CN204634152U - A kind of quick heat radiating high frequency mixed pressure wiring board - Google Patents
A kind of quick heat radiating high frequency mixed pressure wiring board Download PDFInfo
- Publication number
- CN204634152U CN204634152U CN201520240615.1U CN201520240615U CN204634152U CN 204634152 U CN204634152 U CN 204634152U CN 201520240615 U CN201520240615 U CN 201520240615U CN 204634152 U CN204634152 U CN 204634152U
- Authority
- CN
- China
- Prior art keywords
- high frequency
- wiring board
- layer
- mixed pressure
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of quick heat radiating high frequency mixed pressure wiring board, comprise core layer and layer of prepreg that multilayer is successively arranged alternately, the core layer local pressing of the top ground floor of described high frequency mixed pressure wiring board has high frequency daughter board, the below of the layer of prepreg of bottommost also arranges one deck Copper Foil, described quick heat radiating high frequency mixed pressure wiring board inside is embedded with copper billet, described copper billet one end embeds the second layer core layer below high frequency daughter board, imbedding and contact bottom Copper Foil.Quick heat radiating high frequency mixed pressure wiring board described in the utility model, adopt partial hybrid high frequency daughter board in core layer, reduce the use amount of expensive high frequency sheet material, the demand of integration in assembling product process can also be met simultaneously, significantly reduce PCB processing and assembly cost; The utility model adopts the mode of copper of burying, and bottom mixed pressure wiring board pressing one deck Copper Foil, the temperature of high frequency daughter board is longitudinally conducted to copper foil layer, the raising radiating rate of very big mixed pressure wiring board by copper billet, alleviates the problem of wiring board warpage simultaneously.
Description
Technical field
The utility model relates to wiring board techniques field, specifically belongs to a kind of quick heat radiating high frequency mixed pressure wiring board.
Background technology
Electronic devices and components development history is exactly a concentrated electronics development history in fact.Along with third and fourth third-generation mobile communication technology, product compactization, the densification of high-performance high function design is more and more important, so gets off, installs a large amount of element on the surface more and more unrealistic at PCB; Meanwhile, along with the raising of IC integrated level and the increase of I/O number thereof, passive component quantity continues to increase, and imbeds passive component can shorten interelement line length by lamination, improves electrical characteristic, improves package reliability, reduces production cost etc.
Traditional has been the mature technology of current industry by lamination by burying that capacity materials inserts in pcb board, therefore does not repeat them here.But together with embedded resistor, inductance and electric capacity have been melted in fiber waveguide and Z-direction interconnection technique etc. by up-to-date PCB design technology (integrated-type photoelectric substrates EOCB).In addition, because the high speed of Signal transmissions develops, substrate distribution requires to increase sternly, needs to possess high density distribution on the one hand, also will have the collecting technology of high speed distribution on the other hand.
For improving signal integrity and cost minimization, the mixed pressure of high-frequency high-speed material, the design of composite material mixed pressure embedded hole and application are in the ascendant; For installing special functional module or simplifying design of electronic products, high density daughter board is imbedded in local, the design of all kinds of high-precision requirement stepped plate emerges in an endless stream; In traditional PCB design process, if need to use high-frequency signal, design normally adopt flood use high frequency material to make, with high costs.
In addition, after high frequency mixed pressure multi-layer sheet surface mount high power components and parts, high frequency daughter board keeps the condition of high temperature for a long time, and cause components and parts internal chemical to react and accelerate with particle migration, component failure rate significantly improves, and directly affects the reliability of electronic product.Common heat radiation heat conductive design mode has: increase louvre quantity or adopt the filling perforation of high thermal conductivity material, but be unfavorable for the line design of high-frequency microwave plate; Employing metal core printed board designs, and local radiating effect is obvious, but is difficult to cater to the lightly portable requirement of electronic product; Employing heat conducting base material designs, but the thermal conductivity of high-frequency high-speed sheet material is general not high at present.
Along with advancing by leaps and bounds of third and fourth third-generation mobile communication technology and information electronic industries, also more and more higher to the requirement of miniaturization of electronic products, lighting, rapid heat dissipation and high reliability, time the solution of heat dissipation problem has been arrived extremely urgent.
Utility model content
For overcoming the shortcomings and deficiencies of above-mentioned prior art, the utility model provides a kind of quick heat radiating high frequency mixed pressure wiring board.
The technical solution of the utility model is:
A kind of quick heat radiating high frequency mixed pressure wiring board, comprise core layer and layer of prepreg that multilayer is successively arranged alternately, the core layer local pressing of the top ground floor of described quick heat radiating high frequency mixed pressure wiring board has high frequency daughter board, the below of the layer of prepreg of bottommost also arranges one deck Copper Foil, described quick heat radiating high frequency mixed pressure wiring board inside is embedded with copper billet, described copper billet one end embeds the second layer core layer below high frequency daughter board, imbedding and contact bottom Copper Foil.
Preferably, the core layer local of the top ground floor of described quick heat radiating high frequency mixed pressure wiring board has groove, and described high frequency daughter board is embedded in the groove of the core layer of top ground floor.
Preferably, line layer is provided with between described every layer of core layer and layer of prepreg and between the layer of prepreg of bottommost and Copper Foil.
Preferably, the thermal coefficient of expansion of described Copper Foil is 15-20PP/ DEG C.
Preferred further, described semi-solid preparation layer adopts FR-4 prepreg.
A forming method for quick heat radiating high frequency mixed pressure wiring board, comprises step:
S1, wiring board top ground floor core layer surface gong go out partial hybrid groove;
S2, except the core layer of top ground floor, go out to bury through hole to the correspondence position gong of all the other core layer and layer of prepreg;
S3, after wiring board hot melt, respectively at mixed pressure groove with bury through hole and put in type high frequency daughter board and copper billet, and stack Copper Foil in bottom, then carry out pressing, make high frequency daughter board, copper billet, Copper Foil together with wiring board secure bond;
S4, cooling, remove the surperficial cull of quick heat radiating high frequency mixed pressure wiring board.
Preferably, in circuit board pressing process described in step S3, heating rate controls at 2 DEG C/min ~ 2.7 DEG C/min, and most promotion is to 100 DEG C.
Preferably, in the mixed pressure groove of described top core plate layer, gong has a projection, and corresponding high frequency daughter board is provided with a groove.
Preferred further, first brown before described copper billet uses.
The beneficial effects of the utility model:
1. quick heat radiating high frequency mixed pressure wiring board described in the utility model, adopt partial hybrid high frequency daughter board in core layer, the use amount of expensive high frequency sheet material can be reduced, the demand of integration in assembling product process can also be met simultaneously, significantly reduce PCB processing and assembly cost;
2. the utility model adopts the mode of burying copper, and bottom mixed pressure wiring board pressing one deck Copper Foil, the temperature of high frequency daughter board is longitudinally conducted to copper foil layer by copper billet, is dispelled the heat by Copper Foil, the raising radiating rate of very big mixed pressure wiring board, alleviates the problem of wiring board warpage simultaneously.
Accompanying drawing explanation
Fig. 1 is the cutaway view of quick heat radiating high frequency mixed pressure wiring board described in the utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
A kind of quick heat radiating high frequency mixed pressure wiring board, comprise core layer 1 and layer of prepreg 2 that multilayer is successively arranged alternately, described semi-solid preparation layer adopts FR-4 prepreg.The core layer local pressing of the top ground floor of described quick heat radiating high frequency mixed pressure wiring board has high frequency daughter board 3, and the core layer local of the top ground floor of described quick heat radiating high frequency mixed pressure wiring board has groove, and described high frequency daughter board 3 is embedded in groove.The below of the layer of prepreg of bottommost also arranges one deck Copper Foil 4, is provided with line layer between described every layer of core layer and layer of prepreg and between the layer of prepreg of bottommost and Copper Foil.Described quick heat radiating high frequency mixed pressure wiring board inside is embedded with copper billet 5, and described copper billet one end embeds the second layer core layer below high frequency daughter board, imbedding and contact bottom Copper Foil.
The thermal coefficient of expansion of described Copper Foil is 15-20PP/ DEG C.
A forming method for quick heat radiating high frequency mixed pressure wiring board, comprises step:
S1, go out partial hybrid groove at the core layer surface gong of wiring board top ground floor, in the mixed pressure groove of described top core plate layer, gong has one protruding, and corresponding high frequency daughter board is provided with a groove, for the contraposition fool proof of high frequency daughter board.
S2, except the core layer of top ground floor, go out to bury through hole to the correspondence position gong of all the other core layer and layer of prepreg;
S3, after wiring board hot melt, heating rate controls at 2 DEG C/min ~ 2.7 DEG C/min, and most promotion is to 100 DEG C.Respectively at mixed pressure groove with bury through hole and put in type high frequency daughter board and copper billet, first brown before copper billet uses, and stack Copper Foil bottom wiring board, then carry out pressing, make high frequency daughter board, copper billet, Copper Foil together with wiring board secure bond;
S4, cooling, remove the surperficial cull of quick heat radiating high frequency mixed pressure wiring board.
During concrete enforcement, pressing programmed rate controls at 2.3 DEG C/min, presses in 60 DEG C of left/right rotations, and control gummosis, when about 100 DEG C, viscosity is minimum, transfers high pressure to, effectively can control the flowing of semi-solid preparation synusia, ensures that filler is abundant.Prepreg adopts the FR-4 prepreg that the thinner gel content of glass cloth is higher to ensure that filler is abundant.
Bury in copper process, first mill out bury copper groove in the copper region of burying of central layer and prepreg, by after copper billet one side brown by pressing, make copper billet together with pcb board secure bond.The key point of its flow process is first groove milling, after imbed copper, then pressing; The combination of its copper billet and plate mainly solidify by P sheet after with the cohesive force of copper billet.Daughter board is first made the semi-finished product become beyond sandwich circuit except for the outer by partial hybrid, is embedded into the groove that region mills out suitable dimensional tolerance, is imbedded in motherboard by pressing.That makes like this buries copper coin, is as good as with common multi-layer PCB board, can carry out as back drill, the groove that metallizes, control the making of other special process such as dark milling, radio frequency line.
