CN107623985B - Flexible circuit board and mobile terminal - Google Patents
Flexible circuit board and mobile terminal Download PDFInfo
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- CN107623985B CN107623985B CN201710946909.XA CN201710946909A CN107623985B CN 107623985 B CN107623985 B CN 107623985B CN 201710946909 A CN201710946909 A CN 201710946909A CN 107623985 B CN107623985 B CN 107623985B
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Abstract
The invention discloses a kind of flexible circuit board, the flexible circuit board includes: substrate, is equipped with via hole；First conductive layer and the second conductive layer are located at the opposite two sides of the substrate, and the surface of second conductive layer is equipped with welding region and is used for connection of electronic devices, and second conductive layer is electrically connected to first conductive layer by the via hole；First coating, deviate from the side of the substrate positioned at first conductive layer, first coating is equipped with the first opening, and first opening exposes first conductive layer, the first conductive layer ground connection, first opening are staggered in the upright projection of the substrate with the welding region.A kind of mobile terminal is also disclosed in the present invention.In welding region surface mount electronic device, flexible circuit board part corresponding with welding region is not bent, and surface mount effect is good, and product yield is high, reduces production cost.
Description
Technical field
The present invention relates to technical field of electronic devices, more particularly, to a kind of flexible circuit board and mobile terminal.
Background technique
Flexible circuit board (Flexible Printed Circuit, FPC) is made with flexible substrate, has volume
Small, light-weight, bent feature is widely used in various types of electronic equipments.Electronic device is generally pasted by surface
Dress technology (Surface Mount Technology, SMT) is connected to the side of flexible circuit board, and some electronic devices (are such as penetrated
Frequency connector) connection flexible circuit board after also need to be grounded, earthing mode in the prior art can make the thickness of flexible circuit board
Unevenly, especially in the position for being correspondingly connected with electronic device, the surface irregularity of flexible circuit board or in uneven thickness soft
Certain bending can be generated after property circuit board stress, influences the effect of surface adhered with electronic device, product yield is low, improves life
Produce cost.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of flexible circuit board and mobile terminals, to solve the prior art
The middle surface mount for needing the electronic device being grounded on flexible circuit board is ineffective, the low problem of product yield.
In order to solve the above technical problems, the present invention provides a kind of flexible circuit board, the flexible circuit board includes:
Substrate is equipped with via hole；
First conductive layer and the second conductive layer are located at the opposite two sides of the substrate, the table of second conductive layer
Face is equipped with welding region and is used for connection of electronic devices, and second conductive layer is electrically connected to first conduction by the via hole
Layer；
First coating, the side of the substrate is deviated from positioned at first conductive layer, and first coating is equipped with the
One opening, first opening expose first conductive layer, and the first conductive layer ground connection, first opening is in the base
The upright projection of plate is staggered with the welding region.
In a kind of embodiment, first coating includes the support section of welding region described in face, the support
Part is greater than the size of the welding region in the size of the upright projection of the substrate.
In a kind of embodiment, the flexible circuit board further includes stiffening plate, and the stiffening plate is located at first covering
Layer deviates from the side of first conductive layer, and first conductive layer is electrically connected the stiffening plate to be grounded.
In a kind of embodiment, the stiffening plate covers the support section, to reinforce the intensity of the support section.
In a kind of embodiment, the stiffening plate also covers first opening, to reinforce the strong of first coating
Degree.
In a kind of embodiment, the stiffening plate is fixedly connected by the conductive hot-setting adhesive being coated in first opening
First conductive layer.
In a kind of embodiment, the flexible circuit board further includes the second coating, and second coating is located at described
Second conductive layer deviates from the side of the substrate, and second coating is equipped with the second opening to expose the welding region.
In a kind of embodiment, the welding region is equipped with the pad for protruding from second opening, the pad and institute
It states the second conductive layer to be mutually linked together, the pad is for connecting the electronic device.
The present invention also provides a kind of mobile terminal, including one flexible circuit board of electronic device and any of the above, institutes
It states electronic device and is connected to the welding region.
In a kind of embodiment, the mobile terminal further includes metal shell, and first conductive layer is electrically connected to described
Metal shell, so that the electronic device is grounded.
Beneficial effects of the present invention are as follows: electronic device is electrically connected to the first conductive layer by via hole, the first conductive layer from
First opening exposes ground connection, to realize the ground connection of electronic device, the first opening is staggered with welding region, the first conductive layer and weldering
The surfacing of the corresponding part in region is connect, in other words, the thickness of flexible circuit board part corresponding with welding region is uniform,
When welding region surface mount electronic device, flexible circuit board part corresponding with welding region is not bent, surface mount
Effect is good, and product yield is high, reduces production cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other obvious modes of texturing are obtained according to these attached drawings.
Fig. 1 is the schematic cross-section of flexible circuit board provided in an embodiment of the present invention.
Fig. 2 is the schematic diagram that flexible circuit board provided in an embodiment of the present invention is connect with electronic device.
Fig. 3 is the schematic bottom view of flexible circuit board provided in an embodiment of the present invention.
Fig. 4 is the top schematic diagram of flexible circuit board provided in an embodiment of the present invention.
Fig. 5 is a kind of schematic cross-section of embodiment of flexible circuit board provided in an embodiment of the present invention.
Fig. 6 and Fig. 7 is the schematic cross-section of the another embodiment of flexible circuit board provided in an embodiment of the present invention.
Fig. 8 is the schematic diagram of mobile terminal provided in an embodiment of the present invention.
Fig. 9 is the partial structure diagram of mobile terminal provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, flexible circuit board 100 provided in an embodiment of the present invention includes substrate 10, the first conductive layer 22, second
Conductive layer 24 and the first coating 32.Specifically, substrate 10 includes the top surface 104 and bottom surface 102 being oppositely arranged, 104 He of top surface
Bottom surface 102 is substrate 10 in upper two end face of thickness direction.In a kind of embodiment, substrate 10 is polyimides
(Polyimide, PI), substrate 10 have the characteristics that good insulating, soft pliable folding.
Please continue to refer to Fig. 1, the first conductive layer 22 and the second conductive layer 24 are located at the opposite two sides of substrate 10, a kind of
In embodiment, the first conductive layer 22 is by paste adhesive in bottom surface 102, and the second conductive layer 24 is by paste adhesive in top surface
104, with secured connecting substrate 10 and the first conductive layer 22 and the second conductive layer 24.In the present embodiment, the first conductive layer 22 and
Two conductive layers 24 are metal layer, and metal layer electric conductivity is excellent, and in a kind of embodiment, the first conductive layer 22 and second is conductive
Layer 24 is made for copper product, and the conductivity of copper is high, and material cost and processing cost are lower.It is understood that first is conductive
Layer 22 and the second conductive layer 24 include the specific pattern formed after etching, by 24 shape of the first conductive layer 22 and the second conductive layer
The conducting wire required at electrical connection is met.First conductive layer 22 and the second conductive layer 24 are separated in the two of substrate 10 by substrate 10
Side, the first conductive layer 22 can etch to form different patterns according to respective functional requirement from the second conductive layer 24, and connection is not
Same electronic device 60, and the first conductive layer 22 will not be interfered with each other with the second conductive layer 24.Please continue to refer to Fig. 1, this implementation
In example, via hole 12 is additionally provided on substrate 10, the first conductive layer 22 is connect with the second conductive layer 24 by via hole 12, thus by first
The particular electrical circuit of conductive layer 22 is electrically connected with the particular electrical circuit of the second conductive layer 24, in this way, being connected to the electricity of the first conductive layer 22
Sub- device 60 can be electrically connected to the electronic device 60 on the second conductive layer 24 and the second conductive layer 24.
Incorporated by reference to Fig. 2, the surface of the second conductive layer 24 is equipped with the welding region 240 for connection of electronic devices 60.Specifically
, welding region 240 is located at part of the flexible circuit board 100 without bending, and electronic device 60 is connected by modes such as welding
In welding region 240, in a kind of embodiment, electronic device 60 is connected to welding region 240 by surface mounting technology.This reality
It applies in example, electronic device 60 is electrically connected the second conductive layer 24, and the second conductive layer 24 is electrically connected to the first conductive layer by via hole 12
22, so that electronic device 60 be made to be electrically connected to the first conductive layer 22.
Referring to Fig. 1, flexible circuit board 100 further includes the first coating 32, the first coating 32 is located at the first conductive layer
22 deviate from the side of substrate 10.In a kind of embodiment, the first coating 32 is by paste adhesive in 22 surface of the first conductive layer.
First coating 32 is made of insulating materials, for protecting the first conductive layer 22, the first conductive layer 22 is avoided to be collided with damage
Or it is exposed in air and is oxidized.First coating 32 also plays the effect of insulation simultaneously, avoid the first conductive layer 22 with it is outer
Boundary contact and it is short-circuit.
In conjunction with Fig. 3, the first coating 32 is equipped with the first opening 52 to expose the first conductive layer 22 ground connection, specifically, first
Opening 52 can be to be formed on the first coating 32 by the modes such as cutting or excavating, corresponding first opening of the first conductive layer 22
52 position is exposed to except the first coating 32, and the first conductive layer 22 is grounded from the first 52 positions of opening, to realize electronics
The ground connection of device 60.
Referring to Fig. 1, the first opening 52 is staggered in the upright projection of substrate 10 with welding region 240 in the present embodiment, have
Body, the part of the corresponding welding region 240 of the first coating 32 is not provided with opening, the i.e. corresponding electronic device 60 of the first coating 32
Part be not provided with opening, to make the surfacing of the first conductive layer 22 part corresponding with welding region 240, in other words,
The thickness of the part corresponding with welding region 240 of flexible circuit board 100 is uniform.Surface adhered with electronic is carried out in the second conductive layer 24
When device 60, flexible circuit board 100 itself is relatively soft, needs 32 side of the first coating is fixed in the plane to support flexibility
Circuit board 100, during the second conductive layer 24, flexible circuit board 100 is covered mount electronic device 60 by direction first
The power in 32 direction of layer, since the thickness of the part corresponding with welding region 240 of flexible circuit board 100 is uniform, during attachment
Will not be good in the effect of 240 surface adhered with electronic device 60 of welding region there is a phenomenon where bending, product yield is high, reduces
Production cost.
Please continue to refer to Fig. 1, in the present embodiment, the first coating 32 includes the support section of face welding region 240
322, support section 322 is greater than the size of welding region 240 in the size of the upright projection of substrate 10.Specifically, support section
322 bear part of the electronic device 60 to 100 pressure of flexible circuit board, support section 322 when being surface adhered with electronic device 60
Size be greater than welding region 240, the edge of welding region 240 and welding region 240 is supported the support of part 322,
Surface-pasted effect is further improved, guarantees the position of the corresponding welding region 240 of flexible circuit board 100 during attachment
It will not be there is a phenomenon where bending, product yield is high, reduces production cost.
Referring to Fig. 1, flexible circuit board 100 further includes the second coating 34, the second coating 34 is located at the second conductive layer
24 deviate from the side of substrate 10.In a kind of embodiment, the second coating 34 is by paste adhesive in 24 surface of the second conductive layer.
Second coating 34 is made of insulating materials, for protecting the second conductive layer 24, the second conductive layer 24 is avoided to be collided with damage
Or it is exposed in air and is oxidized.Second coating 34 also plays the effect of insulation simultaneously, avoid the second conductive layer 24 with it is outer
Boundary contact and it is short-circuit.
Please refer to Fig. 1 and Fig. 4, in the present embodiment, the second coating 34 is equipped with the second opening 54 to expose welding region
240, specific to Fig. 4, the second opening 54 can be to be formed on the second coating 34 by the modes such as cutting or excavating, and second leads
The position of corresponding second opening 54 of electric layer 24 is exposed to except the second coating 34.In conjunction with Fig. 2, the second conductive layer 24 is opened from second
Mouthful 54 position connection of electronic devices 60, to realize being electrically connected for electronic device 60 and flexible circuit board 100.
Please refer to Fig. 4 and Fig. 5, in a kind of embodiment, welding region 240 is equipped with the pad for protruding from the second opening 54
540, pad 540 is mutually linked together with the second conductive layer 24, and pad 540 is used for connection of electronic devices 60.Specifically, pad 540
It is integrally formed with the second conductive layer 24, pad 540 protrudes from the second opening 54, and electronic device 60 is welded on pad 540, is convenient for
The interconnection of electronic device 60 and flexible circuit board 100 improves production efficiency.As shown in figure 5, in a kind of embodiment, weldering
The top surface 104 of disk 540 protrudes from the second coating 34, and pad 540 is exposed to outside the second coating 34, is further conducive to electronics
The interconnection of device 60 and flexible circuit board 100.
Referring to Fig. 6, flexible circuit board 100 further includes stiffening plate 70 in the present embodiment, stiffening plate 70 is located at the first covering
Layer 32 deviates from the side of the first conductive layer 22, and the first conductive layer 22 is electrically connected stiffening plate 70 to be grounded.Specifically, stiffening plate 70 is
Metal material is made, with conductive property, passes through the first opening 52 between the first conductive layer 22 and stiffening plate 70, stiffening plate
70 are electrically connected with the first conductive layer 22, in conjunction with Fig. 7, when stiffening plate 70 is grounded, the first conductive layer 22 and are welded in flexible circuit board
100 electronic device 60 is grounded.70 size of stiffening plate is larger relative to the first opening 52, is suitable for contact with earth element and connects
Ground.In a kind of embodiment, stiffening plate 70 is fixedly connected with first by the conductive hot-setting adhesive 80 being coated in the first opening 52 and leads
Electric layer 22, specifically, conductive 80 one side of hot-setting adhesive plays fixed effect, stiffening plate 70 and the first conductive layer 22 is fixed,
It is fixed on stiffening plate 70 on flexible circuit board 100, on the other hand, conductive hot-setting adhesive 80 is filled in the first opening 52, thus
The stiffening plate 70 of first coating, 32 two sides is electrically connected with the first conductive layer 22, after electronic device 60 is electrically connected to stiffening plate 70
Ground connection.
Referring to Fig. 6, stiffening plate 70 covers support section 322, in a kind of embodiment to reinforce support section 322
Intensity.Specifically, stiffening plate 70 is the biggish plate structure of hardness, stiffening plate 70 is set to what flexible circuit board 100 was not bent
Position.In a kind of embodiment, stiffening plate 70 is steel plate, and hardness is big, good conductivity and at low cost.In conjunction with Fig. 7, stiffening plate 70 is pasted
Together in the surface of the first coating 32, the hardness of flexible circuit board 100 is strengthened, when carrying out surface adhered with electronic device 60,
Flexible circuit board 100 keeps smooth and does not bend, and improves surface mount effect, improves product yield height, reduces production
Cost.
Referring to Fig. 6, stiffening plate 70 also covers the first opening 52, in a kind of embodiment to reinforce the first coating 32
Intensity.Increase area coverage of the stiffening plate 70 on the first coating 32, stiffening plate 70 imitates the support of flexible circuit board 100
Fruit is promoted, and further increases the integral smoothness of flexible circuit board 100, is conducive to promote surface mount effect, is improved product
Yield is high, reduces production cost.
Electronic device 60 is electrically connected to the first conductive layer 22 by via hole 12, and the first conductive layer 22 exposes from the first opening 52
Ground connection, to realize the ground connection of electronic device 60, the first opening 52 is staggered with welding region 240, the first conductive layer 22 and welding
The surfacing of the corresponding part in region 240, in other words, the thickness of the part corresponding with welding region 240 of flexible circuit board 100
Uniformly, good in the effect of 240 surface adhered with electronic device 60 of welding region, product yield is high, reduces production cost.
Fig. 8 and Fig. 9 are please referred to, the embodiment of the present invention also provides a kind of mobile terminal 300, and mobile terminal 300 includes flexibility
Circuit board 100, electronic device 60 are connected to welding region 240, to realize the company of electronic device 60 Yu flexible circuit board 100
It connects.Mobile terminal 300 provided in an embodiment of the present invention includes but is not limited to mobile phone, tablet computer and laptop etc..
Specific to Fig. 9, mobile terminal 300 further includes metal shell 200, and electronic device 60 and flexible circuit board 100 accommodate
In metal shell 200, the first conductive layer 22 of flexible circuit board 100 is electrically connected to metal shell 200, so that electronic device 60
Ground connection.Specifically, the first conductive layer 22 is electrically connected stiffening plate 70, stiffening plate 70 is electrically connected metal shell 200 by conducting resinl 90
Ground connection, so that electronic device 60 be made to be grounded.Electronic device 60 is electrically connected to the first conductive layer 22, the first conductive layer by via hole 12
22 expose from the first opening 52 and are electrically connected to metal shell 200, thus realize the ground connection of electronic device 60, earthing mode letter
Single Yi Shixian, and surface mount effect of the electronic device 60 on flexible circuit board 100 is not influenced.
In a kind of embodiment, electronic device 60 is radio frequency connector.
Above disclosed is only several preferred embodiments of the present invention, cannot limit the power of the present invention with this certainly
Sharp range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and weighs according to the present invention
Benefit requires made equivalent variations, still belongs to the scope covered by the invention.
Claims (10)
1. a kind of flexible circuit board, which is characterized in that the flexible circuit board includes:
Substrate is equipped with via hole；
First conductive layer and the second conductive layer, are located at the opposite two sides of the substrate, and the surface of second conductive layer is set
There is welding region for connection of electronic devices, the orthographic projection of the welding region on the substrate and the via hole region
It is staggered, second conductive layer is electrically connected to first conductive layer by the via hole；
First coating, the side of the substrate is deviated from positioned at first conductive layer, and first coating is equipped with first and opens
Mouthful, first opening exposes first conductive layer, and the first conductive layer ground connection, first opening is in the substrate
Upright projection is staggered with the welding region.
2. flexible circuit board according to claim 1, which is characterized in that first coating includes welding described in face
The support section in region, the support section are greater than the size of the welding region in the size of the upright projection of the substrate.
3. flexible circuit board according to claim 2, which is characterized in that the flexible circuit board further includes stiffening plate, institute
It states stiffening plate and is located at the side that first coating deviates from first conductive layer, first conductive layer is electrically connected the benefit
Strong plate is to be grounded.
4. flexible circuit board according to claim 3, which is characterized in that the stiffening plate covers the support section, with
Reinforce the intensity of the support section.
5. flexible circuit board according to claim 4, which is characterized in that the stiffening plate also covers first opening,
To reinforce the intensity of first coating.
6. flexible circuit board according to claim 5, which is characterized in that the stiffening plate is opened by being coated on described first
Conductive hot-setting adhesive in mouthful is fixedly connected with first conductive layer.
7. according to claim 1 to flexible circuit board described in 6 any one, which is characterized in that the flexible circuit board also wraps
The second coating is included, second coating is located at the side that second conductive layer deviates from the substrate, second covering
Layer is equipped with the second opening to expose the welding region.
8. flexible circuit board according to claim 7, which is characterized in that the welding region is equipped with and protrudes from described second
The pad of opening, the pad are mutually linked together with second conductive layer, and the pad is for connecting the electronic device.
9. a kind of mobile terminal, which is characterized in that including flexible circuit described in electronic device and claim 1 to 8 any one
Plate, the electronic device are connected to the welding region.
10. mobile terminal according to claim 9, which is characterized in that the mobile terminal further includes metal shell, described
First conductive layer is electrically connected to the metal shell, so that the electronic device is grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710946909.XA CN107623985B (en) | 2017-10-12 | 2017-10-12 | Flexible circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710946909.XA CN107623985B (en) | 2017-10-12 | 2017-10-12 | Flexible circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107623985A CN107623985A (en) | 2018-01-23 |
| CN107623985B true CN107623985B (en) | 2019-08-30 |
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ID=61092017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710946909.XA Active CN107623985B (en) | 2017-10-12 | 2017-10-12 | Flexible circuit board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107623985B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110018584B (en) * | 2019-04-03 | 2023-07-11 | 华显光电技术（惠州）有限公司 | Liquid crystal display module and electronic equipment |
| CN114585150B (en) * | 2022-03-16 | 2024-06-11 | 安捷利（番禺）电子实业有限公司 | Reinforcing sheet, antenna assembly and radio frequency connection assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229665A (en) * | 2002-01-31 | 2003-08-15 | Sumitomo Bakelite Co Ltd | Multilayered flexible wiring board and its manufacturing method |
| CN101287328A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board, processing method of said flexible circuit board and electronic device |
| CN202818766U (en) * | 2012-07-30 | 2013-03-20 | 深圳市子元技术有限公司 | PCB board with components mounted on surface thereof |
| CN105430891A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
-
2017
- 2017-10-12 CN CN201710946909.XA patent/CN107623985B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229665A (en) * | 2002-01-31 | 2003-08-15 | Sumitomo Bakelite Co Ltd | Multilayered flexible wiring board and its manufacturing method |
| CN101287328A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board, processing method of said flexible circuit board and electronic device |
| CN202818766U (en) * | 2012-07-30 | 2013-03-20 | 深圳市子元技术有限公司 | PCB board with components mounted on surface thereof |
| CN105430891A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
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| CN107623985A (en) | 2018-01-23 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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