CN105430895A - Mobile terminal, flexible circuit board and manufacture method of flexible circuit board - Google Patents
Mobile terminal, flexible circuit board and manufacture method of flexible circuit board Download PDFInfo
- Publication number
- CN105430895A CN105430895A CN201511025616.5A CN201511025616A CN105430895A CN 105430895 A CN105430895 A CN 105430895A CN 201511025616 A CN201511025616 A CN 201511025616A CN 105430895 A CN105430895 A CN 105430895A
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- Prior art keywords
- pad
- board
- flexible base
- conducting wire
- lead
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a flexible circuit board. The flexible circuit board includes a flexible substrate as well as a pad and a plurality of conductive lines which are arranged on the flexible substrate; the flexible substrate comprises two oppositely-arranged side edges; the plurality of conductive lines are arranged at intervals on the flexible substrate along the extension direction of the side edges; the pad includes a plurality of leads which are arranged at intervals; the plurality of leads extend along a direction vertical to the side edges in a plane where the flexible substrate is located, and are electrically with one conductive line respectively. In addition, the invention also provides a mobile terminal and a method for manufacturing the flexible circuit board. With the flexible circuit board adopted, the disconnection of the pad and the plurality of conductive lines due to uneven stress can be effectively prevented.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of mobile terminal, flexible PCB and manufacture method thereof.
Background technology
Flexible PCB (FlexiblePrintedCircuit, FPC) be the printed circuit board (PCB) made with flexible base, board, it has many rigid printed circuit board (PrintedCircuitboard, PCB) advantage do not possessed, such as FPC can free bend, winding, folding, can require to arrange arbitrarily according to space layout, thus reach components and parts and assemble the integration be connected with wire.Owing to there is above-mentioned advantage, make to adopt FPC effectively can reduce the volume of electronic product, increase the flexibility of circuit layout, meet the needs of electronic product to high density, miniaturization, highly reliable future development.At present, FPC is widely used in the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, personal digital assistant (PersonalDigitalAssistant, PDA), digital camera or product.
FPC upper usually needs arranges the pad being used for welding component or carrying out as connectivity port and other circuit board welding, and described pad is connected with the cabling on FPC by lead-in wire mostly.In the design and manufaction process of FPC, in order to ensure that it has good integrated level, usually need the trace width on FPC less, and wiring density is larger.But because pad is used for being connected with miscellaneous part, its width obviously can be greater than the width of FPC upward wiring usually, and the thickness of pad is thicker, and hardness is also larger.Therefore, in the process of production and assembly, when there is bending by External Force Acting in FPC, the junction of the pad on it and cabling is due to factors such as width is different, nonhomogeneous hardnesses, easily cause rupturing in the junction of the two, occur being electrically connected phenomenon that is bad or open circuit, reliability is not good.
Summary of the invention
In view of the above-mentioned problems in the prior art, the invention provides a kind of flexible PCB, it is vertical with the conducting wire on flexible PCB by the outlet direction of pads wire is set to, thus prevent when flexible PCB bends, stress is uneven and cause the connection between pad and conducting wire to be ruptured, to promote the reliability of flexible PCB.
Separately, the present invention also provides a kind of manufacture method of flexible PCB.
Separately, the present invention also provides a kind of mobile terminal applying described flexible PCB.
A kind of flexible PCB, the pad comprising flexible base, board and be arranged on described flexible base, board and many conducting wires, described flexible base, board comprises two sides be oppositely arranged, many described conducting wires are arranged at intervals on described flexible base, board along the bearing of trend of described side, described pad comprises many spaced lead-in wires, many described lead-in wires at described flexible base, board planar extend along the direction perpendicular to described side, and to be electrically connected with conducting wire described in respectively.
Wherein, described flexible base, board also comprises an extension, and described extension to stretch out protrusion from the side of described flexible base, board, and is positioned at same plane with described flexible base, board, and described pad is arranged on described extension.
Wherein, many spaced lead-in wires pass from described extension, and extend along the direction perpendicular to described side, and are electrically connected with the conducting wire of on described flexible base, board respectively.
Wherein, described pad to be arranged on described flexible base, board and between many described conducting wires, many described conducting wires are arranged along described pad both sides to walk around described pad respectively on the bearing of trend of described side.
Wherein, many spaced lead-in wires extend along the direction perpendicular to described side, and are electrically connected with a described conducting wire respectively.
Wherein, described pad also comprises multiple independently welding region, and welding region described in each is electrically connected by a described lead-in wire and described conducting wire.
A manufacture method for flexible PCB, comprising:
There is provided flexible base, board, described flexible base, board comprises two sides be oppositely arranged;
Described flexible base, board covers Copper Foil, and form conducting wire on described Copper Foil, described conducting wire is arranged along the bearing of trend interval of described side;
Described Copper Foil is formed pad and lead-in wire, and described lead-in wire extends along the direction perpendicular to described side, and is electrically connected with described conducting wire and pad;
The coverlay with opening is placed on described Copper Foil, and makes described opening and described pad alignment;
Electronic devices and components are mounted on described pad.
Wherein, described electronic devices and components to be mounted on described pad, to comprise:
By the mode of welding, described electronic devices and components are mounted on described pad; Or
By the mode of hot pressing, described electronic devices and components are mounted on described pad; Or
By conducting resinl, described electronic devices and components are mounted on described pad.
Wherein, described manufacture method also comprises:
Described flexible PCB pastes emi shielding film.
Wherein, described flexible base, board also comprises an extension, and described extension to stretch out protrusion from the side of described flexible base, board, and is positioned at same plane with described flexible base, board; Form pad and lead-in wire then on described Copper Foil before, described manufacture method also comprises:
When forming described conducting wire, reserved welding disking area on described flexible base, board;
Described welding disking area is arranged between described conducting wire or on described extension, and described pad is arranged in described welding disking area.
A kind of mobile terminal, comprise flexible PCB, described flexible PCB comprises flexible base, board and the pad that is arranged on described flexible base, board and many conducting wires, described flexible base, board comprises two sides be oppositely arranged, many described conducting wires are arranged at intervals on described flexible base, board along the bearing of trend of described side, described pad comprises many spaced lead-in wires, many described lead-in wires at described flexible base, board planar extend along the direction perpendicular to described side, and to be electrically connected with conducting wire described in respectively.
In sum, according to technique scheme, described flexible PCB is extended by the direction be set to by the lead-in wire of described pad along the side perpendicular to described flexible base, board, and be connected with described conducting wire, thus can effectively prevent described flexible PCB when bending, because of the junction of pad and conducting wire unbalanced stress and cause the connection between described pad and conducting wire to be ruptured, and then promote reliability and the stability of described flexible PCB.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the flexible PCB that the embodiment of the present invention provides;
Fig. 2 is the partial enlargement structural representation of the flexible PCB that the embodiment of the present invention provides;
Fig. 3 is the flow chart of the manufacture method of the flexible PCB that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature is as illustrated in the drawing described.Be appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.
Being appreciated that terminology used here is only to describe specific embodiment, not really wanting to limit the present invention.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of other features one or more, entirety, step, element, assembly and/or its existence of combining or increase.
Refer to Fig. 1, first embodiment of the invention provides a kind of flexible PCB (FlexiblePrintedCircuit, FPC) 10, it comprises flexible base, board 11, many conducting wires 13 and pad 15, and many described conducting wires 13 and pad 15 are arranged on described flexible base, board 11.Described flexible base, board 11 is in strip, and it comprises two sides 111 be oppositely arranged, and many described conducting wires 13 are arranged at intervals on described flexible base, board 11 along the bearing of trend of described side 111.Described pad 15 is arranged at described side 111 place, comprise many spaced lead-in wires 151 and multiple independently welding region 153, go between described in each 151 one end described welding region 153 corresponding be electrically connected, the other end flexible base, board 11 institute planar edge perpendicular to described side 111 direction extension and be electrically connected with a conducting wire 13.Wherein, described multiple independently welding region 153 refers to that multiple described welding region does not contact each other, and without electric connecting relation.
Wherein, described pad 15 is for mounting the electronic devices and components such as resistance, electric capacity, integrated circuit.When described electronic devices and components are soldered on described pad 15, then multiple pins of described electronic devices and components are welded in multiple independently welding region 153 respectively, described lead-in wire 151 is for setting up the electric connection between described electronic devices and components and described conducting wire 13, and namely described electronic devices and components are electrically connected with described conducting wire 13 by described lead-in wire 151.By described lead-in wire 151 to be set at this flexible base, board 11 be planar connected along the direction vertical with described side 111 with described conducting wire 13, and not pad 15 is directly connected with described conducting wire 13, thus when described flexible PCB 10 is bent being subject to External Force Acting, the effect of stress that the lead-in wire 151 that can effectively reduce described pad 15 is subject to described conducting wire 13, and then prevent because described flexible PCB 10 bends and cause the components and parts on described pad 15 to come off, or avoid the lead-in wire 151 between described pad 15 and described conducting wire 13 be torn or disconnect, to promote the reliability of described flexible PCB 10.
Refer to Fig. 2, Fig. 2 is the close-up schematic view of dotted box portion in the structural representation of flexible PCB shown in Fig. 1.In an alternative embodiment, described flexible base, board 11 also can comprise an extension 113, and described extension 113 is connected with described side 111.Be understandable that, described extension 113 can be a part for flexible base, board 11, its protrusion that stretches out from the edge of this flexible base, board 11, such as, to stretch out protrusion from described side 111.Preferably, described extension 113 is positioned at same plane with described flexible base, board 11.Described pad 15 is arranged on described extension 113, and many spaced lead-in wires 151 pass from described extension 113, and extends along the direction perpendicular to described side 111, and is electrically connected with a conducting wire 13 on described flexible base, board 11 respectively.Be appreciated that described flexible PCB 10 can comprise multiple described pad 15, correspondingly, described flexible base, board 11 also can comprise multiple described extension 113, and pad 15 described in each is arranged on a described extension 113 respectively.
In an alternative embodiment, described flexible base, board 11 also can comprise pad 15 ', and described pad 15 ' is arranged on described flexible base, board 11, and between many described conducting wires 13.Wherein, many described conducting wires 13 are in the position through described pad 15 ' place, respectively along described pad 15 ' both sides and arrange near the position of described side 111, namely many described conducting wires 13 are arranged along described pad 15 ' both sides respectively on the bearing of trend of described side 111, to walk around described pad 15 ', thus prevent from being short-circuited between pad 15 ' and conducting wire 13.Described pad 15 ' comprises many spaced lead-in wires 151 ' and multiple independently welding region 153 ' (in the present embodiment, because described in each, lead-in wire 151 ' is overlapping with welding region described in each 153 ', therefore represent welding region 153 ' with parantheses in Fig. 2), described in one end and of lead-in wire 151 ' described in each, welding region 153 ' is electrically connected, and the other end extends along the direction perpendicular to described side 111 and described conducting wire 13 is electrically connected with one respectively.
In the present embodiment, described pad 15 ' comprises two intervals and arranges and the lead-in wire 151 ' extended towards contrary direction, wherein a lead-in wire 151 ' extends towards the direction of a described side 111, and be connected with a conducting wire 13 near described side 111, another lead-in wire 151 ' extends towards the direction of another relative side 111, and is connected with a conducting wire 13 near another side 111 described.Be appreciated that in other embodiments of the invention, the lead-in wire 151 ' of described pad 15 ' also can extend in the same direction, and conducting wire 13 described with is connected respectively, does not do concrete restriction at this.
Refer to Fig. 3, second embodiment of the invention provides a kind of manufacture method of flexible PCB, and described manufacture method at least comprises the steps.
Step S201: flexible base, board is provided, described flexible base, board comprises two sides be oppositely arranged;
Wherein, the material of described flexible base, board can be polyimides, and polyimides has excellent pliability and good dimensional stability, and operating temperature range is wider, has outstanding fire resistance, and electrical property is under soldering conditions influenced hardly.Be appreciated that the material of described flexible base, board can also for polyester, the polymer general name that polyester is polyalcohol and polyacid polycondensation and obtains, it mainly refers to polyethylene terephthalate, also can comprise polybutylene terephthalate and polyarylate.
Step S202: cover Copper Foil on described flexible base, board, and conducting wire is formed on described Copper Foil, described conducting wire is arranged along the bearing of trend interval of described side;
Wherein, described Copper Foil can be rolled copper foil or electrolytic copper foil, wherein rolled copper foil has the characteristics such as good ductility, repeated deflection, and compared to described rolled copper foil, and electrolytic copper foil is then have lower manufacturing cost, be conducive to the advantages such as fine-line making.In addition, the Copper Foil of different-thickness can be covered thereon according to demands such as the suppleness of described flexible PCB, bending property and current capacities.
Be appreciated that described conducting wire can be arranged at a surface of described flexible base, board, also can be arranged on two relative surfaces of described flexible base, board.When two that described conducting wire is arranged at described flexible base, board surperficial, the conducting wire between different surfaces realizes being electrically connected by the mode opening via hole on described flexible base, board.
Being appreciated that when forming described conducting wire, needing reserved welding disking area on described flexible base, board, for arranging pad.Described welding disking area can between many described conducting wires.Wherein, many described conducting wires are in the position through described welding disking area place, respectively along described welding disking area both sides and arrange near the position of described side, namely many described conducting wires are arranged along described welding disking area both sides, to walk around described welding disking area respectively on the bearing of trend of described side.
Step S203: form pad and lead-in wire on described Copper Foil, described lead-in wire extends along the direction perpendicular to described side, and is electrically connected with described conducting wire and pad;
Wherein, described pad is used for the electronic devices and components such as welding kesistance, electric capacity, integrated circuit, described flexible PCB can comprise multiple pad, and pad described in each comprises multiple independently welding region, and welding region described in each is electrically connected by a described lead-in wire and a described conducting wire.When described electronic devices and components are soldered on described pad, many spaced described lead-in wires are for setting up the electric connection between described electronic devices and components and described conducting wire, and namely described electronic devices and components are electrically connected by described lead-in wire and described conducting wire.
Step S204: the coverlay with opening is placed on described Copper Foil, and make described opening and described pad alignment;
Wherein, described coverlay can optionally cover FPC surface, for the protection of described conducting wire.The material of described coverlay can be polyimides or polyester, and polyimides has good pliability and resistant to elevated temperatures feature; Polyester then has the feature that cost is low, pliability is good.In an alternative embodiment, the material of described coverlay can also be solder mask, thus mode of printing can be adopted to process, to reduce production cost further.
Step S205: electronic devices and components are mounted on described pad.
Wherein, describedly electronic devices and components to be mounted on described pad, can be: by the mode of welding, described electronic devices and components are mounted on described pad, or by the mode of hot pressing, described electronic devices and components are mounted on described pad, or by conducting resinl, described electronic devices and components are mounted on described pad.
In an alternative embodiment, described flexible base, board also can comprise an extension, and described extension is connected with described side.Be understandable that, described extension can be a part for flexible base, board, its protrusion that stretches out from the edge of this flexible base, board, such as, to stretch out protrusion from described side edge.Preferably, described extension and described flexible base, board are positioned at same plane.Described welding disking area and pad are arranged on described extension.Many spaced described lead-in wire exposes from described extension and extends along the direction perpendicular to described side, and is electrically connected with the conducting wire of on described flexible base, board respectively.Be appreciated that described flexible PCB can comprise multiple described extension, pad described in each is arranged on a described extension respectively.
Be appreciated that described electronic devices and components are mounted on described pad after, described manufacture method also comprises: on described flexible PCB, paste electromagnetic interference (ElectromagneticInterference, EMI) screened film.
Wherein, described EMI screened film is used for carrying out electromagnetic interference shield to described conducting wire.Be appreciated that in other embodiments, electromagnetic interference shield can also be realized by the mode of brushing silver slurry.
Third embodiment of the invention provides a kind of mobile terminal, comprises flexible PCB as described in the first embodiment of the present invention.Wherein, described mobile terminal can be but be not limited to mobile phone, panel computer, intelligent watch, motion bracelet etc.
In sum, state the mobile terminal of embodiment on the invention, in flexible PCB and manufacture method thereof, described flexible PCB is extended by the direction be set to by the lead-in wire of described pad along the side perpendicular to described flexible base, board, and be connected with described conducting wire, thus can effectively prevent described flexible PCB when bending, because of the junction of pad and conducting wire unbalanced stress and cause the connection between described pad and conducting wire to be ruptured, also can prevent the electronic devices and components be mounted on described pad from coming off when flexible PCB bends simultaneously, thus effectively put forward the described reliability rising flexible PCB.
Above disclosedly be only preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (10)
1. a flexible PCB, comprise flexible base, board and be arranged at the pad on described flexible base, board, it is characterized in that, described flexible PCB also comprises many conducting wires be arranged on described flexible base, board, described flexible base, board comprises two sides be oppositely arranged, many described conducting wires are arranged at intervals on described flexible base, board along the bearing of trend of described side, described pad comprises many spaced lead-in wires, many described lead-in wires at described flexible base, board planar extend along the direction perpendicular to described side, and be electrically connected with conducting wire described in respectively.
2. flexible PCB as claimed in claim 1, it is characterized in that, described flexible base, board also comprises an extension, and described extension to stretch out protrusion from the side of described flexible base, board, and being positioned at same plane with described flexible base, board, described pad is arranged on described extension.
3. flexible PCB as claimed in claim 2, it is characterized in that, many spaced lead-in wires pass from described extension, and extend along the direction perpendicular to described side, and are electrically connected with the conducting wire of on described flexible base, board respectively.
4. flexible PCB as claimed in claim 1, it is characterized in that, described pad is arranged on described flexible base, board and between many described conducting wires, many described conducting wires are arranged along described pad both sides to walk around described pad respectively on the bearing of trend of described side.
5. flexible PCB as claimed in claim 4, is characterized in that, many spaced lead-in wires extend along the direction perpendicular to described side, and are electrically connected with a described conducting wire respectively.
6. the flexible PCB as described in claim 1-5 any one, is characterized in that, described pad also comprises multiple independently welding region, and welding region described in each is electrically connected by a described lead-in wire and described conducting wire.
7. a manufacture method for flexible PCB, is characterized in that, described manufacture method comprises:
There is provided flexible base, board, described flexible base, board comprises two sides be oppositely arranged;
Described flexible base, board covers Copper Foil, and form conducting wire on described Copper Foil, described conducting wire is arranged along the bearing of trend interval of described side;
Described Copper Foil is formed pad and lead-in wire, and described lead-in wire extends along the direction perpendicular to described side, and is electrically connected with described conducting wire and pad;
The coverlay with opening is placed on described Copper Foil, and makes described opening and described pad alignment;
Electronic devices and components are mounted on described pad.
8. manufacture method as claimed in claim 7, is characterized in that, is describedly mounted on described pad by electronic devices and components, comprising:
By the mode of welding, described electronic devices and components are mounted on described pad; Or
By the mode of hot pressing, described electronic devices and components are mounted on described pad; Or
By conducting resinl, described electronic devices and components are mounted on described pad.
9. the manufacture method as described in claim 7-8 any one, is characterized in that, described flexible base, board also comprises an extension, and described extension to stretch out protrusion from the side of described flexible base, board, and is positioned at same plane with described flexible base, board; Form pad and lead-in wire then on described Copper Foil before, described manufacture method also comprises:
When forming described conducting wire, reserved welding disking area on described flexible base, board;
Described welding disking area is arranged between described conducting wire or on described extension, and described pad is arranged in described welding disking area.
10. a mobile terminal, is characterized in that, described mobile terminal comprises the flexible PCB as described in claim 1-6 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025616.5A CN105430895A (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and manufacture method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025616.5A CN105430895A (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and manufacture method of flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN105430895A true CN105430895A (en) | 2016-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025616.5A Pending CN105430895A (en) | 2015-12-29 | 2015-12-29 | Mobile terminal, flexible circuit board and manufacture method of flexible circuit board |
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| CN (1) | CN105430895A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702835A (en) * | 2020-12-25 | 2021-04-23 | 浙江荷清柔性电子技术有限公司 | Flexible circuit board packaging method and flexible circuit board |
| WO2021134405A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Electrically conductive member |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1411327A (en) * | 2001-09-27 | 2003-04-16 | 奥林巴斯光学工业株式会社 | Flexible printed circuid board |
| CN102869186A (en) * | 2012-04-26 | 2013-01-09 | 宸阳光电科技（厦门）有限公司 | Connection structure for flexible printed circuit board and touch panel |
| CN103582296A (en) * | 2012-08-10 | 2014-02-12 | 乐金显示有限公司 | Flexible printed circuit film and display device using the same |
| CN204069479U (en) * | 2014-07-14 | 2014-12-31 | 联想(北京)有限公司 | Flexible circuit board FPC and electronic equipment |
| CN104902678A (en) * | 2014-03-07 | 2015-09-09 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board and manufacturing method for the same |
| CN105072803A (en) * | 2015-07-10 | 2015-11-18 | 武汉华星光电技术有限公司 | Flexible circuit board and electronic equipment |
-
2015
- 2015-12-29 CN CN201511025616.5A patent/CN105430895A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1411327A (en) * | 2001-09-27 | 2003-04-16 | 奥林巴斯光学工业株式会社 | Flexible printed circuid board |
| CN102869186A (en) * | 2012-04-26 | 2013-01-09 | 宸阳光电科技（厦门）有限公司 | Connection structure for flexible printed circuit board and touch panel |
| CN103582296A (en) * | 2012-08-10 | 2014-02-12 | 乐金显示有限公司 | Flexible printed circuit film and display device using the same |
| CN104902678A (en) * | 2014-03-07 | 2015-09-09 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board and manufacturing method for the same |
| CN204069479U (en) * | 2014-07-14 | 2014-12-31 | 联想(北京)有限公司 | Flexible circuit board FPC and electronic equipment |
| CN105072803A (en) * | 2015-07-10 | 2015-11-18 | 武汉华星光电技术有限公司 | Flexible circuit board and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021134405A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Electrically conductive member |
| CN112702835A (en) * | 2020-12-25 | 2021-04-23 | 浙江荷清柔性电子技术有限公司 | Flexible circuit board packaging method and flexible circuit board |
| CN112702835B (en) * | 2020-12-25 | 2022-02-25 | 浙江荷清柔性电子技术有限公司 | Flexible circuit board packaging method and flexible circuit board |
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Application publication date: 20160323 |