CN106079814B - A kind of copper-clad plate lamination method - Google Patents
A kind of copper-clad plate lamination method Download PDFInfo
- Publication number
- CN106079814B CN106079814B CN201610394537.XA CN201610394537A CN106079814B CN 106079814 B CN106079814 B CN 106079814B CN 201610394537 A CN201610394537 A CN 201610394537A CN 106079814 B CN106079814 B CN 106079814B
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- Prior art keywords
- copper
- filler
- vibration
- clad plate
- lamination
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1045—Intermittent pressing, e.g. by oscillating or reciprocating motion of the pressing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
Abstract
The invention discloses a kind of copper-clad plate lamination methods, and vibration is carried out at the same time during lamination.The desirable following advantageous effect of the method for the present invention：Make filler distribution evenly, plank has better apparent, the performance of more stable homogeneous；Cavity and bad interface can be substantially reduced, water absorption rate is reduced, improves heat resistance；Keep filler accumulation evenly close, improves thermal conductivity；The additive amount of filler is can further improve, thermal conductivity is improved.
Description
Technical field
The invention belongs to copper-clad plate fields, and in particular to a kind of copper-clad plate lamination method.
Background technology
The packaging density of electronic product is higher and higher, while as LED, power module constant power are increasing, to substrate
Heat-sinking capability proposes increasingly higher demands.Currently, the mentality of designing of heat-conductive copper-clad plate is still to add based on filler, raising is filled out
Material additive amount is the method for the raising plank thermal conductivity generally used.But it is simple to improve filler additive amount, often technique is caused to be grasped
Decline to a great extent as property and plank interior void may be caused to increase, apparent variation the defects of.The prior art mainly by using
The tightly packed of filler is realized in big small particle collocation, different-shape collocation etc., improves the additive amount of filler.
Traditional copper-clad plate lamination technique is certain heating rate, and as temperature increases, in different temperatures node,
Stepped pressure.This laminating technology may make the mobility of resin and lamination pressure to match, and ensure that resin can flow exclusion
Bubble, and the excessive influence thickness evenness of gummosis will not be made.But for the prodigious bonding sheet of filler additive amount, this substep adds
The laminating technology of pressure, pressure unilaterally rise, and filler cannot be made to move horizontally well, and point of the filler in whole bonding sheet
Cloth is constantly present certain fluctuation, and filler multi-region domain resin is squeezed away, forms bad interface, and the region that filler is few, it is likely that
It is under-voltage, form cavity so that the performance of copper-clad plate, it is not only uneven, but also whole variation.It is well-known in terms of lamination procedure
Raising heating rate, increase lamination pressure can make filler accumulation it is closer.But this kind of technique cannot still be fully solved with
Upper problem.
Invention content
The object of the present invention is to provide a kind of copper-clad plate lamination method, solve that existing laminating technology is prepared covers copper
The non-uniform problem of plate filler distribution.
The technical solution adopted in the present invention is that a kind of copper-clad plate lamination method is carried out at the same time during lamination and shakes
It is dynamic.Application vibration is conducive to filler and preferably moves horizontally, and adjusts more suitably posture, makes filler distribution evenly, heap
Product is closer.
The features of the present invention also characterized in that：
It is carried out at the same time vibration during being laminated heating.
When laminating temperature is in the colloidal sol transition point T of material1With gel conversion point T2Between when start to vibrate.In T1~T2It
Between resin have certain fluidity, vibrating can just be such that filler is moved horizontally at this time.
The frequency of vibration is 300~6000Hz, this frequency band is more effective to the common micro-scaled filler used in copper-clad plate.
Time of vibration is 2~50min.
Second object of the present invention is to provide a kind of laminate, includes the prepreg of several overlappings, using above-mentioned
Laminating technology is made.
Third object of the present invention is to provide a kind of copper-clad plates comprising above-mentioned laminate and fits in laminate one
The copper foil in face or two sides.
Fourth object of the present invention is to provide a kind of printed circuit board, uses copper-clad plate described above.
Compared with prior art, the invention has the advantages that：
Application vibration is conducive to filler and preferably moves horizontally, and adjusts more suitably posture, keeps filler distribution more equal
Even, accumulation is closer.Following advantageous effect can use to obtain using the method for the present invention：1. making filler distribution evenly, plank has more preferably
Apparent, the performance of more stable homogeneous；2. cavity and bad interface can be substantially reduced, water absorption rate is reduced, improves heat resistance；3. making
Filler accumulation is evenly close, improves thermal conductivity；4. can further improve the additive amount of filler, thermal conductivity is improved.
Description of the drawings
Fig. 1 is the structure chart of upper and lower cover plates used in copper-clad plate lamination method of the present invention.
