This plating is tin,
Made of nickel, gold, silver, palladium, solder, etc.
A single layer or a multi-layer is applied to a contact portion of the CD 10 or the PCB 11 with a connection terminal by an ordinary method. If partial plating is difficult, plating is applied to the entire plurality of wiring patterns 4.

In the above configuration, when the LCD 10 and the PCB 11 are electrically connected using the heat seal connector, first, the connection terminals of the LCD 10, which is the first connected circuit component, are placed on the first connection portion 6. Are electrically connected through the same anisotropic conductive adhesive 12 as in the conventional example, and the mounting plate 15 made of synthetic resin or rubber is fixed to the reinforcing plate 8,
The connection terminal of the PCB 11 as the second connected circuit component is contact-supported on the second connection portion 7 having an elastic structure, and then the mounting hole between the mounting plate 15 and the PCB 11 is made of a jig made of synthetic resin or rubber. 16 and tighten the PC to the second connection part 7
If B11 is press-fitted and fixed, LC with heat seal connector
D10 and PCB11 can be electrically connected.

At the time of the above operation, the anisotropic conductive adhesive 12 is applied in a layer form by coating the second connection portion 7 with screen printing or a coater, and is dried, cured and solidified. Of course, the solidified anisotropic conductive film is transferred to the second connection portion 7,
It may be formed. If the thickness of the anisotropic conductive adhesive 12 is too large, the connection reliability deteriorates.
The following is desirable, and if it is too thin, the adhesive strength is reduced. The other end 3a of the flexible substrate 1 and the second connecting portion 7 are compressed and deformed by 1% to 80% in the cross-sectional shape at the time of connection, compared to the cross-sectional shape before connection.

According to the above configuration, since the other end 3a of the flexible base 1 and the second connecting portion 7 have an integral elastic structure, the large, thick and expensive printed circuit board connector 17 is provided.
Even if Omitted, PCB with non-planar structure with components mounted
11 and FPC can be connected stably and easily. Therefore, it is possible to provide a connection method suitable for recent electronic devices pursuing thinness, light weight, small size, high definition, and low cost.

FIGS. 5 to 7 show a second embodiment of the present invention. In this case, the other end 3a of the flexible substrate 1 and the second connecting portion 7 are connected to each other. Are respectively wound downward to form a three-dimensional circular cross section.
The PCB 11 has an elastic structure that generates a repulsive force against the pressing force that acts on the surface of the PCB from the vertical direction. The PCB 11 is electrically connected to the second connecting portion 7 having a cylindrical shape while applying a uniform pressing force from below. I am trying to fix it. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. In this embodiment, the same operation and effect as the above embodiment can be expected.

Next, FIG. 8 shows a third embodiment of the present invention. In this case, a reinforcing plate 8 having a plate-shaped cross section is provided on the other end 3a on the back surface of the flexible substrate 1. And an adjusting rubber 9 is filled between them in a substantially M-shaped cross section, and the other end 3a of the flexible substrate 1 and the second connecting portion 7 are respectively bulged upward and curved. They are formed into a three-dimensional substantially M-shaped cross section, and these have an elastic structure that generates a repulsive force against a pressing force that acts on the surface of the flexible substrate 1 from above and vertically. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. In this embodiment, the same operation and effect as those of the above embodiment can be expected. Further, since the other end 3a of the flexible base 1 and the second connecting portion 7 are substantially M-shaped in cross section, it is extremely excellent. Obviously, surface contact and elasticity can be obtained.

In the above embodiment, the plurality of wiring patterns 4 are laid only on the surface of the flexible substrate 1. However, the plurality of wiring patterns 4 are laid on both sides of the flexible substrate 1. It is also possible. If necessary, the one side 2 of the flexible substrate 1 and the first connecting portion 6 may also have an elastic structure. The connected circuit components are the LCD 10 and the PC.
The components are not limited to B11 at all, and include components recognized to be substantially the same as these. Further, the reinforcing plate 8, the adjusting rubber 9, the mounting plate 15, and the jig 16 can be omitted as necessary. Furthermore, one or more positioning holes or notches may be provided near the other side portion 3 of the flexible base material 1.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a heat seal connector and an electric circuit connection structure according to the present invention will be described below. Preparation of a flexible base material and a plurality of wiring patterns As a material of the plurality of wiring patterns 4, a rolled copper foil having a thickness of 12 μm is coated with a polyamic acid solution, dried and cured to form a polyimide layer having a thickness of 25 μm. A polyimide film with a copper foil was obtained. When a polyimide film with a copper foil was thus obtained, the copper foil was etched by a conventional method to obtain a wiring pattern 4 having a pitch of 0.20 mm and 200 wires. Then, nickel (3 mm thick) -gold (0.3 mm thick) plating was applied to the first and second connection portions 6 and 7 by an electroless plating method.

