CN103249265B - A kind of blind hole filling perforation method - Google Patents
A kind of blind hole filling perforation method Download PDFInfo
- Publication number
- CN103249265B CN103249265B CN201310191197.7A CN201310191197A CN103249265B CN 103249265 B CN103249265 B CN 103249265B CN 201310191197 A CN201310191197 A CN 201310191197A CN 103249265 B CN103249265 B CN 103249265B
- Authority
- CN
- China
- Prior art keywords
- resin
- blind hole
- consent
- bushing
- oatmeal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of blind hole filling perforation method, comprising: one deck resin-made powdering that the glass cloth to lamination prepreg used applies, and gets rid of glass cloth part wherein, obtains the resin-oatmeal in powdered resin thus; Make consent bushing, described consent bushing is formed with the small opening corresponding with the position of the blind hole on corresponding multilayer printed circuit board; Before laminated stacked plate, by consent bushing and with corresponding multilayer printed circuit board stacked align fixing, the resin-oatmeal of acquisition is spread in the small opening of consent bushing, resin-oatmeal is made to fill up the blind hole of multilayer printed circuit board completely, after this on resin-oatmeal, PI tape seal is utilized, and by PI tape-stripping on consent bushing; Prepreg is utilized to carry out lamination to multilayer printed circuit board; Remove PI adhesive tape after lamination, take off consent bushing, plate face is ground, remove the resin-oatmeal solidfied material that blind hole mouth is piled up, and aperture is polished.
Description
Technical field
The present invention relates to printed circuit board and manufacture field, more particularly, the present invention relates to a kind of blind hole filling perforation method.
Background technology
Some multilayer printed boards having buried blind via to design are due to plate face attachment components and parts, require that plate face is smooth, therefore generally all to fill and lead up process in the blind hole of components and parts mounting position, but part plate due to design requirement need to use the low prepreg of mobility (fluidity is lower than 10%) lamination.Fill discontented aperture depression during lamination in blind hole, evenness is very poor, and cannot meet the demands, and adopt filling holes with resin mode to make, because the resin of consent and the prepreg of lamination are not same resin systems, the difference in performance causes reliability to be affected.
Specifically, part multilayer printed circuit board, due to electrical performance demands, folded structure design has buried blind via to design; As shown in Figure 1, top blind hole 1, buried blind via 2, bottom blind hole 3 and through hole 4 may be there is in multilayer printed circuit board.If buried blind via 2 place is not is not filled and led up, when lamination, resin gummosis will be filled in buried blind via.But for the prepreg of low fluidity (being less than 10%), due to its poor fluidity, during lamination, prepreg resin Heated Flow can not be filled in aperture completely, causes aperture to cave in large, cannot meet the reliability requirement of printed board plate face aperture position high-flatness; As shown in Figure 2, forming blind hole in internal layer base material 5, hole wall plated with copper 6, is prepreg resin gummosis fill area 7 between blind hole, and blind hole can form aperture depression 8.
At present, the solution for this defect adopts liquid resin to fill blind hole, blind hole filled and led up, and follow-up heavy copper plating again makes.Made by this mode, blind hole position is filled and led up, and can reach the high-flatness requirement of plate face aperture position.
But, although employing liquid resin or copper cream consent can be populated by hole, but because the prepreg of liquid resin or copper cream and multi-layer sheet lamination is not same resin system, at thermal endurance and thermal coefficient of expansion (Coefficient of Thermal Expand, CTE) differ greatly, easy after being subject to repeatedly thermal shock from generation crack, interface, crack further expands and will directly cause the separation plate bursting of printed board, and therefore the printed board reliability of this method processing is poor.
Summary of the invention
Technical problem to be solved by this invention is for there is above-mentioned defect in prior art, thering is provided a kind of can guarantee when not adopting liquid resin or copper cream consent in blind hole, to fill uniform lazy flow prepreg blind hole filling perforation manufacture method, which obviating blind hole and filling discontented or that reliability is poor problem.
