CN105128454B - A kind of double-side aluminum copper-clad plate of LED lamp - Google Patents
A kind of double-side aluminum copper-clad plate of LED lamp Download PDFInfo
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- CN105128454B CN105128454B CN201510522948.8A CN201510522948A CN105128454B CN 105128454 B CN105128454 B CN 105128454B CN 201510522948 A CN201510522948 A CN 201510522948A CN 105128454 B CN105128454 B CN 105128454B
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- copper
- copper foil
- insulating barrier
- foil layer
- clad plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
Abstract
The present invention provides the double-side aluminum copper-clad plate of a kind of LED lamp, this copper-clad plate includes aluminum base layer, the first insulating barrier being separately positioned on aluminum base layer two sides and the second insulating barrier, it is arranged on the first insulating barrier and away from aluminum base layer the first copper foil layer simultaneously, arrange over the second dielectric and away from aluminum base layer one side the second copper foil layer, on the first copper foil layer and the second copper foil layer formed circuitous pattern；Multiple exposed circular arc is set at this copper-clad plate circumference side and connects via, connect and carry out copper facing, for electrical connection the first copper foil layer and the second copper foil layer at its insulation inwall after via inwall arranges the 3rd insulating barrier.Use technical scheme, by be used for levels circuit electrical connect via be arranged on copper-clad plate circumferential side and exposed outside, thus without using complicated technique to prepare the via of aluminium base, avoid the generation of parasitic capacitance simultaneously, improve the anti-interference function of circuit board further.
Description
Technical field
The present invention relates to LED circuit board technical field, particularly relate to the double-side aluminum copper-clad plate of a kind of LED lamp.
Background technology
Aluminum-based copper-clad plate is one of key components of LED lamp, in the prior art, is typically provided in LED lamp
Two pieces of wiring boards, one piece of aluminum-based copper-clad plate being to load LED lamp, another block is the driving plate driving LED lamp, along with LED
Light fixture constantly develops to the direction of high-performance, small size, especially in the field of the lamp interior limited spaces such as Down lamp, within it sets
Two pieces of wiring boards make lamp interior the most crowded, are unfavorable for that light fixture dispels the heat, and the design and installation to wiring board are proposed
Higher requirement.Using double-face aluminium substrate, i.e. one side to load LED lamp in LED lamp, another side is for driving plate, which
The dimensional space of light fixture can be reduced, but prior art double-face aluminium substrate generally covers copper after aluminum base layer two sides arranges insulating barrier
Layers of foil, owing to aluminum base layer is metal material, needs first to carry out insulation processing when crossing hole machined, then makes metallic vias, preparation
Technique is extremely complex；Simultaneously because LED lamp is unequal with the heat dissipation capacity of driving plate, the big heat of LED lamp is diffused into driving
Plate influences whether to drive the normal work of plate, thus affects lamp life.Aluminum-based copper-clad plate is carried simultaneously heat radiation, voltage are also
It is being continuously increased, it is being proposed high heat conduction requirement pressure, high.To this end, people have carried out long-term exploration, it is proposed that of all kinds
Solution.
Such as, Chinese patent literature discloses the manufacture method of a kind of double-side aluminum circuit board, [application number:
201110275598.1], utilize the resin glue of PP to use the mode of press evacuation to fill conductive hole, solve the bubble in hole wall
A difficult problem；Make in this way, turn in the hole of upper and lower copper foil layer can be solved, not short-circuit with the aluminium base being pressed together on centre,
Conductive hole is not conducted electricity with aluminium base, improves finished product yield, reduce production cost.
Above-mentioned technical scheme improves prior art to a certain extent, particularly proposes a kind of in aluminium base making
The method of via, but prepare double-face aluminium substrate by which, when making via, technique is complex, adds aluminium base
Cost so that it is apply, in Low-cost LED lamp tool field, there is certain limitation.
Summary of the invention
In order to solve the problem that prior art exists, it is an object of the invention to provide a kind of perfect heat-dissipating, via system
The double-side aluminum copper-clad plate of standby simple LED lamp.
In order to solve the problem that prior art exists, it is an object of the invention to provide a kind of simple LED lamp of technique
The preparation method of double-side aluminum copper-clad plate.
The double-side aluminum copper-clad plate of a kind of LED lamp, this copper-clad plate includes aluminum base layer, is separately positioned on described aluminum base layer
First insulating barrier on two sides and the second insulating barrier, be arranged on described first insulating barrier and away from aluminum base layer the first Copper Foil simultaneously
Layer, is arranged on described second insulating barrier and away from the second copper foil layer of aluminum base layer one side, described first copper foil layer and described the
Circuitous pattern is formed on two copper foil layers；Multiple exposed circular arc is set at this copper-clad plate circumference side and connects via, described company
Take over and carry out copper facing at its insulation inwall after hole inwall arranges the 3rd insulating barrier, be used for being electrically connected described first copper foil layer and institute
State the second copper foil layer.
Preferably, the circuitous pattern of described first copper foil layer is the light bar circuit that can be provided with multiple LED chip, described second
The circuitous pattern of copper foil layer is the drive circuit of the plurality of LED chip；This copper-clad plate also includes being arranged on described aluminum base layer and institute
State the thermal insulation layer between the second insulating barrier.
Preferably, first described first copper foil layer and described second copper foil layer are printed, etching processing shape thereon
It is separately positioned on again on described first insulating barrier and described second insulating barrier after becoming circuitous pattern.
Preferably, described first insulating barrier and described second insulating barrier are semi-solid preparation resin sheet, and this semi-solid preparation resin sheet is
The compositions that epoxy resin intermixture by 65%～85% and 15%～35% nano inorganic filler form；Described epoxy
Mixed with resin agent includes vitreous epoxy resin, amion-terminated polyurethane, phenolic resin, methylimidazole and acetone；Described nanometer without
Machine filler includes α-Al2O3Ceramics, carborundum and tetragonal phase zirconium oxide, described α-Al2O3Ceramics described nanometer without
The quality accounting of machine filler is 40%～65%, and described carborundum is 33% in the quality accounting of described nano inorganic filler
～55%, described tetragonal phase zirconium oxide is 1%～8% in the quality accounting of described nano inorganic filler.
Preferably, described 3rd insulating barrier is semi-solid preparation resin sheet.
The present invention also provides for the manufacture method of the double-side aluminum copper-clad plate of a kind of LED lamp, and the method includes following step
Rapid:
S1: aluminium substrate plate is provided, and this aluminium substrate plate is carried out surface process preparation aluminum base layer；
S2: preparing semi-solid preparation resin sheet, described semi-solid preparation resin sheet preparation process is as follows:
(1) by vitreous epoxy resin, 10%～the amion-terminated polyurethane of 40% that quality accounting is 35%～60%, 15%
～the methylimidazole of the phenolic resin of 40%, 1%～3% and the acetone mix homogeneously of 5%～35%, continuous stirring 20～40
Stand 1～3 hour after minute, prepare epoxy resin intermixture；
(2) by α-Al that quality accounting is 40%～65%2O3Ceramics, the carborundum of 33%～55% and 1%～8%
Tetragonal phase zirconium oxide mix homogeneously, prepare nano inorganic filler；
(3) epoxy resin intermixture and 15%～35% nano inorganic filler that mass ratio is 65%～85% are mixed
Uniformly, semi-solid preparation resin binder is prepared；
(4) utilize silk screen printing to be coated on the surface of aluminum base layer by above-mentioned semi-solid preparation resin binder, form described half
Solidification resin sheet；
S3 a: Copper Foil is provided and this Copper Foil is carried out surface process preparation the first copper foil layer and the second copper foil layer；
S4: surface pressing that described first copper foil layer and described second copper foil layer are placed in described semi-solid preparation resin sheet are
Integrally obtaining double-side aluminum copper-clad plate, described semi-solid preparation resin sheet solidify to form the first insulating barrier and the second insulating barrier；
S5: multiple exposed circular arc is set at this copper-clad plate circumference side and connects via, in described connection via
Wall arranges one layer of semi-solid preparation resin binder and makes it solidify to form the 3rd insulating barrier, plates at described 3rd insulating barrier inwall
Copper, makes described first copper foil layer and described second copper foil layer electrical connection.
