CN207560437U - High-power led circuit board - Google Patents
High-power led circuit board Download PDFInfo
- Publication number
- CN207560437U CN207560437U CN201721473063.4U CN201721473063U CN207560437U CN 207560437 U CN207560437 U CN 207560437U CN 201721473063 U CN201721473063 U CN 201721473063U CN 207560437 U CN207560437 U CN 207560437U
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- Prior art keywords
- aluminum substrate
- layer
- circuit board
- power led
- led circuit
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Abstract
The utility model is related to a kind of high-power LED circuit board, including：Aluminum substrate has upper surface and the lower surface opposite with the upper surface；Alumina insulating layer, positioned at the upper surface and the lower surface of the aluminum substrate, the aluminum substrate to be made to be electrically insulated with the external world；Electro-plated pottery layer, positioned at the surface of the alumina insulating layer；Conductor layer, is printed in the surface of the electro-plated pottery layer, and forms preset conducting wire；Wherein, the aluminum substrate has several through-holes that another side is extended to by the aluminum substrate one side, to form the circulation passage of coolant.Above-mentioned high-insulativity wiring board, which utilizes to be equipped with successively on aluminum substrate, changes aluminum insulation layer, electro-plated pottery layer to increase the insulating properties of wiring board, achievees the effect that the insulating properties of wiring board.Meanwhile above-mentioned coolant with heat caused by taking away great power LED work, can just achieve the effect that high efficiency heat radiation from the flowing in the through-hole of above-mentioned aluminum substrate in this way.
Description
Technical field
The utility model is related to LED field, more particularly to high-power LED circuit board.
Background technology
With the new line of global environmental consciousness, energy saving has become current trend.LED industry is most to be looked steadily in recent years
One of purpose industry.Be developed so far, LED product has had energy saving, power saving, high efficiency, the reaction time is fast, life cycle is long and
It is not mercurous, there is environmental benefit.
Great power LED can generate a large amount of thermal energy at work at present, this just requires LED circuit board can be to produced by it
Thermal energy timely radiate, and the heat dissipation of current LED circuit board is unsatisfactory.
Utility model content
Based on this, it is necessary to for current LED circuit board heat dissipation effect it is undesirable the technical issues of, a kind of energy is provided
Enough reach the LED circuit board of high cooling efficiency.
A kind of high-power LED circuit board, including：
Aluminum substrate has upper surface and the lower surface opposite with the upper surface；
Alumina insulating layer, positioned at the upper surface and the lower surface of the aluminum substrate, to make the aluminum substrate and external world's electricity
Property insulation；
Electro-plated pottery layer, positioned at the surface of the alumina insulating layer；
Conductor layer, is printed in the surface of the electro-plated pottery layer, and forms preset conducting wire；
Wherein, the aluminum substrate has several through-holes that another side is extended to by the aluminum substrate one side, with
Form the circulation passage of coolant.
In a wherein preferred embodiment, the shape of the cross section of the through-hole is circle.
In a wherein preferred embodiment, the through-hole is arranged in array in the side of the aluminum substrate.
In a wherein preferred embodiment, the thickness of the aluminum substrate is at least 0.1mm.
In a wherein preferred embodiment, the shape of the cross section of the through-hole is circle, the circular through hole it is straight
Diameter is not more than 0.08mm.
In a wherein preferred embodiment, the conductor layer is formed by copper foil.
In a wherein preferred embodiment, the electro-plated pottery layer is silicon carbide ceramics layer.
In a wherein preferred embodiment, also there is insulation to gather between the electro-plated pottery layer and the conductor layer
Close nitride layer.
In a wherein preferred embodiment, the thickness of the dielectric polymers is 2 μm -5 μm.
In a wherein preferred embodiment, the thickness of the conductor layer is 5 μm~10 μm.
Above-mentioned high-insulativity wiring board, which utilizes to be equipped with successively on aluminum substrate, changes aluminum insulation layer, electro-plated pottery layer to increase line
The insulating properties of road plate achievees the effect that the insulating properties of wiring board.Meanwhile above-mentioned coolant can be out of, above-mentioned aluminum substrate through-hole
Flowing, with take away great power LED work caused by heat, just achieve the effect that high efficiency heat radiation in this way.
Description of the drawings
Fig. 1 is a kind of structure diagram of the high-power LED circuit board of preferred embodiment of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention is further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
It should be noted that when element is referred to as " being set to " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is only in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
As shown in Figure 1, one preferred embodiment of the utility model discloses a kind of high-power LED circuit board 100, the big work(
Rate LED circuit board 100 includes aluminum substrate 110, alumina insulating layer 120, electro-plated pottery layer 130 and conductor layer 140.
Above-mentioned high-insulativity wiring board 100 in present embodiment is the wiring board of Double-side line, in present embodiment
Above-mentioned aluminum substrate 110 can be thin sheet like plate, and usually, the thickness of the aluminum substrate 110 is at least 0.1mm, the thin plate in the form of sheets
Aluminum substrate 110 can have upper surface and the lower surface opposite with the upper surface.
Wherein, above-mentioned aluminum substrate 110 has several through-holes 111, these through-holes 111 are therein by above-mentioned aluminum substrate 110
One side extends to another side, to form the circulation passage of coolant.
In detail, the cross section of above-mentioned through-hole 111 is circle, and in other words, the global shape formed from through-hole 111 comes
It sees, the circulation passage for the coolant which is formed is cylindrical tubular structure.These several through-holes 111 are in arrange in array
It is distributed in the side of above-mentioned aluminum substrate 110.More specifically, the thickness of above-mentioned aluminum substrate is at least 0.1mm, and above-mentioned circular through hole
Diameter is not more than 0.08mm.
Above-mentioned alumina insulating layer 120 is located at the upper surface of above-mentioned aluminum substrate 110, mainly make above-mentioned aluminum substrate 110 with it is outer
Boundary is electrically insulated.
Above-mentioned electro-plated pottery layer 130 is located at the surface of above-mentioned alumina insulating layer 120.Specifically, above-mentioned electro-plated pottery layer
130 can be silicon carbide ceramics layer.
The above-mentioned printing of conductor layer 140 and the surface of above-mentioned electro-plated pottery layer 130, and on the surface of its electro-plated pottery layer 130
Form preinstalled circuit.
In more detail, there can also be insulating polymer between above-mentioned electro-plated pottery layer 130 and above-mentioned conductor layer 140
Layer, can enhance the insulation performance between above-mentioned conductor layer 140 and aluminum substrate 110 in this way.Usually, which can
It is referred and synthesized with including butadiene-styrene rubber or butadiene-styrene rubber with aluminium oxide, in this way, the dielectric polymers can both have high insulation
Property, can also have high-termal conductivity.In present embodiment, the thickness of above-mentioned dielectric polymers is 2 μm -5 μm.Above-mentioned conductor layer
Thickness can be 5 μm~10 μm.
Above-mentioned conductor layer is formed by copper foil.
Above-mentioned high-insulativity wiring board, which utilizes to be equipped with successively on aluminum substrate, changes aluminum insulation layer, electro-plated pottery layer to increase line
The insulating properties of road plate achievees the effect that the insulating properties of wiring board.Meanwhile above-mentioned coolant can be from the logical of above-mentioned aluminum substrate 110
Flowing in hole 111, with take away great power LED work caused by heat, just achieve the effect that high efficiency heat radiation in this way.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that the common skill for this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of high-power LED circuit board, which is characterized in that including：
Aluminum substrate has upper surface and the lower surface opposite with the upper surface；
Alumina insulating layer, positioned at the upper surface and the lower surface of the aluminum substrate, to make the aluminum substrate electrically exhausted with the external world
Edge；
Electro-plated pottery layer, positioned at the surface of the alumina insulating layer；
Conductor layer, is printed in the surface of the electro-plated pottery layer, and forms preset conducting wire；
Wherein, the aluminum substrate has several through-holes that another side is extended to by the aluminum substrate one side, cold to be formed
But the circulation passage of liquid.
2. high-power LED circuit board according to claim 1, which is characterized in that the shape of the cross section of the through-hole is
It is round.
3. high-power LED circuit board according to claim 1, which is characterized in that the through-hole is arranged in array in described
The side of aluminum substrate.
4. high-power LED circuit board according to claim 1, which is characterized in that the thickness of the aluminum substrate is at least
0.1mm。
5. high-power LED circuit board according to claim 4, which is characterized in that the shape of the cross section of the through-hole is
Circle, the diameter of the circular through hole are not more than 0.08mm.
6. high-power LED circuit board according to claim 1, which is characterized in that the conductor layer is formed by copper foil.
7. high-power LED circuit board according to claim 1, which is characterized in that the electro-plated pottery layer is made pottery for silicon carbide
Enamel coating.
8. high-power LED circuit board according to claim 1, which is characterized in that led in the electro-plated pottery layer with described
Also there are dielectric polymers between line layer.
9. high-power LED circuit board according to claim 1, which is characterized in that the thickness of the dielectric polymers is 2
μm-5μm。
10. high-power LED circuit board according to claim 1, which is characterized in that the thickness of the conductor layer for 5 μm~
10μm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721473063.4U CN207560437U (en) | 2017-11-07 | 2017-11-07 | High-power led circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721473063.4U CN207560437U (en) | 2017-11-07 | 2017-11-07 | High-power led circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207560437U true CN207560437U (en) | 2018-06-29 |
Family
ID=62682417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721473063.4U Active CN207560437U (en) | 2017-11-07 | 2017-11-07 | High-power led circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207560437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660067A (en) * | 2017-11-07 | 2018-02-02 | 百硕电脑(苏州)有限公司 | High-power led circuit board |
-
2017
- 2017-11-07 CN CN201721473063.4U patent/CN207560437U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660067A (en) * | 2017-11-07 | 2018-02-02 | 百硕电脑(苏州)有限公司 | High-power led circuit board |
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