CN105898982A - High-voltage flexible circuit board and multi-layer flexible circuit board - Google Patents

High-voltage flexible circuit board and multi-layer flexible circuit board Download PDF

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Publication number
CN105898982A
CN105898982A CN201610500732.6A CN201610500732A CN105898982A CN 105898982 A CN105898982 A CN 105898982A CN 201610500732 A CN201610500732 A CN 201610500732A CN 105898982 A CN105898982 A CN 105898982A
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China
Prior art keywords
copper foil
layer
foil circuit
circuit layer
pet film
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Granted
Application number
CN201610500732.6A
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Chinese (zh)
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CN105898982B (en
Inventor
罗绍静
赖弥勇
卢欣欣
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Guangdong Shunde Siry Technology Co Ltd
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Guangdong Shunde Siry Technology Co Ltd
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Priority to CN201610500732.6A priority Critical patent/CN105898982B/en
Publication of CN105898982A publication Critical patent/CN105898982A/en
Application granted granted Critical
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to the technical field of a flexible circuit board, in particular to a high-voltage flexible circuit board. The high-voltage flexible circuit board comprises an insulation base layer, wherein a first copper foil circuit layer is arranged at one side of the insulation base layer, a second copper foil circuit layer, a first PET film layer and a third copper foil circuit layer are sequentially arranged at the other side of the insulation base layer, a first through hole is formed between the first copper foil circuit layer and the insulation base layer to achieve the conduction between the first copper foil circuit layer and the second copper foil circuit layer, and a second through hole is formed among the first copper foil circuit layer, the insulation base layer, the second copper foil circuit layer and the first PET film layer to achieve the conduction between the first copper foil circuit layer and the third copper foil circuit layer. A positive electrode and a negative electrode of a traditional multi-layer circuit board are arranged at the same layer, and the widths of a positive electrode copper foil and a negative electrode copper foil are affected due to limitation of creeping distance; and the electrodes of the multi-layer circuit board are arranged at several layers, creepage between the electrodes can be prevented, the width of the circuit board is reduced to the greatest extend on the condition that the voltage drop is consistent with that of a dual-layer circuit board, and a higher cooling effect also can be achieved.

Description

A kind of high-voltage flexible wiring board and multi-layer flexible circuit board
Technical field
This practicality relates to flexible PCB technical field, particularly relates to a kind of high-voltage flexible wiring board and multi-layer flexible circuit board.
Background technology
Flexible PCB is called for short " soft board ", is commonly called as FPC in industry, the printed circuit board (PCB) made with flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.Such as it can with free bend, turn around, folding etc..Utilize flexible PCB can be substantially reduced the volume of electronic product, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, flexible PCB is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
Light bar is the more popular field of flexible PCB application.Described light bar, refers to LED to be welded on flexible PCB by special processing technique, reconnects electrical source luminescent, and it has the features such as length in service life, energy-conserving and environment-protective.Along with improving constantly of people's living standard, LED is widely used in decorative lighting place, such as neon light, large-scale antenna wiring board, captions advertisement, signboard, variola illumination etc..But the flexible PCB that light bar traditionally is used is one side circuit, as the patent of invention of Application No. 201010232537.2 discloses a kind of method using juxtaposed wire producing single-sided circuit board, the circuit board utilizing the method to prepare is single-sided circuit board, this single-sided circuit board a problem is that, after be combined formation light bar with LED, single-sided circuit board additionally must be connected wire when this light bar is powered, not only increase the volume of light bar, and manually-operated complexity can be increased.Owing to manual operation exists error, long-time use after the loose contact of wire to be easily caused the intermittence of light bar malfunctioning so that the service life of light bar declines.
The utility model patent of Application No. 201320405662.8 discloses a kind of double-circuit LED high-voltage light bar, including wiring board and the LED assembly that is layed on wiring board, the end face of described wiring board is provided with end face electric conductor circuit, bottom surface is provided with bottom surface electric conductor circuit, wiring board is Double-side line conductive structure, LED assembly is located on end face electric conductor circuit, and bottom surface electric conductor circuit is wire line.The wiring board of this two-wire paths of LEDs high-pressure lamp band uses the design of double-circuit plate, the shortcoming solving tradition single-sided circuit board, but, this utility model have ignored a problem, its electric conductor circuit is in the case of long-time use, easily affected by surrounding enviroment such as dust, moisture etc. and caused the short circuit of LED weld, thus reduced service life.
Summary of the invention
In view of this, it is an object of the invention to overcome the deficiencies in the prior art, it is provided that a kind of can effectively prevent external interference, be applicable under high pressure use flexible circuit board and multi-layer flexible circuit board.
In order to solve above-mentioned technical problem, the present invention uses following scheme to realize:
A kind of high-voltage flexible wiring board, including insulated substrate, the side of described insulated substrate is provided with the first copper foil circuit layer, opposite side is sequentially provided with the second copper foil circuit layer, the first PET film layer and the 3rd copper foil circuit layer, it is provided with the first through hole between described first copper foil circuit layer and insulated substrate to realize the first copper foil circuit layer and the conducting of the second copper foil circuit layer, is provided with the second through hole between described first copper foil circuit layer, insulated substrate, the second copper foil circuit layer and the first PET film layer to realize the first copper foil circuit layer and the conducting of the 3rd copper foil circuit layer.
The flexible circuit board of the present invention is respectively provided with copper foil circuit layer in the both sides of insulated substrate, second copper foil circuit layer can be negative or positive electrode, 3rd copper foil circuit layer is negative pole or positive pole accordingly, and both realize conducting by the first through hole and the second through hole and the first copper foil circuit layer respectively.Second through hole runs through one greater area of circle of position excision of the second copper foil circuit layer, to prevent the first copper foil circuit layer from being turned on by the second through hole and the second copper foil circuit layer.
The circuit of insulated substrate side is divided into both sides copper foil layer by the present invention, it is respectively the second copper foil circuit layer and the 3rd copper foil circuit layer, therefore the second copper foil circuit layer and the cross-sectional area of the 3rd copper foil circuit layer can be increased in the insulated substrate of one fixed width so that it is more suitable for environment under high pressure.
Three layers of copper foil circuit layer form conducting wire, therefore, the present invention is when being applied to light bar, need not additionally connect wire so that the light bar of preparation is the most encapsulated, reduce the manufacture difficulty of light bar, and, in the both sides of insulated substrate, copper foil circuit layer is set, so that the integral thickness of wiring board is substantially reduced, compacter.Copper foil circuit layer uses continuous physical cutting to form, therefore can continuous continual production, overcome and prior art etches the wiring board length of circuit at most only have 1 ~ 2m, being prepared as light bar needs the shortcoming of a plurality of splicing, can be greatly improved production efficiency.Each interlayer can be formed by bonding.
Described first copper foil circuit layer is provided with the second PET film layer.
When preparing light bar, first copper foil circuit layer arranges lamp bead, after a long time use, especially at dust compared with big or that dampness is heavier place, it is susceptible to short circuit between lamp bead and the first copper foil circuit layer, causes fault, therefore, the first copper foil circuit layer of the present invention covers the second PET film layer, the first copper foil circuit layer is come with external environment isolation, it is provided that good electronic isolation function.
Owing to the scene of light bar application needs bending greatly, it is susceptible to after a long time use at traditional circuit plate benging break or separate, in the present invention, utilize the first PET film layer and the second PET film layer to reduce the stress of knee, make the weatherability of wiring board, ageing resistace more preferably, the wiring board life-span is the most lasting, furthermore, superperformance just because of PET, it can be accomplished sufficiently thin and is not easily separate in the case of light bar is emitted light and heat and shrinks, its cost comprehensive and characteristic, this is that other material can not be compared.
Described second PET film layer is provided with through hole.Through hole on second PET film layer is to allow the lamp bead being arranged on the first copper foil circuit layer appear, and when can make paster, tin cream will not be lost to other positions.
The thickness of described first PET film layer and the second PET film layer is 0.05 ~ 0.2mm.Although present invention employs the first PET film layer and the second PET film layer to guarantee the bending resistance of wiring board, but, PET film layer is not the thickest more good, and it to control to bring superior performance to wiring board in certain thickness range.If PET film layer is blocked up, although its electronic protection function is strengthened, but during wiring board is in bending, PET film layer forms extruding to copper foil circuit layer and insulated substrate, easily makes both rupture;If PET film layer is the thinnest, then can not play the most anti-around ability and electronic protection ability.
The thickness of described insulated substrate is 0.5 ~ 1mm.Described insulated substrate is pet layer.Middle pet layer coordinates three layers of copper foil circuit layer and two-layer PET film layer, and its thickness can be made to become thinner.
Described second PET film layer is provided with the annular protrusion around through hole.
When flexible circuit board prepared by the present invention is for manufacturing light bar, light bar needs to carry out encapsulated, therefore, the present invention arranges annular protrusion in the through hole of the second PET film layer, when encapsulated press lamp bead time, annular protrusion and encapsulated close contact, the dust that can intercept the external world to a certain extent enters into through hole, and when wiring board is in bending, annular protrusion is possible to prevent the stress mutation of through hole to rupture.
It is 0.5 ~ 3.5mm that described annular protrusion highlights the thickness of the second PET film layer, and the edge 0.5 ~ 3mm of its inner distance through hole.When encapsulated press lamp bead time, the micro-standing shape of encapsulated formation that lamp bead is corresponding, coordinate the lower slightly annular protrusion of thickness, can combine closely.
A kind of high pressure multi-layer flexible circuit board, including insulated substrate, the side of described insulated substrate is provided with upper strata copper foil circuit layer, opposite side is provided with multilamellar lower floor copper foil circuit layer, and it is provided with insulating film layer, described upper strata copper foil circuit layer and lower floor's copper foil circuit layer between Mei Ceng lower floor copper foil circuit layer by running through the through hole realization conducting of insulated substrate.Multilamellar in multilamellar lower floor described here copper foil circuit layer is at least more than two-layer.Upper strata copper foil circuit layer is realized by through hole with the connection of lower floor's copper foil circuit layer, by corresponding through hole is through to the position of correspondence.Further, also as above-mentioned high-voltage flexible wiring board, PET film layer and annular protrusion can be covered at upper strata copper foil circuit layer.Multi-layer flexible circuit board is applicable to relative complex circuit, and such as RGB lamp belt circuit, multiple structure can realize the four of RGB electrodes (positive three negative) are each distributed in one layer, solves, because of reserved creep age distance, wiring board width to do big shortcoming.
Compared with prior art, there is advantages that conventional double wiring board both positive and negative polarity at same layer, because creep age distance limits, both positive and negative polarity Copper Foil width is affected.Multilayer circuit board in which floor, is avoided that separated for electrode between electrode creepage, is guaranteeing that pressure drop reduces the width of wiring board in the case of consistent with double-layered circuit board to greatest extent, and can reach more preferable radiating effect.
Accompanying drawing explanation
Fig. 1 is embodiment 1 structural representation;
Fig. 2 is A-A sectional view in Fig. 1;
Fig. 3 is embodiment 2 structural representation.
Detailed description of the invention
In order to allow those skilled in the art be more fully understood that technical scheme, the present invention is further elaborated below in conjunction with the accompanying drawings.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of high-voltage flexible wiring board, including insulated substrate 100, the side of described insulated substrate 100 is provided with the first copper foil circuit layer 200, opposite side is sequentially provided with the second copper foil circuit layer 400, first PET film layer 500 and the 3rd copper foil circuit layer 600, the first through hole 800 it is provided with to realize the first copper foil circuit layer 200 and conducting of the second copper foil circuit layer 400 between described first copper foil circuit layer 200 and insulated substrate 100, described first copper foil circuit layer 200, insulated substrate 100, the second through hole 900 it is provided with to realize the first copper foil circuit layer 200 and conducting of the 3rd copper foil circuit layer 600 between second copper foil circuit layer 400 and the first PET film layer 500.
Described first copper foil circuit layer 200 is provided with the second PET film layer 300.Described second PET film layer 300 is provided with through hole 310.The thickness of described first PET film layer 500 and the second PET film layer 300 is 0.1mm.The thickness of described insulated substrate 100 is 0.8mm.Described insulated substrate 100 is pet layer.Described second PET film layer 300 is provided with the annular protrusion 320 around through hole 310.It is 2mm that described annular protrusion 320 highlights the thickness of the second PET film layer 300, and the edge 1mm of its inner distance through hole 310.
Embodiment 2
As shown in Figure 3, a kind of high pressure multi-layer flexible circuit board, including insulated substrate 100, the side of described insulated substrate 100 is provided with upper strata copper foil circuit layer 200, opposite side is provided with three lower layers copper foil circuit layer, it is respectively first lower floor's copper foil circuit layer 400, second lower floor's copper foil circuit layer 600 and the 3rd lower floor's copper foil circuit layer 700, and it is provided with PET film layer 500 between three lower layers copper foil circuit layer, described upper strata copper foil circuit layer 200 and lower floor's copper foil circuit layer realize conducting by running through the through hole of insulated substrate, through hole runs through the principle of connection upper strata copper foil circuit layer and lower floor's copper foil circuit layer with embodiment 1.
Above-described embodiment is only the wherein specific implementation of the present invention, and it describes more concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these obvious alternative forms belong to protection scope of the present invention.

Claims (10)

1. a high-voltage flexible wiring board, it is characterized in that, including insulated substrate, the side of described insulated substrate is provided with the first copper foil circuit layer, opposite side is sequentially provided with the second copper foil circuit layer, first PET film layer and the 3rd copper foil circuit layer, the first through hole it is provided with to realize the first copper foil circuit layer and the conducting of the second copper foil circuit layer between described first copper foil circuit layer and insulated substrate, described first copper foil circuit layer, insulated substrate, the second through hole it is provided with to realize the first copper foil circuit layer and the conducting of the 3rd copper foil circuit layer between second copper foil circuit layer and the first PET film layer.
High-voltage flexible wiring board the most according to claim 1, it is characterised in that described first copper foil circuit layer is provided with the second PET film layer.
High-voltage flexible wiring board the most according to claim 2, it is characterised in that described second PET film layer is provided with through hole.
4. according to the high-voltage flexible wiring board described in Claims 2 or 3, it is characterised in that the thickness of described first PET film layer and the second PET film layer is 0.05 ~ 0.2mm.
High-voltage flexible wiring board the most according to claim 4, it is characterised in that the thickness of described insulated substrate is 0.5 ~ 1mm.
High-voltage flexible wiring board the most according to claim 5, it is characterised in that described insulated substrate is pet layer.
7. according to the high-voltage flexible wiring board described in Claims 2 or 3, it is characterised in that described second PET film layer is provided with the annular protrusion around through hole.
High-voltage flexible wiring board the most according to claim 7, it is characterised in that it is 0.5 ~ 3.5mm that described annular protrusion highlights the thickness of the second PET film layer, and the edge 0.5 ~ 3mm of its inner distance through hole.
9. a high pressure multi-layer flexible circuit board, it is characterized in that, including insulated substrate, the side of described insulated substrate is provided with upper strata copper foil circuit layer, opposite side is provided with multilamellar lower floor copper foil circuit layer, and it is provided with insulating film layer, described upper strata copper foil circuit layer and lower floor's copper foil circuit layer between Mei Ceng lower floor copper foil circuit layer by running through the through hole realization conducting of insulated substrate.
High pressure multi-layer flexible circuit board the most according to claim 9, it is characterised in that described insulating film layer is PET film layer.
CN201610500732.6A 2016-06-30 2016-06-30 A kind of high-voltage flexible wiring board and multi-layer flexible circuit board Active CN105898982B (en)

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Application Number Priority Date Filing Date Title
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CN105898982B CN105898982B (en) 2019-01-18

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106287260A (en) * 2016-09-29 2017-01-04 东莞市善时照明科技有限公司 LED wiring board and LED and the application process of glimmer after eliminating LED power-off
CN106455300A (en) * 2016-11-10 2017-02-22 广东欧珀移动通信有限公司 Circuit board and mobile terminal
CN107072044A (en) * 2017-06-05 2017-08-18 广东顺德施瑞科技有限公司 A kind of double-faced flexible wiring board
CN107278024A (en) * 2017-08-02 2017-10-20 常熟东南相互电子有限公司 Flexible circuit board assembly
CN107990177A (en) * 2017-12-16 2018-05-04 中山市富大照明科技有限公司 A kind of flexible LED rope light
CN109435369A (en) * 2018-11-20 2019-03-08 鹤山市众晟科技有限公司 The manufacturing method and LED light bar of LED light bar

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JP2011029385A (en) * 2009-07-24 2011-02-10 Murata Mfg Co Ltd Flexible multilayered substrate and method of manufacturing the same
CN204721710U (en) * 2015-05-07 2015-10-21 深圳市星之光实业发展有限公司 A kind of multi-layer flexible circuit board
CN105101685A (en) * 2015-09-02 2015-11-25 广东欧珀移动通信有限公司 Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB
CN205693971U (en) * 2016-06-30 2016-11-16 广东顺德施瑞科技有限公司 A kind of high-voltage flexible wiring board and multi-layer flexible circuit board

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US3436819A (en) * 1965-09-22 1969-04-08 Litton Systems Inc Multilayer laminate
EP0469308A1 (en) * 1990-08-01 1992-02-05 International Business Machines Corporation Multilayered circuit board assembly and method of making same
JP2011029385A (en) * 2009-07-24 2011-02-10 Murata Mfg Co Ltd Flexible multilayered substrate and method of manufacturing the same
CN204721710U (en) * 2015-05-07 2015-10-21 深圳市星之光实业发展有限公司 A kind of multi-layer flexible circuit board
CN105101685A (en) * 2015-09-02 2015-11-25 广东欧珀移动通信有限公司 Fabrication method of multi-layer printed circuit board (PCB) and multi-layer PCB
CN205693971U (en) * 2016-06-30 2016-11-16 广东顺德施瑞科技有限公司 A kind of high-voltage flexible wiring board and multi-layer flexible circuit board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106287260A (en) * 2016-09-29 2017-01-04 东莞市善时照明科技有限公司 LED wiring board and LED and the application process of glimmer after eliminating LED power-off
CN106287260B (en) * 2016-09-29 2022-08-05 东莞市善时照明科技有限公司 LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure
CN106455300A (en) * 2016-11-10 2017-02-22 广东欧珀移动通信有限公司 Circuit board and mobile terminal
CN106455300B (en) * 2016-11-10 2023-09-12 Oppo广东移动通信有限公司 Circuit board and mobile terminal
CN107072044A (en) * 2017-06-05 2017-08-18 广东顺德施瑞科技有限公司 A kind of double-faced flexible wiring board
CN107072044B (en) * 2017-06-05 2024-04-12 广东顺德施瑞科技有限公司 Double-sided flexible circuit board
CN107278024A (en) * 2017-08-02 2017-10-20 常熟东南相互电子有限公司 Flexible circuit board assembly
CN107990177A (en) * 2017-12-16 2018-05-04 中山市富大照明科技有限公司 A kind of flexible LED rope light
CN108087745A (en) * 2017-12-16 2018-05-29 中山市富大照明科技有限公司 A kind of flexible LED circuit board module
CN109435369A (en) * 2018-11-20 2019-03-08 鹤山市众晟科技有限公司 The manufacturing method and LED light bar of LED light bar

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