In figure, 1. cover boards, 2. dithers.
Specific implementation mode
The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments.
By taking CEM-3 core material bonding sheets as an example, packing quality score 85%, filling alumina.Its 1.2 DEG C of rheometer test/
T under min heating rates1It is 90 DEG C, T2It is 125 DEG C.Several high-frequency vibrations are set in lamination upper and lower cover plates 1 used first
Device 2 (referring to Fig. 1) then assembles lamination material, mirror board, upper and lower cover plates, is put into hot press lamination.
A is traditional lamination procedure A in table 1, as a comparison case；B1-B8 is the lamination procedure for applying different vibration frequencies.
Table 1
The performance test results：
As can be seen that the plank for applying vibration lamination has improvement in terms of apparent, water absorption rate, thermal conductivity, in embodiment
It is effective in the frequency range of selection, it is best with 2000Hz~4000Hz effects.
It is 2000Hz that C1-C9, which is vibration frequency, in table 2, the lamination procedure of different vibration times.
Table 2
The performance test results：
As can be seen that applying vibration time within the scope of 2min~50min, the plank of lamination is in apparent, water absorption rate, thermal conductivity
It is improved in varying degrees in terms of rate, after vibration time is more than 10min, plate property tends towards stability.
It is 2000Hz, vibration time 30min, the different lamination journey of vibration start temperature that D1-D7, which is vibration frequency, in table 3
Sequence.
Table 3
The performance test results：
As can be seen that the period of vibration covers T1~T2In this temperature range, plank is in apparent, water absorption rate, thermal conductivity
Improve in terms of rate more apparent.D7 do not cover T due to the period of vibration1~T2In this temperature range, thus effect is worst.
Theoretically speaking only in T1~T2This temperature range, resin is in viscoelastic state, flowable, applies vibration at this time and is conducive to fill out
Material is moved horizontally, tightly packed.
Claims (4)
1. a kind of copper-clad plate lamination method, which is characterized in that be carried out at the same time vibration during being laminated heating；Applying vibration has
It is preferably moved horizontally conducive to filler, and adjusts more suitably posture, make filler distribution evenly, accumulation is closer；
Colloidal sol transition point T of the laminating temperature in material1With gel conversion point T2Between when start to vibrate；
The frequency of vibration is 2000~4000Hz；Time of vibration is 2~50min.
2. a kind of laminate includes the prepreg of several overlappings, which is characterized in that it uses lamination described in claim 1
Method is made.
3. a kind of copper-clad plate, which is characterized in that it include laminate described in claim 2 and fit in laminate one side or
The copper foil on two sides.
4. a kind of printed circuit board, which is characterized in that it uses the copper-clad plate of the claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610394537.XA CN106079814B (en) | 2016-06-06 | 2016-06-06 | A kind of copper-clad plate lamination method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610394537.XA CN106079814B (en) | 2016-06-06 | 2016-06-06 | A kind of copper-clad plate lamination method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106079814A CN106079814A (en) | 2016-11-09 |
| CN106079814B true CN106079814B (en) | 2018-11-09 |
Family
ID=57447238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610394537.XA Active CN106079814B (en) | 2016-06-06 | 2016-06-06 | A kind of copper-clad plate lamination method |
Country Status (1)
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1775502A (en) * | 2005-11-25 | 2006-05-24 | 华南理工大学 | Vibration shaping method for neat-conducting insulated plastics |
| CN101848604A (en) * | 2010-05-10 | 2010-09-29 | 陕西生益科技有限公司 | Preparation method of CEM-3 copper clad plate with high heat conductivity |
| JP2015061797A (en) * | 2013-08-20 | 2015-04-02 | 株式会社村田製作所 | Chip throw-in device |
| CN104902728A (en) * | 2014-03-03 | 2015-09-09 | 联想(北京)有限公司 | Electronic equipment and heat-radiating member |
-
2016
- 2016-06-06 CN CN201610394537.XA patent/CN106079814B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1775502A (en) * | 2005-11-25 | 2006-05-24 | 华南理工大学 | Vibration shaping method for neat-conducting insulated plastics |
| CN101848604A (en) * | 2010-05-10 | 2010-09-29 | 陕西生益科技有限公司 | Preparation method of CEM-3 copper clad plate with high heat conductivity |
| JP2015061797A (en) * | 2013-08-20 | 2015-04-02 | 株式会社村田製作所 | Chip throw-in device |
| CN104902728A (en) * | 2014-03-03 | 2015-09-09 | 联想(北京)有限公司 | Electronic equipment and heat-radiating member |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106079814A (en) | 2016-11-09 |
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