CN202271584U - Metal substrate with high thermal conductivity - Google Patents

Metal substrate with high thermal conductivity Download PDF

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Publication number
CN202271584U
CN202271584U CN 201120387706 CN201120387706U CN202271584U CN 202271584 U CN202271584 U CN 202271584U CN 201120387706 CN201120387706 CN 201120387706 CN 201120387706 U CN201120387706 U CN 201120387706U CN 202271584 U CN202271584 U CN 202271584U
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CN
China
Prior art keywords
layer
heat radiation
insulating polymer
base plate
thickness
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CN 201120387706
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Chinese (zh)
Inventor
林志铭
李建辉
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昆山雅森电子材料科技有限公司
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Abstract

The utility model discloses a metal substrate with high thermal conductivity, comprising a copper foil layer, a metal layer, an insulating polymer layer possessing first heat radiation powder and a heat conduction adhesion layer possessing second heat radiation powder, wherein the insulating polymer layer comprises a top layer and a bottom layer; the first heat radiation powder is uniformly dispersed in at least one of the top layer and the bottom layer; and because the insulating polymer layer is a composite layer comprising the top layer and the bottom layer, and at least one of the top layer and the bottom layer possesses the first heat radiation powder, the structure of the insulating polymer layer enables the insulating polymer layer to possess insulating and heat radiation effects, the integral thickness of the product is thinner, and heat radiation efficiency and anti-voltage-breakdown effect are enhanced.

Description

High-thermal conductive metal base plate

Technical field

The utility model relates to the flexible base, board on heat radiation such as a kind of LED of the being used for product, particularly a kind of high-thermal conductive metal base plate with high cooling efficiency.

Background technology

Along with the consciousness new line of global environmental protection, energy saving has become current trend.The LED industry is one of industry that attracts most attention in recent years.Development so far, that the LED product has had is energy-conservation, power saving, high efficiency, the response time is fast, life cycle is long, reach the not mercurous advantage such as environmental benefit that has.Yet usually the input power of LED high power products is only had an appointment and 20% can be converted into light, and remaining 80% electric energy all converts heat energy into.

Generally speaking, if the heat energy that is produced when LED is luminous will make LED knot surface temperature too high, and then influence product life cycle, luminous efficiency and stability can't remittance abroad.

Traditional heat sink material is owing to need to consider insulation characterisitic, and the glue thickness that is used to bind copper foil layer need accomplish that 60 to 120um can reach insulating requirements, so the gross thickness of product can be very big, and radiating effect is undesirable.If adopt the TP worker's's (Thermocurable polyimide) who is doped with the heat radiation powder heat radiation model; Though can product thickness be reduced the requirement that also can satisfy insulation characterisitic; But because processing TP man-hour requirement high-temperature operation (operating temperature is greater than 350 ℃), so processing cost is very high, effectively mass production.

Therefore, how to develop have the good resistance voltage breakdown, heat dispersion product, thinning integral thickness, and the high-thermal conductive metal base plate that can make through the processing procedure of simplifying is the problem for needing to be resolved hurrily.

The utility model content

In order to overcome above-mentioned defective, the utility model provides a kind of high-thermal conductive metal base plate, and this high-thermal conductive metal base plate can make the thinning of product integral thickness, and radiating efficiency is high, and promotes the effect that reactance voltage punctures.

The utility model for the technical scheme that solves its technical problem and adopt is:

A kind of high-thermal conductive metal base plate, by copper foil layer, metal level, have first the heat radiation powder the insulating polymer layer and have second the heat radiation powder the heat conduction adhesion layer constitute; Said insulating polymer layer is folded between said copper foil layer and the heat conduction adhesion layer, and said heat conduction adhesion layer is folded between said insulating polymer layer and the said metal level; Wherein, said insulating polymer layer is made up of top layer and bottom, and said top layer contacts with said heat conduction adhesion layer and said bottom contacts with said copper foil layer, the said first heat radiation powder be dispersed in said top layer and the said bottom one of at least.

The utility model has also further adopted following technical proposals in order to solve its technical problem:

By weight percentage, the heat radiation of first in said insulating polymer layer powder accounts for 10% to 80% of said insulating polymer layer solid content.

By weight percentage, the heat radiation of second in said heat conduction adhesion layer powder accounts for 10% to 80% of said heat conduction adhesion layer solid content.

Said first heat radiation powder and the said second heat radiation powder are respectively at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.

Said copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil.

The thickness of said copper foil layer is 9 to 70 microns, and the thickness of said insulating polymer layer is 3 to 8 microns, and the thickness of said heat conduction adhesion layer is 20 to 25 microns, and said metal layer thickness is 0.2 to 6 millimeter.

The material of said insulating polymer layer is a polyimides.

Said heat conduction adhesion layer comprises resin; Said resin is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin, and the said second heat radiation powder is dispersed in the said resin.

The said first heat radiation powder can be scattered in said bottom, and preferably, the thickness of said top layer is less than the thickness of said bottom.

The said first heat radiation powder also can be scattered in said top layer, and preferably, the thickness of said bottom is less than the thickness of said top layer.

The said first heat radiation powder also can be scattered in said top layer and said bottom.

The beneficial effect of the utility model is: the insulating polymer layer of the high-thermal conductive metal base plate of the utility model is the composite bed that is made up of top layer and bottom; And said top layer and bottom have one of at least the first heat radiation powder; The said structure of insulating polymer layer can make the insulating polymer layer have insulating properties and radiating effect; Make the whole thinning of product thickness, promote radiating efficiency and reactance voltage and puncture effect.

Description of drawings

Fig. 1 to Fig. 3 is the method for making (having the first heat radiation powder with top layer is example) of the high-thermal conductive metal base plate of signal the utility model;

Fig. 4 is a kind of high-thermal conductive metal base plate structure (bottom has the first heat radiation powder) of the utility model.

The specific embodiment

Embodiment: following embodiment through specific instantiation explanation the utility model, the personage who is familiar with this skill can be understood the advantage and the effect of the utility model easily by the content that this specification disclosed.The utility model also can be implemented by other different mode,, under the category that discloses from the utility model that is not contrary to, can give different modifications and change that is.

The coefficient of heat conduction (thermal conductivity; Claim the K value again), in this article refer to the capacity of heat transmission of high-thermal conductive metal base plate, refer to that especially this substrate is under the unit temperature difference; Unit interval is through the heat of unit are unit distance; The coefficient of heat conduction that is called high-thermal conductive metal base plate, if measure the thickness L of this substrate, then this measuring value then need multiply by L and obtain the coefficient of heat conduction of high-thermal conductive metal base plate.

In the utility model, the first heat radiation powder is meant heat radiation powder contained in the insulating polymer layer, and it can be one or more heat radiation powders.

In the utility model, the second heat radiation powder is meant heat radiation powder contained in the heat conduction adhesion layer, and it can be one or more heat radiation powders.

The utility model provides a kind of high-thermal conductive metal base plate, by copper foil layer, have first the heat radiation powder insulating polymer layer, heat conduction adhesion layer and metal level constitute.The material of this insulating polymer layer can be selected any material with insulating property (properties), but is good with polyimides.The resin of this heat conduction adhesion layer then can be and is selected from epoxy resin, acrylic resin, amido formate is that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.

Method for this high-thermal conductive metal base plate is made in explanation sees also Fig. 1 to Fig. 3, is the method for making that shows this high-thermal conductive metal base plate.At first, (then, behind this polyamic acid of slaking, forming a material is the bottom 11a of polyimide film for Polyamic acid, copper foil layer 10 PAA) to prepare to be coated with on the surface polyamic acid.

As shown in Figure 2; Go up polyamide coated acid in this polyimide film 11a again; Then, behind this polyamic acid of slaking, forming another material is the top layer 11b of polyimide film, and constitutes insulating polymer layer 11 by this polyimide film 11a and 11b; Because the polyamic acid of twice coating is an identical material, so come down to obtain an insulating polymer layer 11.Because this insulating polymer layer has the first heat radiation powder; And this first heat radiation powder be scattered in this bottom 11a and top layer 11b one of at least in; Therefore when forming bottom 11a and/or top layer 11b, but blending is selected from one or more powders that dispel the heat of carborundum, boron nitride, aluminium nitride and group that aluminium oxide is formed in the coated polyamic acid.To aspect shown in Figure 3, this top layer 11b has the first heat radiation powder at Fig. 1.Should recognize that so-called " the first heat radiation powder is scattered in said top layer " non-meaning has smooth boundary fully between bottom 11a and the top layer 11b; Should be meant compared to bottom 11a; The first heat radiation powder is scattered in this top layer 11b haply, and promptly bottom 11a does not have the first heat radiation powder.

As shown in Figure 3, go up to form heat conduction adhesion layer 12 and for example be the metal level 13 of aluminium sheet in this top layer 11b in regular turn again.This heat conduction adhesion layer comprises resin; To be selected from epoxy resin, acrylic resin, amido formate and to be resin, silicon rubber be resin, gather ring diformazan benzene series resin, BMI is at least a of resin and group that polyimide resin is formed, and this second powder that dispels the heat is scattered in this resin.

Seeing also Fig. 4, is another high-thermal conductive metal base plate that shows the utility model, and this bottom 11a has the first heat radiation powder, and all the other are then identical to high-thermal conductive metal base plate shown in Figure 3 with Fig. 1.Certainly, also can make this bottom 11a and top layer 11b all contain the first heat radiation powder.

According to aforesaid method for making, the high-thermal conductive metal base plate of the utility model, by copper foil layer 10, metal level 13, have first the heat radiation powder insulating polymer layer 11 and have second the heat radiation powder heat conduction adhesion layer 12 constitute; Said insulating polymer layer 11 is folded between said copper foil layer 10 and the heat conduction adhesion layer 12, and said heat conduction adhesion layer 12 is folded between said insulating polymer layer 11 and the said metal level 13; Wherein, Said insulating polymer layer 11 is made up of top layer 11b and bottom 11a; Said top layer 11b contacts with said heat conduction adhesion layer 12 and said bottom 11a contacts with said copper foil layer 10, the said first heat radiation powder be dispersed among said top layer 11b and the said bottom 11a one of at least.

For obtaining preferable radiating effect, by weight percentage, the heat radiation of first in insulating polymer layer powder accounts for 10% to 80% of insulating polymer layer solid content; In the heat conduction adhesion layer second heat radiation powder accounts for 10% to 80% of heat conduction adhesion layer solid content.

Said first heat radiation powder and the said second heat radiation powder are respectively at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.

Said copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil.

The thickness of said copper foil layer is 9 to 70 microns, and the thickness of said insulating polymer layer is 3 to 8 microns, and the thickness of said heat conduction adhesion layer is 20 to 25 microns, and said metal layer thickness is 0.2 to 6 millimeter.

Test: according to the high-thermal conductive metal base plate that the prescription and the aforesaid method for making of table one are made the utility model, wherein, metal level is an aluminium, selects to add aluminium nitride (AlN), boron nitride (BN), carborundum (SiC) and aluminium oxide (Al in top layer and the bottom 2O 3).And according to ASTM D5470 standard method heat conducting coefficient measuring, and according to JIS C 2110 standard methods measurement breakdown voltage.Sample 1 to 5 is the high-thermal conductive metal base plate sample of the utility model, and comparative example is a prior art common metal substrate.

Table one

But the high-thermal conductive metal base plate by table one knowledge capital utility model has higher thermal conductivity factor and good reactance voltage puncture effect.

Above-mentioned specification and embodiment are merely the principle and the effect thereof of exemplary illustration the utility model, are not to be the restriction to the utility model, and any utility model that falls in the utility model claim scope all belongs to the scope that the utility model is protected.

Claims (8)

1. high-thermal conductive metal base plate is characterized in that: be made up of copper foil layer, metal level, the heat conduction adhesion layer that has the insulating polymer layer of the first heat radiation powder and have second a heat radiation powder; Said insulating polymer layer is folded between said copper foil layer and the heat conduction adhesion layer, and said heat conduction adhesion layer is folded between said insulating polymer layer and the said metal level; Wherein, said insulating polymer layer is made up of top layer and bottom, and said top layer contacts with said heat conduction adhesion layer and said bottom contacts with said copper foil layer, the said first heat radiation powder be dispersed in said top layer and the said bottom one of at least.
2. high-thermal conductive metal base plate according to claim 1 is characterized in that: said copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil.
3. high-thermal conductive metal base plate according to claim 1; It is characterized in that: the thickness of said copper foil layer is 9 to 70 microns; The thickness of said insulating polymer layer is 3 to 8 microns, and the thickness of said heat conduction adhesion layer is 20 to 25 microns, and said metal layer thickness is 0.2 to 6 millimeter.
4. high-thermal conductive metal base plate according to claim 1 is characterized in that: said insulating polymer layer is a polyimide layer.
5. high-thermal conductive metal base plate according to claim 1 is characterized in that: the said first heat radiation powder is scattered in said bottom.
6. high-thermal conductive metal base plate according to claim 5 is characterized in that: the thickness of said top layer is less than the thickness of said bottom.
7. high-thermal conductive metal base plate according to claim 1 is characterized in that: the said first heat radiation powder is scattered in said top layer.
8. high-thermal conductive metal base plate according to claim 7 is characterized in that: the thickness of said bottom is less than the thickness of said top layer.
CN 201120387706 2011-10-13 2011-10-13 Metal substrate with high thermal conductivity CN202271584U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103042762A (en) * 2011-10-13 2013-04-17 昆山雅森电子材料科技有限公司 High thermal conductive metal substrate
CN103112215A (en) * 2013-03-08 2013-05-22 苏州佳值电子工业有限公司 Novel heat conducting material
CN103144377A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof
CN103144376A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof
CN106476898A (en) * 2016-09-27 2017-03-08 北京新能源汽车股份有限公司 Vehicle

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103042762A (en) * 2011-10-13 2013-04-17 昆山雅森电子材料科技有限公司 High thermal conductive metal substrate
CN103042762B (en) * 2011-10-13 2015-04-29 昆山雅森电子材料科技有限公司 High thermal conductive metal substrate
CN103112215A (en) * 2013-03-08 2013-05-22 苏州佳值电子工业有限公司 Novel heat conducting material
CN103144377A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof
CN103144376A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof
CN103144376B (en) * 2013-03-15 2015-09-09 松扬电子材料(昆山)有限公司 There is composite copper clad laminate and the manufacture method thereof of electromagnetic shielding effect
CN106476898A (en) * 2016-09-27 2017-03-08 北京新能源汽车股份有限公司 Vehicle

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