According to the present invention, provide a kind of blind hole filling perforation method, it comprises:
First step: one deck resin-made powdering that the glass cloth to lamination prepreg used applies, and get rid of glass cloth part wherein, obtain powdered resin powder thus;
Second step: make consent bushing, described consent bushing is formed with the small opening corresponding with the position of the blind hole on corresponding multilayer printed circuit board;
Third step: before laminated stacked plate, by consent bushing and with corresponding multilayer printed circuit board stacked align fixing, the resin-oatmeal obtained in first step is spread in the small opening of consent bushing, resin-oatmeal is made to fill up the blind hole of multilayer printed circuit board completely, after this on resin-oatmeal, utilize PI adhesive tape (Kapton Tape) to seal, and by PI tape-stripping on consent bushing;
4th step: utilize prepreg to carry out lamination to multilayer printed circuit board;
5th step: remove PI adhesive tape after lamination, takes off consent bushing, grinds plate face, removes the resin-oatmeal solidfied material that blind hole mouth is piled up, and is polished in aperture.
Preferably, in a first step, prepreg used to lamination is crumpled, one deck resin that prepreg glass cloth applies is twisted into powdery, the resin-oatmeal fine mesh screen cloth rubbed with the hands filters, and gets rid of glass cloth part wherein, is collected by the resin-oatmeal filtered down.
Preferably, in the second step, according to multilayer printed circuit board being wanted bore position hole at correspondence position at aluminium flake, consent bushing is made thus.
Preferably, the diameter 0.3-0.6mm larger than the diameter of the blind hole on printed circuit board of the small opening of aluminium flake brill.
Preferably, in the 4th step, vacuum laminator is utilized to carry out lamination by HTHP to multilayer printed circuit board.
Preferably, in the 4th step, vacuum laminator is utilized to carry out lamination by HTHP to multilayer printed circuit board according to the parameter of prepreg.
Utilization of the present invention and the same resin system resin-oatmeal of layers cementing prepreg used fill printed board blind hole; Wherein bore small opening from consent bushing, corresponding printed board blind hole position, small opening position, obtains the bushing of potting resin; Resin-oatmeal to be sprinkled in plate in blind hole by consent bushing; The HTHP effect of lamination makes resin-oatmeal fully solidify and fill up aperture, and the raised area grinds away, thus reaches the closely knit smooth effect of blind hole filling perforation.Thus, the invention provides and a kind ofly just can guarantee when not adopting liquid resin or copper cream consent in blind hole, to fill uniform lazy flow prepreg blind hole filling perforation manufacture method.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its adjoint advantage and feature, wherein:
Fig. 1 is the schematic diagram schematically showing multilayer printed board buried blind via structure.
Fig. 2 is the schematic diagram of the prepreg filling blind hole effect schematically showing lazy flow.
Fig. 3 schematically shows the flow chart of blind hole filling perforation method according to the preferred embodiment of the invention.
Fig. 4 and Fig. 5 is the sectional view of the step schematically showing blind hole filling perforation method according to the preferred embodiment of the invention.
It should be noted that, accompanying drawing is for illustration of the present invention, and unrestricted the present invention.Note, represent that the accompanying drawing of structure may not be draw in proportion.Further, in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention clearly with understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
The present invention is directed to the deficiency of above-mentioned consent mode in reliability, propose a kind of novel blind hole filling perforation mode.By spreading resin-oatmeal (be same resin system with the prepreg of multi-layer sheet lamination) in blind hole position, in laminating machine, HTHP mode is filled blind hole, both ensure that in blind hole and filled evenly, again because all adhesive linkages are same resin systems, consistent on thermal endurance and CTE, the better reliability of therefore printed board.
The preferred embodiments of the present invention are specifically described below in conjunction with accompanying drawing 3 to Fig. 5.
Fig. 3 schematically shows the flow chart of blind hole filling perforation method according to the preferred embodiment of the invention.
Specifically, as shown in Figure 3, blind hole filling perforation method comprises according to the preferred embodiment of the invention:
First step S1: one deck resin-made powdering that the glass cloth to lamination prepreg used applies, and get rid of glass cloth part wherein, obtain the resin-oatmeal in powdered resin thus;
Specifically, such as, in first step S1, can crumple by the prepreg used to lamination, one deck resin that prepreg glass cloth applies is twisted into powdery, the resin-oatmeal fine mesh screen cloth (such as 310 orders) rubbed with the hands filters, and gets rid of glass cloth part wherein, is collected by the resin-oatmeal filtered down;
Second step S2: make consent bushing 10, described consent bushing is formed with the small opening 11 corresponding with the position of the blind hole 101 on corresponding multilayer printed circuit board 100 (position that will hole).
Specifically, such as, in second step S2, as shown in Figure 4, can hole at correspondence position at aluminium flake according to multilayer printed circuit board being wanted bore position, making consent bushing thus.Preferably, the diameter 0.3-0.6mm larger than the diameter of the blind hole on printed circuit board of the small opening that aluminium flake bores, so that fill out resin-oatmeal alignment operation.
Third step S3: before laminated stacked plate, by consent bushing 10 and with corresponding multilayer printed circuit board 100 stacked align fixing, the resin-oatmeal 30 obtained in first step S1 is sprinkling upon in the small opening of consent bushing 10, resin-oatmeal 30 is made to fill up the blind hole 101 of multilayer printed circuit board 100 completely, after this on resin-oatmeal 30, utilize PI adhesive tape 20 (i.e. Kapton Tape) to seal, and PI adhesive tape 20 is pasted onto on consent bushing 10, as shown in the resin-oatmeal 30 of Fig. 5 and PI adhesive tape 20;
4th step S4: utilize prepreg 40 pairs of multilayer printed circuit boards 100 to carry out lamination, as shown in Figure 5;
Wherein, in the fourth step s 4, vacuum laminator specifically can be utilized to carry out lamination by HTHP to multilayer printed circuit board 100, and lamination can be carried out according to the requirement parameter of prepreg 40;
5th step S5: remove PI adhesive tape 20 after lamination, takes off consent bushing 10, grinds plate face, removes the resin-oatmeal solidfied material that blind hole 101 mouthfuls is piled up, and is polished in aperture; The filler of the same resin system of prepreg 40 used with layers cementing is just filled with in such blind hole 101.
Above preferred embodiment of the present invention utilizes fills printed board blind hole with the same resin system resin-oatmeal of layers cementing prepreg used; Wherein bore small opening from consent bushing, corresponding printed board blind hole position, small opening position, obtains the bushing of potting resin; Resin-oatmeal to be sprinkled in plate in blind hole by consent bushing; The HTHP effect of lamination makes resin-oatmeal fully solidify and fill up aperture, and the raised area grinds away, thus reaches the closely knit smooth effect of blind hole filling perforation.
In addition, it should be noted that, unless otherwise indicated, otherwise the term " first " in specification, " second ", " the 3rd " etc. describe only for distinguishing each assembly, element, step etc. in specification, instead of for representing logical relation between each assembly, element, step or ordinal relation etc.
Be understandable that, although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. a blind hole filling perforation method, is characterized in that comprising:
First step: one deck resin-made powdering that the glass cloth to lamination prepreg used applies, and get rid of glass cloth part wherein, obtain the resin-oatmeal in powdered resin thus;
Second step: make consent bushing, described consent bushing is formed with the small opening corresponding with the position of the blind hole on corresponding multilayer printed circuit board;
Third step: before laminated stacked plate, consent bushing and the stacked alignment of corresponding multilayer printed circuit board are fixed, the resin-oatmeal obtained in first step is spread in the small opening of consent bushing, resin-oatmeal is made to fill up the blind hole of multilayer printed circuit board completely, after this on resin-oatmeal, PI tape seal is utilized, and by PI tape-stripping on consent bushing;
4th step: utilize prepreg to carry out lamination to multilayer printed circuit board;
5th step: remove PI adhesive tape after lamination, takes off consent bushing, grinds plate face, removes the resin-oatmeal solidfied material that blind hole mouth is piled up, and is polished in aperture.
2. blind hole filling perforation method according to claim 1, it is characterized in that, in a first step, the prepreg used to lamination is crumpled, one deck resin that prepreg glass cloth applies is twisted into powdery, the resin-oatmeal fine mesh screen cloth rubbed with the hands filters, and gets rid of glass cloth part wherein, is collected by the resin-oatmeal filtered down.
3. blind hole filling perforation method according to claim 1 and 2, is characterized in that, in the second step, the correspondence position according to multilayer printed circuit board being wanted bore position at aluminium flake is holed, and makes consent bushing thus.
4. blind hole filling perforation method according to claim 1 and 2, is characterized in that, the diameter 0.3-0.6mm larger than the diameter of the blind hole on printed circuit board of the small opening that aluminium flake bores.
5. blind hole filling perforation method according to claim 1 and 2, is characterized in that, in the 4th step, utilize vacuum laminator to carry out lamination by HTHP to multilayer printed circuit board.
6. blind hole filling perforation method according to claim 1 and 2, is characterized in that, utilizes vacuum laminator to carry out lamination by HTHP to multilayer printed circuit board according to the parameter of prepreg in the 4th step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310191197.7A CN103249265B (en) | 2013-05-21 | 2013-05-21 | A kind of blind hole filling perforation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310191197.7A CN103249265B (en) | 2013-05-21 | 2013-05-21 | A kind of blind hole filling perforation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103249265A CN103249265A (en) | 2013-08-14 |
| CN103249265B true CN103249265B (en) | 2015-10-07 |
Family
ID=48928396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310191197.7A Active CN103249265B (en) | 2013-05-21 | 2013-05-21 | A kind of blind hole filling perforation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103249265B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636355A (en) * | 2016-03-07 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | Adhesive filling method for groove hole of metal substrate |
| CN107333397A (en) * | 2017-08-07 | 2017-11-07 | 胜宏科技（惠州）股份有限公司 | A kind of wiring board control deeply etching method |
| CN109561586A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | High-frequency microwave multilayer board filling holes with resin method |
| CN107734835A (en) * | 2017-11-14 | 2018-02-23 | 惠州市兴顺和电子有限公司 | Wiring board consent pressing structure and compression method |
| CN111295052B (en) * | 2020-03-25 | 2021-06-01 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5795618A (en) * | 1991-07-23 | 1998-08-18 | Ibiden Co., Ltd | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board |
| CN102244986A (en) * | 2010-05-13 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | Hole plugging device and hole plugging method of circuit board |
| CN202351076U (en) * | 2011-12-09 | 2012-07-25 | 广东生益科技股份有限公司 | Automatic powder sampling device for detection and sampling of prepreg |
-
2013
- 2013-05-21 CN CN201310191197.7A patent/CN103249265B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5795618A (en) * | 1991-07-23 | 1998-08-18 | Ibiden Co., Ltd | Polymerizable adhesive (comprising cured amino resin powder) for print ed circuit board |
| CN102244986A (en) * | 2010-05-13 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | Hole plugging device and hole plugging method of circuit board |
| CN202351076U (en) * | 2011-12-09 | 2012-07-25 | 广东生益科技股份有限公司 | Automatic powder sampling device for detection and sampling of prepreg |
Non-Patent Citations (1)
| Title |
|---|
| 树脂塞孔工艺技术的研发;赵志平、周刚;《印制电路信息》;20100228;第2010卷(第2期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103249265A (en) | 2013-08-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103249265B (en) | A kind of blind hole filling perforation method | |
| CN102933032B (en) | Printed wiring board lamination and copper block embedding method | |
| CN102946687B (en) | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof | |
| US9277640B2 (en) | Flexible printed circuit board and method for manufacturing same | |
| CN103237422B (en) | A kind of thick copper multilayer plate laminates method | |
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| CN205961580U (en) | A compound glued membrane component that hinders for production of printed circuit board | |
| CN102029746A (en) | Copper-clad board and production method thereof | |
| CN105451450A (en) | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow | |
| TW201501600A (en) | Printed circuit board and method for manufacturing same | |
| CN204836779U (en) | A printed circuit board structure for having than high heat dissipating demand product | |
| CN201216042Y (en) | Second order hole overlapping construction constructed by reverse suspension type blind hole | |
| CN206421054U (en) | A kind of polarizing coating | |
| CN102858098A (en) | Production method of asymmetric PCB (printed circuit board) | |
| JP2012243986A (en) | Component built-in module and manufacturing method of the same | |
| CN102365006A (en) | Processing method of multi-layer circuit board | |
| CN206024252U (en) | Circuit board | |
| CN204367507U (en) | A kind of flexible-paper-base copper-clad plate | |
| CN203407071U (en) | Circuit board with crimping blind hole | |
| CN102490435A (en) | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method | |
| CN105128454A (en) | Double-sided aluminum-based copper-clad plate for LED lamp and manufacturing method for double-sided aluminum-based copper-clad plate | |
| CN205378338U (en) | Electromagnetic interference resistance printed circuit board | |
| JP2007115954A5 (en) | ||
| CN204335151U (en) | Metal laminate connecting circuit | |
| JP5228626B2 (en) | Three-dimensional printed wiring board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |