CN101888741B - Printed circuit board and notebook computer - Google Patents
Printed circuit board and notebook computer Download PDFInfo
- Publication number
- CN101888741B CN101888741B CN2010102178551A CN201010217855A CN101888741B CN 101888741 B CN101888741 B CN 101888741B CN 2010102178551 A CN2010102178551 A CN 2010102178551A CN 201010217855 A CN201010217855 A CN 201010217855A CN 101888741 B CN101888741 B CN 101888741B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- substrate
- pcb
- resistance welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a printed circuit board. The printed circuit board comprises a substrate and a plurality of pad areas, wherein the pad areas comprises welding areas and welding resistant areas. The pad areas are formed on one of the substrate surfaces, the welding areas are positioned in central areas of the pad areas, and the welding resistant areas are positioned in surrounding areas of the pad areas. The invention also provides a notebook computer using the printed circuit board at the same time. The printed circuit board and the notebook computer using the same have the advantage of good product reliability.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), and the notebook computer of using this printed circuit board (PCB).
Background technology
The prior art notebook computer is generally plug-in unit (DIP) with interface, as universal serial bus (Universal Serial Bus, USB); Audio format (Audio); Video graphics array (Video Graphics Array, VGA), HDMI (High Definition Multimedia Interface; HDMI) etc.; But along with the development trend of notebook computer develops towards lightening and portable direction, (Surface Mounted Device, SMD) interface of type also will be widely used in above the notebook computer increasing surface mount device.
Seeing also Fig. 1, is the part plan sketch map that a kind of prior art adopts the printed circuit board (PCB) of SMD technology.This printed circuit board (PCB) 10 comprises substrate 11, pad 13, perforation 15 and copper cash 17.The positive and negative surface of this substrate 11 all is formed with conductive layer.This pad 13 is arranged on a wherein surface of this substrate 11.This perforation 15 runs through the positive and negative surface of this substrate 11, and keeps at a certain distance away with this pad 13.This copper cash 17 electrically connects these pads 13 and a terminal (figure does not show), and when terminal and this pad 13 laid respectively at this substrate 11 positive and negative surperficial, this copper cash 17 can pass this perforation 15 to electrically connect this pad 13 and terminal.
The problem that such prior art printed circuit board (PCB) exists is that its product reliability is relatively poor.That is to say that because this pad 13 is attached to these substrate 11 surfaces, the contact area of its and this substrate 11 is less, when carrying out the anti-plug test of interface,, and cause these pad 13 quilts to be come off from these substrate 11 pull-ups easily owing to receive external force bigger.
Summary of the invention
To the relatively poor problem of the pad reliability of prior art printed circuit board (PCB), the present invention provides a kind of reliability printed circuit board (PCB) preferably.
The present invention also provides a kind of notebook computer of this printed circuit board (PCB) of application.
A kind of printed circuit board (PCB) comprises a substrate and a plurality of pad area, and this pad comprises weld zone and resistance welding zone, and this pad area is arranged on a wherein surface of this substrate, and this weld zone is positioned at the central area of this pad area, and this resistance welding zone is positioned at the neighboring area of this pad area.
As the further improvement of this printed circuit board (PCB), this weld zone and this resistance welding zone are structure as a whole.
As the further improvement of this printed circuit board (PCB), this weld zone comprises first perforation, and this first perforation is positioned at this central area, weld zone, and this first hole pass connects this weld zone and this substrate.
As the further improvement of this printed circuit board (PCB), this first perforation is filled tin.
As the further improvement of this printed circuit board (PCB), this resistance welding zone comprises a plurality of second perforations, and this second perforation becomes arranged around this weld zone, and this second hole pass connects should resistance welding zone and this substrate.
As the further improvement of this printed circuit board (PCB), this second perforation is filled green lacquer.
As the further improvement of this printed circuit board (PCB), this printed circuit board (PCB) further comprises the metal level that multilayer is insulated from each other, and this metal level is separately positioned on and this first perforation, substrate internal layer and bottom that second perforation is corresponding.
A kind of notebook computer; It comprises printed circuit board (PCB); It comprises a substrate and a plurality of pad area this printed circuit board (PCB), and this pad comprises weld zone and resistance welding zone, and this pad area is arranged on a wherein surface of this substrate; This weld zone is positioned at the central area of this pad area, and this resistance welding zone is positioned at the neighboring area of this pad area.
As the further improvement of this notebook computer, this weld zone and this resistance welding zone are structure as a whole.
As the further improvement of this notebook computer, this weld zone comprises first perforation, and this first perforation is positioned at this central area, weld zone, and this resistance welding zone comprises a plurality of second perforations, and this second perforation becomes arranged around this weld zone.
Printed circuit board (PCB) of the present invention and using in the notebook computer of this printed circuit board (PCB); Enlarge the contact area of this pad area and this substrate; This central area, weld zone is provided with a plurality of second perforations around at least one pair of first perforation, this resistance welding zone are set, and this first perforation is filled tin, and second perforation is filled green lacquer; Strengthen the inner adhesive force of this pad area and this substrate, to prevent coming off of this pad area.
In sum, printed circuit board (PCB) of the present invention and the notebook computer of using this printed circuit board (PCB) have product reliability advantage preferably.
Description of drawings
Fig. 1 is a kind of part plan sketch map of prior art printed circuit board (PCB).
Fig. 2 is the planar structure sketch map of printed circuit board (PCB) first execution mode of the present invention.
Fig. 3 is the planar structure sketch map of printed circuit board (PCB) second execution mode of the present invention.
Fig. 4 is the perspective view of notebook computer of the present invention.
Embodiment
Below in conjunction with accompanying drawing to printed circuit board (PCB) of the present invention and the capable explanation of notebook computer.
Seeing also Fig. 2, is the planar structure sketch map of printed circuit board (PCB) first execution mode of the present invention.This printed circuit board (PCB) 20 comprises a substrate 22 and a plurality of pad area 21.This substrate 22 is one in order to carry the support plate of various electronic devices and components.These a plurality of pad areas 21 all are arranged at the same surface of this substrate 22, and it is respectively near the edge of this substrate 22 but still keep certain distance with the edge.According to the product design needs, the shape of this pad area 21 can be needed shapes such as circle, rectangle.For convenient explanation, in this execution mode, be that rectangle is an example with this pad area 21.This pad area 21 comprises weld zone 211 and resistance welding zone 213, and this weld zone 211 is structure as a whole with resistance welding zone 213.This pad area 21 is processed by metal material, for example copper foil material.
This weld zone 211 is positioned at the central area of this pad area 21, and it is shaped as rectangle.The upper surface of this weld zone 211 is brushed with one deck tin.
This resistance welding zone 213 is around this pad area 21, and its upper surface is brushed with solder resist, for example the solder resist of green paint material.This solder resist not only can play anti-welding effect as protective layer, can also protection circuit avoids causing short circuit or opening circuit because of scratch.
This resistance welding zone 213 of this pad area 21 comprises perforation 2131, and this perforation 2131 runs through the positive and negative surface of this substrate 21.Because the upper surface of this resistance welding zone 213 has the existence of solder resist, this perforation 2131 can be avoided being infiltrated by tin in the manufacturing process of this printed circuit board (PCB) 20.
In this printed circuit board (PCB) 20 of this execution mode; Use the copper cash that is integrally formed these resistance welding zone 213 replacement prior aries of structure with this weld zone 211; Make this pad area 21 extend to the scope at this perforation 2131 places, realize being communicated with of this perforation 2131 and this pad area 21.Compared with prior art; This pad area 21 of this printed circuit board (PCB) 20 is bigger with the contact area of this substrate 22; Help strengthening the adhesive force between this pad area 21 and this substrate 22, make this pad area 21 be not easy to come off, thereby improved the product reliability of this printed circuit board (PCB) 20.
Seeing also Fig. 3, is the planar structure sketch map of printed circuit board (PCB) second execution mode of the present invention.This printed circuit board (PCB) 30 comprises substrate 32, pad area 31 and multilayer metal level insulated from each other (figure does not show), and this pad area 31 comprises weld zone 311 and resistance welding zone 313.Wherein, this weld zone 311 of each pad area 31 is structure as a whole with this resistance welding zone 313.
This weld zone 311 comprises that first perforation, 3111, the first perforations 3111 are arranged on this 311 central areas, weld zone, and it connect to connect this weld zone 311 and this substrate 32, and during this weld zone 311 brush tin, this first perforation 3111 is filled up by tin.
This resistance welding zone 313 comprises a plurality of second perforations 3131, and this second perforation 3131 is arranged on resistance welding zone 313 neighboring areas, and it connects to connect and should hinder welding zone 313 and this substrate 32, forms arranged around this weld zone 311, and this second perforation 3131 is filled green lacquer.
This multiple layer metal layer is insulated from each other, and it is separately positioned on and this first perforation 3111, substrate 32 internal layers and bottom that second perforation 3131 is corresponding.
Compare with this printed circuit board (PCB) 20 of first execution mode; This printed circuit board (PCB) 30 of this execution mode has increased this first perforation 3111; And increasing the quantity of this second perforation 3131, this metal level is arranged at this first perforation 3111, this second perforation 3131 corresponding each substrate 32 internal layers and bottom.Because this first perforation 3111 is filled tin; This second perforation 3131 is filled green lacquer; Adhesive force between this pad area 31 and this substrate 32 further is enhanced; And increase the contact area of this pad area 31 and this substrate 32, and more help this pad area 31 attached to these substrate 32 surfaces, improve its product reliability.
Seeing also Fig. 4, is the perspective view of notebook computer of the present invention.This notebook computer 40 comprises this above-mentioned printed circuit board (PCB) 20, so it has product reliability advantage preferably.In addition, this notebook computer 40 can also adopt this printed circuit board (PCB) 30, with further raising product reliability.
In sum, the notebook computer 40 of printed circuit board (PCB) 20,30 these printed circuit board (PCB)s 20,30 of application of the present invention has product reliability advantage preferably.
More than be merely preferred case study on implementation of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. printed circuit board (PCB), it comprises a substrate and a plurality of pad area, it is characterized in that: each this pad area comprises weld zone and resistance welding zone; This weld zone and this resistance welding zone are structure as a whole, and these a plurality of pad areas are arranged on a wherein surface of this substrate, and this weld zone is positioned at the central area of this pad area; This weld zone comprises first perforation; This first perforation is positioned at this central area, weld zone, and this first hole pass connects this weld zone and this substrate, and this resistance welding zone is positioned at the neighboring area of this pad area; The upper surface of this resistance welding zone is brushed with solder resist; This resistance welding zone comprises a plurality of second perforations, and these a plurality of second perforations become arranged around this weld zone, and these a plurality of second hole pass connect should resistance welding zone and this substrate.
2. printed circuit board (PCB) according to claim 1 is characterized in that: this first perforation is filled tin.
3. printed circuit board (PCB) according to claim 1 is characterized in that: these a plurality of second perforations are filled green lacquer.
4. printed circuit board (PCB) according to claim 1 is characterized in that: this printed circuit board (PCB) further comprises the metal level that multilayer is insulated from each other, and these a plurality of metal levels are separately positioned on and this first perforation, substrate internal layer and bottom that a plurality of second perforation is corresponding.
5. notebook computer, it comprises printed circuit board (PCB), this printed circuit board (PCB) comprises a substrate and a plurality of pad area; It is characterized in that: each this pad area comprises weld zone and resistance welding zone, and this weld zone and this resistance welding zone are structure as a whole, and these a plurality of pad areas are arranged on a wherein surface of this substrate; This weld zone is positioned at the central area of this pad area, and this weld zone comprises first perforation, and this first perforation is positioned at this central area, weld zone; This first hole pass connects this weld zone and this substrate; This resistance welding zone is positioned at the neighboring area of this pad area, and the upper surface of this resistance welding zone is brushed with solder resist, and this resistance welding zone comprises a plurality of second perforations; These a plurality of second perforations become arranged around this weld zone, and these a plurality of second hole pass connect should resistance welding zone and this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102178551A CN101888741B (en) | 2010-07-02 | 2010-07-02 | Printed circuit board and notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102178551A CN101888741B (en) | 2010-07-02 | 2010-07-02 | Printed circuit board and notebook computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101888741A CN101888741A (en) | 2010-11-17 |
| CN101888741B true CN101888741B (en) | 2012-05-02 |
Family
ID=43074394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102178551A Expired - Fee Related CN101888741B (en) | 2010-07-02 | 2010-07-02 | Printed circuit board and notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101888741B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874320B (en) * | 2012-12-17 | 2017-02-01 | 纬创资通股份有限公司 | Circuit board and manufacturing method thereof |
| CN105636350A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| JP6741456B2 (en) * | 2016-03-31 | 2020-08-19 | Fdk株式会社 | Multilayer circuit board |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2645405Y (en) * | 2003-09-26 | 2004-09-29 | 比亚迪股份有限公司 | Double-faced flexible printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050095722A (en) * | 2004-03-27 | 2005-09-30 | 한국시그네틱스 주식회사 | Semiconductor package improving a solder joint capability with print circuit board |
-
2010
- 2010-07-02 CN CN2010102178551A patent/CN101888741B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2645405Y (en) * | 2003-09-26 | 2004-09-29 | 比亚迪股份有限公司 | Double-faced flexible printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 鲜飞.《印制板设计与制作工艺》.《印制电路信息》.2005,(第6期), * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101888741A (en) | 2010-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9398692B2 (en) | Interconnecting conduction structure for electrically connecting conductive traces of flexible circuit boards | |
| CN107484328B (en) | A kind of display device | |
| US9332641B2 (en) | Connection structure of circuit board | |
| US7368666B2 (en) | Surface-mounting type electronic circuit unit without detachment of solder | |
| CN113514989A (en) | Display panel and display device | |
| US8779292B2 (en) | Substrate and substrate bonding device using the same | |
| CN101888741B (en) | Printed circuit board and notebook computer | |
| CN105407636A (en) | Golden finger device for flexible printed circuit board | |
| US20150382454A1 (en) | Spilled adhesive guide structure of flexible circuit board | |
| CN105682343A (en) | Flexible-rigid combined board and terminal | |
| CN105636336A (en) | Printed circuit board and mobile terminal | |
| US9076698B2 (en) | Flexible package-to-socket interposer | |
| US7559777B2 (en) | Electrical connector for connecting electrically an antenna module to a grounding plate | |
| JP5275332B2 (en) | Electronics | |
| CN112415818A (en) | Display panel and electronic equipment | |
| JP4908620B2 (en) | Television receiver and electronic device | |
| TW201547338A (en) | Power supply path structure of flexible printed circuit board | |
| CN105430896B (en) | Flexible PCB and mobile terminal | |
| CN109792838A (en) | The flexible printed circuit board for having via pad | |
| CN105430891B (en) | Flexible circuit board and mobile terminal | |
| JP2011061243A (en) | Flexible printed circuit board | |
| CN105873342B (en) | Display device | |
| US8780575B2 (en) | Printed circuit board | |
| CN112867226B (en) | High-frequency transmission circuit board and manufacturing method thereof | |
| CN218868429U (en) | Printed circuit board and circuit board assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20101117 Assignee: Shenzhen Dinghai Electron Co., Ltd. Assignor: Shenzhen Dingxing Digital Network Technology Co., Ltd. Contract record no.: 2012440020331 Denomination of invention: Printed circuit board and notebook computer Granted publication date: 20120502 License type: Exclusive License Record date: 20121210 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120502 Termination date: 20140702 |
|
| EXPY | Termination of patent right or utility model |