CN102595767B - Circuit board structure of mobile electronic product and manufacturing method thereof - Google Patents
Circuit board structure of mobile electronic product and manufacturing method thereof Download PDFInfo
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- CN102595767B CN102595767B CN201110006823.1A CN201110006823A CN102595767B CN 102595767 B CN102595767 B CN 102595767B CN 201110006823 A CN201110006823 A CN 201110006823A CN 102595767 B CN102595767 B CN 102595767B
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- circuit board
- flexible circuit
- electronic products
- portable electronic
- copper
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Abstract
The invention relates to a circuit board structure of a mobile electronic product and a manufacturing method thereof. The circuit board structure structurally comprises a flexible circuit board and a heat dissipating unit. In the manufacturing process of the circuit board structure, a first insulating layer is laminated with a copper layer; a circuit layout zone is formed on the copper layer; a second insulating layer is adhered onto the circuit layout zone, so that connecting interfaces and contact points are respectively formed at both ends of the circuit layout zone; a perforated hole is arranged between the contact points to form the flexible circuit board; a bump is arranged on a copper material to form the heat dissipating unit; the bump is correspondingly arranged in the perforated hole; a third insulating layer is arranged between the first insulating layer and the heat dissipating unit; and finally, a projection mechanism is electrically connected with the contact points and the bottom surface of the projection mechanism is contacted with the bump. Therefore, the requirements for thinning and bending can be met, so that the circuit board structure is easy to assemble in an inner space of the mobile electronic product and the requirement of according with the assembly of various mobile electronic products is met.
Description
Technical field
The present invention has about a kind of circuit board structure of mobile electronic product and preparation method thereof, espespecially one can make flexible circuit board, heat-sink unit slimming and bent design, and then be easy to the inner space being assembled in portable electronic products, and reach the effect that can meet various portable electronic products and carry out assembling.
Background technology
The board structure of circuit 4 (as Figure 12) of general portable electronic products, it is electrically connected at projector mechanism 42 on hard circuit board 41 by a hard circuit board 41, one and a connecting interface 43 be electrically connected on hard circuit board 41 formed; By this, this projection structure 4 can be made to be incorporated into portable electronic products inside and to be electrically connected, and allow portable electronic products utilize this projection structure 4 to produce the effect of projection.
But because this connecting interface 43 has a predetermined height, therefore after this connecting interface 43 is located on hard circuit board 41, then projection structure 4 can be made cannot to reach the design of slimming because of connecting interface 43, and cannot be bent due to the hard circuit board 41 of this projection structure 4, therefore, when this projection structure 4 is assembled in the inner space of portable electronic products, normal meeting produces with the inner space of portable electronic products because of protruding connecting interface 43 to be interfered, and also for this inner space, hard circuit board 41 cannot be bent, cause the mechanism design must changing portable electronic products housing during actual use, and cause the puzzlement in actual use.
Summary of the invention
Main purpose of the present invention is, provides a kind of slimming and bent circuit board structure of mobile electronic product and preparation method thereof, makes this circuit board be easy to be assembled in the inner space of portable electronic products, and meets various portable electronic products assembling needs.
For reaching above-mentioned purpose, a kind of circuit board structure of mobile electronic product of system of the present invention, it comprises a flexible circuit board and a heat-sink unit, the one side of this flexible circuit board has a circuit layout district, the one end in this circuit layout district has connecting interface, the other end has corresponding contact, has the perforation that runs through this flexible circuit board between each contact; The one side of this flexible circuit board utilize contact to be electrically connected with projector mechanism, be characterized in, described heat-sink unit have a pedestal and be located at pedestal one side on projection, this pedestal and flexible circuit board are fitted, this projection is corresponding and extend in perforation with perforation, and the height of this projection is consistent with the surface of flexible circuit board, and this heat-sink unit area is less than this flexible circuit board, and the bump contact of the bottom surface of this projector mechanism and heat-sink unit.
In one embodiment of the invention, this flexible circuit board includes layers of copper, the second insulating barrier and be located in layers of copper that one first insulating barrier, is located in the first insulating barrier one side and is located at the 3rd insulating barrier between the first insulating barrier and heat-sink unit, and described circuit layout district is located in the one side of layers of copper, and this second insulating barrier sticks in circuit layout district.
In one embodiment of the invention, this flexible circuit board system is the tabular of a long strip type.
In one embodiment of the invention, this flexible circuit board system can be bent, and is provided with a stiffening plate below its connecting interface.
In one embodiment of the invention, this flexible circuit board is the tabular of a L-type.
In one embodiment of the invention, this heat-sink unit can be a copper material and makes.
In one embodiment of the invention, this projector mechanism can be LED component or OLED assembly.
And circuit board structure of mobile electronic product manufacture method of the present invention includes the following step:
Step one: by one first insulating barrier and layers of copper pressing in addition;
Step 2: formation one circuit layout district in the one side of this layers of copper;
Step 3: paste one second insulating barrier in the circuit layout district of layers of copper, make the one end in this circuit layout district be formed with connecting interface, the other end has corresponding contact;
Step 4: punching sets out a perforation between each contact again, use formation one flexible circuit board, and this perforation runs through this flexible circuit board;
Step 5: get a copper material, and in the one side of this copper material formation one projection, use formation one heat-sink unit;
Step 6: the projection correspondence of this heat-sink unit one side is located in the perforation of flexible circuit board, and the height of this projection is consistent with the surface of flexible circuit board, and one the 3rd insulating barrier is set between the first insulating barrier and heat-sink unit; And
Step 7: the one side finally again a projector mechanism being located at flexible circuit board is electrically connected with contact, and makes bottom surface and the bump contact of this projector mechanism.
In an embodiment of circuit board manufacturing method of the present invention, this circuit layout district forms in the one side of this layers of copper with etching mode.
In an embodiment of circuit board manufacturing method of the present invention, this flexible circuit board system is the tabular of a long strip type.
In an embodiment of circuit board manufacturing method of the present invention, this flexible circuit board system can utilize the ductility of layers of copper to be bent, and can be provided with a stiffening plate under its connecting interface.
In an embodiment of circuit board manufacturing method of the present invention, this flexible circuit board system is the tabular of a L-type.
In an embodiment of board structure of circuit manufacture method of the present invention, this projector mechanism is LED component or OLED assembly.
Compared with prior art, the beneficial effect that the present invention has is: the present invention adopts flexible circuit board, and directly form connecting interface in the one end in circuit layout district, the other end forms contact, also make heat-sink unit consistent with the height of flexible circuit board, so not only achieve the needs of portable electronic products circuit board thin type, utilize the bent characteristic of flexible circuit board in addition simultaneously, the inner space being assembled in portable electronic products can be easy to when the present invention is used, can not produce with the inner space of portable electronic products and interfere, use the mechanism design not needing to change portable electronic products housing, and meet various portable electronic products assembling needs, more can, when projector mechanism operates, heat-sink unit be utilized to dispel the heat.
Accompanying drawing explanation
Fig. 1 system schematic appearance of the present invention.
The schematic diagram of Fig. 2 system step one of the present invention.
The schematic diagram of Fig. 3 system step 2 of the present invention.
The schematic diagram of Fig. 4 system step 3 of the present invention.
The schematic diagram of Fig. 5 system step 4 of the present invention.
The schematic diagram of Fig. 6 system step 5 of the present invention.
The schematic diagram of Fig. 7 system step 6 of the present invention.
The schematic diagram of Fig. 8 system step 7 of the present invention.
The side-looking view of Fig. 9 system step 7 of the present invention.
Figure 10 system another using state schematic diagram of the present invention.
The schematic appearance of Figure 11 system another embodiment of the present invention.
Figure 12 system schematic appearance.
Label declaration:
Flexible circuit board 1,1a; First insulating barrier 11;
Layers of copper 12; Circuit layout district 13;
Connecting interface 131; Contact 132;
Stiffening plate 133; Second insulating barrier 14;
Perforation 15; Heat-sink unit 2;
Pedestal 21; Projection 22;
Projector mechanism 3; Projection structure 4;
Hard circuit board 41; Projector mechanism 42;
Connecting interface 43.
Embodiment
Referring to shown in Fig. 1 ~ Fig. 9, is the side-looking view being respectively schematic appearance of the present invention, the schematic diagram of step one of the present invention, the schematic diagram of step 2 of the present invention, the schematic diagram of step 3 of the present invention, the schematic diagram of step 4 of the present invention, the schematic diagram of step 5 of the present invention, the schematic diagram of step 6 of the present invention, the schematic diagram of step 7 of the present invention and step 7 of the present invention.As shown in the figure: flexible circuit board structure of a kind of portable electronic products of system of the present invention and preparation method thereof, its structure at least comprise flexible circuit board 1, heat-sink unit 2 and a projector mechanism 3 form (as shown in Figure 1).
And this projection structure manufacture method, include the following step:
Step one: by one first insulating barrier 11 and layers of copper 12 pressing (as shown in Figure 2) in addition.
Step 2: form a circuit layout district 13 (as shown in Figure 3) with etching mode in the one side of this layers of copper 12.
Step 3: paste one second insulating barrier 14 in a circuit layout district 13 of layers of copper 12, make the one end in this circuit layout district 13 be formed with connecting interface 131, the other end has corresponding contact 132 (as shown in Figure 4).
Step 4: punching sets out a perforation 15 between each contact 132 again, use formation one flexible circuit board 1, and this perforation 15 runs through this flexible circuit board 1, an and stiffening plate 133 can be provided with for 131 times in this connecting interface, and the tabular (as shown in Figure 5) of this flexible circuit board 1 in a long strip type.
Step 5: the pedestal 21 getting a copper material, and in the one side of this pedestal 21 formation one projection 22, use formation one heat-sink unit 2, and the area of this heat-sink unit 2 is less than this flexible circuit board 1 (as shown in Figure 6).
Step 6: projection 22 correspondence of this heat-sink unit 2 one side is located in the perforation 15 of flexible circuit board 1, and after making projection 22 be located at perforation 15, the height of this projection 22 is consistent with the surface of flexible circuit board 1, and be no more than flexible circuit board 1, and one the 3rd insulating barrier 16 (as shown in Figures 7 and 8) is set between the first insulating barrier 11 and heat-sink unit 2.
Step 7: the one side finally again a projector mechanism 3 being located at flexible circuit board 1 is electrically connected with contact 132, and the bottom surface of this projector mechanism 3 is contacted (as shown in Figure 9) with the projection 22 of heat-sink unit 2, and this projector mechanism 3 can be LED component or OLED assembly.
So, above step can form the flexible circuit board structure that a portable electronic products has heat-sink unit, the cooperation of flexible circuit board 1, heat-sink unit 2 and projector mechanism 3 can be utilized and form the design (and not having protrusion improperly) of slimming, the inner space being assembled in portable electronic products (not shown) can be easy to when allowing the present invention use, and can not produce with the inner space of portable electronic products and interfere, use the mechanism design not needing to change portable electronic products housing, and meet various portable electronic products assembling needs; More can, when projector mechanism 3 operates, heat-sink unit 2 be utilized to dispel the heat.
Referring to shown in Figure 10, is another using state schematic diagram of the present invention.As shown in the figure: when the present invention uses in reality, this flexible circuit board 1 can be made to utilize the ductility of layers of copper 12 to be bent, and make the bent design of this flexible circuit board 1 can be easy to be assembled in the inner space of portable electronic products (not shown), and can not produce with the inner space of portable electronic products and interfere, use the mechanism design not needing to change portable electronic products housing, and reach the effect that can meet the assembling of various portable electronic products.
Referring to shown in Figure 11, is the schematic appearance of another embodiment of the present invention.As shown in the figure: flexible circuit board 1 of the present invention is except can be the tabular of a long strip type, more can be the configuration of the present embodiment, and its difference is, this flexible circuit board 1a is the tabular of a L-type, so, system can be easy to the inner space being assembled in portable electronic products (not shown) when the present invention can be allowed to use, and can not produce with the inner space of portable electronic products and interfere, and this flexible circuit board 1a also can be made to be bent, use the mechanism design not needing to change portable electronic products housing, and reach and can meet various portable electronic products and assemble effect.
In sum, portable electronic products flexible circuit board structure with heat-sink unit of the present invention and preparation method thereof effectively can improve various shortcoming, the slimming of flexible circuit board, heat-sink unit and bent design can be made, and then be easy to the inner space being assembled in portable electronic products, and reach the effect that can meet various portable electronic products and carry out assembling.
Claims (6)
1. a portable electronic products circuit board manufacturing method, is characterized in that including the following step:
Step one: by one first insulating barrier and layers of copper pressing in addition;
Step 2: formation one circuit layout district in the one side of this layers of copper;
Step 3: paste one second insulating barrier in the circuit layout district of layers of copper, make the one end in this circuit layout district be formed with connecting interface, the other end has corresponding contact;
Step 4: punching sets out a perforation between each contact again, use formation one flexible circuit board, and this perforation runs through this flexible circuit board;
Step 5: the pedestal getting a copper material, and in the one side of this pedestal formation one projection, use formation one heat-sink unit;
Step 6: the projection correspondence of this heat-sink unit one side is located in the perforation of flexible circuit board, and the height of this projection is consistent with the surface of flexible circuit board, and one the 3rd insulating barrier is set between the first insulating barrier and heat-sink unit; And
Step 7: the one side finally again a projector mechanism being located at flexible circuit board is electrically connected with contact, and makes bottom surface and the bump contact of this projector mechanism.
2. portable electronic products circuit board manufacturing method according to claim 1, is characterized in that, this circuit layout district forms in the one side of this layers of copper with etching mode.
3. portable electronic products circuit board manufacturing method according to claim 1, is characterized in that, this flexible circuit board is the tabular of a long strip type.
4. portable electronic products circuit board manufacturing method according to claim 1, is characterized in that, this flexible circuit board can utilize the ductility fold-type in addition of layers of copper, and is provided with a stiffening plate below its connecting interface.
5. portable electronic products circuit board manufacturing method according to claim 1, is characterized in that, this flexible circuit board is the tabular in a L-type.
6. portable electronic products circuit board manufacturing method according to claim 1, is characterized in that, this projector mechanism is LED component or OLED assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110006823.1A CN102595767B (en) | 2011-01-13 | 2011-01-13 | Circuit board structure of mobile electronic product and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110006823.1A CN102595767B (en) | 2011-01-13 | 2011-01-13 | Circuit board structure of mobile electronic product and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102595767A CN102595767A (en) | 2012-07-18 |
| CN102595767B true CN102595767B (en) | 2015-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110006823.1A Expired - Fee Related CN102595767B (en) | 2011-01-13 | 2011-01-13 | Circuit board structure of mobile electronic product and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN102595767B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348215A (en) * | 2000-10-05 | 2002-05-08 | 三洋电机株式会社 | Radiating base plate and semiconductor module |
| CN2730078Y (en) * | 2004-07-22 | 2005-09-28 | 嘉联益科技股份有限公司 | Compound multi-layer flexible circuit board structure |
| CN100471375C (en) * | 2004-11-24 | 2009-03-18 | 乐金电子(中国)研究开发中心有限公司 | Mobile communication terminal with double organic luminescent display units |
| WO2009094829A1 (en) * | 2008-01-07 | 2009-08-06 | Jie She | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly |
| CN100574554C (en) * | 2007-04-10 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10229255A (en) * | 1997-02-14 | 1998-08-25 | Iwaki Electron Corp Ltd | Flexible printed board with flat plate |
| CN1225789C (en) * | 2002-12-30 | 2005-11-02 | 扬明光学股份有限公司 | Optical valve heat radiator |
-
2011
- 2011-01-13 CN CN201110006823.1A patent/CN102595767B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348215A (en) * | 2000-10-05 | 2002-05-08 | 三洋电机株式会社 | Radiating base plate and semiconductor module |
| CN2730078Y (en) * | 2004-07-22 | 2005-09-28 | 嘉联益科技股份有限公司 | Compound multi-layer flexible circuit board structure |
| CN100471375C (en) * | 2004-11-24 | 2009-03-18 | 乐金电子(中国)研究开发中心有限公司 | Mobile communication terminal with double organic luminescent display units |
| CN100574554C (en) * | 2007-04-10 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
| WO2009094829A1 (en) * | 2008-01-07 | 2009-08-06 | Jie She | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly |
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| Publication number | Publication date |
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| CN102595767A (en) | 2012-07-18 |
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Granted publication date: 20150722 Termination date: 20170113 |