CN101848604B - Preparation method of CEM-3 copper clad plate with high heat conductivity - Google Patents
Preparation method of CEM-3 copper clad plate with high heat conductivity Download PDFInfo
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- CN101848604B CN101848604B CN201010168176.XA CN201010168176A CN101848604B CN 101848604 B CN101848604 B CN 101848604B CN 201010168176 A CN201010168176 A CN 201010168176A CN 101848604 B CN101848604 B CN 101848604B
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Abstract
The invention relates to a preparation method of a CEM-3 copper clad plate with high heat conductivity, which comprises the following processes and steps of: (1) preparing a core material: selecting epoxy resin/phenolic resin as a main curing agent, adding a coupling agent, padding and a curing accelerator and preparing into resin liquid for the core material with butanone, and soaking glass fiber paper into a semi-cured state with the core material glue to obtain the core material; (2) preparing a facing material: dissolving the epoxy resin/phenolic resin curing system with butanone, adding padding and preparing into resin liquid for the facing material with butanone, soaking glass fiber cloth into the resin liquid, and curing to obtain the facing material; and (3) proportioning and molding by laminating. The invention not only has the insulating property, the electrical properties, the mechanical properties and other basic properties of a general universal CEM-3 composite copper clad plate, but also has excellent heat conductivity, high CTI, higher heat resistance and excellent PCB (printed circuit board) processing performance. The invention is suitable for LED (Light Emitting Diode), vehicle systems, variable-frequency power sources and other products needing excellent heat conductivity, and can greatly improve the heat dispersion of electronic devices and improve the reliability of electronic products.
Description
Technical field
The present invention is the preparation method of a kind of copper clad laminate CEM-3, the specifically preparation method of the composite-based copper clad plate CEM-3 of high heat-conducting type and high proof tracking index, product prepared by this invention is a kind of composite base sheet material of printed circuit board (PCB) copper clad laminate.
Background technology
Along with the development of low-carbon economy, light-emitting diode (LED) has become the environmental protection and energy saving class luminous product of main flow, its purposes is very extensive, as LED television, LED Landscape Lighting, LED special lighting (mine lamp, emergency light etc.), LED automobile lamp decoration, LED signal mark etc.LED will keep long-life and high brightness, needs to solve power supply, LED light source, heat radiation, safety four large key technologies." heat radiation difficult " problem of LED product is one of insoluble key problem of LED manufacturing enterprise always, and it directly affects the reliability etc. of the luminous efficiency of LED, useful life and product.Such as, the electric energy conversion of about 20% can be only luminous energy by LED, and the electric energy of residue about 80% can be converted into heat energy; Efficiency be 70% power supply the electric energy of 30% can be converted to heat energy, unless distributed by heat, otherwise rising successively of bulb temperature significantly will reduce useful life of LED and power supply.
In the application of LED product, no matter for display backlight source, indicator light, or general lighting, usually can optionally multiple LED be assembled on a circuit substrate.This circuit substrate, on the one hand carrying LED module structure, on the other hand, along with LED power output is more and more higher, the role of heat radiation-gone out by the heat trnasfer that LED chip produces also played the part of by substrate.Therefore, the selection of circuit base material, must take into account structural strength and radiating requirements.
The CEM-3 sheet material that tradition adopts, thermal conductivity is at about 0.4-0.6W/m.k.Adopt epoxy resin/dicyandiamide cure system, filler is done with aluminium hydroxide, there is high peel strength, good insulation property, excellent processability and lower cost, but it is low to there is thermal conductivity, thermal endurance is lower, the shortcomings such as Z-direction thermal coefficient of expansion is large, be used in LED television, LED illumination, on the products such as power supply board, there is poor radiation, easily cause the aging of product, the lost of life, power consumption increases, the shortcomings such as reliability reduction, so improve the thermal conductivity of CEM-3, high CTI performance, the copper-clad plate that a kind of cost performance is good is provided, become one of direction of electronic technology field research and development.
High thermal conductivity CEM-3 composite base laminated board covered with copper foil is just in order to meet the demand of LED and the novel copper-clad plate of one grown up, not yet there is at present report at home and produce, only having SUNX abroad, there is this type of product introduction in Deng Ji company of Sumitomo Electric Industries.This product is except having the key property such as insulating properties, electric property, mechanical performance that general universal CEM-3 composite-based copper clad plate has, also there is good thermal conductivity feature, be applicable to be used in the product such as LED, onboard system, variable frequency power supply needing thermal conductivity good.The metal matrix copper-clad laminate that this product relative thermal conductivity energy is good, except having price advantage, also has the printed circuit board characteristic of holes metallization double-side conduction.
Summary of the invention
Object of the present invention is the deficiency overcoming traditional C EM-3 sheet material, provides the preparation method of the composite-based copper clad plate CEM-3 of a kind of high heat-conducting type and high proof tracking index.
Preparation method and the technological process of the CEM-3 copper-clad plate of the present invention are as follows:
The preparation method of I core material
A. be main curing agent with epoxy resin/phenolic resins, add coupling agent and filler.Said coupling agent is KH-550, KH-560 etc.; Said filler is the mixture of one or more in aluminium oxide, aluminium nitride, magnesium oxide, boron nitride, aluminium hydroxide, magnesium hydroxide, talcum powder, titanium dioxide etc.Proportioning is therebetween:
In weight epoxy part for 100,
Phenolic resins is 20 ~ 30 parts
Curing accelerator 0.03-0.5 part
Coupling agent is 1.5 ~ 4.5 parts
Filler is 100 ~ 300 parts
B. above material butanone is modulated into core material resin liquid;
C. with above-mentioned core material glue impregnated glass fiber paper, at temperature 130 DEG C-210 DEG C, make it become semi-cured state, make core material;
The preparation method of II fabric
D. epoxy resin/phenolic resin curing system is used, be dissolved into butanone the solution that viscosity is 25 ± 10s (Φ 4 glasss), one or more the mixture added in aluminium hydroxide or magnesium hydroxide, boron nitride, aluminium nitride, aluminium oxide makes filler.
The curing system of said epoxy resin/phenolic resins, in the weight portion of epoxy resin for 100, phenolic resins is 25 ± 5; The weight portion of aluminium hydroxide or magnesium hydroxide is 50 ~ 100, curing accelerator: 0.03-0.3 part.
E. above material butanone is modulated into fabric resin liquid;
F. with above-mentioned fabric glue impregnated glass fiber cloth, at temperature 130 DEG C-210 DEG C, make it become semi-cured state, make fabric;
III batching and laminated into type
G. according to thickness needs, superposition 1-10 opens above-mentioned core material.Respectively stick in the core material upper and lower surface of superposition and state fabric, cover Copper Foil at the one or both sides of fabric.At temperature 80 DEG C-200 DEG C, pressure 10-100Kg/cm
2with below vacuum degree-60mmHg, hot-forming.
The present invention is except having the key property such as insulating properties, electric property, mechanical performance that general universal CEM-3 composite-based copper clad plate has, also have good thermal conductivity and high CTI feature, thermal conductivity >=1W/m.k, CTI >=600V, higher thermal endurance and good PCB technology processing type.Be applicable in the product such as LED, onboard system, variable frequency power supply needing thermal conductivity good, significantly can improve thermal diffusivity, the high reliability of electronic product, be the product of environmental protection and energy saving.
Accompanying drawing explanation
Fig. 1 .CEM-3 copper-clad plate Making programme schematic diagram
Embodiment
Describe three embodiments below in conjunction with accompanying drawing, the present invention will be further described, but the present invention is not limited to these embodiments.
Embodiment 1: a kind of preparation method of CEM-3 copper-clad plate
A. prepare core material resin, its ingredients weight parts is:
Bisphenol A type epoxy resin 90 parts, novolak type epoxy resin 10 parts,
30 parts, phenolic resins, filler Al2O3 240 parts,
Filler titanium dioxide 10 parts, filler talcum powder 20 parts
Coupling agent KH-560 4.5 parts of curing accelerator 2-ethyl-4-methylimidazoles 0.03 part,
B. above material butanone is modulated into core material resin liquid;
C. with above-mentioned resin liquid dipping glass fiber paper, at temperature 130-210 DEG C, make it become semi-cured state, make core material bonding sheet.
D. prepare fabric resin matrix, its component (weight portion) is:
Bisphenol A type epoxy resin 70 parts, brominated epoxy resin 30 parts,
Nitrogenous novolak type phenolic resins 20 parts of Al (OH)
320 parts,
Boron nitride 40 parts of curing accelerator 2-ethyl-4-methylimidazoles 0.05 part
E. above material butanone is modulated into core material resin liquid;
F. flood 7628 glass-fiber-fabrics with above-mentioned core material glue, after temperature 130-210 DEG C of drying, cut into slices and make fabric bonding sheet.
G. suppress 1.6mm thickness sheet material, select 3 core materials, upper and lower surface respectively pastes a fabric, and one or both sides cover Copper Foil, at temperature 80 DEG C-200 DEG C, pressure 10-100Kg/cm
2with below vacuum degree-60mmHg, heat-insulation pressure keeping 60 minutes, makes CEM-3 type copper clad laminate.
Embodiment 2: a kind of preparation method of CEM-3 copper-clad plate
A. prepare core material resin, its ingredients weight parts is:
Bisphenol A type epoxy resin 90 parts, novolak type epoxy resin 10 parts,
20 parts, phenolic resins, filler Al (OH)
340 parts,
Filler boron nitride 80 parts, coupling agent KH-560 1.5 parts,
Curing accelerator 2-ethyl-4-methylimidazole 0.4 part
B. above material butanone is modulated into core material resin liquid;
C. with above-mentioned resin liquid dipping glass fiber paper, after 130-210 DEG C of drying, cut into slices and make core material;
D. prepare fabric resin, its component (weight portion) is:
Bisphenol A type epoxy resin 70 parts, brominated epoxy resin 30 parts,
Nitrogenous novolak type phenolic resins 30 parts of Al (OH)
340 parts,
Aluminium nitride 60 parts of curing accelerator 2-ethyl-4-methylimidazoles 0.2 part
E. above material butanone is modulated into fabric resin liquid;
F. flood 7628 glass-fiber-fabrics by above-mentioned resin liquid, after 130-210 DEG C of drying, cut into slices and make fabric;
G. suppress 1.6mm thickness sheet material, select 3 core materials, upper and lower surface respectively pastes a fabric, and one or both sides cover Copper Foil, temperature laminated into type 170 DEG C, unit pressure 30-60kgf/cm
2with below vacuum degree-60mmHg, heat-insulation pressure keeping 60 minutes, makes CEM-3 type copper clad laminate.
Embodiment 3: a kind of preparation method of CEM-3 copper-clad plate
A. prepare core material resin, its component (weight portion) is:
Bisphenol A type epoxy resin 100 parts, 25 parts, phenolic resins,
Filler Al (OH)
380 parts, filler aluminium nitride 20 parts,
120 parts, filler magnesium oxide, coupling agent KH-560 2.5 parts;
Curing accelerator 2-ethyl-4-methylimidazole 0.1 part.
B. above material butanone is modulated into core material resin liquid;
C. with above-mentioned resin liquid dipping glass fiber paper, after 130-210 DEG C of drying, cut into slices and make core material;
D. prepare fabric resin, its component is:
Bisphenol A type epoxy resin 70 parts, brominated epoxy resin 30 parts,
Nitrogenous novolak type phenolic resins 25 parts of Mg (OH)
330 parts,
Aluminium nitride 40 parts of curing accelerator 2-ethyl-4-methylimidazoles 0.2 part
E. above material butanone is modulated into fabric resin liquid;
F. flood 7628 glass-fiber-fabrics by above-mentioned resin liquid, after 130-210 DEG C of drying, cut into slices and make fabric;
G. suppress 2.0mm thickness sheet material, select 6 core materials, upper and lower surface respectively pastes a fabric, and one or both sides cover Copper Foil, and temperature laminated into type 170 DEG C, at unit pressure 30kgf/cm
2with below vacuum degree-60mmHg, heat-insulation pressure keeping 60 minutes, makes CEM-3 type copper clad laminate.
The present invention compares with the preparation method of traditional C EM-3, and the thermal conductivity (method of testing adopts ASTM5470) of sheet material and phase ratio creepage tracking index, test result sees the following form.Resistance to tracking is tested by IEC electrolyte method of dripping; Anti-flammability presses UL-94 test.
Results contrast is analyzed:
1 from above results of property, and product thermal conductivity of the present invention is all more than or equal to 1W/mk.And the thermal conductivity of common CEM-3 product is at about 0.5W/mk.
2 product phase ratio creepage tracking indexes of the present invention are all more than or equal to 600V, and Td is more than 330 DEG C, and T260 is greater than 60min.And the CTI of common CEM-3 product is about 7min at 200V, T260, Td is below 310 DEG C.
3 compare from the floating weldering of traditional performance, fried plate, and product of the present invention is far away higher than common CEM-3 product; Fried plate after pressure cooker is far longer than common sheet material, illustrates that the moisture-proof of this sheet material is good.
Claims (1)
1. preparation method of CEM-3 copper clad plate with high heat conductivity, is characterized in that, carries out according to following Method and process:
The preparation method of I core material
A. be main curing agent with epoxy resin/phenolic resins, add coupling agent, filler and curing accelerator; Said coupling agent is KH-550 or KH-560; Proportioning is therebetween:
Bisphenol A type epoxy resin 90 parts, novolak type epoxy resin 10 parts;
30 parts, phenolic resins;
Filler: Al
2o
3240 parts, titanium dioxide 10 parts, talcum powder 20 parts;
Coupling agent 4.5 parts;
Curing accelerator 2-ethyl-4-methylimidazole 0.03 part;
Or be: bisphenol A type epoxy resin 90 parts, novolak type epoxy resin 10 parts;
20 parts, phenolic resins;
Filler: Al (OH)
340 parts, boron nitride 80 parts;
Coupling agent 1.5 parts;
Curing accelerator 2-ethyl-4-methylimidazole 0.4 part;
B. above material butanone is modulated into core material resin liquid;
C. with above-mentioned core material glue impregnated glass fiber paper, at temperature 130 DEG C-210 DEG C, make it become semi-cured state, make core material;
The preparation method of II fabric
D. use epoxy resin/phenolic resin curing system, be dissolved into butanone the solution that viscosity is 25 ± 10s, the two or more mixture added in aluminium hydroxide or magnesium hydroxide, boron nitride, aluminium nitride, aluminium oxide makes filler;
The curing system of said epoxy resin/phenolic resins, in the weight portion of epoxy resin for 100, phenolic resins is 25 ± 5; The weight portion of filler is 60-100, and curing accelerator is 0.03-0.3 part;
E. above material butanone is adjusted to fabric resin liquid;
F. with above-mentioned fabric glue impregnated glass fiber cloth, at temperature 130 DEG C-210 DEG C, make it become semi-cured state, make fabric;
III batching and laminated into type
G. according to thickness needs, superposition 1-10 opens above-mentioned core material, respectively sticks and states fabric, cover Copper Foil at the one or both sides of fabric in the core material upper and lower surface of superposition; At temperature 80 DEG C-200 DEG C, pressure 10-100kg/cm
2with below vacuum degree-60mmHg, hot-forming.
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| CN101848604B true CN101848604B (en) | 2015-04-08 |
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Families Citing this family (16)
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| CN102006722A (en) * | 2010-11-15 | 2011-04-06 | 中山市格普斯纳米电热科技有限公司 | Quick heat dissipation circuit board |
| CN102031008B (en) * | 2010-11-17 | 2012-07-25 | 广东生益科技股份有限公司 | Production method of thin prepreg with high-content filler adhesive system |
| CN102205675A (en) * | 2011-03-29 | 2011-10-05 | 浙江华正新材料股份有限公司 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
| CN102612278B (en) * | 2012-03-05 | 2014-09-10 | 深圳市景旺电子股份有限公司 | Method for producing multilayer printed circuit board by adopting CEM-3(composite epoxy material grade-3) type copper-clad plate |
| WO2013156906A1 (en) * | 2012-04-16 | 2013-10-24 | Koninklijke Philips N.V. | Pcb laminate material |
| CN102690495B (en) * | 2012-05-30 | 2014-10-22 | 日邦树脂(无锡)有限公司 | Hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin and application thereof |
| CN103057214B (en) * | 2012-12-31 | 2015-03-11 | 金安国纪科技股份有限公司 | Environment-friendly glue solution for LED full-color display, copper clad laminate and preparation method thereof |
| CN103057213B (en) * | 2012-12-31 | 2015-10-07 | 金安国纪科技股份有限公司 | The copper-clad plate of environment-friendly type LED single color display screen, glue and preparation method |
| CN103304961B (en) * | 2013-06-14 | 2016-01-20 | 泰山医学院 | High heat conduction semicure film of composite copper-clad plate and preparation method thereof |
| CN103770436B (en) * | 2014-01-16 | 2016-08-17 | 陕西生益科技有限公司 | A kind of preparation method and applications of halogen-free high-thermal-conductivity resin matrix composite |
| CN104972727B (en) * | 2014-04-09 | 2018-01-05 | 广东生益科技股份有限公司 | A kind of copper-clad plates of Halogen composite base CEM 3 and preparation method thereof |
| CN105437673A (en) * | 2015-12-25 | 2016-03-30 | 广东生益科技股份有限公司 | Ultrathin copper clad laminate and production method thereof |
| CN106079814B (en) * | 2016-06-06 | 2018-11-09 | 陕西生益科技有限公司 | A kind of copper-clad plate lamination method |
| CN107205310B (en) | 2017-06-29 | 2019-12-24 | 惠科股份有限公司 | Circuit board and display device |
| CN110370750B (en) * | 2019-07-03 | 2022-01-28 | 江西品升电子有限公司 | High-thermal-conductivity copper-clad plate and preparation method thereof |
| CN110435254B (en) * | 2019-08-29 | 2021-12-03 | 山东金宝电子股份有限公司 | Preparation method of CEM-3 copper-clad plate with high heat resistance and high CTI (comparative tracking index) |
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