CN204335151U - Metal laminate connecting circuit - Google Patents
Metal laminate connecting circuit Download PDFInfo
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- CN204335151U CN204335151U CN201420755918.2U CN201420755918U CN204335151U CN 204335151 U CN204335151 U CN 204335151U CN 201420755918 U CN201420755918 U CN 201420755918U CN 204335151 U CN204335151 U CN 204335151U
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- circuit
- wiring underlayer
- electronic component
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Abstract
The utility model relates to a kind of metal laminate connecting circuit, comprise substrate, wiring underlayer, electronic component and at least one deck upper layer circuit, wiring underlayer is arranged on substrate, electronic component is arranged on wiring underlayer, and upper layer circuit is arranged on to synthesize on wiring underlayer and with wiring underlayer johning knot has certain thickness circuit.The utility model adopts brand-new design concept, adopted by power circuit brand-new technique to be arranged on substrate and form circuit by metal superposition in layer, the wiring underlayer of this circuit mainly adopts the mode of pasting (being coated with heat conduction, electrocondution slurry) to be formed, and the circuit of upper strata superposition is formed mainly through metal thermal spraying technology or laser printing clinkering technology, thus the volume achieving this circuit is little, advantages such as (can be 10 times of current technique) that production technology is simple, cost is low, pollution-free, production efficiency is high.
Description
Technical field
The utility model relates to power circuit, particularly a kind of metal laminate connecting circuit.
Background technology
Current circuit mainly contains PCBA, thin film circuit and the employing pottery thick film circuit as substrate, and these three kinds of circuit are all well-known to those skilled in the art, and its deficiency mainly contains: production technology is comparatively complicated, production efficiency is lower.
Utility model content
The purpose of this utility model is to provide a kind of simple and reasonable for structure, and volume is little, be easy to the metal laminate connecting circuit that realizes.
The purpose of this utility model is achieved in that
A kind of metal laminate connecting circuit, it is characterized in that: comprise substrate, wiring underlayer, electronic component and at least one deck upper layer circuit, wiring underlayer is arranged on substrate, electronic component is arranged on wiring underlayer, and upper layer circuit is arranged on to synthesize on wiring underlayer and with wiring underlayer johning knot has certain thickness circuit.
Above-mentioned metal laminate connecting circuit is a kind of brand-new technology, due to its circuit be by metal in layer lamination and formed with plane on, so called after MLC/MLCA.This circuit is different from current PCBA, thin film circuit and thick film circuit etc.
The purpose of this utility model can also adopt following technical measures to solve:
As scheme more specifically, described electronic component has the pin contacted with circuit conductive, and pin is fixed between lower sandwich circuit and upper layer circuit.
Described substrate, for being flexible fiber sheet material, also can be rigid fibre sheet material.Fibre sheet material is a kind of novel heat conduction, insulating material, and it is walked back and forth as paper is thin, has good heat conductivility and insulation property, does not also serve as the substrate of power circuit at present.
Described upper layer circuit is at least one deck, and according to the power requirement of circuit, the suitably number of plies of increase or less upper layer circuit, to change the thickness of circuit.
The beneficial effects of the utility model are as follows:
(1) the utility model adopts brand-new design concept, adopted by power circuit brand-new technique to be arranged on substrate and form circuit by metal superposition in layer, the wiring underlayer of this circuit mainly adopts the mode of pasting (being coated with heat conduction, electrocondution slurry) to be formed, and the circuit of upper strata superposition is formed mainly through metal thermal spraying technology or laser printing clinkering technology, thus the volume achieving this circuit is little, advantages such as (can be 10 times of current technique) that production technology is simple, cost is low, pollution-free, production efficiency is high;
(2) upper layer circuit can need the pin welded with circuit to be fixed on circuit in electronic component and make pin and circuit form good conductive contact while being formed;
(3), when adopting metal thermal spraying technology or laser printing clinkering technology to prepare upper strata circuit, its working temperature, below 80 DEG C, does not damage electronic component.
Accompanying drawing explanation
Fig. 1 is the utility model one example structure schematic diagram.
Fig. 2 is the A-A sectional structure schematic diagram of Fig. 1.
Fig. 3 is the utility model metal laminate connecting circuit Making programme block diagram.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
Shown in Fig. 1 and Fig. 2, a kind of metal laminate connecting circuit, comprise substrate 1, wiring underlayer 2, electronic component 3 and at least one deck upper layer circuit 5, wiring underlayer 2 arranges on substrate 1, electronic component 3 is arranged on wiring underlayer 2, and upper layer circuit 5 is arranged on to synthesize on wiring underlayer 2 and with wiring underlayer 2 johning knot has certain thickness circuit.
Described electronic component 3 has the pin 4 contacted with circuit conductive, and pin 4 is fixed between lower sandwich circuit and upper layer circuit 5.
Described substrate 1 is fibre sheet material.
Described metal laminate connecting circuit comprises multiple sub-power circuit.
Shown in composition graphs 3, a kind of preparation method of metal laminate connecting circuit:
The first step, gets out substrate 1(and is preferably fibre sheet material), and coat the slurry of conductive and heat-conductive on substrate 1 surface according to the layout requirements of circuit, to form wiring underlayer 2;
Second step, utilizes the viscosity of slurry mounted with electronic components 3 on wiring underlayer 2;
3rd step, electronic component 3 is placed lid mask plate, and lid mask plate corresponding circuits is provided with hollow-out parts;
4th step, adopts metal thermal spraying technology or laser printing clinkering technology to be formed described hollow-out parts and has certain thickness upper layer circuit 5 and the pin 4 simultaneously completing electronic component 3 is fixed;
5th step, takes lid mask plate away;
6th step, cuts metal laminate connecting circuit, to be separated by each sub-power circuit.
Described metal thermal spraying technology is: to hollow-out parts sprayed metal layer, and metal level is upper layer circuit 5, and the pin 4 of electronic component 3 is fixed together with lower floor's line conduction by metal level.
During sprayed metal layer, the distance of shower nozzle and lid mask plate 40mm or within.
Described laser printing clinkering technology is: first, in hollow-out parts, fill metal dust; Then, utilize the laser head of printing device to irradiate metal dust, form upper layer circuit 5 after making fusion of metal powder and the pin 4 of electronic component 3 is fixed together with lower floor's line conduction.
Generally, when the pin 4 of electronic component 3 is narrower, laser printing clinkering technology is adopted to be fixed it; When the pin 4 of electronic component 3 is wider, metal thermal spraying technology is adopted to be fixed it.
Claims (3)
1. a metal laminate connecting circuit, it is characterized in that: comprise substrate, wiring underlayer, electronic component and at least one deck upper layer circuit, wiring underlayer is arranged on substrate, electronic component is arranged on wiring underlayer, and upper layer circuit is arranged on to synthesize on wiring underlayer and with wiring underlayer johning knot has certain thickness circuit.
2. metal laminate connecting circuit according to claim 1, it is characterized in that: described electronic component has the pin contacted with circuit conductive, pin is fixed between lower sandwich circuit and upper layer circuit.
3. metal laminate connecting circuit according to claim 1, is characterized in that: described substrate is flexible fiber sheet material or rigid fibre sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420755918.2U CN204335151U (en) | 2014-12-05 | 2014-12-05 | Metal laminate connecting circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420755918.2U CN204335151U (en) | 2014-12-05 | 2014-12-05 | Metal laminate connecting circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335151U true CN204335151U (en) | 2015-05-13 |
Family
ID=53171455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420755918.2U Active CN204335151U (en) | 2014-12-05 | 2014-12-05 | Metal laminate connecting circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204335151U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582270A (en) * | 2014-12-05 | 2015-04-29 | 广东明路电力电子有限公司 | Metal lamination connecting circuit and preparation method thereof |
-
2014
- 2014-12-05 CN CN201420755918.2U patent/CN204335151U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582270A (en) * | 2014-12-05 | 2015-04-29 | 广东明路电力电子有限公司 | Metal lamination connecting circuit and preparation method thereof |
| WO2016086892A1 (en) * | 2014-12-05 | 2016-06-09 | 广东明路电力电子有限公司 | Metal lamination connecting circuit and preparation method therefor |
| CN104582270B (en) * | 2014-12-05 | 2018-04-27 | 广东明路电力电子有限公司 | Metal laminate connects the preparation method of circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |