CN111475064B - Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device - Google Patents

Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device Download PDF

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Publication number
CN111475064B
CN111475064B CN202010306084.7A CN202010306084A CN111475064B CN 111475064 B CN111475064 B CN 111475064B CN 202010306084 A CN202010306084 A CN 202010306084A CN 111475064 B CN111475064 B CN 111475064B
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transparent
induction
coil
transparent conductive
conductive film
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CN111475064A (en
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陈运燊
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Shenzhen Honghe Innovation Information Technology Co Ltd
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Shenzhen Honghe Innovation Information Technology Co Ltd
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Priority to PCT/CN2020/112247 priority patent/WO2021208325A1/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display

Abstract

The application discloses a transparent coil plate, a manufacturing method of the transparent coil plate, a transparent electromagnetic induction plate and display equipment. The manufacturing method comprises the steps of processing a conductive layer of a transparent conductive substrate into a plurality of sections of first transparent induction lines which are arranged in parallel; forming a plurality of through holes on the transparent conductive film; attaching a transparent conductive film on a transparent conductive substrate, processing the conductive layer of the transparent conductive film into a plurality of sections of second transparent induction lines which are arranged in parallel, and sequentially corresponding the head and tail adjacent ends of the first transparent induction lines and the second transparent induction lines; and forming conductive fillers in the through holes to electrically connect the adjacent ends of the first transparent induction line and the second transparent induction line in the head and tail directions to form a complete spiral coil loop. The manufacturing method provided by the application has the advantages that the requirements on process equipment are simple, a copper deposition process is not needed, and the efficiency is high; and the finally formed transparent electromagnetic induction plate can be placed at the front end of the display screen, so that the interference of the display screen is reduced when the electromagnetic pen touches the display screen.

Description

Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device
Technical Field
The application relates to the technical field of touch display equipment, in particular to a transparent coil plate and a manufacturing method thereof, a transparent electromagnetic induction plate and display equipment.
Background
At present, the intelligent interactive display equipment in the market is more and more in variety, wherein an electromagnetic induction plate is a handwriting plate technology which is generally adopted at present. The principle is that the position of a pen point with a coil is induced to work by forming an electromagnetic field in a certain space range after a circuit is energized in direction X, Y formed by wiring below the handwriting board. The technology is widely used at present, is mainly determined by good performance, can write smoothly and has good hand feeling.
The basic principle of an electromagnetic screen is to recognize a slide by the change of a magnetic field generated by an inductor under a panel and during the operation of an electromagnetic pen.
At present, the induction coil manufactured by an electromagnetic induction board is formed by making a first induction line and a second induction line which are discontinuous on two sides of a PET substrate, punching holes at the head end and the tail end of the discontinuous induction lines to form through holes, filling a conductive substance in the through holes, and connecting the induction lines on the two sides of the substrate, so as to form a complete induction coil; according to the traditional manufacturing process, the induction lines with two discontinuous surfaces need to be connected, the punching process is required to be fine, and the equipment requirement is high; meanwhile, because the thickness of the substrate is relatively thick, the manufacturing efficiency is low when the copper is deposited and filled.
In addition, because the induction line of the used PET board of traditional preparation electromagnetic induction board technology's both sides is also non-transparent metal wire, this induction zone that just causes the electromagnetic induction board can have a large amount of metal wires and metal overlap joint for the induction zone visibility of electromagnetic induction board is poor, and the whole thick weight that also can not place at the display screen front end of electromagnetic induction board, therefore traditional electromagnetic induction board is usually put at the display screen at the back. Because the display screen is separated between the electromagnetic induction plate and the electromagnetic pen, the electromagnetic induction can be interfered by the display screen, and the induction effect is poor.
Disclosure of Invention
In order to overcome the problems in the related art, an embodiment of the present application provides a method for manufacturing a transparent coil plate, including:
processing a conductive layer of a transparent conductive substrate into a plurality of sections of first transparent induction lines which are arranged in parallel;
forming a plurality of through holes on the transparent conductive film;
attaching the transparent conductive film on the transparent conductive substrate, wherein an insulating layer of the transparent conductive film is adjacent to a conductive layer of the transparent conductive substrate, and the plurality of via holes correspond to the head and tail positions of the first transparent induction line;
processing the conductive layer of the transparent conductive film into a plurality of sections of second transparent induction lines which are arranged in parallel, wherein the head and tail positions of the plurality of sections of second transparent induction lines correspond to the plurality of via holes, and the adjacent ends of the first transparent induction lines and the second transparent induction lines sequentially correspond to form a spiral coil-shaped structure;
And forming conductive fillers in the through holes, so that the end-to-end adjacent ends of the first transparent induction line and the second transparent induction line are electrically connected to form a complete spiral coil loop.
Optionally, the conductive layer of the transparent conductive substrate is an indium tin oxide film or a silver nanowire film formed on the transparent substrate.
Optionally, the transparent conductive film has a thickness of 5 um.
Optionally, the transparent conductive film is a transfer type transparent conductive film; after the conductive layer of the transparent conductive film is processed into a plurality of sections of second transparent induction lines which are arranged in parallel, the method further comprises the following steps:
and curing the transfer printing type transparent conductive film.
Optionally, the conductive filler is conductive silver paste.
Optionally, the conductive filler is formed in the via hole by a printing process.
The embodiment of the application also provides a manufacturing method of the transparent electromagnetic induction plate, which comprises the following steps:
bonding two transparent coil plates manufactured by the method, wherein the coil directions of the two transparent coil plates are vertical to each other;
and respectively and electrically connecting the wiring ends of the two transparent coil plates to the corresponding flexible circuit boards.
The embodiment of the present application further provides a transparent coil plate, including: the touch screen comprises a transparent conductive substrate, a transparent conductive film attached on a conductive layer of the transparent conductive substrate, a plurality of sections of first transparent induction lines which are arranged in parallel and formed by the conductive layer of the transparent conductive substrate, and a plurality of sections of second transparent induction lines which are arranged in parallel and formed by the conductive layer of the transparent conductive film, wherein an insulating layer of the transparent conductive film is adjacent to the conductive layer of the transparent conductive substrate;
The transparent conductive film is provided with a plurality of via holes, and the head and tail positions of the first transparent induction line and the head and tail positions of the second transparent induction line correspond to the via holes to form a spiral coil-shaped structure;
conductive fillers are arranged in the through holes, and the conductive fillers enable the end-to-end adjacent ends of the first transparent induction line and the second transparent induction line to be electrically connected to form a complete spiral coil loop.
The embodiment of the application also provides a transparent electromagnetic induction plate which comprises two transparent coil plates; the two transparent coil plates are mutually attached, the coil directions of the two transparent coil plates are mutually vertical, and the wiring ends of the two transparent coil plates are respectively and electrically connected to the corresponding flexible circuit boards.
The embodiment of the application further provides a display device, which comprises a display screen and the transparent electromagnetic induction plate, wherein the transparent electromagnetic induction plate is arranged at the front end of the display screen.
Compared with the prior art, the method has the following beneficial technical effects:
according to the coil plate manufacturing method, induction lines do not need to be arranged on two sides of the PET substrate, only the transparent conductive film needs to be attached to the other conductive substrate, and the requirements of process equipment are simple; meanwhile, because the thickness of the transparent conductive film is very small, the via hole is shallow, the via hole can be directly filled with conductive metal through a printing process, a copper deposition process is not needed, and the efficiency is greatly improved.
The electromagnetic induction board that transparent coil plate formed of this application preparation can be placed at the display screen front end for during the touch-control of electromagnetic pen, reduced the interference of display screen, induced magnetic field changes more excellently.
The induction zone of the electromagnetic induction board that the transparent coil plate of this application preparation formed only leaves over partial metal overlap joint, and the transparent visibility of electromagnetic induction board is good, promotes user experience.
Drawings
Fig. 1 is a schematic front view of a conventional electromagnetic induction board;
FIG. 2 is a schematic side sectional view of a conventional electromagnetic induction board;
fig. 3-12 are schematic views illustrating a manufacturing process of the transparent coil plate provided in the present application;
FIG. 13 is a flow chart of a method of making a transparent coil plate provided herein;
fig. 14 is a schematic structural diagram of a transparent electromagnetic induction plate in an embodiment provided in the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
FIG. 1 is a schematic front view of an electromagnetic induction board; FIG. 2 is a side cross-sectional structural view of a conventional electromagnetic induction board; as shown in fig. 1 and 2, currently, in the manufacture of an induction coil of an electromagnetic induction board, a first induction line 12 and a second induction line 13 are formed intermittently on two sides of a substrate 15, holes are formed at the head and tail ends of each intermittent induction line to form a through hole 11, and then a conductive material 14 is filled in the through hole 11 to connect the induction lines on the two sides of the substrate, so as to form a complete induction coil;
because the used base plate of traditional electromagnetic induction board is thick PET board generally, and the induction line on the two sides of base plate also is non-transparent wire, this induction zone that just causes electromagnetic induction board can have a large amount of wire and metal overlap joint, makes electromagnetic induction board's induction zone visibility poor, and electromagnetic induction board is whole also thick heavy, can not place at the display screen front end, therefore traditional electromagnetic induction board is usually put at the display screen at the back. And because the display screen is separated between the electromagnetic induction board and the electromagnetic pen, the electromagnetic induction can be interfered by the display screen, and the induction effect is not good.
The application aims to solve the technical problem, and a light, thin and transparent electromagnetic induction plate which can be arranged at the front end of a display screen is manufactured.
The technical solution of the present application will be explained with reference to specific embodiments.
Example one
Fig. 13 is a flowchart of a method for manufacturing a transparent coil plate in an embodiment provided in the present application, and fig. 3 to 12 are schematic diagrams of a manufacturing process of a transparent coil plate in an embodiment provided in the present application, and as shown in fig. 3 to 13, the manufacturing method includes:
s101, referring to fig. 3 and 4, processing the conductive layer of the transparent conductive substrate 21 into a plurality of first transparent sensing lines 211 arranged in parallel;
s102, referring to fig. 5 and 6, forming a plurality of via holes 221 on the transparent conductive film 22;
s103, referring to fig. 7 and 8, attaching the transparent conductive film 22 on the transparent conductive substrate 21, wherein the insulating layer 223 of the transparent conductive film 22 is adjacent to the conductive layer of the transparent conductive substrate 21, and the via holes 221 correspond to the head and tail positions of the first transparent sensing line 211;
s104, referring to fig. 9 and 10, processing the conductive layer 222 of the transparent conductive film 22 into a plurality of second transparent sensing lines 226 arranged in parallel, wherein the head and tail positions of the plurality of second transparent sensing lines 226 correspond to the plurality of via holes 221, and the head and tail abutting ends of the first transparent sensing line 211 and the second transparent sensing line 226 sequentially correspond to each other, so as to form a spiral coil-shaped structure;
S105, referring to fig. 11 and 12, forming a conductive filler 23 in the via holes 221, so that the end-to-end adjacent ends of the first transparent induction line 211 and the second transparent induction line 226 are electrically connected to form a complete spiral coil loop.
In step S101, the conductive layer of the transparent conductive substrate 21 may be a conductive transparent thin film material such as an Indium Tin Oxide (ITO) thin film, a nano silver wire (snw) thin film, and the forming process of the conductive layer may be selected according to the characteristics of the adopted conductive thin film, for example, an Indium Tin Oxide (ITO) thin film may be sputtered on a PET substrate to form a transparent conductive substrate; the transparent conductive substrate 21 on which the conductive layer has been formed may be used as it is; the formation process of the conductive layer of the transparent conductive substrate 21 is not particularly limited here.
Correspondingly, the forming process of the first transparent sensing line 211 can also be selected according to the specific processing characteristics of the used conductive layer, for example, an Indium Tin Oxide (ITO) conductive film adopts an etching process when forming the first transparent sensing line 211, a nano silver wire (snw) film adopts a laser process when forming the first transparent sensing line 211, and the like, and the specific processing process of the first transparent sensing line 211 is not limited herein;
Therefore, the first transparent sensing line 211 is formed by removing an excess portion of the conductive layer of the transparent conductive substrate.
In addition, the first and the last ends of the first transparent sensing line 211 are formed as the overlapping area, so that the subsequent overlapping process between the two sensing lines is facilitated.
In one embodiment, in step S102, the transparent conductive film 22 is a transfer type transparent conductive film (TCTF), one side of which is a dry film, and the other side of which is a transparent conductive layer, which can be directly attached to other substrates without using OCA optical adhesive, and is itself a film, and has a small overall thickness, and the transparent conductive layer thereon can be processed to form a transparent conductive pattern, so that the transfer type transparent conductive film can be used to effectively reduce the overall thickness of the transparent coil plate and to achieve the insulation and isolation between the transparent induction lines on both sides of the transparent coil plate.
When the via hole 221 is formed on the transparent conductive film 22, the via hole 221 may be formed on the transparent conductive film 22 by selecting a laser process; and the via hole 221 corresponds to the head and tail positions of the first transparent induction line 211, so that the electrical connection between the induction lines on the two sides can be realized after the conductive filler 23 is formed in the via hole 221.
Since the transparent conductive film 22 is adhered with the first protective film 225 and the second protective film 224 on the upper and lower surfaces thereof respectively before use, the second protective film 224 should be removed when the transparent conductive film 22 is adhered on the transparent conductive substrate 21, and the insulating surface of the transfer type transparent conductive film 22 should be adjacent to the first transparent sensing line 211 on the transparent conductive substrate 21 when the transparent conductive film is adhered, so that the first transparent sensing line 211 and the second transparent sensing line 226 are isolated from each other.
When the transparent conductive film 22 is a transfer-printing type transparent conductive film, since the transfer-printing type transparent conductive film is a dry film, and UV light needs to be avoided before curing, the conductive layer 222 of the transparent conductive film 22 in step 104 may be processed by a yellow light process, i.e., by attaching → exposing → developing → etching to finally form a plurality of second transparent sensing lines 226 arranged in parallel; in addition, before the step 104 is performed, the remaining first protective film 225 is removed.
Therefore, the second transparent sensing line 226 is a conductive pattern structure formed by removing an excess portion of the conductive layer 222 of the transparent conductive film 22.
In step S105, the conductive filler 23 may be, for example, a filling material with a conductive property, such as conductive silver paste, and during filling, care should be taken to ensure that after filling, the adjacent ends of the first transparent sensing line 211 and the second transparent sensing line 226 are electrically connected, that is, two ends of the conductive filler 23 are respectively in contact with the corresponding first transparent sensing line 211 and the second transparent sensing line 226.
When the transparent conductive film 22 is a transfer type transparent conductive film, after the processing of the conductive layer of the transparent conductive film 22 into a plurality of sections of second transparent sensing lines 226 arranged in parallel, the method further includes: and curing the transfer-printing type transparent conductive film.
Since the transfer type transparent conductive film is a negative photoresist film, after being attached to the transparent conductive substrate 21 and processed into the second transparent sensing line 226, it can be completely cured by irradiating UV light.
In one implementation, in order to facilitate the formation of the via hole and the printing of the conductive object such as the conductive silver paste, the thickness of the transfer-printing type transparent conductive film should be moderate, for example, the thickness of the transfer-printing type transparent conductive film may be selected to be 5 um.
In summary, in the manufacturing method of the transparent coil plate provided by the embodiment, only the transparent conductive film needs to be attached to the other conductive substrate, and the requirements of process equipment are simple; meanwhile, because the transparent conductive film has small thickness and shallow via holes, the via holes can be directly filled with conductive metal through a printing process without a copper deposition process, and the efficiency is greatly improved; the transparent coil plate manufactured by the embodiment is light and thin, only the conductive structures in the through holes are visible in the induction area, and the rest induction coil parts are transparent structures, so that the electromagnetic induction plate manufactured by the transparent coil plate can be placed at the front end of the display screen, the interference of the display screen is reduced when an electromagnetic pen touches the display screen, and the change of an induction magnetic field is more excellent; and only leave over some metal overlap joint in window district, the transparent visuality of electromagnetic induction board is good, promotes user experience.
Example two
The embodiment provides a manufacturing method of a transparent electromagnetic induction plate, which comprises the following steps:
bonding two transparent coil plates manufactured by the manufacturing method of the first embodiment to each other, wherein the coil directions of the two transparent coil plates are perpendicular to each other;
and the terminals of the two transparent coil plates are respectively and electrically connected to the corresponding flexible circuit boards 6.
The terminals of the transparent coil plate are the terminals of the coil loop led out from the first transparent induction line 211/the second transparent induction line 226 on two sides of the spiral coil loop;
in addition, the forming process of the terminal of the transparent coil plate and the forming process of the conductive filler 23 in the via hole 221 may be performed together by a printing process; two terminals on the outer edge of the coil loop are finally formed, and then the two terminals of the coil loop are electrically connected to a Flexible Printed Circuit (FPC).
The transparent electromagnetic induction plate manufactured by the manufacturing method of the transparent electromagnetic induction plate provided by the embodiment is light and thin, only the conductive structure in the through hole is visible in the induction area, and the rest induction coil parts are transparent structures, so that the transparent electromagnetic induction plate can be placed at the front end of the display screen, the interference of the display screen is reduced when an electromagnetic pen touches the display screen, and the induction magnetic field change is better; and only leave over partial metal overlap joint in window district, the transparent visibility of electromagnetic induction board is good, promotes user experience.
EXAMPLE III
The present embodiment provides a transparent coil plate, including: the touch screen comprises a transparent conductive substrate, a transparent conductive film attached on a conductive layer of the transparent conductive substrate, a plurality of sections of first transparent induction lines which are arranged in parallel and formed by the conductive layer of the transparent conductive substrate, and a plurality of sections of second transparent induction lines which are arranged in parallel and formed by the conductive layer of the transparent conductive film, wherein an insulating layer of the transparent conductive film is adjacent to the conductive layer of the transparent conductive substrate;
the transparent conductive film is provided with a plurality of through holes, and the head and tail positions of the first transparent induction line and the head and tail positions of the second transparent induction line correspond to the through holes to form a spiral coil-shaped structure;
conductive fillers are arranged in the through holes, and the conductive fillers enable the end-to-end adjacent ends of the first transparent induction line and the second transparent induction line to be electrically connected to form a complete spiral coil loop.
Obviously, the transparent coil plate of the present embodiment is manufactured based on the manufacturing method of the present application, and for more detailed contents of the transparent coil plate of the present embodiment, reference may be made to the first embodiment, which is not described herein again.
The transparent coil plate provided by the embodiment is light and thin, only the conductive structures in the through holes are visible in the induction area, and the rest induction coil parts are transparent structures, so that the electromagnetic induction plate made of the transparent coil plate can be placed at the front end of the display screen, the interference of the display screen is reduced when an electromagnetic pen touches the display screen, and the change of an induction magnetic field is better; and only leave over partial metal overlap joint in window district, the transparent visibility of electromagnetic induction board is good, promotes user experience.
Example four
Fig. 14 is a schematic structural view of a transparent electromagnetic induction plate according to an embodiment of the present application, as shown in fig. 14, the transparent electromagnetic induction plate includes an insulating cover plate 5 and two transparent coil plates according to the third embodiment;
two the coil direction mutually perpendicular of transparent coil plate does respectively the X direction coil plate 7 and the Y direction coil plate 3 of transparent electromagnetic induction board, and laminate each other and form the main part of transparent electromagnetic induction board, insulating cover plate 5 laminates on the electrically conductive one side of main part of transparent electromagnetic induction board, two the wiring end electricity of transparent coil plate is connected to corresponding flexible circuit board 6 respectively.
When the transparent electromagnetic induction plate is manufactured, the X-direction coil plate 7 and the Y-direction coil plate 3 are bonded and attached by using the OCA optical cement 4, then the electromagnetic induction plate main body formed by the X-direction coil plate 7 and the Y-direction coil plate 3 is attached to the insulating cover plate 5 by using the OCA optical cement 4, and finally the wiring ends of the X-direction coil plate 7 and the Y-direction coil plate 3 are respectively and electrically connected to the corresponding flexible circuit boards 6, so that the integral manufacturing of the transparent electromagnetic induction plate can be completed.
According to the transparent electromagnetic induction plate obtained in the embodiment, based on the transparent coil plate provided by the application, the induction area is only visible through the conductive structure connected with the induction lines on the two sides, and the rest induction coil parts are transparent structures, so that the electromagnetic induction plate can be placed in front of a display screen, the interference of the display screen is reduced when an electromagnetic pen touches the display screen, and the change of an induction magnetic field is more excellent; and only leave over partial metal overlap joint in window district, the transparent visibility of electromagnetic induction board is good, promotes user experience.
EXAMPLE five
The embodiment provides a display device, including display screen and embodiment four transparent electromagnetic induction board, transparent electromagnetic induction board arranges in the display screen front end.
In the transparent electromagnetic induction plate of the display device provided by the embodiment, the induction area is only visible in the conductive structure connected with the induction lines on the two sides, and the rest induction coil parts are transparent structures, so that the electromagnetic induction plate can be placed in front of the display screen, interference of the display screen is reduced when an electromagnetic pen touches the display screen, and the induction magnetic field changes more optimally; and only leave over some metal overlap joint in window district, the transparent visuality of electromagnetic induction board is good, promotes user experience.
The embodiments given above are preferred examples for implementing the present application, and the present application is not limited to the above-described embodiments. Any non-essential addition and replacement made by a person skilled in the art according to the technical features of the technical solution of the present application belong to the protection scope of the present application.

Claims (10)

1. A method for manufacturing a transparent coil plate is characterized by comprising the following steps:
processing a conductive layer of a transparent conductive substrate into a plurality of sections of first transparent induction lines which are arranged in parallel;
forming a plurality of through holes on the transparent conductive film;
The transparent conductive film is attached to the transparent conductive substrate, wherein an insulating layer of the transparent conductive film is adjacent to a conductive layer of the transparent conductive substrate, the via holes correspond to the head and tail positions of the first transparent induction line, and the transparent conductive film is a transfer printing type transparent conductive film;
processing the conductive layer of the transparent conductive film into a plurality of sections of second transparent induction lines which are arranged in parallel, wherein the head and tail positions of the plurality of sections of second transparent induction lines correspond to the plurality of via holes, and the head and tail adjacent ends of the first transparent induction lines and the second transparent induction lines sequentially correspond to each other to form a spiral coil-shaped structure;
and forming conductive fillers in the through holes, so that the end-to-end adjacent ends of the first transparent induction line and the second transparent induction line are electrically connected to form a complete spiral coil loop.
2. The method according to claim 1, wherein the conductive layer of the transparent conductive substrate is an indium tin oxide film or a silver nanowire film formed on a transparent substrate.
3. The method of claim 1, wherein the transparent conductive film has a thickness of 5 um.
4. The method of claim 1, wherein after processing the conductive layer of the transparent conductive film into a plurality of second transparent sensing lines arranged in parallel, the method further comprises:
And curing the transfer-printing type transparent conductive film.
5. The method of claim 1, wherein the conductive filler is conductive silver paste.
6. The method of claim 1, wherein the conductive filler is formed in the via by a printing process.
7. A method for manufacturing a transparent electromagnetic induction plate is characterized by comprising the following steps:
bonding two transparent coil plates manufactured by the method of any one of claims 1-6 to each other, wherein the coil directions of the two transparent coil plates are perpendicular to each other;
and respectively and electrically connecting the wiring ends of the two transparent coil plates to the corresponding flexible circuit boards.
8. A transparent coil plate, comprising: the touch screen comprises a transparent conductive substrate, a transparent conductive film attached on a conductive layer of the transparent conductive substrate, a plurality of sections of first transparent induction lines which are arranged in parallel and formed by the conductive layer of the transparent conductive substrate, and a plurality of sections of second transparent induction lines which are arranged in parallel and formed by the conductive layer of the transparent conductive film, wherein an insulating layer of the transparent conductive film is adjacent to the conductive layer of the transparent conductive substrate;
the transparent conductive film is provided with a plurality of through holes, and the head and tail positions of the first transparent induction line and the head and tail positions of the second transparent induction line correspond to the through holes to form a spiral coil-shaped structure;
Conductive fillers are arranged in the through holes, and the conductive fillers enable the end-to-end adjacent ends of the first transparent induction line and the second transparent induction line to be electrically connected to form a complete spiral coil loop.
9. A transparent electromagnetic induction plate, comprising two transparent coil plates according to claim 8;
the two transparent coil plates are mutually attached, the coil directions of the two transparent coil plates are mutually vertical, and the wiring ends of the two transparent coil plates are respectively and electrically connected to the corresponding flexible circuit boards.
10. A display device comprising a display screen and the transparent electromagnetic induction plate according to claim 9, wherein the transparent electromagnetic induction plate is disposed in front of the display screen.
CN202010306084.7A 2020-04-17 2020-04-17 Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device Active CN111475064B (en)

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PCT/CN2020/112247 WO2021208325A1 (en) 2020-04-17 2020-08-28 Transparent coil board and manufacturing method therefor, transparent electromagnetic induction board and display device

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CN111475064B (en) * 2020-04-17 2022-05-24 深圳市鸿合创新信息技术有限责任公司 Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device
CN114136201B (en) * 2021-12-30 2023-03-17 西安交通大学 Eddy current probe based on optical transparent conductive medium material and film thickness measuring system and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102479995A (en) * 2010-11-30 2012-05-30 英业达股份有限公司 Antenna structure and touch control display panel
CN203133806U (en) * 2012-09-04 2013-08-14 太瀚科技股份有限公司 Electromagnetic induction antenna substrate, electromagnetic input device and device with touch control function and writing input function
CN203840575U (en) * 2014-04-15 2014-09-17 佛山市顺德区美的电热电器制造有限公司 Electromagnetic coil panel and electromagnetic oven
CN104182111A (en) * 2013-05-22 2014-12-03 太瀚科技股份有限公司 Electromagnetic induction plate structure, manufacturing method thereof and electromagnetic handwriting input device
CN205015867U (en) * 2015-10-18 2016-02-03 周扬帆 Computer handwriting input board
CN208013919U (en) * 2018-03-20 2018-10-26 深圳市鸿合创新信息技术有限责任公司 A kind of capacitance blank touch-control membrane structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576680A (en) * 1994-03-01 1996-11-19 Amer-Soi Structure and fabrication process of inductors on semiconductor chip
JPH1140915A (en) * 1997-05-22 1999-02-12 Nec Corp Printed wiring board
US7948477B2 (en) * 2006-12-15 2011-05-24 Apple Inc. PET-based touchpad
CN101634915A (en) * 2008-07-21 2010-01-27 奇信电子股份有限公司 Touch detection circuit structure for bistable electronic display
CN102402359A (en) * 2011-12-27 2012-04-04 天津美泰真空技术有限公司 Capacitive touch screen
CN102881839B (en) * 2012-09-28 2014-05-07 京东方科技集团股份有限公司 Organic light emitting diode, touch display device and manufacture methods thereof
CN105653106B (en) * 2015-12-25 2019-11-29 芜湖伦丰电子科技有限公司 A kind of capacitance touch screen and its manufacturing method of GF2 structure
CN106681580A (en) * 2017-02-06 2017-05-17 深圳市优苹科技有限公司 Electromagnetic screen manufacturing method, electromagnetic screen and touch device
CN109213351A (en) * 2017-07-03 2019-01-15 深圳市鸿合创新信息技术有限责任公司 A kind of electronic whiteboard touching device and electronic whiteboard
CN111475064B (en) * 2020-04-17 2022-05-24 深圳市鸿合创新信息技术有限责任公司 Transparent coil plate and manufacturing method thereof, transparent electromagnetic induction plate and display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102479995A (en) * 2010-11-30 2012-05-30 英业达股份有限公司 Antenna structure and touch control display panel
CN203133806U (en) * 2012-09-04 2013-08-14 太瀚科技股份有限公司 Electromagnetic induction antenna substrate, electromagnetic input device and device with touch control function and writing input function
CN104182111A (en) * 2013-05-22 2014-12-03 太瀚科技股份有限公司 Electromagnetic induction plate structure, manufacturing method thereof and electromagnetic handwriting input device
CN203840575U (en) * 2014-04-15 2014-09-17 佛山市顺德区美的电热电器制造有限公司 Electromagnetic coil panel and electromagnetic oven
CN205015867U (en) * 2015-10-18 2016-02-03 周扬帆 Computer handwriting input board
CN208013919U (en) * 2018-03-20 2018-10-26 深圳市鸿合创新信息技术有限责任公司 A kind of capacitance blank touch-control membrane structure

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