CN102087325B - Detection method for flexible circuit board - Google Patents
Detection method for flexible circuit board Download PDFInfo
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- CN102087325B CN102087325B CN 200910311001 CN200910311001A CN102087325B CN 102087325 B CN102087325 B CN 102087325B CN 200910311001 CN200910311001 CN 200910311001 CN 200910311001 A CN200910311001 A CN 200910311001A CN 102087325 B CN102087325 B CN 102087325B
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- circuit board
- flexible circuit
- test
- hole
- logging device
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Abstract
The invention discloses a detection method for a flexible circuit board, which comprises a step of providing an electrical test device and a flexible circuit board to be detected, wherein the electrical test device comprises a processor, an electrical test machine and at least one detection probe; the processor and at least one detection probe are connected with the electrical test machine; the flexible circuit board comprises a circuit board substrate and a covering layer which are stacked together; the circuit board substrate is provided with a first conductive layer close to the covering layer; the covering layer is provided with at least one test through hole so as to expose part of the first conductive layer; at least one test through hole corresponds to at least one detection probe and is used for threading at least one detection probe to conduct an electrical test; at least one detection probe of the electrical test machine is used for conducting the electrical test on at least one test through hole on the flexible circuit board from one side of the covering layer; and the processor judges whether a reinforcing plate of insulating material is attached to the place corresponding to at least one test through hole on the flexible circuit board according to the test result of the electrical test machine.
Description
Technical field
The present invention relates to the flexible circuit board detection technique, particularly a kind of method of the flexible circuit board for detection of having stiffening plate.
Background technology
Development along with collapsible electronic products such as folding cell phone and slide phones, flexible printed wiring board (Flexible Printed Circuit Board with light, thin, short, little and bent characteristics, FPCB) be widely used in the electronic product, to realize the electric connection between the different circuit.In order to obtain to have the FPCB of performance of better destroying or force to yield, the performance of destroying or force to yield of improving the used basal lamina material of FPCB becomes study hotspot.See also document Flectrical Insulation Maganize, Volume5, Issue 1, Jan.-Feb., 1989 Papers:15-23, " Applications of Polyimide Films tothe Electrical and Electronic Industries in Japan ".
For satisfying the design requirement of collapsible electronic product multifunction, be installed on the also corresponding increase of quantity of the electronic devices and components on FPCB surface.But, compare the FPCB with the performance of well destroying or force to yield with hard circuit board, physical strength is little, load-bearing capacity is low, and in use, during such as the middle mounting electronic device of surface mount process (Surface Mount Technology, SMT), FPCB easily chaps or is impaired, can't carry the electron device of larger quality or a greater number, hinder the development that realizes collapsible electronic product multifunction.For addressing this problem, a kind of method commonly used is to attach stiffening plate at the back side of electron device.After attaching stiffening plate, usually need to check whether to have to leak on the flexible circuit board and pasted stiffening plate.The modes of manual observation that adopt check flexible circuit board more at present, to filter out the flexible circuit board that has Lou pasted stiffening plate.The method not only consumes a large amount of manpowers, and easily makes mistakes, and is unfavorable for enhancing productivity.
Therefore, be necessary to provide a kind of method of the flexible circuit board for detection of having stiffening plate, to realize the robotization of board production, save human resources, enhance productivity.
Summary of the invention
A kind of detection method of flexible circuit board, comprise step: provide electric probe device and flexible circuit board to be detected, described electric probe device comprises a processor, an electric logging device and at least one detector probe, described processor and at least one detector probe all are connected in described electric logging device, described flexible circuit board comprises circuit board substrate and the overlayer that is stacked in together, described circuit board substrate has one near described tectal the first conductive layer, described overlayer has at least one test through hole, with described the first conductive layer of expose portion, described at least one test through hole is corresponding with described at least one detector probe, is used for passing to carry out testing electrical property for described at least one detector probe; Utilize at least one detector probe of described electric logging device from described overlayer one side at least one the test through hole on the described flexible circuit board to be carried out testing electrical property; Described processor judges according to the test result of described electric logging device at least one tests the stiffening plate whether through hole corresponding position is pasted with the insulation material on the described flexible circuit board, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when opening circuit, described at least one test through hole corresponding position is pasted with the stiffening plate of insulation material, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when being short circuit, described at least one test through hole corresponding position does not attach the stiffening plate of insulation material.
