CN106287260A - LED wiring board and LED and the application process of glimmer after eliminating LED power-off - Google Patents
LED wiring board and LED and the application process of glimmer after eliminating LED power-off Download PDFInfo
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- CN106287260A CN106287260A CN201610864091.2A CN201610864091A CN106287260A CN 106287260 A CN106287260 A CN 106287260A CN 201610864091 A CN201610864091 A CN 201610864091A CN 106287260 A CN106287260 A CN 106287260A
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- led
- line layer
- wiring board
- base material
- layer
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 34
- 210000002615 epidermis Anatomy 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011190 CEM-3 Substances 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000011324 bead Substances 0.000 abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000004411 aluminium Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
A kind of method of glimmer after the invention discloses LED wiring board and LED and eliminating LED power-off, wherein: a kind of LED wiring board, including insulated base material layer, the upper surface of insulated base material layer is sequentially provided with line layer and upper epidermis, forming positive pole circuit and negative pole circuit on line layer, the lower surface of insulated base material layer is additionally provided with the positive pole circuit of conductive electrode flaggy and line layer and is electrically connected conducting；A kind of LED, pad position welding LED chip；A kind of eliminating the method for glimmer after LED power-off, the positive pole circuit of line layer uses via insulated base material layer and conductive electrode flaggy to couple together formation inductance capacitance circuit, is guided to conductive electrode flaggy by LED lamp bead P junction voltage after a loss of power.It is desirable to provide allow line layer and LED chip lamp bead P junction voltage be eliminated, thus solve LED and the most also can there is the phenomenon of glimmer.
Description
Technical field
The present invention relates to a kind of LED circuit board, more specifically, particularly relate to a kind of LED wiring board and LED and disappear
Except the application process of glimmer after LED power-off.
Background technology
As it is shown in figure 1, there is opening of the Double-phase switch such as Fig. 1 in actual use in LED lamp wiring in actual use
Close, cut off single-phase switch when employing, and be when cutting off single-phase N line or lamp bead in the case of switch tape light
The luminescence that meeting is slight, was especially apparent at night.Production and life can be impacted, and the loss of electric energy.Specifically at light fixture
Use aluminium base be in wiring board internal structure (as shown in Figure 2), the shell of light fixture is connected together with the aluminium of aluminium base
Namely the aluminium of aluminium base is ground connection, and when abnormal closedown light fixture, the Copper Foil on aluminium base (LED lamp bead patch layer) is deposited
Have line voltage, in the middle of aluminium base be thickness be 100um epoxy resin (insulating barrier), aluminium ground connection therein, constitute whole aluminum
Board structure is just comparable to the structure of an electric capacity.As long as LED lamp bead PN junction has potential difference just to have luminescence, luminous intensity
It is current related with what PN junction flow through, so after aluminium base forms an inductance capacitance, the induced voltage of this electric capacity is applied to LED
On light source, cause the luminescence that LED light source is slight.As being traditional capacitance structure in Fig. 3, A Yu B is the conductive electrode being placed in parallel
Plate, its interval, with megohmite insulant (such as air), is connected to a DC source E via a switch S.All protect before two-plate access failure power supply
Hold neutral for not charged state.After S closes, the electronics of pole plate A is drawn to the positive pole of battery, thus A presents positively charged
The phenomenon of lotus；The electronics of battery negative terminal is then ostracised to pole plate B simultaneously, makes B present electronegative phenomenon；Therefore, at A, B two
Form electric field between pole plate and set up potential difference V.The phenomenon of this electronics flowing is persistently carried out, the electricity shifted and power supply
Voltage be directly proportional, during until the potential difference between AB two-plate is equal with supply voltage (V=E), just stop electronics movement.Electricity
During subflow is dynamic, the energy of power supply is taken out of and unloading on two-plate, say, that store electric charge.Wherein electric capacity
Principle of induction is: if the electric potential difference of two inter-stages is 1 volt during electricity with 1 storehouse, its electric capacity is exactly 1 method, it may be assumed that C=Q/U but electric capacity
Size not by Q or U determine, it may be assumed that C=ε S/4 π kd.Wherein, ε is a constant, and S is that the right opposite of capacitor plate amasss, d
For the distance of capacitor plate, k is then electrostatic force constant.Common plate condenser, electric capacity is that (ε is to be situated between pole plate to C=ε S/d.
The dielectric constant of matter, S is polar plate area, and d is the distance between pole plate).Therefore, how to solve the problems referred to above, become urgently to be resolved hurrily
Problem.
Summary of the invention
The technical problem to be solved in the present invention is the above-mentioned deficiency for prior art, it is provided that a kind of LED wiring board and
The application process of glimmer after LED and elimination LED power-off.
The technical scheme is that such: a kind of LED wiring board, including insulated base material layer, in insulated base material layer
Upper surface set gradually line layer and upper epidermis, line layer forms positive pole circuit and negative pole circuit, wherein: at insulation base
The lower surface of sheet material layers is additionally provided with conductive electrode flaggy, and the positive pole circuit of conductive electrode flaggy and line layer is electrically connected conducting.
Use a kind of LED wiring board of technique scheme, by arranging the LED circuit board of the one side of insulated base material layer
Lower surface arranges the conductive electrode flaggy of metal, and conductive electrode flaggy forms relative flat board with the line layer of insulated base material layer upper surface
Electrode, and make the conducting that is electrically connected of the positive pole circuit of conductive electrode flaggy and line layer constitute plate condenser structure, it is formed
Inductance capacitance circuit, can guide LED lamp bead P junction voltage to conductive electrode flaggy after a loss of power.Allow line layer and LED chip lamp
Pearl P junction voltage is eliminated, thus solves LED and the most also can there is the phenomenon of glimmer.
After the positive pole circuit of above-mentioned LED wiring board, conductive electrode flaggy and line layer is by via and insulated base material layer
Be electrically connected conducting；Insulated base material layer is offered and is led via, and the line layer of upper strata positive pole circuit is stretched downwards, with lower floor by via
Conductive electrode flaggy physical contact, forms the double-sided wiring board of conductive electrode flaggy and line layer conducting.Wherein line layer and lower floor lead
Plate electrode layer can also be filled the modes such as conducting by perfusion stannum material and be realized.
Above-mentioned LED wiring board, forms some groups of integrated circuits on line layer, often group integrated circuit include positive pole and
Negative pole, line layer is placed equidistant pad position；Dress patch LED electronic devices and components on pad position on line layer, LED electronic devices and components
The positive pole of both positive and negative polarity conducting integrated circuit and negative pole.
Above-mentioned LED wiring board, insulated base material layer is the CEM-3 dual platen of high thermal conductivity coefficient, the thickness of insulated base material layer
Degree 0.8～1.6mmum, heat conductivity is (1.0～2.0) W/MK.The thickness of insulated base material layer ensures plate condenser structure
Distance between pole plate, makes the positive pole circuit of conductive electrode flaggy and line layer be electrically connected and turns on composition plate condenser structure, its
Formed inductance capacitance circuit.The CEM-3 dual platen of high thermal conductivity coefficient realizes effectively causing dissipating to the heat of LED electronic devices and components
Dispel the heat on hot housing.
Above-mentioned LED wiring board, line layer is that copper moors layer, thickness 20～40um.
Above-mentioned LED wiring board, upper epidermis is resist layer, thickness 20～30um；Realize protection circuit layer, oxygen
The purpose changed, corrode.
Above-mentioned LED wiring board, conductive electrode flaggy lower surface is provided with heat-conducting silica gel sheet；It is positioned at by heat-conducting silica gel sheet
On lamp housing, being directed on radiating shell by heat, heat-conducting silica gel sheet has the attribute of insulation, heat conduction, heat radiation, makes conductive electrode flaggy
With lamp housing body phase insulation.
A kind of LED, arranges LED chip, LED lamp between the positive pole circuit and the negative pole circuit that are formed on line layer
The welding conducting corresponding with positive pole circuit and negative pole circuit respectively of the both positive and negative polarity of sheet.
A kind of LED, line layer is placed equidistant pad position, pad position welding LED chip；Realize LED chip even
Connect the purpose of conductive electrode flaggy and line layer.
A kind of eliminate the application process of glimmer after LED power-off, wherein: the positive pole circuit of line layer uses via insulation base
The conductive electrode flaggy of sheet material layers and bottom couples together and forms inductance capacitance circuit, is guided extremely by LED lamp bead P junction voltage after a loss of power
On conductive electrode flaggy.Allow line layer and LED chip lamp bead P junction voltage be eliminated, thus solve LED and the most also can
There is the phenomenon of glimmer.
Accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the present invention is described in further detail, but is not intended that the present invention
Any restriction.
Fig. 1 is LED lamp wiring construction in actual use；
Fig. 2 is the wiring board internal structure schematic diagram of traditional LED lamp wiring board；
Fig. 3 is the operation principle circuit diagram of capacitor；
Fig. 4 is the attachment structure generalized section of LED wiring board of the present invention；
Fig. 5 is the planar structure schematic diagram of LED wiring board of the present invention；
Fig. 6 is another attachment structure generalized section of LED wiring board of the present invention；
Fig. 7 is the structural profile schematic diagram of LED of the present invention.
Detailed description of the invention
As shown in figures 4-6, a kind of LED wiring board, including insulated base material layer 1, the upper surface in insulated base material layer 1 depends on
Secondary line layer 2 and upper epidermis 3 are set, line layer 2 is formed electrode line paths of LEDs+and negative line paths of LEDs-, wherein: in insulation
The lower surface of substrate layer 1 is additionally provided with conductive electrode flaggy 4, the electrode line paths of LEDs of conductive electrode flaggy 4 and line layer 2+be electrically connected and lead
Logical.
The positive pole circuit of conductive electrode flaggy 4 and line layer 2 is by the conducting that is electrically connected after via a and insulated base material layer 1.Its
The via a of middle line layer and underlying conductive pole plate layer fills conduction mode by perfusion stannum material and realizes.
As shown in Figure 6, insulated base material layer is offered and is led via a, and the line layer of upper strata positive pole circuit is pulled down by via a
Stretch, with underlying conductive pole plate layer physical contact, form the double-sided wiring board of conductive electrode flaggy and line layer conducting.
Forming some groups of integrated circuits on line layer 2, often group integrated circuit includes electrode line paths of LEDs+and negative pole circuit
LED-, line layer 2 is placed equidistant pad position 21.
Insulated base material layer 1 is the CEM-3 dual platen of high thermal conductivity coefficient, the thickness 0.8～1.6mmum of insulated base material layer 1, leads
Hot coefficient is (1.0～2.0) W/MK.
Top layer Copper Foil: line layer 2 moors layer, thickness 30um for copper.
Upper epidermis 3 is resist layer, thickness 25um.
Conductive electrode flaggy 4 lower surface is provided with heat-conducting silica gel sheet 5.Conductive electrode flaggy 4 lower surface can also arrange resist and protect
Sheath carries out insulating and protective effect.Correspondence is sticked heat-conducting silica gel sheet 5 the most again and is connected with lamp housing.
As it is shown in fig. 7, a kind of LED, wherein: LED chip 6 is welded in pad position 21.
A kind of eliminate the application process of glimmer after LED power-off, wherein: the electrode line paths of LEDs+use via of line layer 2
The conductive electrode flaggy 4 of insulated base material layer 1 and bottom couples together and forms inductance capacitance circuit, after a loss of power by LED lamp bead P knot electricity
Pressure guides to conductive electrode flaggy 4.
When the present invention is specifically used, metal is set by arranging the LED circuit board lower surface of the one side of insulated base material layer 1
Conductive electrode flaggy 4, the relative plate electrode that conductive electrode flaggy 4 is formed with the line layer 2 of insulated base material layer 1 upper surface, and make
Conductive electrode flaggy 4 constitutes plate condenser structure, its formed sensing with the electrode line paths of LEDs+conducting that is electrically connected of line layer 4
Condenser network, can guide LED lamp bead P junction voltage to conductive electrode flaggy 4 after a loss of power.Allow line layer and LED chip lamp bead P
Junction voltage is eliminated, thus solves LED and the most also can there is the phenomenon of glimmer.
Specific works principle is: according to the formula C=ε S/d. of capacity plate antenna, (ε is the dielectric constant of medium between pole plate, and S is
Polar plate area, d is the distance between pole plate.Owing to the area of the conductive electrode flaggy 4 (bottom Copper Foil) of pcb board (pushes up more than line layer 2
Layer Copper Foil) area, so at conductive electrode flaggy 4 (bottom Copper Foil) and the lamp outer casing of insulated base material layer 1 (pcb board) bottom
The faradism capacitance formed between (ground connection) is higher than the sensing formed between line layer 2 (top layer Copper Foil) and lamp outer casing (ground connection)
Capacitance.The LED+ terminal potential that result in top layer has all been directed to bottom, causes LED PN junction no longer to form potential difference.
In sum, the present invention, such as description and diagramatic content, makes actual sample and through test is used for multiple times, from making
Seeing by the effect of test, the provable present invention can reach the purpose that it is desired, and practical value is unquestionable.Provided above
Embodiment is only used for the convenient illustration present invention, and the present invention not makees any pro forma restriction, any affiliated technology neck
Territory has usually intellectual, if in the range of without departing from the carried technical characteristic of the present invention, utilizing disclosed technology
The Equivalent embodiments that the done local of content is changed or modified, and without departing from the technical characteristic content of the present invention, all still fall within
In the range of the technology of the present invention feature.
Claims (10)
1. a LED wiring board, including insulated base material layer (1), the upper surface in insulated base material layer (1) sets gradually line layer
(2) and upper epidermis (3), positive pole circuit and negative pole circuit are formed line layer (2) is upper, it is characterised in that: in insulated base material layer (1)
Lower surface be additionally provided with conductive electrode flaggy (4), the positive pole circuit of conductive electrode flaggy (4) and line layer (2) is electrically connected conducting.
LED wiring board the most according to claim 1, it is characterised in that: conductive electrode flaggy (4) is with line layer (2) just
Polar curve road is by the conducting that is electrically connected after via and insulated base material layer (1).
LED wiring board the most according to claim 1, it is characterised in that: at line layer (2) some groups of integrated lines of upper formation
Road, often group integrated circuit includes positive pole and negative pole, and line layer (2) is placed equidistant pad position (21).
LED wiring board the most according to claim 1, it is characterised in that: insulated base material layer (1) is high thermal conductivity coefficient
CEM-3 dual platen, the thickness 0.8～1.6mmum of insulated base material layer (1), heat conductivity is (1.0～2.0) W/MK.
5. according to the LED wiring board described in claim 1 or 3, it is characterised in that: line layer (2) be copper moor layer, thickness 20～
40um。
6. according to the LED wiring board described in claim 1 or 3, it is characterised in that: upper epidermis (3) is resist layer, thickness 20
～30um.
LED wiring board the most according to claim 1, it is characterised in that: conductive electrode flaggy (4) lower surface is provided with thermal conductive silicon
Film (5).
8. a LED, it is characterised in that: between upper positive pole circuit and the negative pole circuit formed of line layer (2), LED is set
Chip (5).
LED wiring board the most according to claim 1, it is characterised in that: line layer is placed equidistant pad position on (2)
(21), pad position (21) welding LED chip (5).
10. one kind eliminates the application process of glimmer after LED power-off, it is characterised in that: the positive pole circuit of line layer (2) used
The conductive electrode flaggy (4) of hole insulated base material layer (1) and bottom couples together and forms inductance capacitance circuit, after a loss of power by LED
Pearl P junction voltage guides to conductive electrode flaggy (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864091.2A CN106287260B (en) | 2016-09-29 | 2016-09-29 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864091.2A CN106287260B (en) | 2016-09-29 | 2016-09-29 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106287260A true CN106287260A (en) | 2017-01-04 |
| CN106287260B CN106287260B (en) | 2022-08-05 |
Family
ID=57716371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610864091.2A Active CN106287260B (en) | 2016-09-29 | 2016-09-29 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106287260B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031657A (en) * | 2019-12-10 | 2020-04-17 | 欧普照明股份有限公司 | LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board |
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|---|---|---|---|---|
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| CN201902900U (en) * | 2010-11-26 | 2011-07-20 | 四川新力光源有限公司 | Alternating-current LED (light-emitting diode) fluorescent lamp |
| CN202697035U (en) * | 2012-08-01 | 2013-01-23 | 田茂福 | LED circuit board with conducting adhesive lines, and LED lamp band |
| CN202721893U (en) * | 2012-06-26 | 2013-02-06 | 田茂福 | Aluminum-based circuit board and LED lamp bar |
| CN103542386A (en) * | 2013-11-01 | 2014-01-29 | 深圳市九洲光电科技有限公司 | Light-emitting diode (LED) substrate and high voltage resistant LED lamp |
| CN203895504U (en) * | 2013-12-30 | 2014-10-22 | 广州市鸿利光电股份有限公司 | LED light source for stage lamp |
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| CN204894670U (en) * | 2015-08-24 | 2015-12-23 | 浙江展邦电子科技有限公司 | LED lamps and lanterns are with aluminium base two -sided copper -clad plate |
| CN105898982A (en) * | 2016-06-30 | 2016-08-24 | 广东顺德施瑞科技有限公司 | High-voltage flexible circuit board and multi-layer flexible circuit board |
| CN206514084U (en) * | 2016-09-29 | 2017-09-22 | 东莞市善时照明科技有限公司 | A kind of LED wiring board and LED |
-
2016
- 2016-09-29 CN CN201610864091.2A patent/CN106287260B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994022281A1 (en) * | 1993-03-19 | 1994-09-29 | Fujitsu Limited | Laminated circuit board |
| CN201902900U (en) * | 2010-11-26 | 2011-07-20 | 四川新力光源有限公司 | Alternating-current LED (light-emitting diode) fluorescent lamp |
| CN202721893U (en) * | 2012-06-26 | 2013-02-06 | 田茂福 | Aluminum-based circuit board and LED lamp bar |
| CN202697035U (en) * | 2012-08-01 | 2013-01-23 | 田茂福 | LED circuit board with conducting adhesive lines, and LED lamp band |
| CN103542386A (en) * | 2013-11-01 | 2014-01-29 | 深圳市九洲光电科技有限公司 | Light-emitting diode (LED) substrate and high voltage resistant LED lamp |
| CN203895504U (en) * | 2013-12-30 | 2014-10-22 | 广州市鸿利光电股份有限公司 | LED light source for stage lamp |
| CN204721722U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of easily extensible multi-layer flexible circuit board |
| CN204894670U (en) * | 2015-08-24 | 2015-12-23 | 浙江展邦电子科技有限公司 | LED lamps and lanterns are with aluminium base two -sided copper -clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031657A (en) * | 2019-12-10 | 2020-04-17 | 欧普照明股份有限公司 | LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106287260B (en) | 2022-08-05 |
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Effective date of registration: 20231226 Address after: No. 5 Shengxing Street, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN XINHAI METAL PRODUCTS Co.,Ltd. Address before: 523000 third floor, No. 1, Weiming Road, hengzeng Avenue, Xin'an community, Chang'an Town, Dongguan City, Guangdong Province Patentee before: Dongguan Sense Lighting Technology Co.,Ltd. |