CN100574554C - Flexible PCB, processing method of said flexible circuit board and electronic installation - Google Patents
Flexible PCB, processing method of said flexible circuit board and electronic installation Download PDFInfo
- Publication number
- CN100574554C CN100574554C CNB2007102004242A CN200710200424A CN100574554C CN 100574554 C CN100574554 C CN 100574554C CN B2007102004242 A CNB2007102004242 A CN B2007102004242A CN 200710200424 A CN200710200424 A CN 200710200424A CN 100574554 C CN100574554 C CN 100574554C
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- reinforcement plate
- metal reinforcement
- conductive layer
- flexible pcb
- insulating barrier
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Abstract
The invention provides a kind of flexible PCB, it comprises that at least one electronic component mounts portion.Each electronic component portion of mounting comprises a metal reinforcement plate, an insulating barrier and a conductive layer that is formed on the described insulating barrier of being located on the described metal reinforcement plate.Described conductive layer comprises circuit region and centers on the marginal zone of described circuit region.Described marginal zone offers at least one through hole that runs through described conductive layer and insulating barrier.Be filled with the welding material that is electrically connected described conductive layer and described metal reinforcement plate in each through hole.Described marginal zone and described metal reinforcement plate are stablized, connected securely to described flexible PCB by welding material.During use, described metal reinforcement plate earthing, the ground connection electrostatic shielding cover that described marginal zone and described metal reinforcement plate form can provide described electronic component to mount the stable anti-emi protection of portion.In addition, the present invention also provides a kind of processing method of described flexible PCB and adopts the electronic installation of described flexible PCB.
Description
Technical field
The present invention relates to printed-board technology, particularly a kind of flexible PCB, processing method of said flexible circuit board and have the electronic installation of described flexible PCB.
Background technology
Flexible PCB (Flexible Printed Circuit, FPC) claim flexible electric circuit board or flexible circuit board again, it can be scratched at three dimensions changes assembling, and has advantages such as light, thin, short, little, be widely used in various electronic products, as mobile phone, disc unit and notebook computer etc.
For making things convenient for mounted with electronic components, flexible PCB is provided with stiffening plate in the electronic component portion of mounting, to improve the mechanical strength that electronic component mounts portion.If need the electronic component portion of mounting is done anti-electromagnetic interference design, then form the naked copper district, and adopt conducting resinl to be loaded on the one side that the electronic component portion of mounting has the naked copper district with stiffening plate is sticking at the edge that electronic component mount portion, stiffening plate then adopts the metal reinforcement plate.So, the electronic component naked copper district that mounts portion just is electrically connected to the metal reinforcement plate by conducting resinl.During use, with the metal reinforcement plate earthing, make the electrical ground connection in naked copper district, the naked copper district formation electrostatic shielding cover that metal reinforcement plate and electronic component mount the portion edge will mount portion around electronic component, just can suppress the external electric magnetic source mounts portion to electronic component interference.In addition, the electric channel that naked copper district, conducting resinl and metal reinforcement plate constitute also can be used as the heat dissipation channel that electronic component mounts portion, takes away the heat that the electronic component portion of mounting produces.
Yet, adopt the anti-electromagnetic interference design of conducting resinl to have following problem: 1) to adopt the gluing dress of conduction to be difficult to guarantee that the naked copper district well contacts with the metal reinforcement plate; 2) flexible PCB processing needs through reflow stove soldering of electronic components, and this process will cause the conductivity of conducting resinl and thermal conductivity to worsen; 3) conducting resinl is shorter useful life, and its conductive capability and the capacity of heat transmission increase in time and worsens.To sum up, adopt conducting resinl to prevent the anti-electromagnetic interference capability and the heat-sinking capability instability, unreliable of the flexible PCB of electromagnetic interference design.
Summary of the invention
In view of this, the invention provides a kind of electronic installation that has flexible PCB, the processing method of said flexible circuit board of reliable anti-electromagnetic interference capability and adopt described flexible PCB.
A kind of flexible PCB, it comprises that at least one electronic component mounts portion.Each electronic component portion of mounting comprises a metal reinforcement plate, an insulating barrier and a conductive layer of being located on the described insulating barrier of being located on the described metal reinforcement plate.Described conductive layer comprises circuit region and centers on the marginal zone of described circuit region.Described marginal zone offers at least one through hole that runs through described conductive layer and insulating barrier.Be filled with the welding material that is electrically connected described conductive layer and described metal reinforcement plate in each through hole.
A kind of processing method of said flexible circuit board, it may further comprise the steps:
In conjunction with a conductive layer and an insulating barrier;
Form circuit region at described conductive layer and reach the marginal zone that centers on described circuit region;
Offer the through hole that at least one runs through described conductive layer and insulating barrier in the marginal zone;
In conjunction with a metal reinforcement plate and described insulating barrier;
One welding material is packed into described through hole;
Weld described welding material.
A kind of electronic installation, it comprises an earth terminal and a flexible PCB.Described flexible PCB comprises that at least one electronic component mounts portion.Each electronic component portion of mounting comprises a metal reinforcement plate, an insulating barrier and a conductive layer of being located on the described insulating barrier of being located on the described metal reinforcement plate.Described conductive layer comprises circuit region and centers on the marginal zone of described circuit region.Described marginal zone offers at least one through hole that runs through described conductive layer and insulating barrier.Be filled with the welding material that is electrically connected described conductive layer and described metal reinforcement plate in each through hole.
Described flexible PCB stablizes, is electrically connected reliably the marginal zone and the described metal reinforcement plate of described conductive layer by described welding material; during use; with described metal reinforcement plate earthing, the ground connection electrostatic shielding cover that described marginal zone and described metal reinforcement plate form can provide described electronic component to mount the stable anti-emi protection of portion.Described flexible PCB is applied to electronic installation can provide electronic installation stable anti-emi protection.
Description of drawings
Fig. 1 is the sectional perspective schematic diagram of the flexible PCB of preferred embodiment of the present invention;
Fig. 2 is a flexible PCB shown in Figure 1 generalized section along the II-II direction;
Fig. 3 is the processing method of said flexible circuit board flow chart of preferred embodiment of the present invention;
Fig. 4 is the partial exploded view of the electronic installation of preferred embodiment of the present invention.
Embodiment
See also Fig. 1, the flexible PCB 100 of preferred embodiment of the present invention comprises that an electronic component mounts portion 10 and one and mounts the flexible transfer part 20 that portion 10 is connected with described electronic component.Each electronic component mounts portion 10 and comprises that 11, one of metal reinforcement plates are located at insulating barrier 12 and the conductive layer 13 of being located on the described insulating barrier 12 on the described metal reinforcement plate 11.Described conductive layer 13 comprises circuit region 131 and centers on the marginal zone 132 of described circuit region 131.Described circuit region 131 is formed with a plurality of pads (figure does not show), mounts with electronic component 30.Described marginal zone 132 offers at least one through hole 14 that runs through described conductive layer 13 and insulating barrier 12, and each through hole 14 is filled with the welding material 15 that is electrically connected described conductive layer 13 and described metal reinforcement plate 11.
Particularly, the conductive layer 13 of originally executing example comprises two marginal zones 132 around described circuit region 131, and each marginal zone 132 offers two described through holes 14.Certainly, the number of described marginal zone 132 and through hole 14 is not limited to present embodiment, visual actual operating position setting.
Described metal reinforcement plate 11 can adopt steel plate, aluminium sheet or other high electricity is led, the metallic plate of high thermal conductance, and present embodiment adopts steel plate.The thickness range of described metal reinforcement plate 11 is the 100-200 micron, so, can make described electronic component mount portion 10 has higher mechanical strength and bears various manufacturing procedures, can obviously not increase the thickness that described electronic component mounts portion 10 again, metal reinforcement plate 11 thickness of present embodiment are 150 microns.
Described insulating barrier 12 adopts the polyimide resins preparation, and polyimide resin can prepare micron-sized insulating barrier, and has preferable commentaries on classics property, heat-resisting quantity, the electrical insulating property of scratching, and insulating barrier 12 thickness of present embodiment are about 30 microns.Certainly, described insulating barrier 12 is not limited to present embodiment, can adopt other to have that flexible changes, thin-film material high temperature resistant, electric insulation prepares insulating barrier, and looks user demand and change thickness of insulating layer.
Described conductive layer 13 can adopt Copper Foil, silver foil or goldleaf, and present embodiment adopts Copper Foil.
See also Fig. 2, described metal reinforcement plate 11 adopts curable solid (figure does not show) to engage with described insulating barrier 12, described insulating barrier 12 with 13 of described conductive layers.Preferably, described electronic component mounts portion 10 and comprises that also one is covered in the protective layer 16 on the described conductive layer 13, avoids exposed described conductive layer 13, causes described circuit region 131 to be subjected to external action and damages.Equally, described protective layer 16 can adopt described curable solid to engage with described conductive layer 13.Described protective layer 16 offers at least one and described through hole 14 position corresponding opening 161, to expose described through hole 14.More preferably, the diameter of described opening 161 is bigger than the diameter of described through hole 14, with the conductive layer 12 formation pads 141 at exposed described through hole 14 edges.So, can increase the bonding area of described welding material 15 and described conductive layer 13, guarantee the electric connection of 11 of described conductive layer 12 and described metal reinforcement plates.
See also Fig. 3, be the flow chart of flexible circuit board 100 processing methods of preferred embodiment.Described flexible circuit board processing method may further comprise the steps:
P1: in conjunction with a conductive layer 12 and an insulating barrier 13;
P2: form the marginal zone 132 that circuit region 131 reaches around described circuit region 131 at described conductive layer 13;
P3: 132 offer the through hole 14 that at least one runs through described conductive layer 13 and insulating barrier 12 in the marginal zone;
P4: in conjunction with a metal reinforcement plate 11 and described insulating barrier 12;
P5 a: welding material 15 is packed into described through hole 14;
P6: weld described welding material 15,11 formation of described conductive layer 13 and described metal reinforcement plate are electrically connected reliably.
For the P1 step, concrete operations are as follows: at the described curable solid of described insulating barrier 12 coatings, and stick described conductive layer 13, dry described curable solid, described conductive layer 13 is pressed on the described insulating barrier 12, solidify described curable solid, just can be in conjunction with described conductive layer 12 and described insulating barrier 13.
Certainly, the P1 step is not limited to present embodiment, can realize combining of described conductive layer 12 and described insulating barrier 13 by alternate manner.
For the P2 step, described conductive layer 13 is carried out dry film pressing, pattern exposure, video picture etching, just can obtain described circuit region 131 and insulation layer 132.Preferably, after obtaining described circuit region 131 and insulation layer 132, should on described conductive layer 13, press described protective layer 16.Concrete operations are as follows: the described curable solid of coating on described conductive layer 13, follow described protective layer 16 then, and solidify described curable solid, just described protective layer 16 can be pressed on the described conductive layer 13.
For the P3 step, concrete operations are as follows: offer at least one opening that runs through described protective layer 16 161 in each marginal zone 132, then, offer described through hole 14 in each opening 161.Particularly, the P3 step also needs the opening (figure does not show) of pad in described protective layer 16 is offered corresponding described circuit region 131, mounts for waiting to assemble electronic component 30 with the pad in the exposed described circuit region 131.Preferably, also the exposed pad of reply carries out surface treatment, and surface treatment comprises: operations such as antirust processing, the plumbous electroplating processes of tin, electrolytic gold plating processing, electroless gold plating processing.
For the P4 step, can adopt curable solid in conjunction with described metal reinforcement plate 11 and described insulating barrier 12.
For the P5 step, can adopt stencil printer (Solder printer, figure does not show) to carry out the silk-screen operation so that 11 formation of described conductive layer 13 and described metal reinforcement plate are electrically connected reliably.Described welding material 15 is inserted described through hole 14, and described welding material 15 is a tin cream.Certainly, can adopt miscellaneous equipment that described welding material 15 is inserted described through hole 14, described welding material 15 can adopt the metal material of other tool welding ability.Particularly, described stencil printer is also given tin on the pad of described circuit region 131 simultaneously, carry out an electronic component subsequently and mount step, electronic component 30 is mounted on the pad of described circuit region 131, can adopts surface stick-mounting machine (Surface Mounting Machine) to mount and treat mounted with electronic components 30.
For the P6 step, can adopt the described welding material 15 of reflow stove (Reflow Solder) welding.Preferably, described processing method of said flexible circuit board comprises that is also cleaned and detect a step, and whether described cleaning and detection step are used to clean described flexible PCB 100 and detect its quality qualified.Described cleaning and detection step are carried out behind described flexible PCB 100 Overwelding and rewelding furnaces.
See also Fig. 4, be the schematic perspective view of the electronic installation 200 of preferred embodiment.Described electronic installation 200 is a clamshell phone, and it comprises an earth terminal 40 and described flexible PCB 100.Described flexible PCB 100 is arranged at described clamshell phone inside, is used to electrically connect the turnover two parts panel of described clamshell phone.Described metal reinforcement plate 11 is electrically connected with described earth terminal 40.
Be noted that the foregoing description only is better embodiment of the present invention, those skilled in the art also can do other variation in spirit of the present invention.The variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (10)
1. flexible PCB, it comprises that at least one electronic component mounts portion, is characterized in that: each electronic component portion of mounting comprises a metal reinforcement plate, an insulating barrier and a conductive layer of being located on the described insulating barrier of being located on the described metal reinforcement plate; Described conductive layer comprises circuit region and centers on the marginal zone of described circuit region; Described marginal zone offers at least one through hole that runs through described conductive layer and insulating barrier; Be filled with the welding material that is electrically connected described conductive layer and described metal reinforcement plate in each through hole, described metal reinforcement plate earthing.
2. flexible PCB as claimed in claim 1 is characterized in that: described metal reinforcement plate adopts steel plate or aluminium sheet.
3. flexible PCB as claimed in claim 1 is characterized in that: the described electronic component portion of mounting also comprises a protective layer that is covered on the described conductive layer, and described protective layer offers at least one and described at least one lead to the hole site corresponding opening.
4. flexible PCB as claimed in claim 3 is characterized in that: the diameter of described opening is bigger than the diameter of described through hole.
5. flexible PCB as claimed in claim 1 is characterized in that: the thickness range of described metal reinforcement plate is the 100-200 micron.
6. flexible PCB as claimed in claim 1 is characterized in that: the thickness of described metal reinforcement plate is 150 microns.
7. flexible PCB as claimed in claim 1 is characterized in that: the thickness of described insulating barrier is 30 microns.
8. processing method of said flexible circuit board, it may further comprise the steps:
In conjunction with a conductive layer and an insulating barrier;
Form circuit region at described conductive layer and reach the marginal zone that centers on described circuit region;
Offer the through hole that at least one runs through described conductive layer and insulating barrier in described marginal zone;
In conjunction with a metal reinforcement plate and described insulating barrier;
One welding material is packed into described through hole;
Weld described welding material; And
With the metal reinforcement plate earthing.
9. processing method of said flexible circuit board as claimed in claim 8 is characterized in that: offer described through hole step and comprise:
Offer the opening that at least one runs through described protective layer in the marginal zone;
In each opening, offer described through hole;
10. electronic installation, it comprises an earth terminal and a flexible PCB as claimed in claim 1, described metal reinforcement plate is electrically connected with described earth terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007102004242A CN100574554C (en) | 2007-04-10 | 2007-04-10 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007102004242A CN100574554C (en) | 2007-04-10 | 2007-04-10 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101287328A CN101287328A (en) | 2008-10-15 |
| CN100574554C true CN100574554C (en) | 2009-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007102004242A Expired - Fee Related CN100574554C (en) | 2007-04-10 | 2007-04-10 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
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Cited By (1)
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| CN102595767A (en) * | 2011-01-13 | 2012-07-18 | 钰桥半导体股份有限公司 | Circuit board structure of mobile electronic product and manufacturing method thereof |
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| CN101848599B (en) * | 2009-03-27 | 2011-11-30 | 胜华科技股份有限公司 | Flexible printing circuit board |
| CN102123561B (en) * | 2010-04-19 | 2013-12-25 | 苹果公司 | Electronic sub-component used for electronic device |
| CN102686012B (en) | 2011-03-18 | 2017-03-15 | 爱立信(中国)通信有限公司 | Electrostatic screen device, electronic equipment and the method for making the electrostatic screen device |
| CN102427676B (en) * | 2011-11-18 | 2013-08-14 | 景旺电子（深圳）有限公司 | Heat dissipation type rigid-flexible combined board and manufacturing method thereof |
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| CN103596352B (en) * | 2012-08-15 | 2018-02-06 | 江苏润阳物流器械科技有限公司 | flexible circuit board device and camera module |
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| CN104470194B (en) * | 2013-09-22 | 2017-08-22 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN103687285A (en) * | 2014-01-02 | 2014-03-26 | 上海华测导航技术有限公司 | Signal shielding structure used for printing circuit board |
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| WO2021134402A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Conductive connector |
| CN112996229A (en) * | 2021-01-19 | 2021-06-18 | 惠州Tcl移动通信有限公司 | Flexible circuit board, electronic equipment and electronic equipment manufacturing method |
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-
2007
- 2007-04-10 CN CNB2007102004242A patent/CN100574554C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595767A (en) * | 2011-01-13 | 2012-07-18 | 钰桥半导体股份有限公司 | Circuit board structure of mobile electronic product and manufacturing method thereof |
| CN102595767B (en) * | 2011-01-13 | 2015-07-22 | 钰桥半导体股份有限公司 | Circuit board structure of mobile electronic product and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101287328A (en) | 2008-10-15 |
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Inventor after: He Qiang Inventor before: Zeng Fuyan |
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| TR01 | Transfer of patent right |
Effective date of registration: 20160921 Address after: 515100 Guangdong Province, Shantou city Chaoyang District North Guiyu Qiaotou Industrial Zone Patentee after: Shantou Sen Sheng Electronic Industrial Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091223 Termination date: 20190410 |