A kind of detection method of flexible circuit board, comprise step: provide electric probe device and flexible circuit board to be detected, described electric probe device comprises a processor, an electric logging device and at least one detector probe, described processor and at least one detector probe all are connected in described electric logging device, described flexible circuit board comprises circuit board substrate and overlayer, described circuit board substrate has near described tectal the first conductive layer, described overlayer has at least one test through hole, with expose portion the first conductive layer, described at least one test through hole is corresponding with described at least one detector probe, is used for passing to carry out testing electrical property for described at least one detector probe; Attach the stiffening plate of insulation material at described overlayer; Utilize at least one detector probe of described electric logging device from described stiffening plate one side at least one the test through hole on the described flexible circuit board to be carried out testing electrical property; Described processor judges according to the test result of described electric logging device whether at least one test through hole corresponding position is covered by stiffening plate on the described flexible circuit board, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when opening circuit, described at least one test through hole corresponding position is covered by stiffening plate, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when being short circuit, described at least one test through hole corresponding position is not covered by stiffening plate.
The detection method of the flexible circuit board that the technical program provides only need adopt common electric logging device, can when flexible circuit board is carried out testing electrical property, also carry out short circuit/out of circuit test at least one the test through hole corresponding position to this flexible circuit board, can detect the stiffening plate that whether is pasted with the insulation material on the overlayer.Flexible circuit board and the detection method thereof of using the technical program to provide are conducive to realize the robotization of board production, save human resources, enhance productivity.
Description of drawings
Fig. 1 is the structural representation of the flexible circuit board that provides of the technical program the first embodiment.
Fig. 2 is the decomposing schematic representation of the flexible circuit board that provides of the technical program the first embodiment.
Fig. 3 is that Fig. 1 is along the cut-open view of III-III line.
Fig. 4 is the schematic diagram that uses the detection method of the flexible circuit board that the technical program the first embodiment provides that flexible circuit board is detected.
Fig. 5 is the diagrammatic cross-section of using the detector probe of the electric logging device that the technical program the first embodiment provides that flexible circuit board is detected.
Fig. 6 is another schematic diagram that uses the detection method of the flexible circuit board that the technical program the first embodiment provides that flexible circuit board is detected.
Fig. 7 is another diagrammatic cross-section of using the detector probe of the electric logging device that the technical program the first embodiment provides that flexible circuit board is detected.
Fig. 8 is the schematic diagram that the flexible circuit board that the technical program the second embodiment provides is attached stiffening plate.
Fig. 9 is the schematic diagram that the electric probe device that uses the technical program the second embodiment to provide detects flexible circuit board.
Figure 10 is the vertical view of flexible circuit board when using the detection method of the flexible circuit board that the technical program the second embodiment provides that flexible circuit board is detected.
The main element symbol description
| |
10、40 |
| Electric probe device | 20、30 |
| |
11、41 |
| |
12、42 |
| |
13、43 |
| The first |
110、410 |
| The |
111 |
| The second |
112 |
| Mark | 113 |
| The test through |
120、420 |
| Processor | 21、31 |
| |
22、32 |
| |
23、33 |
| Board | 24、34 |
| Board to board connector | 25、35 |
| Base plate | 26、36 |
| Guide rail | 27、37 |
Embodiment
The detection method of the flexible circuit board that the technical program is provided below in conjunction with accompanying drawing and a plurality of embodiment is described in further detail.
See also Fig. 1 to Fig. 7, the detection method of the flexible circuit board that the technical program the first embodiment provides can may further comprise the steps:
The first step provides flexible circuit board 10 and electric probe device 20 to be detected.
See also Fig. 1 to Fig. 3, the flexible circuit board 10 that the technical program the first embodiment provides comprises circuit board substrate 11 and overlayer 12.Described overlayer 12 may be pasted with stiffening plate 13.In fact, production MR medium reinforcing plate 13 normally is attached on the described overlayer 12 in the mode of artificial attaching, thereby can obtain to have the flexible circuit board 10 of stiffening plate 13.Yet, during owing to manually-operated error being arranged, presumable flexible circuit board 10 has attached stiffening plate 13, and some flexible circuit boards 10 do not attach stiffening plate 13.Whether attached stiffening plate 13 therefore need to detect flexible circuit board 10 with electric probe device 20.Below, only take the flexible circuit board 10 that attached stiffening plate 13 as example, introduce the structure of flexible circuit board 10.
Described circuit board substrate 11 can be Double side soft circuit board or multi-layer soft circuit board.In the present embodiment, described circuit board substrate 11 is double-sided PCB, and it comprises and stacks gradually the first conductive layer 110, the first insulation course 111 and the second conductive layer 112.But described the first conductive layer 110 and the second conductive layer 112 equal Copper Foils, nickel foil, aluminium copper paper tinsel or other soft conductive materials.Can form the conducting wire in described the first conductive layer 110, have at least one mark 113 on it.Described at least one mark 113 is used to indicate the position that needs to attach stiffening plate 13 on the first conductive layer 110, and it can be arbitrary shape.Described mark 113 can form when forming circuit.In the present embodiment, described mark 113 is one, and it is for being formed at the circular groove of described the first conductive layer 110 by etching mode, and this groove runs through two relative surfaces of described the first conductive layer 110, thereby exposes part the first insulation course 111.Described the first insulation course 111 is polyimide, polyester, teflon or other soft insulating material.Also have at least one electrical measurement point (not shown) on described the first conductive layer 110, described at least one electrical measurement point can be solder joint.Also can form the conducting wire on described the second conductive layer 112, and can be used for installing the electron devices such as resistance, electric capacity with described at least one mark 113 corresponding position on it.
Described overlayer 12 is positioned at described circuit board substrate 11 near a side of the first conductive layer 110.Described overlayer 12 is used for described the first conductive layer 110 is played the effect of insulation protection; it can comprise the second insulation course (not shown) and the bonding coat (not shown) between described the first conductive layer 110 and described the second insulation course, and can be attached at by the mode of pressing described the first conductive layer 110.Offer at least one test through hole 120 in the described overlayer 12.Described at least one test through hole 120 is corresponding one by one with the position of described at least one mark 113, and each mark 113 all is not exposed to corresponding with it test through hole 120.In the present embodiment, described test through hole 120 is one, and it is positioned at the center of corresponding with it mark 113, and its radius is less than the radius-of-curvature of corresponding with it mark 113.
Described stiffening plate 13 is positioned at described overlayer 12 away from a side of the first conductive layer 110.Described stiffening plate 13 is the insulation material, and covers at least one test through hole 120 of described overlayer 12.The material of described stiffening plate 13 is optional from polyimide, polyethylene terephthalate and resin etc.Described stiffening plate 13 can directly be attached at least one test through hole 120 top of described overlayer 12.
See also Fig. 4, described electric probe device 20 comprises a processor 21, electric logging device 22, at least one detector probe 23 and at least one electrical measuring probe (not shown).Described processor 21, at least one detector probe 23 and at least one electrical measuring probe all are connected in described electric logging device 22.Described electric logging device 22 is used for flexible circuit board to be detected 10 is carried out testing electrical property, and each electrical measurement point is such as the size of the resistance value between solder joint, with conducting property and the insulativity of judging this circuit board in the same site that namely is electrically connected by testing circuit board.It comprises board 24 and board to board connector 25.Described board 24 comprises base plate 26 and guide rail 27.Described base plate 26 is used for carrying flexible circuit board to be detected 10.Described guide rail 27 is vertically connected at described base plate 26.Described board to board connector 25 is arranged at described guide rail 27 and can be along described guide rail 27 relative slidings, thus can near or move away from the direction of described flexible circuit board 10 to be detected.Described at least one detector probe 23 and the equal telescopically of at least one electrical measuring probe are arranged at described board to board connector 25.Described at least one detector probe 23 is used for testing electrical property is carried out at least one the through hole corresponding position on the described flexible circuit board, it is corresponding one by one with described at least one test through hole 120, and each detector probe 23 all can be passed corresponding with it test through hole 120.Described at least one electrical measuring probe be used for that at least one the electrical measurement point on the described flexible circuit board is carried out testing electrical property, its at least one electrical measurement point with described the first conductive layer 110 is corresponding one by one.In the present embodiment, described at least one detector probe 23 is one with the quantity of described at least one test through hole 120.Described processor 21 can be single-chip microcomputer, is used for judging the stiffening plate 13 that whether is pasted with the insulation material on the flexible circuit board according to the electrical measurement result of described electric logging device 22.In the present embodiment, described processor 21 is arranged at described board 24.
Second step utilizes at least one detector probe 23 of described electric logging device 22 from a side of described stiffening plate 13 testing electrical property to be carried out at least one test through hole 120 corresponding position on the described flexible circuit board 10.Particularly, can be first that the circuit board substrate 11 of described flexible circuit board 10 is relative with described base plate 26, be placed on the base plate 26 of described electric probe device 20.Then, make described board to board connector 25 along guide rail 27 to moving near flexible circuit board 10 directions, described at least one detector probe 23 is contacted with flexible circuit board 10 from a side of described overlayer 12, and 22 pairs of described flexible circuit boards 10 of described electric logging device carry out testing electrical property.Simultaneously, described at least one electrical measuring probe also contacts at least one the electrical measurement point on described the first conductive layer 110, described electric logging device 22 also detects the conducting wire that forms in described the first conductive layer 110, with conducting property and the insulativity of judging this circuit board conductive wire.
In the 3rd step, described processor 21 judges according to the test result of described electric logging device 22 whether at least one test through hole 120 corresponding position is covered by stiffening plate 13 on the described flexible circuit board 10.
Particularly, if the testing electrical property result of test through hole 120 corresponding positions on 22 pairs of described flexible circuit boards of described electric logging device is short circuit, illustrate that then detector probe 23 directly passes test through hole 120 and touch the first conductive layer 110 of circuit board substrate 11, this place is not covered by stiffening plate 13, and is extremely shown in Figure 5 such as Fig. 4.If the testing electrical property result of test through hole 120 corresponding positions on 22 pairs of described flexible circuit boards 10 of described electric logging device is for opening circuit, illustrate that then detector probe 23 touches the stiffening plate 13 of the insulation material that is attached at overlayer 12, be that described at least one test through hole 120 corresponding position are covered by stiffening plate 13, extremely shown in Figure 7 such as Fig. 6.
The detection method of the flexible circuit board that the technical program the second embodiment provides can be used for detecting the stiffening plate that whether is pasted with the insulation material on the flexible circuit board, if be pasted with the stiffening plate of insulation material, whether deflection is arranged.See also Fig. 8 to Figure 10, the detection method of the flexible circuit board that the second embodiment provides can comprise step:
The first step provides electric probe device 30 and flexible circuit board 40 to be detected.
The electric probe device 20 of described electric probe device 30 and the first embodiment is roughly the same, also comprises a processor 31, electric logging device 32, at least one detector probe 33 and at least one electrical measuring probe (not shown).Described processor 31, at least one detector probe 33 and at least one electrical measuring probe all are connected in described electric logging device 32.Described electric logging device 32 is used for flexible circuit board to be detected 40 is carried out testing electrical property, to judge the conducting property of this flexible circuit board 40.Described electric logging device 32 comprises board 34 and board to board connector 35.Described board 34 comprises base plate 36 and guide rail 37.Described base plate 36 is used for carrying flexible circuit board to be detected 40.Described guide rail 37 is vertically connected at described base plate 36.Described board to board connector 35 is arranged at described guide rail 37 and can be along described guide rail 37 relative slidings, thus can near or move away from the direction of described flexible circuit board 40 to be detected.Described at least one detector probe 33 and the equal telescopically of at least one electrical measuring probe are arranged at described board to board connector 35.Its difference is, at least one detector probe 33 of the electric probe device 30 of the present embodiment is four.Described flexible circuit board 40 only comprises circuit board substrate 41 and overlayer 42, and described circuit board substrate 41 has the first conductive layer 410 near described overlayer 42, and described overlayer 42 has at least one test through hole 420, with expose portion the first conductive layer 410.Described at least one test through hole 420 is corresponding with described at least one detector probe 33, also is four.Described at least one test through hole 420 becomes array to distribute at overlayer 42 centers, be used for passing to carry out testing electrical property for described at least one detector probe 33.
Second step is at the stiffening plate 43 of described overlayer 42 attaching insulation materials.
The material of described stiffening plate 43 is optional from polyimide, polyethylene terephthalate and resin etc.Can first described stiffening plate 43 be aimed at least one test through hole 420 of described overlayer 42, by the mode of hot pressing stiffening plate 43 is attached at again at least one test through hole 420 top of described overlayer 42, as shown in Figure 8.When stiffening plate 43 normal the attaching, each test through hole 420 is all covered by a drift angle of stiffening plate 43.
In the 3rd step, utilize at least one detector probe 33 of described electric logging device 32 from described stiffening plate 43 1 sides at least one the test through hole 420 on the described flexible circuit board 40 to be carried out testing electrical property.
Make described board to board connector 35 along guide rail to moving near flexible circuit board 40 directions, until each detector probe 33 all touches flexible circuit board 40.Because described at least one detector probe 33 telescopically are arranged at described board to board connector 35, when part detector probe 33 just touches flexible circuit board 40, the part detector probe 33 that has touched flexible circuit board 40 also can be compressed, thereby can continue mobile described board to board connector 35, until each detector probe 33 all touches described flexible circuit board 40 so that described flexible circuit board 40 is carried out testing electrical property, as shown in Figure 9.
The 4th step, described processor 31 judges according to the test result of described electric logging device 32 whether at least one test through hole 420 corresponding position is covered by stiffening plate 43 on the described flexible circuit board 40, when the testing electrical property result of at least one the test through hole 420 on 32 pairs of described flexible circuit boards 40 of described electric logging device when opening circuit, described at least one test through hole 420 corresponding position are covered by stiffening plate, when the testing electrical property result of at least one the test through hole on 32 pairs of described flexible circuit boards 40 of described electric logging device was short circuit, described at least one test through hole 420 corresponding position were not covered by stiffening plate 43.
During detection, if described electric logging device is short circuit to four on the described flexible circuit board 30 testing electrical property results that test through hole 320 corresponding positions, illustrate that then this place does not attach the stiffening plate 43 of insulation material.Described electric logging device is that partial short circuit, part open circuit to the testing electrical property result of four on the described flexible circuit board 30 test through hole 320 corresponding positions, deflection occurs in the stiffening plate 43 that the insulation material that this place attaches then is described, as shown in figure 10, the testing electrical property result of four test through hole 320 corresponding positions is that the short circuit of two places, Liang Chu open circuit.Described electric logging device is the testing electrical property result of a plurality of test through holes 320 corresponding positions on the described flexible circuit board 30 and opens circuit, and illustrates that then this place is pasted with the stiffening plate 43 of insulation material.
Be appreciated that in actual production process, when using the detection method of the flexible circuit board that the technical program provides, can attach first the stiffening plate of insulation material at the overlayer of described flexible circuit board, with electric logging device described flexible circuit board is tested again.
The detection method of the flexible circuit board that the technical program provides only need adopt common electric logging device, can when flexible circuit board is carried out testing electrical property, also carry out short circuit/out of circuit test at least one the through hole corresponding position to this flexible circuit board, can detect the stiffening plate that whether is pasted with the insulation material on the overlayer.Flexible circuit board and the detection method thereof of using the technical program to provide are conducive to realize the robotization of board production, save human resources, enhance productivity.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (10)
1. the detection method of a flexible circuit board comprises step:
Electric probe device and flexible circuit board to be detected are provided, described electric probe device comprises a processor, an electric logging device and at least one detector probe, described processor and at least one detector probe all are connected in described electric logging device, described flexible circuit board comprises circuit board substrate and the overlayer that is stacked in together, described circuit board substrate has one near described tectal the first conductive layer, described overlayer has at least one test through hole, with described the first conductive layer of expose portion, described at least one test through hole is corresponding with described at least one detector probe, is used for passing to carry out testing electrical property for described at least one detector probe;
Utilize at least one detector probe of described electric logging device from described overlayer one side at least one the test through hole on the described flexible circuit board to be carried out testing electrical property;
Described processor judges according to the test result of described electric logging device at least one tests the stiffening plate whether through hole corresponding position is pasted with the insulation material on the described flexible circuit board, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when opening circuit, described at least one test through hole corresponding position is pasted with the stiffening plate of insulation material, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when being short circuit, described at least one test through hole corresponding position does not attach the stiffening plate of insulation material.
2. the detection method of flexible circuit board as claimed in claim 1, it is characterized in that, described electric logging device also has at least one electrical measuring probe, described flexible circuit board also has and described at least one electrical measuring probe at least one electrical measurement point one to one, when at least one detector probe of utilizing described electric logging device is carried out testing electrical property at least one the test through hole corresponding position on the described flexible circuit board, described at least one electrical measuring probe also carries out testing electrical property at least one electrical measurement point of described flexible circuit board, to obtain the conducting property of circuit board.
3. the detection method of flexible circuit board as claimed in claim 1, it is characterized in that, described circuit board substrate also has away from described tectal the second conductive layer, is used for installing electronic elements with described at least one test through hole corresponding position on described the second conductive layer.
4. the detection method of flexible circuit board as claimed in claim 1, it is characterized in that, described electric logging device comprises base plate, guide rail and board to board connector, described base plate is used for carrying flexible circuit board to be detected, described guide rail is vertically connected at described base plate, described board to board connector is arranged at described guide rail and can slides with respect to described guide rail, described at least one detector probe is arranged at described board to board connector, utilize at least one detector probe of described electric logging device when described overlayer one side is carried out testing electrical property at least one the test through hole on the described flexible circuit board, comprise step:
Described flexible circuit board is placed the base plate of described electric logging device, make described overlayer near described board to board connector;
Make described board to board connector along guide rail to moving near the flexible circuit board direction, described at least one detector probe is contacted, so that described flexible circuit board is carried out testing electrical property with flexible circuit board.
5. the detection method of a flexible circuit board comprises step:
Electric probe device and flexible circuit board to be detected are provided, described electric probe device comprises a processor, an electric logging device and at least one detector probe, described processor and at least one detector probe all are connected in described electric logging device, described flexible circuit board comprises circuit board substrate and overlayer, described circuit board substrate has near described tectal the first conductive layer, described overlayer has at least one test through hole, with expose portion the first conductive layer, described at least one test through hole is corresponding with described at least one detector probe, is used for passing to carry out testing electrical property for described at least one detector probe;
Attach the stiffening plate of insulation material at described overlayer;
Utilize at least one detector probe of described electric logging device from described stiffening plate one side at least one the test through hole on the described flexible circuit board to be carried out testing electrical property;
Described processor judges according to the test result of described electric logging device whether at least one test through hole corresponding position is covered by stiffening plate on the described flexible circuit board, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when opening circuit, described at least one test through hole corresponding position is covered by stiffening plate, when described electric logging device to the testing electrical property result of at least one the test through hole on the described flexible circuit board when being short circuit, described at least one test through hole corresponding position is not covered by stiffening plate.
6. the detection method of flexible circuit board as claimed in claim 5, it is characterized in that, described electric logging device also has at least one electrical measuring probe, described flexible circuit board also has and described at least one electrical measuring probe at least one electrical measurement point one to one, when at least one detector probe of utilizing described electric logging device is carried out testing electrical property at least one the test through hole corresponding position on the described flexible circuit board, described at least one electrical measuring probe also carries out testing electrical property at least one electrical measurement point of described flexible circuit board, to obtain the conducting property of circuit board.