Preferably, further include steps of in described step S4
Form circuitous pattern at described first copper foil layer and described second copper foil layer, described first copper foil layer is printed
Brush, etching processing are formed on light bar circuit, and and described second copper foil layer is printed, etching processing shape thereon
Become drive circuit；
Described first copper foil layer and described second copper foil layer are placed in the surface of described semi-solid preparation resin sheet and form one and treat
To this, laminate structures, treats that laminate structures is heated to described semi-solid preparation resin sheet and melts with the heating rate less than 5 DEG C/min,
And under certain pressure effect, by described the most solid for being pressed together on of the circuitous pattern of described first copper foil layer and described second copper foil layer
Change the surface of resin sheet, then make described semi-solid preparation resin sheet solidify to form the first insulating barrier with the rate of temperature fall less than 5 DEG C/min
With the second insulating barrier.
Preferably, further include steps of in described step S4
Described first copper foil layer and described second copper foil layer are placed in the surface of described semi-solid preparation resin sheet, make the first Copper Foil
Layer, the first insulating barrier, aluminum base layer, the second insulating barrier and the second copper foil layer are built up by order from top to bottom and to be laminated cover copper
Plate；
Above-mentioned copper-clad plate to be laminated is put into vacuum bag and this vacuum bag is carried out evacuation process；
Vacuum bag is put into hermetic container and in this hermetic container, is full of heating liquid medium；
Pressurize described hermetic container, heat treatment makes semi-solid preparation resin sheet solidify.
Preferably, described liquid medium is hydraulic oil, described hermetic container is forced into 2～10MPa, and makes described hydraulic pressure
Oil is at the uniform velocity warming up to 60 to 80 DEG C.
Preferably, further comprising the steps of:
A thermal insulation layer, described thermal insulation layer is provided to be arranged between described aluminum base layer and described second insulating barrier, with pressing
Mode is integrated with copper-clad plate.
Relative to prior art, use technical scheme, the via being used for the connection of levels circuit electrical is set
Put copper-clad plate circumferential side and exposed outside, outside it is carried out insulation processing owing to via is exposed relatively easy, simultaneously
Simpler copper-plating technique is used to realize levels connection, thus without using complicated technique to prepare the mistake of aluminium base
Hole, avoids the generation of parasitic capacitance simultaneously, improves the anti-interference function of circuit board further.Simultaneously heat insulation by arranging
Layer, makes the heat between upper and lower copper foil layer mutually to conduct, thus ensures the normal circuit operation on copper foil layer.
Accompanying drawing explanation
The structural representation of the double-side aluminum copper-clad plate of the LED lamp that Fig. 1 provides for the embodiment of the present invention.
The double-side aluminum copper-clad plate of the LED lamp that Fig. 2 provides for the embodiment of the present invention connects the schematic diagram of via.
The another kind of structural representation of the double-side aluminum copper-clad plate of the LED lamp that Fig. 3 provides for the embodiment of the present invention.
The flow chart of the manufacture method of the double-side aluminum copper-clad plate of the LED lamp that Fig. 4 provides for the embodiment of the present invention.
Component symbol explanation
Aluminum base layer 1, the first insulating barrier 2, the second insulating barrier 3, the first copper foil layer 4, the second copper foil layer 5, connect via 6, the
Three insulating barriers 7, thermal insulation layer 8.
Detailed description of the invention
The following is the specific embodiment of the present invention and combine accompanying drawing, technical scheme is further described,
But the present invention is not limited to these embodiments.
Multilayer circuit board of the prior art, the line layer in intermediate layer to connect with its levels circuit or outside line
Connect, be typically employed on wiring board the mode processing metallic vias.But double-face aluminium substrate is metal due to middle aluminum base layer
Material, needs first to carry out insulation processing when crossing hole machined, then makes metallic vias, and preparation technology is extremely complex；Simultaneously because
Metallic vias is internally formed metal level, so can produce parasitic capacitance.In the wiring board in LED lamp field, along with device
Miniaturization and mount technology continuous ripe, either light bar circuit or increasingly complex drive circuit can use
Paster technique realize, therefore, light bar circuit and drive circuit can use single sided board to realize, and in reality light bar circuit with drive
Electrical connection between galvanic electricity road is the most considerably less, can by use a kind of special in the way of realize the double-side aluminum of LED lamp and cover
Copper coin.
For the defect overcoming prior art to exist, refer to Fig. 1 and Fig. 2, show the LED that the embodiment of the present invention provides
The structural representation of the double-side aluminum copper-clad plate of light fixture, the embodiment of the present invention provides the double-side aluminum of a kind of LED lamp to cover
Copper coin, this copper-clad plate includes aluminum base layer 1, is separately positioned on first insulating barrier 2 and second insulating barrier 3 on described aluminum base layer 1 two sides,
It is arranged on described first insulating barrier 2 and away from aluminum base layer 1 the first copper foil layer 4 simultaneously, is arranged on described second insulating barrier 3
And away from the second copper foil layer 5 of aluminum base layer 1 one side, described first copper foil layer 4 and described second copper foil layer 5 form circuit diagram
Shape；Arranging multiple exposed circular arc at this copper-clad plate circumference side and connect via 6, described connection via 6 inwall arranges the 3rd
Carry out copper facing at its insulation inwall after insulating barrier 7, be used for being electrically connected described first copper foil layer 4 and described second copper foil layer 5.
Use technical scheme, the via being used for the connection of levels circuit electrical is arranged on the circumference of copper-clad plate
Side and exposed outside, outside it is carried out insulation processing owing to via is exposed relatively easy, uses simpler plating simultaneously
Process for copper realizes levels connection, thus without using complicated technique to prepare the via of aluminium base, avoids simultaneously and post
The generation of raw electric capacity, improves the anti-interference function of circuit board further.
In a preferred embodiment, the circuitous pattern of the first copper foil layer 4 is the light bar that can be provided with multiple LED chip
Circuit, the drive circuit that circuitous pattern is the plurality of LED chip of the second copper foil layer 5；Due to the heat distributed when LED chip works
Amount is very big, the driving electricity that the big heat distributed in order to avoid the light bar circuit of the first copper foil layer 4 has influence on the second copper foil layer 5
Road, sees Fig. 3, show the another kind of structural representation of the double-side aluminum copper-clad plate of the LED lamp that the embodiment of the present invention provides
Figure, the embodiment of the present invention is also included the thermal insulation layer 8 being arranged between aluminum base layer 1 and the second insulating barrier 3, is protected by this thermal insulation layer 8
Demonstrate,prove the big heat that the light bar circuit of the first copper foil layer 4 distributes and will not be transmitted to the second copper foil layer 5.Heat dissipation capacity due to drive circuit
Less, in prior art, drive circuit the most generally uses common epoxy circuit board, and therefore thermal insulation layer 8 does not interferes with drive circuit
Heat radiation.
Due to the existence of thermal insulation layer 8, the big heat distributed due to light bar circuit cannot conduct to the second copper foil layer 5, one
Determine affect in degree the heat radiation of light bar circuit, in order to improve the heat radiation of light bar circuit further, increase the thickness of aluminum base layer 1,
The thickness of aluminum base layer 1 is set to 1.5～3mm, it is preferable that its thickness can be 1.5mm, 2.0mm, 3.0mm etc..Meanwhile, exist
The circumferential side of aluminum base layer 1 offers zigzag gutter, increases the area that aluminum base layer 1 is outwardly dispelled the heat.The aluminium sheet that aluminum base layer 1 uses
Material model can be 1100,5052,6061 etc..
In a preferred embodiment, the first copper foil layer 4 and the second copper foil layer 5 are initially formed circuitous pattern to set again
Put on the first insulating barrier 2 and the second insulating barrier 3, first to the first copper foil layer 4 with the second copper foil layer 5 prints, etching processing
And be separately positioned on again after being formed on circuitous pattern on the first insulating barrier 2 and the second insulating barrier 3.
In a preferred embodiment, the first insulating barrier 2 and the second insulating barrier 3 are semi-solid preparation resin sheet, should be the most solid
Change the combination that resin sheet is the epoxy resin intermixture by 65%～85% and 15%～35% nano inorganic filler forms
Thing；Epoxy resin intermixture includes vitreous epoxy resin, amion-terminated polyurethane, phenolic resin, methylimidazole and acetone；Nanometer
Inorganic filler includes α-Al2O3Ceramics, carborundum and tetragonal phase zirconium oxide, α-Al2O3Ceramics is filled at nano inorganic
The quality accounting of agent is 40%～65%, and carborundum is 33%～55% in the quality accounting of nano inorganic filler, Tetragonal
Zirconium oxide is 1%～8% in the quality accounting of nano inorganic filler.
α-Al2O3Ceramics is mainly used in increasing the thermal conductivity of insulating barrier, and its purity is more than or equal to 99.9% and dispersed
In epoxy resin intermixture, α-Al2O3The content of ceramics should be appropriate.As α-Al2O3When the content of ceramics is relatively low, the
The thermal conductivity of one insulating barrier 2 and the second insulating barrier 3 cannot meet the cooling requirements of light bar circuit.As α-Al2O3The content of ceramics
Time higher, increase largely although thermal conductivity has, but resistance to pressure reduces, it is impossible to meet the resistance to pressure requirement of LED lamp.
Tetragonal phase zirconium oxide (t-ZrO2) relatively low in nano inorganic filler accounting, for improving the first insulating barrier 2 and the
The toughness of two insulating barriers 3 and the adhesion with aluminium base.
In a preferred embodiment, the 3rd insulating barrier 7 is semi-solid preparation resin sheet, set in the circumference of copper-clad plate
Connection via 6 on coat one layer of semi-solid preparation resin sheet described above, its solidification after formed the 3rd insulating barrier 7.Use above-mentioned skill
Art scheme, enormously simplify the insulation processing connecting via 6.
In order to solve the problem that prior art exists, seeing Fig. 4, the double-side aluminum showing LED lamp of the present invention covers
The flow chart of the manufacture method of copper coin, the method comprises the following steps:
S1: aluminium substrate plate is provided, and this aluminium substrate plate is carried out surface process preparation aluminum base layer 1；
S2: preparing semi-solid preparation resin sheet, semi-solid preparation resin sheet preparation process is as follows:
(1) by vitreous epoxy resin, 10%～the amion-terminated polyurethane of 40% that quality accounting is 35%～60%, 15%
～the methylimidazole of the phenolic resin of 40%, 1%～3% and the acetone mix homogeneously of 5%～35%, continuous stirring 20～40
Stand 1～3 hour after minute, prepare epoxy resin intermixture；
(2) by α-Al that quality accounting is 40%～65%2O3Ceramics, the carborundum of 33%～55% and 1%～8%
Tetragonal phase zirconium oxide mix homogeneously, prepare nano inorganic filler；
(3) epoxy resin intermixture and 15%～35% nano inorganic filler that mass ratio is 65%～85% are mixed
Uniformly, semi-solid preparation resin binder is prepared；
(4) utilize silk screen printing to be coated on the surface of aluminum base layer 1 by above-mentioned semi-solid preparation resin binder, form semi-solid preparation
Resin sheet；
S3 a: Copper Foil is provided and this Copper Foil is carried out surface process preparation the first copper foil layer 4 and the second copper foil layer 5；
S4: the first copper foil layer 4 and the second copper foil layer 5 are placed in the surface of semi-solid preparation resin sheet and pressing be integrated obtain double
Face aluminum-based copper-clad plate, semi-solid preparation resin sheet solidify to form the first insulating barrier 2 and the second insulating barrier 3；
S5: multiple exposed circular arc is set at this copper-clad plate circumference side and connects via 6, at the inwall connecting via 6
One layer of semi-solid preparation resin binder it is set and makes it solidify to form the 3rd insulating barrier 7, carrying out copper facing at the 3rd insulating barrier 7 inwall,
The first copper foil layer 4 and the second copper foil layer 5 is made to be electrically connected.
Use technique scheme, the via being used for the connection of levels circuit electrical is arranged on the circumferential side of copper-clad plate
And exposed outside, due to via exposed outside can by coating semi-solid preparation resin binder insulating barrier is set, use more simultaneously
Add simple copper-plating technique and realize levels connection, thus without using complicated technique to prepare the via of aluminium base, with
Time avoid the generation of parasitic capacitance, improve the anti-interference function of circuit board further.Use α-Al2O3 ceramics to make simultaneously
For packing agent, considerably increase the thermal conductivity of insulating barrier.
In a preferred embodiment, further include steps of in step s 4
It is placed in again on semi-solid preparation resin sheet after described first copper foil layer 4 and described second copper foil layer 5 form circuitous pattern,
Owing to copper foil layer is initially formed circuitous pattern, thus without again copper-clad plate being performed etching process, one step press molding, it is ensured that aluminum base
The stability of plate.Print described first copper foil layer 4, etching processing is formed on light bar circuit, and and to described
Second copper foil layer 5 carries out printing, etching processing is formed on drive circuit；
First copper foil layer 4 and the second copper foil layer 5 are placed in the surface of semi-solid preparation resin sheet and form one and treat laminate structures, with
This is treated that laminate structures is heated to semi-solid preparation resin sheet and melts by the heating rate less than 5 DEG C/min, and makees at certain pressure
Under with, by the first copper foil layer 4 and the surface being pressed together on semi-solid preparation resin sheet of the circuitous pattern of the second copper foil layer 5, then with less than 5
DEG C/rate of temperature fall of min makes semi-solid preparation resin sheet solidify to form the first insulating barrier 2 and the second insulating barrier 3.Preferably, with 2 DEG C/
Described semi-solid preparation resin sheet is heated by the heating rate of min, when described semi-solid preparation resin sheet is heated to 50 DEG C, to described
Treat that laminate structures applies the pressure of 2.5Mpa；Under the pressure of 2.5Mpa, continue the heating rate with 2 DEG C/min to described half admittedly
Change resin sheet to heat, be heated to when 80 DEG C stopping heating up, and at this temperature and pressure, maintain a period of time；Then, exist
Under the pressure of 2.5Mpa gradually cooling down to room temperature.Under described constant voltage, semi-solid preparation resin sheet will not make described in there is circuit
First copper foil layer 4 of figure and the second copper foil layer 5 surface are uneven containing glue.
In technique scheme, the pressure applying each point on the insulating layer cannot ensure completely the same, can affect product
Quality and concordance.In order to solve this technical problem, in one preferred implementation of the present invention, the most further
Comprise the following steps:
First copper foil layer 4 and the second copper foil layer 5 are placed in the surface of semi-solid preparation resin sheet, make the first copper foil layer 4, first exhausted
Edge layer 2, aluminum base layer the 1, second insulating barrier 3 and the second copper foil layer 5 are built up copper-clad plate to be laminated by order from top to bottom；
Above-mentioned copper-clad plate to be laminated is put into vacuum bag and this vacuum bag is carried out evacuation process；
Vacuum bag is put into hermetic container and in this hermetic container, is full of heating liquid medium；
Pressurize hermetic container, heat treatment makes semi-solid preparation resin sheet solidify.
Technique scheme, by carrying out vacuum hydraulic to copper-clad plate, it is ensured that be applied in copper-clad plate in hermetic container
Pressure be essentially equal, copper-clad plate will not produce bubble, make the good product consistency prepared, thickness is uniform, bonding
Respond well.
Further, above-mentioned liquid medium is hydraulic oil, hermetic container is forced into 2～10MPa, and makes hydraulic oil even
Speed is warming up to 60 to 80 DEG C.
In a preferred embodiment, further include steps of
Thering is provided a thermal insulation layer 8, thermal insulation layer 8 is arranged between aluminum base layer 1 and the second insulating barrier 3, with the side of above-mentioned pressing
Formula is integrated with copper-clad plate.Ensure that the big heat that the light bar circuit of the first copper foil layer 4 distributes will not conduct by this thermal insulation layer 8
To the second copper foil layer 5, thus ensure that the drive circuit on the second copper foil layer 5 can normally work.Preferably, thermal insulation layer 8 is adopted
Use ceramic fibre material.
The number of plies of copper-clad plate pressing of the present invention is more, and technique scheme is owing to carrying out layer again after using overlapping complete
Pressure, unavoidably has some air between each layer and steam is brought into, make conforming product rate low.Ask to solve above-mentioned technology
Topic, in the preferred embodiment of the present invention, uses the mode of successively pressing, namely first aluminum base layer 1 and insulating barrier is entered
Row pressing for the first time, it is ensured that aluminum base layer 1 and insulating barrier enter without air and steam, then are pressed together on by copper foil layer the most again
On insulating barrier.Thus the qualification rate of improving product.
The explanation of above example is only intended to help to understand method and the core concept thereof of the present invention.It is right to it should be pointed out that,
For those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to the present invention is carried out
Some improvement and modification, these improve and modify in the protection domain also falling into the claims in the present invention.To these embodiments
Multiple amendment is apparent from for those skilled in the art, and generic principles defined herein can be not
Realize in other embodiments in the case of departing from the spirit or scope of the present invention.Therefore, the present invention is not intended to be limited to this
These embodiments shown in literary composition, and it is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (5)
1. the double-side aluminum copper-clad plate of a LED lamp, it is characterised in that this copper-clad plate includes aluminum base layer, is separately positioned on
First insulating barrier on described aluminum base layer two sides and the second insulating barrier, be arranged on described first insulating barrier and away from aluminum base layer one side
The first copper foil layer, be arranged on described second insulating barrier and away from aluminum base layer one side the second copper foil layer, described first Copper Foil
Circuitous pattern is formed on layer and described second copper foil layer；Arrange multiple exposed circular arc at this copper-clad plate circumference side to connect
Hole, described connection via inwall carries out copper facing at its insulation inwall after arranging the 3rd insulating barrier, is used for being electrically connected described first
Copper foil layer and described second copper foil layer.
2. the double-side aluminum copper-clad plate of LED lamp as claimed in claim 1, it is characterised in that described first copper foil layer
Circuitous pattern is the light bar circuit that can be provided with multiple LED chip, and the circuitous pattern of described second copper foil layer is the plurality of LED chip
Drive circuit；This copper-clad plate also includes the thermal insulation layer being arranged between described aluminum base layer and described second insulating barrier.
3. the double-side aluminum copper-clad plate of LED lamp as claimed in claim 1 or 2, it is characterised in that first to described first bronze medal
Layers of foil and described second copper foil layer carry out printing, etching processing be separately positioned on described again after being formed on circuitous pattern
On one insulating barrier and described second insulating barrier.
4. the double-side aluminum copper-clad plate of LED lamp as claimed in claim 1 or 2, it is characterised in that described first insulating barrier
Be semi-solid preparation resin sheet with described second insulating barrier, this semi-solid preparation resin sheet be the epoxy resin intermixture by 65%～85% with
And 15%～35% nano inorganic filler composition compositions；Described epoxy resin intermixture includes vitreous epoxy resin, end
Amido polyurethane, phenolic resin, methylimidazole and acetone；Described nano inorganic filler includes α-Al2O3Ceramics, carbonization
Silicon and tetragonal phase zirconium oxide, described α-Al2O3Ceramics the quality accounting of described nano inorganic filler be 40%～
65%, described carborundum is 33%～55% in the quality accounting of described nano inorganic filler, and described tetragonal phase zirconium oxide exists
The quality accounting of described nano inorganic filler is 1%～8%.
5. the double-side aluminum copper-clad plate of LED lamp as claimed in claim 4, it is characterised in that described 3rd insulating barrier is
Semi-solid preparation resin sheet.
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| CN201610878142.7A CN106515133B (en) | 2015-08-24 | 2015-08-24 | A kind of manufacturing method of the double-side aluminum copper-clad plate of LED lamp |
| CN201510522948.8A CN105128454B (en) | 2015-08-24 | 2015-08-24 | A kind of double-side aluminum copper-clad plate of LED lamp |
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| CN201510522948.8A CN105128454B (en) | 2015-08-24 | 2015-08-24 | A kind of double-side aluminum copper-clad plate of LED lamp |
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| CN105128454B true CN105128454B (en) | 2017-01-04 |
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| CN201610878142.7A Active CN106515133B (en) | 2015-08-24 | 2015-08-24 | A kind of manufacturing method of the double-side aluminum copper-clad plate of LED lamp |
| CN201510522948.8A Active CN105128454B (en) | 2015-08-24 | 2015-08-24 | A kind of double-side aluminum copper-clad plate of LED lamp |
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| CN113518509B (en) * | 2021-04-01 | 2023-03-03 | 珠海精路电子有限公司 | Manufacturing process of resistance-stabilized circuit board |
| CN115384139B (en) * | 2022-09-20 | 2024-01-02 | 天长市京发铝业有限公司 | Aluminum-based aluminum-coated metal plate for electronic circuit and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6139762A (en) * | 1998-12-11 | 2000-10-31 | Shipley Company, L.L.C. | Methods for manufacture of electronic devices |
| CN102031008B (en) * | 2010-11-17 | 2012-07-25 | 广东生益科技股份有限公司 | Production method of thin prepreg with high-content filler adhesive system |
| CN102166847A (en) * | 2010-12-31 | 2011-08-31 | 陕西生益科技有限公司 | Preparation method of aluminum-based copper-clad laminate |
| CN102262844B (en) * | 2011-08-03 | 2013-08-14 | 石家庄市京华电子实业有限公司 | Aluminum-base integrated outdoor full-color three-in-one light-emitting diode (LED) display screen and method for manufacturing same |
| CN102316679B (en) * | 2011-09-16 | 2012-10-24 | 深圳市万泰伟业科技有限公司 | Manufacture method for double-side aluminum circuit board |
| CN102638936A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of LED (light-emitting diode) lighting type aluminum-based circuit board with super heat conduction and high voltage resistance |
| CN104582265B (en) * | 2013-10-14 | 2018-10-19 | 珠海方正科技高密电子有限公司 | A kind of implementation method and circuit board of Embedded capacitance |
| CN104661434A (en) * | 2013-11-20 | 2015-05-27 | 昆山苏杭电路板有限公司 | Double-faced aluminum substrate manufacturing process |
| CN104708869A (en) * | 2015-03-25 | 2015-06-17 | 广东美的制冷设备有限公司 | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof |
| CN204894670U (en) * | 2015-08-24 | 2015-12-23 | 浙江展邦电子科技有限公司 | LED lamps and lanterns are with aluminium base two -sided copper -clad plate |
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| CN106515133A (en) | 2017-03-22 |
| CN105128454A (en) | 2015-12-09 |
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