CN203057694U - Printed circuit board with metal base - Google Patents
Printed circuit board with metal base Download PDFInfo
- Publication number
- CN203057694U CN203057694U CN 201320023381 CN201320023381U CN203057694U CN 203057694 U CN203057694 U CN 203057694U CN 201320023381 CN201320023381 CN 201320023381 CN 201320023381 U CN201320023381 U CN 201320023381U CN 203057694 U CN203057694 U CN 203057694U
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- CN
- China
- Prior art keywords
- metal substrate
- circuit board
- printed circuit
- pcb
- bronze medal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model relates to a printed circuit board with metal base. The printed circuit board comprises a first copper layer, a second copper layer and a metal base arranged between the first copper layer and the second copper layer. The metal base is arranged between the first copper layer and the second copper layer, thus the stresses on both sides of the metal base are mutually offset, so as to avoid the technical problems of the existing printed circuit board with metal base that stratification phenomenon easily occurs between a bonding layer and the metal base.
Description
Technical field
The utility model relates to the circuit board making field, particularly relates to a kind of printed circuit board (PCB) with Metal Substrate.
Background technology
Traditional printed circuit board (PCB) (PCB, Printed Circuit Board) is made up of copper layer, epoxy resin and glass cloth.Wherein epoxy resin and glass cloth are the non-conductor of heat, and heat dispersion is relatively poor; As work long hours under the condition of high temperature, epoxy resin meeting accelerated ageing makes to shorten greatly the useful life of printed circuit board (PCB), simultaneously because the coefficient of expansion is inconsistent between epoxy resin and the glass cloth, work under the condition of high temperature, the possibility that functional disorder occurs increases greatly.
Because metal possesses thermal stability under better thermal diffusivity, capability of electromagnetic shielding and the high temperature with respect to epoxy resin, so the designer develops a kind of printed circuit board (PCB) with Metal Substrate.
Fig. 1 is existing structural representation with printed circuit board (PCB) of Metal Substrate.This printed circuit board (PCB) with Metal Substrate comprises rigid plate 11, copper layer 12, Metal Substrate 13 and tack coat 14.Rigid plate 11 is arranged between the two-layer copper layer 12, and this Metal Substrate 13 is arranged on a side of printed circuit board (PCB), is connected by the copper layer 12 of tack coat 14 with printed circuit board (PCB) one side.Metal Substrate 13 heat that printed circuit board (PCB) can well be distributed conducts like this, thereby prolongs the useful life of printed circuit board (PCB).But because the coefficient of expansion of the copper layer 12 that uses is bigger in the prior art, when printed circuit board (PCB) during in the condition of high temperature and low-temperature condition alternation, can the great internal stress of formation between tack coat 14 and the Metal Substrate 13; When variations in temperature surpasses certain limit, internal stress will break through the power that is connected between tack coat 14 and the Metal Substrate 13, causes printed circuit board (PCB) to produce plate and sticks up phenomenon, even cause tack coat 14 to separate with Metal Substrate 13, just the normal lamination of saying.
So, be necessary to provide a kind of printed circuit board (PCB) with Metal Substrate, to solve the existing in prior technology problem.
The utility model content
The purpose of this utility model is to provide a kind of printed circuit board (PCB) with Metal Substrate, and it is arranged on Metal Substrate between the first bronze medal layer and the second bronze medal layer, makes the internal stress of Metal Substrate both sides to cancel out each other; Plate sticks up or the technical problem of lamination easily to produce between the tack coat that solves existing printed circuit board (PCB) with Metal Substrate and the Metal Substrate.
For addressing the above problem, the technical scheme that the utility model provides is as follows:
The utility model embodiment relates to a kind of printed circuit board (PCB) with Metal Substrate, and it comprises:
The first bronze medal layer;
The second bronze medal layer; And
Be arranged on the Metal Substrate between the described first bronze medal layer and the described second bronze medal layer.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, be connected by tack coat between the described first bronze medal layer and the described Metal Substrate and between the described second bronze medal layer and the described Metal Substrate.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, also be provided with through hole on the described printed circuit board (PCB), described through-hole surfaces is provided with through hole copper layer, is provided with insulation division between described through hole copper layer and described Metal Substrate.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, be filled with insulating resin in the described insulation division.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, described tack coat is prepreg.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, be filled with the material of described tack coat in the described insulation division.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, the material of described tack coat is filled in the described insulation division by lamination.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, described Metal Substrate is aluminium base, copper base or iron-based.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, the thickness of described insulation division is 0.2mm to 0.3mm.
In the printed circuit board (PCB) with Metal Substrate described in the utility model, described Metal Substrate surface is provided with roughened layer.
Compared to the printed circuit board (PCB) with Metal Substrate of prior art, the printed circuit board (PCB) with Metal Substrate of the present utility model is arranged on Metal Substrate between the first bronze medal layer and the second bronze medal layer, makes the internal stress of Metal Substrate both sides to cancel out each other; Solved and produced easily between the tack coat of existing printed circuit board (PCB) with Metal Substrate and the Metal Substrate that plate sticks up or the technical problem of lamination.
Description of drawings
Fig. 1 is existing structural representation with printed circuit board (PCB) of Metal Substrate;
Fig. 2 is the structural representation of first preferred embodiment of the printed circuit board (PCB) with Metal Substrate of the present utility model;
Fig. 3 is the structural representation of second preferred embodiment of the printed circuit board (PCB) with Metal Substrate of the present utility model;
Wherein, description of reference numerals is as follows:
21, the first bronze medal layer;
22, the second bronze medal layer;
23, Metal Substrate;
24, tack coat;
25, through hole;
26, through hole copper layer;
27, insulation division.
Embodiment
Below the explanation of each embodiment be with reference to additional graphic, can be in order to the specific embodiment of implementing in order to illustration the utility model.
Please refer to Fig. 2, Fig. 2 is the structural representation of first preferred embodiment of the printed circuit board (PCB) with Metal Substrate of the present utility model.The printed circuit board (PCB) with Metal Substrate of this preferred embodiment comprises the first bronze medal layer 21, the second bronze medal layer 22, Metal Substrate 23 and tack coat 24, Metal Substrate 23 is arranged between the first bronze medal layer 21 and the second bronze medal layer 22, the first bronze medal layer 21 is connected by tack coat 24 with a side of Metal Substrate 23, and the second bronze medal layer 22 also is connected by tack coat 24 with the opposite side of Metal Substrate 23.Also be provided with through hole 25 on this printed circuit board (PCB), these through hole 25 surfaces are provided with through hole copper layer 26, and this through hole copper layer 26 is connected with the second bronze medal layer 22 with the first bronze medal layer 21 respectively.Be provided with insulation division 27 between through hole copper layer 26 and Metal Substrate 23, the thickness of insulation division 27 is 0.2mm to 0.3mm, is filled with insulating resin in this insulation division 27.Wherein Metal Substrate 23 is aluminium base, copper base or iron-based, and tack coat 24 is prepreg.
When the printed circuit board (PCB) with Metal Substrate of this preferred embodiment uses, be provided with Metal Substrate 23 in the printed circuit board (PCB) to replace rigid plate, make printed circuit board (PCB) have the thermal stability under thermal diffusivity, electromagnetic shielding ability and the high temperature preferably.Metal Substrate 23 is arranged between the first bronze medal layer 21 and the second bronze medal layer 22 by tack coat 24 simultaneously, when printed circuit board (PCB) during in the condition of high temperature and low-temperature condition alternation, Metal Substrate 23 both sides and tack coat 24 all can form internal stress, but the direction of the internal stress of Metal Substrate 23 both sides is opposite, offset mutually, make Metal Substrate 23 all to form good stable being connected with the tack coat 24 of both sides, avoided the generation of lamination.The Metal Substrate 23 that arranges diverse location of insulation division 27 can play good insulating effect.
How to make the printed circuit board (PCB) with Metal Substrate of this preferred embodiment below with reference to Fig. 2 explanation.
At first to Metal Substrate 23 processing of holing, so that the through hole 25 on the follow-up formation printed circuit board (PCB), should hole here than the big 0.4mm to 0.6mm(in the aperture of through hole on the printed circuit board (PCB) 25 and handle the hole that forms and comprise through hole 25 and insulation division 27 simultaneously in the aperture that the hole that forms is handled in boring).
The hole of using insulating resin to hole subsequently handle to form is filled up, and the first bronze medal layer 21 and the second bronze medal layer 22 is laminated to the both sides of Metal Substrate 23 by tack coat 24.
Use drilling machine to form the through hole 25 that runs through the first bronze medal layer 21, Metal Substrate 23 and the second bronze medal layer 22 at printed circuit board (PCB) then, forming through hole copper layer 26 by electroless copper plating on through hole 25 surfaces, make and the line conduction of Metal Substrate 23 both side surface also formed the insulation division 27 that fills up insulating resin between through hole copper layer 26 and the Metal Substrate 23 simultaneously.
After the first bronze medal layer 21 and the second bronze medal layer 22 are carried out etching, forming surface lines, can finish the making of the printed circuit board (PCB) with Metal Substrate like this.
Further, before lamination, also can make roughened layer on Metal Substrate 23 surfaces, be aluminium base as Metal Substrate 23, then can make roughened layer etc., the Metal Substrate 23 in the time of can further strengthening lamination like this and the adhesion between the tack coat 24 on this aluminium base surface by anodized.
The printed circuit board (PCB) with Metal Substrate of this preferred embodiment is arranged on Metal Substrate between the first bronze medal layer and the second bronze medal layer, make the internal stress of Metal Substrate both sides to cancel out each other, form good insulation performance between the Metal Substrate that is arranged so that diverse location of insulation division simultaneously.Solved and produced easily between the tack coat of existing printed circuit board (PCB) with Metal Substrate and the Metal Substrate that plate sticks up or the technical problem of lamination.
Please refer to Fig. 3, Fig. 3 is the structural representation of second preferred embodiment of the printed circuit board (PCB) with Metal Substrate of the present utility model.This preferred embodiment is that with the difference of first preferred embodiment be filled with the material of tack coat 24 in the insulation division 27, the material of this tack coat 24 is filled in the insulation division 27 by lamination.
When the printed circuit board (PCB) with Metal Substrate of this preferred embodiment uses, Metal Substrate 23 is arranged between the first bronze medal layer 21 and the second bronze medal layer 22 by tack coat 24 equally, when printed circuit board (PCB) during in the condition of high temperature and low-temperature condition alternation, Metal Substrate 23 both sides and tack coat 24 all can form internal stress, but the direction of the internal stress of Metal Substrate 23 both sides is opposite, just in time can cancel out each other, make Metal Substrate 23 all to form good stable being connected with the tack coat 24 of both sides, avoided the generation of lamination.The material of tack coat 24 can play the good insulation effect to the Metal Substrate 23 of diverse location equally in the insulation division 27 simultaneously.
How to make the printed circuit board (PCB) with Metal Substrate of this preferred embodiment below with reference to Fig. 3 explanation.
At first to Metal Substrate 23 processing of holing, so that the through hole 25 on the follow-up formation printed circuit board (PCB), should hole here than the big 0.4mm to 0.6mm(in the aperture of through hole on the printed circuit board (PCB) 25 and handle the hole that forms and comprise through hole 25 and insulation division 27 simultaneously in the aperture that the hole that forms is handled in boring).
Use 24 pairs of first bronze medal layers 21 of tack coat, Metal Substrate 23 and the second bronze medal layer 22 to carry out lamination treatment subsequently, what the tack coat 24 here used is pure glue prepreg, this pure glue prepreg can be converted into the gummosis state in lamination process, handle in the hole that forms thereby be filled into boring.
Use drilling machine to form the through hole 25 that runs through the first bronze medal layer 21, Metal Substrate 23 and the second bronze medal layer 22 at printed circuit board (PCB) then, forming through hole copper layer 26 by electroless copper plating on through hole 25 surfaces, make and the line conduction of Metal Substrate 23 both sides also formed the insulation division 27 that has filled up bonding layer material between through hole copper layer 26 and the Metal Substrate 23 simultaneously.
Like this first bronze medal layer 21 and the second bronze medal layer 22 are carried out etching, after the formation surface lines, can finish the making of the printed circuit board (PCB) with Metal Substrate.
Further, before lamination, also can make roughened layer on Metal Substrate 23 surfaces, as etching processing etc., the Metal Substrate 23 in the time of can further strengthening lamination like this and the adhesion between the tack coat 24 are carried out in Metal Substrate 23 surfaces.
The printed circuit board (PCB) with Metal Substrate of this preferred embodiment is arranged on Metal Substrate between the first bronze medal layer and the second bronze medal layer, make the internal stress of Metal Substrate both sides to cancel out each other, the setting of insulation division simultaneously not only makes and forms good insulation performance between the Metal Substrate of diverse location, simultaneously do not need through hole is carried out other padding, reduced the cost of manufacture of printed circuit board (PCB).
In sum; though the utility model discloses as above with preferred embodiment; but above preferred embodiment is not in order to limit the utility model; those of ordinary skill in the art; in not breaking away from spirit and scope of the present utility model; all can do various changes and retouching, therefore protection range of the present utility model is as the criterion with the scope that claim defines.
Claims (10)
1. the printed circuit board (PCB) with Metal Substrate is characterized in that, comprising:
The first bronze medal layer;
The second bronze medal layer; And
Be arranged on the Metal Substrate between the described first bronze medal layer and the described second bronze medal layer.
2. the printed circuit board (PCB) with Metal Substrate according to claim 1 is characterized in that, is connected by tack coat between the described first bronze medal layer and the described Metal Substrate and between the described second bronze medal layer and the described Metal Substrate.
3. the printed circuit board (PCB) with Metal Substrate according to claim 2 is characterized in that, also is provided with through hole on the described printed circuit board (PCB), and described through-hole surfaces is provided with through hole copper layer, is provided with insulation division between described through hole copper layer and described Metal Substrate.
4. the printed circuit board (PCB) with Metal Substrate according to claim 3 is characterized in that, is filled with insulating resin in the described insulation division.
5. the printed circuit board (PCB) with Metal Substrate according to claim 3 is characterized in that, described tack coat is prepreg.
6. the printed circuit board (PCB) with Metal Substrate according to claim 5 is characterized in that, is filled with the material of described tack coat in the described insulation division.
7. the printed circuit board (PCB) with Metal Substrate according to claim 6 is characterized in that, the material of described tack coat is filled in the described insulation division by lamination.
8. the printed circuit board (PCB) with Metal Substrate according to claim 3 is characterized in that, described Metal Substrate is aluminium base, copper base or iron-based.
9. the printed circuit board (PCB) with Metal Substrate according to claim 3 is characterized in that, the thickness of described insulation division is 0.2mm to 0.3mm.
10. the printed circuit board (PCB) with Metal Substrate according to claim 3 is characterized in that, described Metal Substrate surface is provided with roughened layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320023381 CN203057694U (en) | 2013-01-16 | 2013-01-16 | Printed circuit board with metal base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320023381 CN203057694U (en) | 2013-01-16 | 2013-01-16 | Printed circuit board with metal base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203057694U true CN203057694U (en) | 2013-07-10 |
Family
ID=48740604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320023381 Expired - Lifetime CN203057694U (en) | 2013-01-16 | 2013-01-16 | Printed circuit board with metal base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203057694U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347838A (en) * | 2018-02-07 | 2018-07-31 | 维沃移动通信有限公司 | A kind of production method of circuit board, circuit board and mobile terminal |
-
2013
- 2013-01-16 CN CN 201320023381 patent/CN203057694U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347838A (en) * | 2018-02-07 | 2018-07-31 | 维沃移动通信有限公司 | A kind of production method of circuit board, circuit board and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130710 |