Preparation of Anisotropic Conductive Adhesive Bisphenol type epoxy resin 4 having a saturated copolymerized polyester resin 100 parts by weight and an epoxy equivalent of 800 to 1100
00 parts by weight, 2-methylimidazole 20
By mixing the parts by weight, a liquid heat seal adhesive 13 was obtained. Styrene resin particles whose surface is nickel-gold plated with respect to 100 parts by volume of this heat seal adhesive 13.
(Average particle size: 10 μm) was added to 20 parts by volume to obtain an anisotropic conductive adhesive 12.

Preparation of Heat Seal Connector Anisotropic conductive adhesive 12 is screen-printed on the first connection portion 6 so as to have a thickness of 10 μm.
A commercially available insulating resist layer (trade name, manufactured by Acheson Japan, Ltd.) 5 was provided on portions other than 7 so as to have a thickness of 30 μm, and this was cut into a predetermined size. When cut to a predetermined size in this way, the other end 3a of the flexible base material 1 and the second connecting portion 7 are respectively bulged upward and curved by press molding using a mold, and a three-dimensional substantially semicircular cross section is formed. (0.3 mmR), and these were formed into an elastic structure that generates a repulsive force against a pressing force acting on the surface of the flexible substrate 1 from above and vertically. The resilience at the time of 10% deformation of this elastic structure portion was 700 Pa. Then, a reinforcing plate 8 made of a PET film having a thickness of 125 μm was adhered to the other end 3a on the back surface of the flexible base material 1 with an adhesive having a thickness of 25 μm to produce a heat seal connector.

The first connection portion 6 of the heat seal connector thus obtained is sheet-sealed to a connection terminal of a transparent conductive oxide film substrate (ITO) having a sheet resistivity of 50 Ω / □ at 160 ° C., 4 MPa, and 10 seconds. , The PCB 11 to the second connection part 7
Were subjected to a pressure of 1000 Pa to hold them, and an environmental test of high temperature and high humidity of 85 ° C., 85% and RH was performed. When the resistance value between the connection terminals on both sides and the insulation resistance value were measured, the results shown in Table 1 were obtained.

[0028]

[Table 1]

[0029]

As described above, according to the present invention, it is possible to provide an inexpensive heat seal connector and an electric circuit connection structure which can be mounted on a thin, lightweight, and small electronic device. .

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional explanatory view showing a use state in an embodiment of a connection structure of a heat seal connector and an electric circuit according to the present invention.

FIG. 2 is a partially sectional explanatory view showing an embodiment of the heat seal connector according to the present invention.

FIG. 3 is a perspective view of a main part showing an embodiment of the heat seal connector according to the present invention.

FIG. 4 is a sectional view showing an IV section in FIG. 2;

FIG. 5 is an explanatory partial sectional view showing a second embodiment of the connection structure of the heat seal connector and the electric circuit according to the present invention.

FIG. 6 is a main part perspective view showing a second embodiment of the heat seal connector according to the present invention.

FIG. 7 is an explanatory view showing a second embodiment of the heat seal connector according to the present invention.

FIG. 8 is a sectional view showing a third embodiment of the heat seal connector according to the present invention.

FIG. 9 is a partial cross-sectional explanatory view showing a connection structure of a conventional heat seal connector and an electric circuit.

FIG. 10 is a partial cross-sectional explanatory view showing a connection structure of another conventional heat seal connector and an electric circuit.

FIG. 11 is a partial cross-sectional explanatory view showing another conventional heat seal connector using a printed circuit board connector and a connection structure of an electric circuit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flexible base material 2 One side part 3 Other side part 3a Other side end part 4 Wiring pattern 5 Insulating resist layer 6 First connection part 7 Second connection part 9 Adjustment rubber 10 LCD 11 PCB (connected circuit parts ) 12 Anisotropic conductive adhesive 17 Connector for printed circuit board

Claims (2)

[Claims] 1. A plurality of wiring patterns made of a conductive metal layer are provided on at least one surface of an insulating flexible base material, and the plurality of wiring patterns are arranged from one end to the other end of the flexible base material. A heat seal connector in which each wiring pattern extends from one side of the flexible base material to the other side, wherein one side of the plurality of wiring patterns is a first connection portion, The other side portions of the plurality of wiring patterns are respectively formed in the second connection portion, and at least the other side portion of the flexible base and the second connection portion are bent in the same direction, and these are bent by the flexible connection. A heat seal connector having an elastic structure that generates a repulsive force against a pressing force applied to one surface of a conductive base material from a substantially vertical direction. 2. A connection structure for an electric circuit, wherein a circuit component to be connected is held in electrical contact with at least the second connection portion of the heat seal connector according to claim 1.