7. the detection method of flexible circuit board as claimed in claim 5, it is characterized in that, the first conductive layer of described circuit board substrate has at least one mark corresponding with described at least one test through hole, is used to indicate the position that needs to attach stiffening plate on described the first conductive layer.
8. the detection method of flexible circuit board as claimed in claim 5, it is characterized in that, described circuit board substrate also has away from described tectal the second conductive layer, is used for installing electronic elements with described at least one test through hole corresponding position on described the second conductive layer.
9. the detection method of flexible circuit board as claimed in claim 5, it is characterized in that, described at least one test through hole is a plurality of test through holes, when described electric logging device to the testing electrical property result of a plurality of test through holes corresponding position on the described flexible circuit board be partial short circuit, when part opens circuit, the stiffening plate generation deflection of the insulation material that this place attaches; When described electric logging device is when opening circuit the testing electrical property result of a plurality of test through holes corresponding position on the described flexible circuit board, deflection does not occur in the stiffening plate of the insulation material that this place attaches.
10. the detection method of flexible circuit board as claimed in claim 5, it is characterized in that, described electric logging device comprises base plate, guide rail and board to board connector, described base plate is used for carrying flexible circuit board to be detected, described guide rail is vertically connected at described base plate, described board to board connector is arranged at described guide rail and can slides with respect to described guide rail, described at least one detector probe is arranged at described board to board connector, utilize at least one detector probe of described electric logging device when described overlayer one side is carried out testing electrical property at least one the test through hole on the described flexible circuit board, comprise step:
Described flexible circuit board is placed the base plate of described electric logging device, make described overlayer near described board to board connector;
Make described board to board connector along guide rail to moving near the flexible circuit board direction, described at least one detector probe is contacted, so that described flexible circuit board is carried out testing electrical property with flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910311001 CN102087325B (en) | 2009-12-07 | 2009-12-07 | Detection method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910311001 CN102087325B (en) | 2009-12-07 | 2009-12-07 | Detection method for flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN102087325A CN102087325A (en) | 2011-06-08 |
| CN102087325B true CN102087325B (en) | 2013-01-09 |
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| CN 200910311001 Expired - Fee Related CN102087325B (en) | 2009-12-07 | 2009-12-07 | Detection method for flexible circuit board |
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| CN115184654A (en) * | 2022-07-20 | 2022-10-14 | 燕麦(杭州)智能制造有限公司 | Test pin die, test method, and storage medium |
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| US5654528A (en) * | 1994-11-24 | 1997-08-05 | Fuji Photo Optical Co., Ltd. | Flexible printed circuit |
| CN1548971A (en) * | 2003-05-16 | 2004-11-24 | 统宝光电股份有限公司 | Method for testing flexible circuit board connection qualification and flexible circuit board with testing pad |
| CN101242711A (en) * | 2007-02-01 | 2008-08-13 | 松下电器产业株式会社 | Test mark structure, substrate sheet laminate and design method thereof, multilayered circuit substrate, and method for inspecting lamination matching precision of the multilayered circuit substrate |
| TW200841795A (en) * | 2007-04-10 | 2008-10-16 | Hon Hai Prec Ind Co Ltd | Flexible printed circuit, manufacture method of same and electronic device with same |
-
2009
- 2009-12-07 CN CN 200910311001 patent/CN102087325B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5654528A (en) * | 1994-11-24 | 1997-08-05 | Fuji Photo Optical Co., Ltd. | Flexible printed circuit |
| CN1548971A (en) * | 2003-05-16 | 2004-11-24 | 统宝光电股份有限公司 | Method for testing flexible circuit board connection qualification and flexible circuit board with testing pad |
| CN101242711A (en) * | 2007-02-01 | 2008-08-13 | 松下电器产业株式会社 | Test mark structure, substrate sheet laminate and design method thereof, multilayered circuit substrate, and method for inspecting lamination matching precision of the multilayered circuit substrate |
| TW200841795A (en) * | 2007-04-10 | 2008-10-16 | Hon Hai Prec Ind Co Ltd | Flexible printed circuit, manufacture method of same and electronic device with same |
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|---|---|
| CN102087325A (en) | 2011-06-08 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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