CN103068151B - Heat radiating material - Google Patents
Heat radiating material Download PDFInfo
- Publication number
- CN103068151B CN103068151B CN201110323648.9A CN201110323648A CN103068151B CN 103068151 B CN103068151 B CN 103068151B CN 201110323648 A CN201110323648 A CN 201110323648A CN 103068151 B CN103068151 B CN 103068151B
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- line
- glue
- layer
- radiation glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a kind of heat radiating material, be made up of radiating insulating polymeric layer, the first heat radiation glue-line, the second heat radiation glue-line and metal level, utilize radiating insulating polymeric layer to reach high breakdown voltage resistant effect, the high radiating effect of whole base material is reached by the heat dissipation characteristics of radiating insulating polymeric layer, the first heat radiation glue-line and the second heat radiation glue-line trilaminate material, be applicable to for the higher lamp box panel of radiating requirements more general FPC material, and this heat radiating material is convenient to formation half buried via hole when producing, and is conducive to improving production efficiency and yield.
Description
Technical field
The present invention relates to a kind of flexible copper foil high-heat-conductivity on the heat radiation products such as LED, FPC.
Background technology
Along with the consciousness of global environmental protection comes back, energy saving has become current trend.LED industry is one of industry attracted most attention in recent years.Be developed so far, LED product has had energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has the advantages such as environmental benefit.But usually LED high power products input power is only about 20% and can converts light to, the electric energy of remaining 80% is all converted to heat energy.
Generally speaking, if the heat energy produced when LED is luminous cannot be derived, LED will be made to tie surface temperature too high, and then affect product life cycle, luminous efficiency and stability.
Traditional heat sink material is due to needs consideration insulation characterisitic, and reach breakdown voltage resistant effect, product glue thick needs accomplishes that 60um to 120um can reach requirement, therefore the gross thickness of product can be very large, and radiating effect is undesirable, the thickness of glue promotes and causes cost increase, produces difficulty; And in order to reach corresponding heat-conducting effect, it is particles filled to add a large amount of heat radiations in glue.According to the heat dissipation model of TPI (thermoplastic polyimide)+heat radiation powder, although product thickness can be reduced the requirement that also can meet insulation characterisitic, but need high-temperature operation (operating temperature is greater than 350 DEG C) due to during processing TPI, therefore processing cost is very high, cannot effectively mass production.
And at present the development trend of global electronic industry is to compact, high-fire resistance, multifunctionality, densification, high reliability and the future development of low cost, therefore selecting of substrate just becomes very important influencing factor.And good substrate must possess high thermal conductivity, high dimensional stability, the high material behavior hiding chromatic effect, high-cooling property, high-fire resistance and low thermal coefficient of expansion.Polyimide resin thermal stability is high and have excellent thermal diffusivity, mechanical strength and adherence, often applies to multiple electronic material, as flexible printed wiring board (Flexible Printed Circuit).
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of heat radiating material, this heat radiating material has the characteristic that high heat conduction and high withstand voltage puncture, and buried via hole can be facilitated to design.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of heat radiating material, be provided with radiating insulating polymeric layer, the two sides of described radiating insulating polymeric layer is stained with the first heat radiation glue-line and the second heat radiation glue-line respectively, described first heat radiation glue-line is stained with copper foil layer, described first heat radiation glue-line is folded between described copper foil layer and described radiating insulating polymeric layer, described second heat radiation glue-line is stained with metal level, and described second heat radiation glue-line is folded between described metal level and described radiating insulating polymeric layer.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
Described radiating insulating polymeric layer is the polyimide layer containing heat radiation powder, polyethylene terephthalate (polyethylene terephthalate containing heat radiation powder, PET) layer, polyaniline (polyaniline containing heat radiation powder, PAn) layer, Polyethylene Naphthalate (Polyethylene Naphthalate containing heat radiation powder, PEN) layer, triacetyl glycerine (Triacetine containing heat radiation powder, TAc) layer and the polycarbonate resin (Polycarbonate containing heat radiation powder, PC) one in layer, preferably the polyimide layer containing heat radiation powder or the layer of polyethylene terephthalate containing heat radiation powder.The thickness of described radiating insulating polymeric layer is 12.5 ~ 50um.Wherein, the powder that dispels the heat is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride.
Described first heat radiation glue-line and the second heat radiation glue-line are all the resin beds containing heat radiation powder after baking-curing, and the thickness of described first heat radiation glue-line and the second heat radiation glue-line is all 8 ~ 50um.The resin material of the first heat radiation glue-line and the second heat radiation glue-line is selected from epoxide-resin glue system, polyacrylic resin glue system, amido formate system resin, silicon rubber system resin, gathers at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin.Wherein, the powder that dispels the heat is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride.
Described copper foil layer is the one in electrolytic copper foil and rolled copper foil, wherein rolls (RA) Copper Foil and also comprises high (HA) Copper Foil that extends.The thickness of described copper foil layer is 8 ~ 70um.
Described metal level is the one in aluminium sheet, copper coin and iron plate, also can be other metal substrates.The thickness of described metal level is 0.1 ~ 3mm.
Described heat radiating material is drilled with half buried via hole of copper foil layer described in break-through, described first heat radiation glue-line, described radiating insulating polymeric layer and described second heat radiation glue-line.
The invention has the beneficial effects as follows: heat radiating material of the present invention is made up of radiating insulating polymeric layer, the first heat radiation glue-line, the second heat radiation glue-line and metal level, utilize radiating insulating polymeric layer to reach high breakdown voltage resistant effect, the high radiating effect of whole base material is reached by the heat dissipation characteristics of radiating insulating polymeric layer, the first heat radiation glue-line and the second heat radiation glue-line trilaminate material, be applicable to for the higher lamp box panel of radiating requirements more general FPC material, and this heat radiating material is convenient to formation half buried via hole when producing, and is conducive to improving production efficiency and yield.
Accompanying drawing explanation
Fig. 1 is heat radiating material generalized section of the present invention;
Fig. 2 is the generalized section that the present invention is provided with the heat radiating material of half buried via hole.
Embodiment
Embodiment: be described in detail preferred embodiment of the present invention below in conjunction with accompanying drawing, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus make more explicit defining to protection scope of the present invention.
A kind of heat radiating material, be provided with radiating insulating polymeric layer 1, the two sides of described radiating insulating polymeric layer is stained with the first heat radiation glue-line 2 and the second heat radiation glue-line 3 respectively, described first heat radiation glue-line is stained with copper foil layer 4, described first heat radiation glue-line is folded between described copper foil layer and described radiating insulating polymeric layer, described second heat radiation glue-line is stained with metal level 5, and described second heat radiation glue-line is folded between described metal level and described radiating insulating polymeric layer.
Wherein, described radiating insulating polymeric layer is the polyimide layer containing heat radiation powder, polyethylene terephthalate (polyethylene terephthalate containing heat radiation powder, PET) layer, polyaniline (polyaniline containing heat radiation powder, PAn) layer, Polyethylene Naphthalate (Polyethylene Naphthalate containing heat radiation powder, PEN) layer, triacetyl glycerine (Triacetine containing heat radiation powder, TAc) layer and the polycarbonate resin (Polycarbonate containing heat radiation powder, PC) one in layer, preferably the polyimide layer containing heat radiation powder or the layer of polyethylene terephthalate containing heat radiation powder.The thickness of described radiating insulating polymeric layer is 12.5 ~ 50um.Wherein, the powder that dispels the heat is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride.
Wherein, described first heat radiation glue-line and the second heat radiation glue-line are all the resin beds containing heat radiation powder after baking-curing, and the thickness of described first heat radiation glue-line and the second heat radiation glue-line is all 8 ~ 50um.The resin material of the first heat radiation glue-line and the second heat radiation glue-line is selected from epoxide-resin glue system, polyacrylic resin glue system, amido formate system resin, silicon rubber system resin, gathers at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin.Wherein, the powder that dispels the heat is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride.
Wherein, described copper foil layer is the one in electrolytic copper foil and rolled copper foil, wherein rolls (RA) Copper Foil and also comprises high (HA) Copper Foil that extends.The thickness of described copper foil layer is 8 ~ 70um.
Wherein, described metal level is the one in aluminium sheet, copper coin and iron plate, also can be other metal substrates.The thickness of described metal level is 0.1 ~ 3mm.
Described heat radiating material is drilled with half buried via hole 6 of copper foil layer described in break-through, described first heat radiation glue-line, described radiating insulating polymeric layer and described second heat radiation glue-line.
Above-mentioned heat radiating material obtains by following production technology: prior to the matsurface coating first heat radiation glue-line of copper foil layer, after high temperature toasts online, make the first heat radiation glue-line reach semi-solid preparation half flow regime, then radiating insulating polymeric layer is pasted, by these semi-finished product by baking Post RDBMS, the another side coating second heat radiation glue-line of the half-finished radiating insulating polymeric layer after solidification, after toasting online, make the second heat radiation glue-line reach semi-solid preparation half flow regime, then on the second heat radiation glue-line, paste release liners.Holes drilled through on above-mentioned base material, then tears release liners off, and described second heat radiation glue-line pastes metal level, then baking-curing, obtains finished product.The through hole wherein base material bored just automatically becomes half buried via hole of only copper foil layer, described first heat radiation glue-line, described radiating insulating polymeric layer and described second heat radiation glue-line described in break-through after pasting metal level, effectively can improve the yield of formation half buried via hole.
Using heat radiating material sample of the present invention as experimental group, using the base material of prior art as comparative example, and the heat conduction efficiency of both tests by experiment and insulation voltage, and by outcome record in following table one.
Table one
As shown in Table 1, heat radiating material of the present invention has the characteristic that high heat conduction and high withstand voltage puncture.
Claims (1)
1. a heat radiating material, it is characterized in that: be provided with radiating insulating polymeric layer (1), the two sides of described radiating insulating polymeric layer is stained with the first heat radiation glue-line (2) and the second heat radiation glue-line (3) respectively, described first heat radiation glue-line is stained with copper foil layer (4), described first heat radiation glue-line is folded between described copper foil layer and described radiating insulating polymeric layer, described second heat radiation glue-line is stained with metal level (5), described second heat radiation glue-line is folded between described metal level and described radiating insulating polymeric layer, described radiating insulating polymeric layer is the polyimide layer containing heat radiation powder, layer of polyethylene terephthalate containing heat radiation powder, polyaniline containing heat radiation powder, Polyethylene Naphthalate layer containing heat radiation powder, triacetyl glycerine layer containing heat radiation powder and the one contained in the polycarbonate resin of heat radiation powder, the thickness of described radiating insulating polymeric layer is 12.5 ~ 50um, described first heat radiation glue-line and the second heat radiation glue-line are all the resin beds containing heat radiation powder after baking-curing, the thickness of described first heat radiation glue-line and the second heat radiation glue-line is all 8 ~ 50um, described copper foil layer is the one in electrolytic copper foil and rolled copper foil, the thickness of described copper foil layer is 8 ~ 70um, described metal level is aluminium sheet, one in copper coin and iron plate, the thickness of described metal level is 0.1 ~ 3mm, described heat radiating material is drilled with copper foil layer described in break-through, described first heat radiation glue-line, half buried via hole (6) of described radiating insulating polymeric layer and described second heat radiation glue-line, and the constituted mode of described half buried via hole is:
By the structure holes drilled through after the second heat radiation glue-line place pastes release liners be made up of copper foil layer, the first heat radiation glue-line, dielectric polymers and the second heat radiation glue-line, on the second heat radiation glue-line, paste metal level after removing release liners and after baking-curing, form half buried via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110323648.9A CN103068151B (en) | 2011-10-21 | 2011-10-21 | Heat radiating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110323648.9A CN103068151B (en) | 2011-10-21 | 2011-10-21 | Heat radiating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103068151A CN103068151A (en) | 2013-04-24 |
| CN103068151B true CN103068151B (en) | 2015-09-09 |
Family
ID=48110552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110323648.9A Active CN103068151B (en) | 2011-10-21 | 2011-10-21 | Heat radiating material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103068151B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106034378A (en) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
| CN104742426A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Double-sided copper clad laminate applicable to wireless charging equipment and producing method of copper clad laminate |
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
| WO2021120117A1 (en) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Substrate plate having different copper foils on two surfaces thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
| CN102118916A (en) * | 2009-12-30 | 2011-07-06 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN201910417U (en) * | 2011-01-07 | 2011-07-27 | 昆山雅森电子材料科技有限公司 | Thin metal substrate with high thermal conductivity |
| CN202285457U (en) * | 2011-10-21 | 2012-06-27 | 松扬电子材料(昆山)有限公司 | Heat dissipation substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100955451B1 (en) * | 2009-12-02 | 2010-04-29 | (주) 써트론아이엔씨 | Heat radiant fpcb and method for manufacturing the same |
-
2011
- 2011-10-21 CN CN201110323648.9A patent/CN103068151B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102118916A (en) * | 2009-12-30 | 2011-07-06 | 昆山雅森电子材料科技有限公司 | Heat-conducting covering film |
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
| CN201910417U (en) * | 2011-01-07 | 2011-07-27 | 昆山雅森电子材料科技有限公司 | Thin metal substrate with high thermal conductivity |
| CN202285457U (en) * | 2011-10-21 | 2012-06-27 | 松扬电子材料(昆山)有限公司 | Heat dissipation substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103068151A (en) | 2013-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202285457U (en) | Heat dissipation substrate | |
| CN103068151B (en) | Heat radiating material | |
| CN102593338A (en) | Thin high-thermal-conductivity metal substrate and production method thereof | |
| CN104363697B (en) | The aluminium substrate copper-clad plate of ceramic filler medium and its manufacture method | |
| CN102595766A (en) | Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof | |
| CN103042762B (en) | High thermal conductive metal substrate | |
| CN204634154U (en) | Two-sided heat-conducting substrate | |
| CN202271584U (en) | Metal substrate with high thermal conductivity | |
| CN102711367B (en) | A kind of heat conduction aluminum substrate and preparation method thereof | |
| CN102673048B (en) | The aluminium base method for manufacturing cover clad laminate of a kind of high-termal conductivity | |
| CN202103944U (en) | Metal-base printed circuit board | |
| CN102469685A (en) | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof | |
| CN210607231U (en) | Novel composite heat dissipation material | |
| CN104968138B (en) | A kind of printed circuit board (PCB) | |
| CN201910417U (en) | Thin metal substrate with high thermal conductivity | |
| CN106515133B (en) | A kind of manufacturing method of the double-side aluminum copper-clad plate of LED lamp | |
| CN207014886U (en) | A kind of heat conduction aluminium nitride substrate | |
| CN201937950U (en) | Flexible copper foil high-heat-conductivity base plate | |
| CN206446211U (en) | A kind of high proof voltage aluminum-based copper-clad plate | |
| CN204894670U (en) | LED lamps and lanterns are with aluminium base two -sided copper -clad plate | |
| CN205364691U (en) | Good copper -clad plate of heat dissipation function | |
| CN201805619U (en) | Voltage-proof double-sided circuit board with excellent heat dissipation performance | |
| CN103826425A (en) | High-heat-conductivity foam gasket as well as preparation method and applications thereof | |
| CN206136564U (en) | Graphite covers copper thermal film based on addition process | |
| CN207783277U (en) | Aluminium base heat dissipation high temperature resistance multilayer backboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |