CN202058730U - LED device with high heat-conductive insulated base packaging - Google Patents
LED device with high heat-conductive insulated base packaging Download PDFInfo
- Publication number
- CN202058730U CN202058730U CN2011201443456U CN201120144345U CN202058730U CN 202058730 U CN202058730 U CN 202058730U CN 2011201443456 U CN2011201443456 U CN 2011201443456U CN 201120144345 U CN201120144345 U CN 201120144345U CN 202058730 U CN202058730 U CN 202058730U
- Authority
- CN
- China
- Prior art keywords
- basal plane
- metal
- heat
- weld metal
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 103
- 239000002184 metal Substances 0.000 claims abstract description 103
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 239000006071 cream Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
An LED device with high heat-conductive insulated base packaging comprises an insulated heat-conductive plate, a metal radiator and LED lamp chips. A weldable first metal base surface and a weldable second metal base surface are arranged on the upper surface and the lower surface of the insulated heat-conductive plate respectively and insulated mutually, a weldable third metal base surface is arranged on the top surface of the metal radiator, the weldable third metal base surface and the weldable second metal base surface are welded, the insulated heat-conductive plate and the metal radiator are welded into a whole, and the LED lamp chips are welded on the weldable first metal base surface. The LED lamp chips and the metal radiator are insulated, the insulated heat-conductive plate not only has high heat conductivity coefficient but also has extremely high electrical isolation effect, so that the problem of no resistance to high voltage of a high-power LED device is solved, and further popularization and application of the high-power LED devices on road lamps and factory illumination and decrease of maintenance rate are guaranteed.
Description
Technical field
The utility model relates to the manufacturing technology of LED device packaging technique and integrated circuit (IC) chip, especially relates to the manufacturing technology that a kind of high-capacity LED lamp chip base adopts the encapsulation of high heat conductive insulating pedestal.
Background technology
The energy-saving and environmental protection that the LED new type light source is had, life-span are long, toggle speed is fast, can control luminescent spectrum and forbid making more advantages of higher of brightness with the size of the width of cloth, make conventional light source to have obtained developing on an unprecedented scale with its analogy.
Be accompanied by increasing the actual demand of LED lamp luminous quantity, the high-capacity LED lamp chip arises at the historic moment.Thing followed problem is, for the LED lamp, 80% of the electric energy of importing all consumes with the form of heat.If these heats that can not in time apace LED wick sheet be produced distribute, temperature-rise effect not only makes the light output of LED lamp have a greatly reduced quality, and the life-span of led chip also will significantly reduce.
The traditional fabrication technology of LED lamp is to consider design heat dissipating method and structure from the angle of single led wick sheet and pedestal encapsulation.The shortcoming of this method for designing is: be used for the best radiating mode of radiating effect---heat conducting material volume is little, the heat conducting and radiating area is little, and air flow passage disorder between pedestal, radiating efficiency is low; Pedestal need be processed a plurality of tiny through hole complex manufacturing technology, cost of manufacture height; Consumptions such as precious metal material silver, tungsten, molybdenum are big.Just there are the problems referred to above in for example Chinese utility model patent CN 101252162A " a kind of high-power LED ceramic package base ".
It is to be noted especially, great power LED device of the prior art, LED wick sheet and metal base all are electrical communication, for improving the capacity of heat transmission of metal base to radiator, metal base directly can be linked to each other with radiator, when such great power LED device is used for occasions such as street lamp, industrial light, the induction of the high-voltage electrical apparatus of thunder and lightning and factory's complexity, tend to be higher than 20% device breakdown damage, this has been confirmed when the LED light fixture keeps in repair repeatedly.As addressing this problem, then need between LED metal base and radiator, add an insulating material, very low owing to can not closely contacting with the conductive coefficient of insulating material, the contradictory problems that therefore solves between the anti-puncture of LED wick sheet and the raising capacity of heat transmission is a problem that needs to be resolved hurrily.
The utility model content
In order to solve the anti-breakdown problem of LED wick sheet that exists in the prior art, the utility model proposes a kind of LED high heat conductive insulating pedestal packaged device.
The utility model is by realizing by the following technical solutions:
Manufacture and design a kind of LED high heat conductive insulating pedestal packaged device, described device comprises:
The insulating heat-conductive plate;
Metal heat sink;
LED wick sheet; But one deck weld metal first basal plane that the upper surface of described insulating heat-conductive plate has plating adopted or sintering process to make;
At the lower surface of described insulating heat-conductive plate, but one deck weld metal second basal plane that has plating adopted or sintering process to make;
But it is but insulated from each other between described weld metal first basal plane and weld metal second basal plane;
But the end face of described metal heat sink has one deck weld metal the 3rd basal plane;
But but welding or metal are connected between described weld metal the 3rd basal plane and weld metal second basal plane, and described insulating heat-conductive plate and described metal heat sink are linked into an integrated entity;
But described LED wick sheet is welded on weld metal first basal plane.
The structure of described insulating heat-conductive plate is included in conductive coefficient and is higher than 30 highly heat-conductive carbon/ceramic
But but the thin layer of the two sides of porcelain thin slice preparation weld metal first basal plane and weld metal second basal plane.
The LED wick sheet of preparation more than one on the described insulating heat-conductive plate.
But can realize being connected with the bonding mode of high hot elargol between LED wick sheet and weld metal first basal plane.
Compared with the prior art, the utility model has the advantages that:
LED lamp components with the utility model making, insulate between LED wick sheet and the metal heat sink, the existing high conductive coefficient of one deck insulating heat-conductive plate, high electrical isolation effect is arranged again, thereby solved the not high voltage bearing problem of great power LED lamp components, for the great power LED lamp components is further applied in street lamp, industrial light, reducing maintenance rate provides assurance.
Description of drawings
Fig. 1 is the LED high heat conductive insulating pedestal packaged device schematic diagram of a plurality of LED wick of the utility model sheet.
The drawing reference numeral explanation
1 insulating heat-conductive plate.
But 11 weld metals, first basal plane.
But 12 weld metals, second basal plane.
2 metal heat sinks.
But 21 weld metals the 3rd basal plane.
3 solder(ing) pastes.
4 LED wick sheets.
5 solder(ing) pastes.
Embodiment
In order to further specify the utility model, an existing preferred embodiment of the present utility model shown in conjunction with the accompanying drawings is elaborated, yet the described embodiment usefulness for furnishing an explanation and explaining only can not be used for limiting scope of patent protection of the present utility model.
As shown in Figure 1, manufacture and design a kind of LED high heat conductive insulating pedestal packaged device, described device comprises:
Insulating heat-conductive plate 1;
But it is but insulated from each other between described weld metal first basal plane 11 and weld metal second basal plane 12;
But the end face of described metal heat sink 2 has one deck weld metal the 3rd basal plane 21;
But but welding or metal are connected between described weld metal the 3rd basal plane 21 and weld metal second basal plane 12, and described insulating heat-conductive plate 1 and described metal heat sink 2 are linked into an integrated entity;
But described LED wick sheet 4 is welded on weld metal first basal plane 11.
The structure of described insulating heat-conductive plate 1 is included in conductive coefficient and is higher than 30 highly heat-conductive carbon/ceramic
But but the thin layer of the two sides of porcelain thin slice preparation weld metal first basal plane 11 and weld metal second basal plane 12.
The LED wick sheet 4 of preparation more than one on the described insulating heat-conductive plate 1.
But can realize being connected with the bonding mode of high hot elargol between LED wick sheet 4 and weld metal first basal plane 11.
The utility model can be made the workpiece of many LED wicks of large tracts of land sheet 4, cuts then, is divided into little unit.
But the utility model can utilize prior aries such as plating, soldering, sintering, sputter to realize adhering to of weld metal basal plane, and the material that described insulating heat-conductive plate 1 can be selected for use is more, does not exemplify one by one at this.
The utility model can freely be chosen the size of pedestal according to actual needs, because the material of pedestal is full of near the space the LED wick sheet, during the utility model work, the heat that LED wick sheet produces, with the highest heat exchange pattern of heat transfer efficiency, conduct fast by described insulating heat-conductive plate and radiator.
The utility model has two kinds of technologies when encapsulation high heat conductive insulating pedestal, first kind of technology comprises the steps:
1., insulating heat-conductive plate 1 of preparation, at the upper surface of described insulating heat-conductive plate 1,, but adopt plating or sintering process to make one deck weld metal first basal plane 11 at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate 1, but adopt plating or sintering process to make one deck weld metal second basal plane 12;
But it is but insulated from each other between described weld metal first basal plane 11 and weld metal second basal plane 12;
2., preparation one metal heat sink 2, but make one deck weld metal the 3rd basal plane 21 at the end face of described metal heat sink 2, this basal plane can carry out soldering or metal connects;
But 3., on weld metal first basal plane 11 predeterminated positions of insulating heat-conductive plate 1, be coated with
Cover the high temperature tin cream, this high temperature tin cream fusion temperature 〉=250 ℃, the bottom that LED wick sheet 4 is coated with metal level is placed on the high temperature tin cream then, and closely contact; Again insulating heat-conductive plate 1 and LED wick sheet 4 together are heated to more than 250 ℃, LED wick sheet 4 and insulating heat-conductive plate 1 are welded together; But then Herba Anoectochili roxburghii is welded on the circuit on weld metal first basal plane 11 on LED wick sheet 4 electrodes and the insulating heat-conductive plate 1, or Herba Anoectochili roxburghii is welded on the electric current that forms the LED lamp on the electrode of adjacent LED wick sheet 4 and goes the same way; To be coated in the fluorescent material that glue mixes then on the LED wick sheet 4, form a complete LED encapsulation;
But 4., then on weld metal the 3rd basal plane 21 of described metal heat sink 2,
Apply the eutectic welding tin cream, 180 ℃～249 ℃ of its fusion temperatures, but weld metal second basal plane 12 with the insulating heat-conductive plate 1 in the described LED encapsulation closely contacts with described eutectic welding tin cream then, they are heated to the fusion temperature of eutectic welding tin cream jointly, make described insulating heat-conductive plate 1 and described metal heat sink 2 integrally welded.
The 1. described insulating heat-conductive plate 1 of step is made of high heat-conducting ceramic, and described high heat-conducting ceramic comprises that conductive coefficient is higher than 30 aluminium oxide, aluminium nitride;
But but but the metal material of described weld metal first basal plane 11 weld metals second basal plane 12 weld metals the 3rd basal plane 21 comprises gold, silver, copper, nickel;
The material of described metal heat sink 2 comprises aluminium alloy, steel, copper, high heat-conducting ceramic.
The LED wick sheet 4 of preparation more than one on the described insulating heat-conductive plate 1.
But can also be with high hot elargol between LED wick sheet 4 and weld metal first basal plane 11
Bonding mode realizes connecting.
Second kind of technology, step is as follows:
1., insulating heat-conductive plate 1 of preparation, at the upper surface of described insulating heat-conductive plate 1,, but adopt plating or sintering process to make one deck weld metal first basal plane 11 at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate 1, but adopt plating or sintering process to make one deck weld metal second basal plane 12;
But it is but insulated from each other between described weld metal first basal plane 11 and weld metal second basal plane 12;
2., preparation one metal heat sink 2, but make one deck weld metal the 3rd basal plane 21 at the end face of described metal heat sink 2, this basal plane can carry out soldering or metal connects;
But 3., then on weld metal the 3rd basal plane 21 of metal heat sink 2
The coated with high temperature tin cream, its fusing point 〉=250 ℃, but again weld metal second basal plane 12 of insulating heat-conductive plate 1 is placed on the high temperature tin cream, closely contact together is heated to above 250 ℃, and they are welded together;
But the weld metal first that 4., default circuit is arranged on insulating heat-conductive plate 1 then
Apply the low temperature tin cream on basal plane 11 predeterminated positions, 180 ℃～249 ℃ of its fusion temperatures,
Metal covering with LED wick sheet 4 is placed on the low temperature tin cream then, together be heated to the fusion temperature of tin cream then, they are welded together, and then but Herba Anoectochili roxburghii is welded on the circuit on weld metal first basal plane 11 on LED wick sheet 4 electrodes and the insulating heat-conductive plate 1, or Herba Anoectochili roxburghii is welded on the current path that forms the LED lamp on the electrode of adjacent LED wick sheet 4, on the chip of insulation board, apply fluorescent material more at last.
The utility model has satisfactorily resolved the anti-puncture technical problem of LED light fixture.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. LED high heat conductive insulating pedestal packaged device is characterized in that described device comprises:
Insulating heat-conductive plate (1);
Metal heat sink (2);
LED wick sheet (4); Described insulating heat-conductive plate (1) but upper surface one deck weld metal first basal plane (11) of having plating adopted or sintering process to make; At the lower surface of described insulating heat-conductive plate (1), but one deck weld metal second basal plane (12) that has plating adopted or sintering process to make;
But described weld metal first basal plane (11) but and insulated from each other between weld metal second basal plane (12);
Described metal heat sink (2) but end face one deck weld metal the 3rd basal plane (21) is arranged;
But described weld metal the 3rd basal plane (21) but with weld metal second basal plane (12) between welding or metal is connected, described insulating heat-conductive plate (1) and described metal heat sink (2) are linked into an integrated entity;
Described LED wick sheet (4) but the welding or metal be connected on weld metal first basal plane (11).
2. LED high heat conductive insulating pedestal packaged device according to claim 1 is characterized in that: described insulating heat-conductive plate (1) but structure be included in conductive coefficient be higher than 30 high heat-conducting ceramic thin slice two sides preparation weld metal first basal plane (11) but and the thin layer of weld metal second basal plane (12).
3. LED high heat conductive insulating pedestal packaged device according to claim 1 is characterized in that: the LED wick sheet (4) of preparation more than one on the described insulating heat-conductive plate (1).
4. LED high heat conductive insulating pedestal packaged device according to claim 1 is characterized in that:
LED wick sheet (4) but with weld metal first basal plane (11) between realize being connected with the bonding mode of high hot elargol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201443456U CN202058730U (en) | 2011-05-09 | 2011-05-09 | LED device with high heat-conductive insulated base packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201443456U CN202058730U (en) | 2011-05-09 | 2011-05-09 | LED device with high heat-conductive insulated base packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202058730U true CN202058730U (en) | 2011-11-30 |
Family
ID=45018696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201443456U Expired - Fee Related CN202058730U (en) | 2011-05-09 | 2011-05-09 | LED device with high heat-conductive insulated base packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202058730U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051377A (en) * | 2013-03-14 | 2014-09-17 | 通用电气公司 | Power coverage structure and method of making the same |
| CN105261693A (en) * | 2015-10-25 | 2016-01-20 | 复旦大学 | Integrated package structure for super power vertical chip |
-
2011
- 2011-05-09 CN CN2011201443456U patent/CN202058730U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051377A (en) * | 2013-03-14 | 2014-09-17 | 通用电气公司 | Power coverage structure and method of making the same |
| CN104051377B (en) * | 2013-03-14 | 2020-02-21 | 通用电气公司 | Power cover structure and method of making the same |
| CN105261693A (en) * | 2015-10-25 | 2016-01-20 | 复旦大学 | Integrated package structure for super power vertical chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201307606Y (en) | Novel ceramic package base | |
| CN102208498A (en) | Method and device for packaging light-emitting diode (LED) high-heat-conduction insulated base | |
| CN201412704Y (en) | A light source with integrated LED chips | |
| CN201246695Y (en) | Ceramic heat radiation substrate for chip LED encapsulation | |
| CN102109116A (en) | Led light module and led chip | |
| CN101707234A (en) | LED luminescence module and manufacture method thereof | |
| CN101349417A (en) | High thermal conductivity gap filler material for LED lamp heat dissipation technology | |
| CN100375300C (en) | high power light emitting diode | |
| JP2005101658A (en) | Light emitting device having high efficiency heat dissipation structure | |
| WO2011124019A1 (en) | Led lampwick, led chip, and method for manufacturing led chip | |
| CN100593852C (en) | High Power LED Compatible Integrated Package Module | |
| CN201689910U (en) | LED wick and LED chip for lighting | |
| CN206312938U (en) | A kind of high-power flip LED light source | |
| CN202058730U (en) | LED device with high heat-conductive insulated base packaging | |
| CN101982875B (en) | Packaging structure of N substrate diode half bridges with common anodes in TO-220 | |
| CN104867888A (en) | High-heat-dissipation SiC power module | |
| CN204088317U (en) | LED chip integration module, light source and fixed structure thereof | |
| CN206221990U (en) | A kind of LED lamp | |
| CN102013452B (en) | LED wick, LED chip and manufacturing method | |
| CN201780997U (en) | Heat radiating structure used in LED chip | |
| CN206514084U (en) | LED lamp circuit board and LED lamp | |
| CN210805758U (en) | A double-sided hybrid heat dissipation structure for high power density IGBT modules | |
| CN207621944U (en) | Flexible base board combination heat-pipe radiating apparatus | |
| CN208566353U (en) | A kind of light source device structure | |
| CN205264751U (en) | Low thermal resistance LED light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20140509 |