CN102548219B - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
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- CN102548219B CN102548219B CN201010606543.XA CN201010606543A CN102548219B CN 102548219 B CN102548219 B CN 102548219B CN 201010606543 A CN201010606543 A CN 201010606543A CN 102548219 B CN102548219 B CN 102548219B
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- Prior art keywords
- detection
- ink
- line segment
- conducting line
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000001514 detection method Methods 0.000 claims abstract description 122
- 239000010410 layer Substances 0.000 claims abstract description 36
- 239000011241 protective layer Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 26
- 239000000523 sample Substances 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 6
- 238000010422 painting Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
The invention relates to a circuit board manufacturing method which comprises the following steps of: providing a circuit substrate, wherein the circuit substrate is provided with a conductive pattern layer and an insulating protective layer for protecting the conductive pattern layer and comprises a product zone and a marginal zone which are connected, the conductive pattern layer of the product zone comprises at least two conductive terminals, the insulating protective layer of the product zone is provided with at least two through holes, and the at least two conductive terminals are respectively exposed in the at least two through holes; arranging conductive ink on the surface of the insulating protective layer so as to form an ink structure in the product zone and an ink detection structure on the surface of the insulating protective layer in the marginal zone, wherein the ink structure is electrically connected with the at least two conductive terminals, and the ink detection structure comprises a detection lead with constant width; and carrying out electric detection on the conductive pattern layer in the product zone, and detecting the resistance value of the detection lead, so as to judge whether the ink structure formed in the product zone is qualified according to the resistance value of the detection lead.
Description
Technical field
The present invention relates to circuit board making technology, particularly a kind of manufacture method of circuit board of enhancing productivity.
Background technology
Along with scientific and technical progress, the application widely that printed circuit board (PCB) obtains at electronic applications.Application about circuit board refers to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans.on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.And the electronic products such as computer, mobile phone are being played the part of more and more important effect in people's daily life and automated production.The control of computer, mobile phone etc. and data input are mainly realized by button, and as can be seen here, the importance of button circuit board is indubitable.
Button circuit board surface is almost booked by key contacts, tends to occur that the contact that need to be connected together cannot be by the phenomenon that wiring realization connects on the conductive copper layer of circuit board.For solving problems, there is a kind of jumper, that is, first on the conductive copper layer of circuit board, increase insulating barrier, make the contact that need to be connected together be exposed to this insulating barrier, then on this insulating barrier, increase cabling rete to realize the connection of contact.Form after cabling rete, conventionally can form the cover layer of one deck for shielding thereon.The thickness of cabling rete is directly connected to the mechanical performance of key contacts and the quality of the conduction property between key contacts.Conventionally adopt its square resistance R
shwhether the thickness of weighing cabling rete meets the requirements.Therefore,, after forming cabling rete, need to test the square resistance of cabling rete.Square resistance R
shthe ratio that equals resistivity and thicknesses of layers, is ρ/T.A kind of existing method of measuring square resistance be after forming cabling rete, on cabling rete, form cover layer before, adopt FOUR-POINT PROBE METER to test.So, must purchase special instrument, and increase special testing procedure, waste a large amount of manpower and materials, be unfavorable for enhancing productivity.
Summary of the invention
The technical program provides a kind of manufacture method of circuit board, with cost-saving, enhance productivity.
A kind of manufacture method of circuit board, comprise step: provide circuit substrate, described circuit substrate has conductive pattern layer and for the protection of the insulating protective layer of described conductive pattern layer, described circuit board substrate comprises product zone and the marginal zone being connected, the conductive pattern layer of described product zone comprises at least two conducting terminals, the insulating protective layer of described product zone has at least two through holes, described in described at least two conducting terminals are exposed to respectively at least two through holes; On described insulating protective layer surface, electrically conductive ink is set, to form ink structure in described product zone, insulating protective layer surface in described marginal zone forms ink detection architecture, at least two conducting terminals described in described ink structure is electrically connected to, described ink detection architecture comprises the detection wire of constant width; And the conductive pattern layer of product zone is carried out to electrical detection, and detect to detect the resistance value of wire, to judge that according to the resistance value that detects wire whether be formed at the ink structure of product zone qualified.
The manufacture method of the circuit board that the technical program provides forms and comprises that width detects the ink detection architecture of wire uniformly in marginal zone when product zone makes ink structure.Whether within the specific limits the resistance value of the detection wire recording by judgement, can learn that whether ink detection architecture is qualified, and then learns that whether the ink structure of product zone is qualified.Use the manufacture method of the circuit board of the technical program, without special detecting instrument, can carry out with the electrical measurement process of circuit board simultaneously, be conducive to cost-saving, enhance productivity.
Accompanying drawing explanation
Fig. 1 is the structural representation of the circuit substrate that provides of the technical program the first embodiment.
Fig. 2 applies the structural representation after electrically conductive ink on foregoing circuit substrate.
Fig. 3 is that Fig. 2 is along the phantom of III-III line.
Fig. 4 carries out the structural representation of electrical detection to foregoing circuit substrate.
Fig. 5 arranges the structural representation after electrically conductive ink on the circuit substrate that provides of the technical program the second embodiment.
Fig. 6 is that Fig. 5 is along the phantom of VI-VI line.
Fig. 7 is the vertical view of ink detection architecture.
Main element symbol description
Product zone 101,201
Marginal zone 102,202
Basalis 11
Conducting terminal 120
Wire 121
Insulating protective layer 13,23
Through hole 130
Ink structure 140,240
Ink detection architecture 141,241
Ink terminal 142
Connecting line 143
Detection terminal 144,244
Detect wire 145,245
First detects conducting line segment 246
Connect and detect conducting line segment 247
Second detects conducting line segment 248
Embodiment
The manufacture method of circuit board the technical program being provided below in conjunction with accompanying drawing and a plurality of embodiment is described in further detail.
The technical program the first embodiment provides a kind of manufacture method of circuit board, and it comprises the following steps:
The first step, refers to Fig. 1, and circuit substrate 10 is provided.Described circuit substrate 10 can be cuboid plate, and it comprises the 101He marginal zone, product zone 102 being connected.In the present embodiment, described product zone 101 is positioned at circuit substrate 10 middle parts, and its shape of cross section is rectangle, and described marginal zone 102 is around being connected in around product zone 101, ringwise.
Described circuit substrate 10 is one side copper-clad base plate, and it comprises basalis 11, conductive pattern layer 12 and the insulating protective layer 13 stacking gradually.Basalis 11 can only comprise a layer insulating, also can comprise at least one sandwich circuit layer and at least one layer insulating of alternative arrangement.In the present embodiment, circuit substrate 10 is one side copper-clad base plate, and basalis 11 only comprises a layer insulating.
The conductive pattern layer 12 of described product zone 101 comprises at least two conducting terminals 120 and at least one wire 121.In the present embodiment, described conductive pattern layer 12 comprises two conducting terminals 120 and three wires 121.Described two conducting terminals 120 are intervally arranged.Described three wires 121 be arranged in parallel, and between described two conducting terminals 120.Certainly, for the circuit board product of different model, described conductive pattern layer 12 can be also correspondingly other structures.Certainly, it will be understood by those skilled in the art that the quantity of conducting terminal 120, wire 121 is not limit, the concrete formation of conductive pattern layer 12 is not limit yet, and conductive pattern layer 12 can also comprise the structures such as other pad, edge connector or All other routes.Fig. 1 is only the structure that schematically illustrates conductive pattern layer 12.
Described insulating protective layer 13 is for the protection of described conductive pattern layer 12.The insulating protective layer 13 of described product zone 101 covers the wire 121 of described conductive pattern layer 12 and fills the space of described conductive pattern layer 12, and exposes conducting terminal 120.Described insulating protective layer 13 offers at least two through holes 130, and described at least two through holes 130 are corresponding one by one with described at least two conducting terminals 120, described in described at least two conducting terminals 120 are exposed to respectively at least two through holes 130.
Second step, on described insulating protective layer 13 surfaces, electrically conductive ink is set, to form ink structure 140 in described product zone 101, in the ink detection architecture 141 of at least two conducting terminals 120 described in the insulating protective layer 13 surface formation electrical connections of described marginal zone 102, thereby obtain structure as shown in Figure 2.
Described electrically conductive ink can be carbon ink, and ink structure 140 and ink detection architecture 141 can be formed at by the mode of screen painting or coating described insulating protective layer 13.In the present embodiment, ink structure 140 and ink detection architecture 141 are all formed at described insulating protective layer 13 surfaces by screen painting.
Described ink structure 140 comprises at least two ink terminals 142 and at least one connecting line 143.Described at least two ink terminals 142 are corresponding one by one with described at least two conducting terminals 120.The shape of described ink terminal 142 is corresponding with the shape of described conducting terminal 120, and each ink terminal 142 is all filled in a corresponding through hole 130 of described insulating protective layer 13.Each connecting line 143 is all connected between two ink terminals 142.Certainly, with the structure of conductive pattern layer 12 accordingly, for the circuit board product of different model, described ink structure 140 can be also other structures.The quantity that it will be understood by those skilled in the art that ink terminal 142 and connecting line 143 is not limit, and the concrete formation of ink structure 140 is not limit yet.Fig. 2 is only the structure that schematically illustrates ink structure 140.In the present embodiment, with the structure of described conductive pattern layer 12 accordingly, the quantity of described ink terminal 142 is also two, and the quantity of connecting line 143 is only one.
See also Fig. 2 and Fig. 3, described ink detection architecture 141 comprises two detection terminals 144 and a detection wire 145.Detect the constant width of wire 145.Described two detection terminals 144 are connected in the two ends of described detection wire 145.If the length of described detection wire 145 is L, width is W, and length-width ratio N is L/W.In the present embodiment, each detection terminal 144 is cuboid, and described detection wire 145 is strip.When printing forms ink detection architecture 141, by the design to web plate, make the length of each detection terminal 144 be 1.2 millimeters, width is 0.6 millimeter.Described detection wire 145 is connected between two adjacent long limits of described two detection terminals 144.The length L of described detection wire 145 is 20 millimeters, and width W is 0.4 millimeter, and described length-width ratio N is 50.In the present embodiment, the live width of the live width of described detection wire 145 and the connecting line of product zone 143 is unequal.Certainly, the live width of described detection wire 145 also can equal the live width of connecting line 143.
Certainly, after forming ink structure 140 and ink detection architecture 141, can also form the protective layer that covers described ink structure 140 in described product zone 101.
The 3rd step, refer to Fig. 4, conductive pattern layer 12 to described circuit substrate 10 product zone 101 is carried out electrical detection, and the resistance value of the detection wire 145 in Edge detected district 102, and judges that according to the resistance value that detects wire 145 whether be formed at the ink structure 140 of product zone 101 qualified.
Particularly, can take following steps:
First, provide electric logging device 100, it comprises two detector probe 103 and a controller 104.Described two detector probe 103 are corresponding one by one with described two detection terminals 144.
Certainly, electric logging device 100 can also comprise other detector probe of carrying out electrical detection for the product zone 101 to circuit substrate 10.When described electric logging device 100 detects the resistance value of 144 of above-mentioned two detection terminals, also the conductive pattern layer 12 of circuit substrate 10 product zone 101 is carried out to electrical detection.
Secondly, make respectively two detector probe 103 and the corresponding contact of described two detection terminals 144, detect the resistance value R of described detection wire 145.
Whether the ink structure 140 that finally, described controller 104 is formed at product zone 101 according to the resistance value judgement that detects wire 145 is qualified.
The square resistance of supposing described detection wire 145 is R
sh, and regulation square resistance R
shvalue be greater than minimum square resistance R
sh1, and be less than largest block resistance R
sh2time, the detection wire 145 of formation meets the requirements.According to the law of resistance, resistance R=ρ * L/ (T*W)=L*R
sh/ W.For the ink detection architecture 141 of the present embodiment, owing to detecting the width of the length of wire 145 much larger than detection terminal 144, therefore ignore the resistance of detection terminal 144.104 pairs of testing results of controller are analyzed, when the resistance value R recording is greater than L*R
sh1/ W and be less than L*R
sh2during/W, judge the square resistance R of ink detection architecture 141
shwithin the limits prescribed.In the present embodiment, described length-width ratio N is 50, and the minimum square resistance R setting
sh1be 17 ohm of every sides, largest block resistance R
sh2be 20 ohm of every sides.That is to say, in the present embodiment, the resistance value R recording at 850 ohm within the scope of 1000 ohm, the square resistance R of ink detection architecture 141
shwithin the limits prescribed, thus explanation judges that the thickness of ink detection architecture 141 is qualified.Because ink detection architecture 141 and the ink structure 140 of product zone 101 adopt same technique, in same step, form, also qualified thereby explanation is positioned at the ink structure 140 of product zone 101.
The manufacture method of the circuit board that the technical program the first embodiment provides when product zone 101 makes ink structures 140 in marginal zone the 102 ink detection architecture 141 that form the detection wire 145 that comprises constant width.Whether the resistance value R that only needs the detection wire 145 that records of judgement in certain limit, can learn that whether ink detection architecture 141 is qualified, and then learn that whether the ink structure 140 of product zone is qualified.Use the manufacture method of the circuit board that the technical program the first embodiment provides, without special detecting instrument, can carry out with the electrical measurement process of circuit board simultaneously, be conducive to cost-saving, enhance productivity.
See also Fig. 5 to Fig. 7, the manufacture method of the circuit board that the technical program the second embodiment provides and the first embodiment's is roughly the same, also comprises step:
The first step, provides to comprise product zone 201 and around the circuit substrate 20 that is connected in the marginal zone 202 of described product zone 201.
Second step, arranges electrically conductive ink on insulating protective layer 23 surfaces, to form ink structure 240 in described product zone 201, on insulating protective layer 23 surfaces of described marginal zone 202, forms ink detection architecture 241, obtains structure as shown in Figure 5.
Different from the first embodiment, in described ink detection architecture 241, described detection wire 245 is a broken line, and it comprises that the first detection conducting line segment 246, the connection that are connected successively detect conducting line segment 247 and second and detect conducting line segment 248.A detection terminal 244 is connected in the first detection conducting line segment 246, and another detection terminal 244 is connected in the second detection conducting line segment 248.Described connection detects between conducting line segment 247 and the first detection conducting line segment 246 has angle.Described second detects conducting line segment 248 also has angle with described connection between detection conducting line segment 247.In the present embodiment, it is parallel that described the second detection conducting line segment 248 and first detects conducting line segment 246, connects detection conducting line segment 247 and be vertically connected between the second detection conducting line segment 248 and the first detection conducting line segment 246.Described the first detection conducting line segment 246 and the second detection conducting line segment 248 are all connected in and are connected the same side of detecting conducting line segment 247.That is to say, described connection detects conducting line segment 247 and the first angle detecting between conducting line segment 246 is 90 degree.Described the second detection conducting line segment 248 is also 90 degree with the described angle being connected between detection conducting line segment 247.In the present embodiment, described first detects conducting line segment 246, connection detection conducting line segment 247 and the second width that detects conducting line segment 248 is 0.4 millimeter.First detects the length L of conducting line segment 246
1be 8 millimeters, described connection detects the length L of conducting line segment 247
cbe 4 millimeters, described second detects the length L of conducting line segment 248
2it is 8 millimeters.The total length L of described detection wire 245
t=L
1+ L
c+ L
2, being also 20 millimeters, width W is 0.4 millimeter, described length-width ratio N is still 50.
The 3rd step, carries out electrical detection to described circuit substrate 20, the resistance value of the ink detection architecture 241 in Edge detected district 202, and whether the ink structure 240 that described controller 104 is formed at product zone 201 according to the testing result judgement of ink detection architecture 241 is qualified.
