200841795 % . 九、發明說明： 【發明所屬之技術領域】200841795 % . Nine, invention description: [Technical field to which the invention belongs]
本發明涉及印刷電路板技術，特別涉及一種柔性電I 板、柔性電路板加工方法及具有所述柔性電路板之電子奢 置。 ^ 【先前技術】 柔性電路板(Flexible Printed Circuit，FPC)又稱撓性電 鲁 路板或軟性電路板，其可在三維空間撓轉組裝，且具有輕$ 薄、短、小等優點，被廣泛應用於各種電子產品，如手機、 磁片機及筆記本電腦等。 為方便貼裝電子元件，柔性電路板在電子元件貼裝部 叹有補強板，以提高電子元件貼裝部之機械強度。若需訝 %子元件貼裝部作防電磁干擾設計，則在電子元件貼裝部 之邊緣形成裸銅區，並採用導電膠將補強板黏裝於電子元 魯 件貼裝部具有裸銅區之表面，補強板則採用金屬補強板。 如此，電子元件貼裝部之裸銅區便通過導電膠電連接到金 屬補強板。使用時，將金屬補強板接地，使裸銅區電性接 地，金屬補強板及電子元件貼裝部邊緣之裸銅區形成靜電 屏蔽罩將圍繞電子元件貼裝部，便可抑制外部電磁源對電 子轉貼裝部之干擾。另外，裸銅區、導電膠與金屬補強 板構成之電通道還可作為電子元件貼裝部之散熱通道，帶 走電子元件貼裝部産生之熱量。 ^惟，採用導電膠之防電磁干擾設計存在以下問題：工) 才木用導電膠黏裝難以保證裸銅區與金屬補強板良好接觸； 7 200841795 • 2)木丨生電路板加工需經回焊爐焊接電子元件，此過程將導 致^電膠之導電性及導熱性惡化；3)導電膠使用壽命較 短’其導電能力及導熱能力隨時間增長而惡化。綜上，採 用導電膠進行防電磁干擾設計之柔性電路板之防電磁干擾 月匕力及散熱能力不穩定、不可靠。 【發明内容】 有繁於此，本發明提供一種具有可靠防電磁干擾能力 瞻之柔性電路板、柔性電路板加工方法及採用所述柔性電路 板之電子裝置。 一種柔性電路板，其包括至少一個電子元件貼裝部。 每個電子元件貼裝部包括一個金屬補強板、一個設於所述 金屬補強板上之絕緣層及一個設於所述絕緣層上之導電 層。所述導電層包括電路區及圍繞所述電路區之邊緣區。 所述邊緣區開設有至少一個貫穿所述導電層及絕緣層之通 孔母個通孔内填充有電連接所述導電層與所述金屬補強 鲁 板之焊接材料。 一種柔性電路板加工方法，其包括以下步驟： 結合一個導電層與一個絕緣層； 在所述導電層形成電路區及圍繞所述電路區之邊緣 區； 在邊緣區開設至少一個貫穿所述導電層及絕緣層之通 孔； ~ 結合一個金屬補強板與所述絕緣層； 將一焊接材料填充入所述通孔； 200841795 焊接所述焊接材料。 —種電子裝置，其包括一接地端及一個柔性電路板。 所述柔性電路板包括至少一個電子元件貼裝部。每個電子 元件貼裝部包括一個金屬補強板、一個設於所述金屬補強 板上之絕緣層及一個設於所述絕緣層上之導電層。所述導 電層包括電路區及圍繞所述電路區之邊緣區。所述邊緣區 開設有至少一個貫穿所述導電層及絕緣層之通孔。每個通 孔内填充有電連接所述導電層與所述金屬補強板之焊接材 料。 所述柔性電路板通過所述焊接材料穩定、可靠地電連 接所述導電層之邊緣區與所述金屬補強板，使用時，將所 述金屬補強板接地，所述邊緣區與所述金屬補強板形成之 接地靜電屏蔽罩可提供所述電子元件貼裝部穩定之抗電磁 干擾保護。所述柔性電路板應用於電子裝置可提供電子裝 置穩定之抗電磁干擾保護。 【實施方式】 請參閱圖1，本發明較佳實施例之柔性電路板1〇〇包 括一個電子元件貼裝部1〇及一個與所述電子元件貼裝部 10連接之可撓轉部20。每個電子元件貼裝部1〇包括一個 金屬補強板11，一個設於所述金屬補強板n上之絕緣層 12及一個設於所述絕緣層12上之導電層13。所述導電^ 13包括電路區131及圍繞所述電路區131之邊緣區132。 所述電路區131形成有複數焊盤(圖未示），以供電子元件 30貼裝。所述邊緣區132開設有至少一個貫穿所述導電層 9 200841795 • 13及絶緣層12之通孔14，每個通孔14填充有電連接所述 V私層13與所述金屬補強板u之焊接材料b。 。具體地，本施實例之導電層13包括兩個圍繞所述電路 區131之邊緣區132，每個邊緣區132開設有兩個所述通 孔14。§然，所述邊緣區132及通孔14之數目並不限於 本實施例，可視實際使用情況設置。 ^所述金屬補強板11可採用鋼板、鋁板或其他高電導、 _ 阿熱導之金屬板，本實施例採用鋼板。所述金屬補強板η 之厚度fe圍為100-200微米，如此，可使所述電子元件貼 裝部10具有較高之機械強度承受各種加工工序，又不會明 顯增加所述電子元件貼裝部10之厚度，本實施例之金屬補 強板11厚度為150微米。 所述絕緣層12採用聚酰亞胺樹脂製備，聚酰亞胺樹脂 可製備微米級之纟巴緣層，且具有較佳之挽轉性、耐高溫性、 電絕緣性，本實施例之絕緣層12厚度為3〇微米左右。當 鲁 然，所述絕緣層12並不限於本實施例，可採用其他具有可 撓轉、耐高溫、電絕緣之薄膜材料製備絕緣層，並視使用 需求改變絕緣層厚度。 所述導電層13可採用銅箔、銀箔或金箱，本實施例採 用銅li。 請參閱圖2，所述金屬補強板11與所述絕緣層a、所 述絕緣層12與所述導電層13間採用可固化接著劑（圖未示) 接合。優選地，所述電子元件貼裝部10還包括一覆蓋於所 述導電層13上之保護層16，避免裸露所述導電層13，導 200841795 致所述電路區；[31受外邱你爾 又外口IM乍用而損壞。同樣， 16與所述導電層13可採 斤t保π層 保韻心 才木用所迷可固化接著劑接合。所迷 保5又層16開設有至少—個與所述通孔 161，以裸露出所述通孔14 輯應之開d 、札i4更優選地，所述開口 161之 直徑比所述通孔14之亩你士 、，、 又 省+a 仏大，以稞露所述通孔14邊緣之 ¥包層12形成焊盤ι41。如 ^ 如此，可增大所述焊接材料 與所述導電層13之焊桩而共扣 15 曰之㈣面積，保證所述導電層口與所埯 至屬補強板11間之電連通。The present invention relates to printed circuit board technology, and more particularly to a flexible electrical I board, a flexible circuit board processing method, and an electronic luxury having the flexible circuit board. ^ [Prior Art] Flexible Printed Circuit (FPC), also known as flexible circuit board or flexible circuit board, can be flexed and assembled in three-dimensional space, and has the advantages of being light, thin, short, and small. Widely used in a variety of electronic products, such as mobile phones, magnetic tablets and notebook computers. In order to facilitate the mounting of electronic components, the flexible circuit board has a reinforcing plate in the electronic component mounting portion to improve the mechanical strength of the electronic component mounting portion. If it is necessary to surprise the sub-component mounting part for anti-electromagnetic interference design, a bare copper area is formed at the edge of the electronic component mounting part, and the reinforcing plate is adhered to the electronic elementary piece mounting part with a bare copper area by using conductive adhesive. On the surface, the reinforcing plate is made of metal reinforcing plate. Thus, the bare copper region of the electronic component mounting portion is electrically connected to the metal reinforcing plate through the conductive paste. When using, ground the metal reinforcing plate to make the bare copper area electrically ground. The bare metal area on the edge of the metal reinforcing plate and the electronic component mounting part forms an electrostatic shielding cover around the electronic component mounting part, which can suppress the external electromagnetic source pair. Interference from the electronic re-installation department. In addition, the bare copper region, the conductive paste and the metal reinforcing plate can also serve as a heat dissipation channel for the electronic component mounting portion, and take away the heat generated by the electronic component mounting portion. ^ However, the design of anti-electromagnetic interference using conductive adhesive has the following problems: It is difficult to ensure that the bare copper area is in good contact with the metal reinforcing plate by the conductive adhesive. 7 200841795 • 2) The processing of the wooden circuit board needs to be returned. Welding furnaces solder electronic components, this process will lead to deterioration of the electrical conductivity and thermal conductivity of the electro-adhesive; 3) the short life of the conductive adhesive's conductivity and thermal conductivity deteriorate with time. In summary, the anti-electromagnetic interference of the flexible circuit board designed with anti-electromagnetic interference using conductive adhesive is unstable and unreliable. SUMMARY OF THE INVENTION In view of the above, the present invention provides a flexible circuit board having a reliable anti-electromagnetic interference capability, a flexible circuit board processing method, and an electronic device using the flexible circuit board. A flexible circuit board comprising at least one electronic component mounting portion. Each of the electronic component mounting portions includes a metal reinforcing plate, an insulating layer provided on the metal reinforcing plate, and a conductive layer provided on the insulating layer. The conductive layer includes a circuit region and an edge region surrounding the circuit region. The edge region is provided with at least one through hole through which the conductive layer and the insulating layer are filled with a solder material electrically connecting the conductive layer and the metal reinforcing plate. A flexible circuit board processing method comprising the steps of: combining a conductive layer and an insulating layer; forming a circuit region in the conductive layer and an edge region surrounding the circuit region; and opening at least one through the conductive layer in the edge region And a through hole of the insulating layer; ~ combining a metal reinforcing plate and the insulating layer; filling a soldering material into the through hole; 200841795 soldering the soldering material. An electronic device comprising a ground terminal and a flexible circuit board. The flexible circuit board includes at least one electronic component mounting portion. Each of the electronic component mounting portions includes a metal reinforcing plate, an insulating layer provided on the metal reinforcing plate, and a conductive layer disposed on the insulating layer. The conductive layer includes a circuit region and an edge region surrounding the circuit region. The edge region is provided with at least one through hole penetrating the conductive layer and the insulating layer. Each of the through holes is filled with a solder material electrically connecting the conductive layer and the metal reinforcing plate. The flexible circuit board stably and reliably electrically connects the edge region of the conductive layer and the metal reinforcing plate through the solder material, and in use, grounds the metal reinforcing plate, and the edge region and the metal reinforcement The grounded electrostatic shield formed by the board can provide stable anti-electromagnetic interference protection of the electronic component mounting portion. The flexible circuit board is applied to an electronic device to provide stable anti-electromagnetic interference protection of the electronic device. [Embodiment] Referring to Fig. 1, a flexible circuit board 1 according to a preferred embodiment of the present invention includes an electronic component mounting portion 1A and a flexible rotating portion 20 connected to the electronic component mounting portion 10. Each of the electronic component mounting portions 1 includes a metal reinforcing plate 11, an insulating layer 12 provided on the metal reinforcing plate n, and a conductive layer 13 provided on the insulating layer 12. The conductive layer 13 includes a circuit region 131 and an edge region 132 surrounding the circuit region 131. The circuit area 131 is formed with a plurality of pads (not shown) for mounting on the electronic component 30. The edge region 132 defines at least one through hole 14 penetrating the conductive layer 9 200841795 • 13 and the insulating layer 12 , and each through hole 14 is filled with electrically connecting the V private layer 13 and the metal reinforcing plate u Welding material b. . Specifically, the conductive layer 13 of the present embodiment includes two edge regions 132 surrounding the circuit region 131, and each of the edge regions 132 is provided with two through holes 14. The number of the edge regions 132 and the through holes 14 is not limited to this embodiment, and may be set according to actual use. ^ The metal reinforcing plate 11 can be made of a steel plate, an aluminum plate or other high-conductivity, _ a thermal conductive metal plate, and the steel plate is used in this embodiment. The thickness of the metal reinforcing plate η is 100-200 micrometers, so that the electronic component mounting portion 10 can have high mechanical strength to withstand various processing steps without significantly increasing the electronic component mounting. The thickness of the portion 10, the metal reinforcing plate 11 of the present embodiment has a thickness of 150 μm. The insulating layer 12 is prepared by using a polyimide resin, and the polyimide resin can prepare a micron-sized bar layer, and has better thermal conductivity, high temperature resistance and electrical insulation. The insulating layer of the embodiment 12 thickness is about 3 microns. When the insulating layer 12 is not limited to the embodiment, the insulating layer may be prepared by using other film materials having flexible, high temperature and electrical insulation, and the thickness of the insulating layer may be changed depending on the use requirements. The conductive layer 13 may be a copper foil, a silver foil or a gold box. In this embodiment, copper li is used. Referring to FIG. 2, the metal reinforcing plate 11 and the insulating layer a, the insulating layer 12 and the conductive layer 13 are joined by a curable adhesive (not shown). Preferably, the electronic component mounting portion 10 further includes a protective layer 16 overlying the conductive layer 13 to prevent the conductive layer 13 from being exposed, and the circuit region is led by 200841795; The external port IM is damaged and damaged. Similarly, the conductive layer 13 and the conductive layer 13 can be used to bond the SiC layer with the curable adhesive. The cover layer 5 is further provided with at least one of the through holes 161 to expose the through hole 14 , and the opening d 161 is more preferably the diameter of the opening 161 is larger than the through hole 14 acres of yours,,, and provinces + a large, to expose the edge of the through hole 14 of the layer 12 to form the pad ι41. If so, the welding material and the welding pile of the conductive layer 13 can be enlarged to share the area of (4), and the electrical connection between the conductive layer and the reinforced layer 11 can be ensured.
請參閱圖3，為較佳實施例之軟性電路板加 法之流程圖。所述紐電路板加4法包括以下步驟： Ρ1 :結合-個導電層12與一個絕緣層13; Ρ2在所述昏私層13形成電路區131及圍繞所述電 區131之邊緣區132 ; Ρ3:在邊緣區132開設至少一個貫穿所述導電層13 絕緣層12之通孔14 ; Ρ4 ·結合一個金屬補強板u與所述絕緣層12 ; P5 ·將一焊接材料15填充入所述通孔14 ; P6 :焊接所述燁接材料15，使所述導電層13與所述 金屬補強板11間形成可靠之電連接。 對於P1步驟，具體操作如下··在所述絕緣層12塗佈 所述可固化接著劑，並貼上所述導電層13，乾燥所述可固 化接著劑，將所述導電層13壓合於所述絕緣層Η上，固 化所述可固化接著劑，便可結合所述導電層12與所述絕緣 層13 〇 11 200841795 當然，pi步驟並不限於本實施例，可通過其他方式 現所述導電層12與所述絕緣層13之結合。Please refer to FIG. 3, which is a flow chart of a soft circuit board addition of the preferred embodiment. The circuit board adding method comprises the following steps: Ρ1: combining a conductive layer 12 and an insulating layer 13; Ρ2 forming a circuit area 131 and an edge area 132 surrounding the electric area 131 in the faint layer 13; Ρ3: opening at least one through hole 14 penetrating the insulating layer 12 of the conductive layer 13 in the edge region 132; Ρ4·bonding a metal reinforcing plate u and the insulating layer 12; P5·filling a solder material 15 into the pass Hole 14; P6: welding the splicing material 15 to form a reliable electrical connection between the conductive layer 13 and the metal reinforcing plate 11. For the step P1, the specific operation is as follows: coating the curable adhesive on the insulating layer 12, attaching the conductive layer 13, drying the curable adhesive, and pressing the conductive layer 13 to The insulating layer is cured, and the curable adhesive is cured to bond the conductive layer 12 and the insulating layer 13 4111 200841795. Of course, the pi step is not limited to the embodiment, and may be described by other means. The conductive layer 12 is combined with the insulating layer 13.
對曰於P2步驟，對所述導電層13進行幹膜麼合、圖樣 曝光 '顯像蝴，便可剌所述電路區131及絕緣區出。 優選地，在得到所述電路區131及絕緣區132後，應在所 逑導電層13上壓著所述保護層16。具體操作如下：在所 述導電層13上塗佈所述可固化接著劑，然後接著所述保護 層16，固化所述可固化接著劑，便可將所述保 著於所述導電層13上。 ^ 子於P3步驟，具體操作如下:在每個邊緣區132開設 至少-個貫穿所述保護層16之開口 161，然後，在每個^ 内開設所述通孔Μ。具體地，Ρ3步驟還需在所述保 w 16開設對應所述電路區131内焊盤之開口（圖未 :裸露所述電路區131内之焊盤供待组裝電子元件邓貼 X優選地，還應對裸露之焊盤進行表面處理，表面處理 =處、電一 ^ 板11及所述絕:層:。用了固化接德合所述金屬補強 轮；y驟可採用錫賞印刷機(Solder printer,圖未示） 开序以使所述導電層13與所述金屬補強板u間 戶二、十、I罪之電連接。將所述焊接材料15填入所述通孔14， 接2接材料15為錫膏。當然、，可採用其他設備將所述焊 接材料填人所述通孔14，所述焊接材料15可採用魏 12 200841795 具熔接能力之金屬材料。具體地，所述錫膏印刷機還同時 給所述電路區131之焊盤上錫，隨後進行一個電子元件貼 裝步驟，將電子元件30貼裝於所述電路區131之焊盤上， 可採用表面貼裝機(Surface Mounting Machine)貼裝待貼裝 電子元件30。For the step P2, the conductive layer 13 is subjected to dry film bonding, and the pattern is exposed to a 'development image', and the circuit region 131 and the insulating region can be extracted. Preferably, after the circuit region 131 and the insulating region 132 are obtained, the protective layer 16 is pressed against the conductive layer 13. The specific operation is as follows: coating the curable adhesive on the conductive layer 13, and then adhering to the protective layer 16, curing the curable adhesive, and retaining the protective layer 13 . ^ Sub-step P3, the specific operation is as follows: at least one opening 161 extending through the protective layer 16 is opened in each of the edge regions 132, and then the through-holes are opened in each of the holes. Specifically, the step Ρ3 also needs to open an opening corresponding to the pad in the circuit area 131 in the protection layer 16 (FIG.: the pad in the circuit area 131 is exposed for the electronic component to be assembled. The surface of the exposed pad should also be surface treated, surface treatment = place, electric plate 11 and the above: layer: use the metal reinforcement wheel of the curing joint; y can use the tin display printing machine ( Solder printer (not shown) is opened to electrically connect the conductive layer 13 and the metal reinforcing plate u. The solder material 15 is filled into the through hole 14 and connected. The bonding material 15 is a solder paste. Of course, the soldering material may be filled into the through hole 14 by using other equipment, and the soldering material 15 may be made of a metal material having the welding ability of Wei 12 200841795. Specifically, the The solder paste printer also applies tin to the pads of the circuit area 131, and then performs an electronic component mounting step to mount the electronic component 30 on the pads of the circuit area 131, and a surface mounter can be used. Surface Mounting Machine) Mounts electronic components 30 to be mounted.
對於P6步驟，可採用回焊爐(Reflow Solder)焊接所述 焊接材料15。優選地，所述柔性電路板加工方法還包括一 個清洗及檢測步驟，所述清洗及檢測步驟用於清洗所述柔 性電路板100並檢測其質量是否合格。所述清洗及檢測步 驟在所述柔性電路板100過回焊爐後進行。 請參閱圖4，為較佳實施例之電子裝置200之立體示 意圖。所述電子裝置200為一個翻蓋手機，其包括一個接 地知)40及所述柔性電路板。所述柔性電路板iq〇設置 於所述翻蓋手機内部，用於電性連接所述翻蓋手機可翻轉 之兩部分面板。所述金屬補強板n與所述接地端4〇電連 接0 所述柔性電路板100通過所述焊接材料15穩定、可靠 地電連接所述導電層13之邊緣區132與所述金屬補強板 11 ’使用時，將所述金屬補強板u接地，所述邊緣區 與所述金屬_板⑽叙接地靜電屏蔽罩可提供所述電 子元件貼裝部10穩定之抗電磁干擾保護。 綜上所述，本制確已符合發财件，爰依法 ”申請。惟，以上所述者僅為本發明之較佳實施方 式，舉凡熟悉本案技藝之人士，於援依本案發明精神所作 13 200841795 . 之等效修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明較佳實施例之柔性電路板之局部立體示意 圖； 圖2為圖1所示之柔性電路板沿ΙΙ-Π方向之剖面示意圖； 圖3為本發明較佳實施例之柔性電路板加工方法流程圖； 圖4為本發明較佳實施例之電子裝置之局部分解示意圖。 ^ 【主要组件符號說明】 柔性電路板 100 焊盤 141 電子元件貼裝部 10 焊接材料 15 金屬補強板 11 保護層 16 絕緣層 12 開口 161 導電層 13 可撓轉部 20 電路區 131 電子元件 30 邊緣區 132 電子裝置 200 通孔 14 接地端 40 14For the P6 step, the solder material 15 can be soldered using a Reflow Solder. Preferably, the flexible circuit board processing method further includes a cleaning and detecting step for cleaning the flexible circuit board 100 and detecting whether the quality is acceptable. The cleaning and detecting steps are performed after the flexible circuit board 100 has passed through the reflow oven. Please refer to FIG. 4, which is a perspective view of the electronic device 200 of the preferred embodiment. The electronic device 200 is a flip phone that includes a ground unit 40 and the flexible circuit board. The flexible circuit board iq is disposed inside the flip phone for electrically connecting the two parts of the flip phone. The metal reinforcing plate n is electrically connected to the grounding end 4〇. The flexible circuit board 100 is stably and reliably electrically connected to the edge region 132 of the conductive layer 13 and the metal reinforcing plate 11 through the soldering material 15. In use, the metal reinforcing plate u is grounded, and the edge region and the metal plate (10) are grounded to form an electrostatic shield to provide stable electromagnetic interference protection of the electronic component mounting portion 10. In summary, the system has indeed been in compliance with the issuance of money, and is applied according to law. However, the above is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are in the spirit of the invention. The equivalent modification or variation of the invention is to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial perspective view of a flexible circuit board according to a preferred embodiment of the present invention; FIG. 2 is a schematic view of FIG. 3 is a schematic cross-sectional view of a flexible circuit board in a ΙΙ-Π direction; FIG. 3 is a flow chart of a flexible circuit board processing method according to a preferred embodiment of the present invention; FIG. 4 is a partially exploded perspective view of the electronic device according to a preferred embodiment of the present invention. [Major component symbol description] Flexible circuit board 100 Pad 141 Electronic component mounting portion 10 Soldering material 15 Metal reinforcing plate 11 Protective layer 16 Insulating layer 12 Opening 161 Conducting layer 13 Flexible portion 20 Circuit area 131 Electronic component 30 Edge area 132 Electronic device 200 Through hole 14 Ground terminal 40 14