Regulation square resistance R
shvalue be greater than minimum square resistance R
sh1, and be less than largest block resistance R
sh2time, the detection wire 245 of formation meets the requirements.According to the law of resistance, resistance R=ρ * L
t/ (T*W)=(L
1+ L
c+ L
2) * R
sh/ W.When the resistance value R recording is greater than (L
1+ L
c+ L
2) * R
sh1/ W and be less than (L
1+ L
c+ L
2) * R
sh2during/W, represent the square resistance R of ink detection architecture 241
shqualified.Although the structure of the detection wire 245 in the present embodiment is different from the detection wire 145 of the first embodiment, but be still 50 owing to detecting the length-width ratio N of wire 245, when 104 pairs of testing results of described controller are analyzed, still when the resistance value R recording is within the scope of 850 ohm to 1000 ohm, the square resistance Rsh that judges ink detection architecture 241 is qualified, thereby the thickness of explanation ink detection architecture 241 is qualified.
The manufacture method of the circuit board that the technical program the second embodiment provides 202 forms ink detection architecture 241 in marginal zone when product zone 201 makes ink structures 240.The detection wire 245 of the present embodiment is a broken line, is conducive to improve the space availability ratio of marginal zone 202.
Be appreciated that, it is 50 that the length-width ratio N of described detection wire is not limited to, the shape of described detection wire is not limited to as structures such as straight line or broken lines, can also be other structures such as curve, zigzag, can do corresponding design according to the shape size in the available space, marginal zone of circuit substrate, only need its width W everywhere to equate.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (10)
1. a manufacture method for circuit board, comprises step:
Circuit substrate is provided, described circuit substrate has conductive pattern layer and for the protection of the insulating protective layer of described conductive pattern layer, described circuit board substrate comprises product zone and the marginal zone being connected, the conductive pattern layer of described product zone comprises at least two conducting terminals, the insulating protective layer of described product zone has at least two through holes, described in described at least two conducting terminals are exposed to respectively at least two through holes;
On described insulating protective layer surface, electrically conductive ink is set, to form ink structure in described product zone, insulating protective layer surface in described marginal zone forms ink detection architecture, at least two conducting terminals described in described ink structure is electrically connected to, described ink detection architecture comprises the detection wire of constant width; And
The conductive pattern layer of product zone is carried out to electrical detection, and detect the resistance value of wire, to judge that according to the resistance value that detects wire whether the thickness of the ink structure that is formed at product zone is qualified.
2. the manufacture method of circuit board as claimed in claim 1, is characterized in that, described ink structure and ink detection architecture are all formed at described circuit substrate by the mode of screen painting or coating.
3. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, described ink structure comprises at least two ink terminals and at least one connecting line, described in described at least two ink terminals lay respectively at least two through holes, be connected with described at least two conducting terminals respectively, described at least one connecting line is formed at insulating protective layer surface, and described in being connected between at least two ink terminals.
4. the manufacture method of circuit board as claimed in claim 1, is characterized in that, described detection wire is straight line.
5. the manufacture method of circuit board as claimed in claim 4, it is characterized in that, when the resistance value of described detection wire is greater than L*Rsh1/W, and while being less than L*Rsh2/W, the ink structure that judgement is formed at product zone is qualified, wherein, Rsh1 is minimum square resistance, Rsh2 is largest block resistance, and W is the width of described detection wire, and L is the length of described detection wire.
6. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, described detection wire comprises that the first detection conducting line segment, the connection that are connected successively detect conducting line segment and second and detect conducting line segment, the described first width that detects conducting line segment, connection detection conducting line segment and the second detection conducting line segment equates, described connection detects between conducting line segment and the first detection conducting line segment has angle, and described second detects conducting line segment also has angle with described connection between detection conducting line segment.
7. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, described the first detection conducting line segment and the second detection conducting line segment are all connected in and are connected the same side of detecting conducting line segment, described connection detects conducting line segment and the first angle detecting between conducting line segment is 90 degree, and described the second detection conducting line segment is also 90 degree with the described angle being connected between detection conducting line segment.
8. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, when the resistance value of described detection wire is greater than (L1+LC+L2) * Rsh1/W, and while being less than (L1+LC+L2) * Rsh2/W, the ink structure that judgement is formed at product zone is qualified, wherein, Rsh1 is minimum square resistance, Rsh2 is largest block resistance, W is the width of described detection wire, L1 is the length of described the first detection conducting line segment, and LC is the length that described connection detects conducting line segment, and L2 is the length of described the second detection conducting line segment.
9. the manufacture method of circuit board as claimed in claim 1, is characterized in that, when described ink detection architecture comprises two detection terminals that are connected to described detection wire two ends, described circuit substrate is carried out to electrical detection, comprises step:
Electric logging device is provided, and it comprises two detector probe and controller, and described two detector probe are corresponding one by one with described two detection terminals;
Make respectively two detector probe and the corresponding contact of described two detection terminals, detect the resistance value of described detection wire; And
Described controller judges that according to above-mentioned testing result whether the thickness of the ink structure that is formed at product zone is qualified.
10. the manufacture method of circuit board as claimed in claim 1, is characterized in that, after forming ink structure and ink detection architecture, before described circuit substrate is carried out to electrical detection, forms the protective layer that covers described ink structure in described product zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010606543.XA CN102548219B (en) | 2010-12-28 | 2010-12-28 | Circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010606543.XA CN102548219B (en) | 2010-12-28 | 2010-12-28 | Circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102548219A CN102548219A (en) | 2012-07-04 |
| CN102548219B true CN102548219B (en) | 2014-04-09 |
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|---|---|---|---|
| CN201010606543.XA Expired - Fee Related CN102548219B (en) | 2010-12-28 | 2010-12-28 | Circuit board manufacturing method |
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| CN (1) | CN102548219B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111272830A (en) * | 2020-02-27 | 2020-06-12 | 成都飞机工业（集团）有限责任公司 | Method for detecting surface treatment quality of composite material |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102892253B (en) * | 2012-09-27 | 2015-12-02 | 大连太平洋电子有限公司 | A kind of conduction, insulation ink circuit board processing method |
| CN103901275A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Pressure sensing type conductive ink resistance value tester |
| CN104619114A (en) * | 2015-02-15 | 2015-05-13 | 歌尔声学股份有限公司 | PCB (printed circuit board) with embedded resistors and embedded resistor test method |
| CN111505059A (en) * | 2020-03-25 | 2020-08-07 | 上海玖银电子科技有限公司 | Silver paste detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100695A (en) * | 1988-11-30 | 1992-03-31 | Nippon Cmk Corp. | Method of manufacturing a printed circuit board |
| US6378978B1 (en) * | 2000-03-15 | 2002-04-30 | Industrial Technology Research Institute | Chip structure of inkjet printhead and method of estimating working life through detection of defects |
| CN101363884A (en) * | 2007-08-10 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Method for testing circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135623A (en) * | 2006-11-29 | 2008-06-12 | Toppan Printing Co Ltd | Wiring board, and its manufacturing method |
-
2010
- 2010-12-28 CN CN201010606543.XA patent/CN102548219B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5100695A (en) * | 1988-11-30 | 1992-03-31 | Nippon Cmk Corp. | Method of manufacturing a printed circuit board |
| US6378978B1 (en) * | 2000-03-15 | 2002-04-30 | Industrial Technology Research Institute | Chip structure of inkjet printhead and method of estimating working life through detection of defects |
| CN101363884A (en) * | 2007-08-10 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Method for testing circuit board |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2008-135623A 2008.06.12 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111272830A (en) * | 2020-02-27 | 2020-06-12 | 成都飞机工业（集团）有限责任公司 | Method for detecting surface treatment quality of composite material |
| CN111272830B (en) * | 2020-02-27 | 2021-06-08 | 成都飞机工业（集团）有限责任公司 | Method for detecting surface treatment quality of composite material |
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|---|---|
| CN102548219A (en) | 2012-07-04 |
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