In order to eliminate the integrity problem that between copper billet and plate, inevitable offset causes, while matching between adjustment copper billet thickness and thickness of slab, also need during pressing plate to use suitable buffering resistance glue material, usually suitable release film is selected, suitable pressing condition can ensure pressure uniformity, thus make gap filler abundant, gummosis amount and copper billet can also be controlled with the evenness between pcb board simultaneously.Pressing plate mode can melt the mode adding riveting.
Inevitably there is difference in height in copper billet and plate, need assist pressing plate during pressing plate with fender, eliminates offset impact, ensure full plate pressure uniform, filler just can be made abundant, and make gummosis amount as far as possible little.Because the gap between copper billet and plate is open type, during pressing plate, the resin of molten condition inevitably flows on copper billet, adhesive-bonded fabric grinder can be adopted to carry out grinding and can remove cull very thoroughly.
Copper billet needs brown before using, and guarantee copper billet is imbedded afterwards and prepreg is combined closely.Guarantee that the copper billet imbedded is smooth, do not lean against at cell wall, after preventing pressing plate, copper billet is uneven.Face of imbedding only is selected to carry out brown according to designing requirement.
Quick heat radiating high frequency mixed pressure wiring board described in the utility model, adopt partial hybrid high frequency daughter board in core layer, the use amount of expensive high frequency sheet material can be reduced, the demand of integration in assembling product process can also be met simultaneously, significantly reduce PCB processing and assembly cost; The utility model adopts the mode of copper of burying, and bottom mixed pressure wiring board pressing one deck Copper Foil, the temperature of high frequency daughter board is longitudinally conducted to copper foil layer, the raising radiating rate of very big mixed pressure wiring board by copper billet, alleviates the problem of wiring board warpage simultaneously.
Above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection range of the present utility model enclose with this.All modifications done according to the Spirit Essence of the utility model main technical schemes, all should be encompassed within protection range of the present utility model.
Claims (5)
1. a quick heat radiating high frequency mixed pressure wiring board, comprise core layer and layer of prepreg that multilayer is successively arranged alternately, its feature is being: the core layer local pressing of the top ground floor of described quick heat radiating high frequency mixed pressure wiring board has high frequency daughter board, the below of the layer of prepreg of bottommost also arranges one deck Copper Foil, described quick heat radiating high frequency mixed pressure wiring board inside is embedded with copper billet, described copper billet one end embeds the second layer core layer below high frequency daughter board, imbedding and contact bottom Copper Foil.
2. quick heat radiating high frequency mixed pressure wiring board according to claim 1, is characterized in that: the core layer local of the top ground floor of described quick heat radiating high frequency mixed pressure wiring board has groove, and described high frequency daughter board is embedded in the groove of the core layer of top ground floor.
3. quick heat radiating high frequency mixed pressure wiring board according to claim 2, is characterized in that: be provided with line layer between described every layer of core layer and layer of prepreg and between the layer of prepreg of bottommost and Copper Foil.
4. quick heat radiating high frequency mixed pressure wiring board according to claim 1, is characterized in that: the thermal coefficient of expansion of described Copper Foil is 15-20PP/ DEG C.
5. quick heat radiating high frequency mixed pressure wiring board according to claim 3, is characterized in that: described semi-solid preparation layer adopts FR-4 level prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520240615.1U CN204634152U (en) | 2015-04-21 | 2015-04-21 | A kind of quick heat radiating high frequency mixed pressure wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520240615.1U CN204634152U (en) | 2015-04-21 | 2015-04-21 | A kind of quick heat radiating high frequency mixed pressure wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204634152U true CN204634152U (en) | 2015-09-09 |
Family
ID=54053127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520240615.1U Active CN204634152U (en) | 2015-04-21 | 2015-04-21 | A kind of quick heat radiating high frequency mixed pressure wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204634152U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780702A (en) * | 2015-04-21 | 2015-07-15 | 深圳市博敏电子有限公司 | High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof |
| CN105744722A (en) * | 2016-02-19 | 2016-07-06 | 罗嘉妤 | PCB for heat dissipation of computer |
| CN106376172A (en) * | 2016-11-29 | 2017-02-01 | 中国电子科技集团公司第二十九研究所 | Mixed-lamination metal-based microwave printed board and design method thereof |
-
2015
- 2015-04-21 CN CN201520240615.1U patent/CN204634152U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780702A (en) * | 2015-04-21 | 2015-07-15 | 深圳市博敏电子有限公司 | High-frequency mixed-compression circuit board capable of quick heat dissipation and forming method thereof |
| CN104780702B (en) * | 2015-04-21 | 2017-10-24 | 深圳市博敏电子有限公司 | A kind of forming method of quick heat radiating high frequency mixed pressure wiring board |
| CN105744722A (en) * | 2016-02-19 | 2016-07-06 | 罗嘉妤 | PCB for heat dissipation of computer |
| CN106376172A (en) * | 2016-11-29 | 2017-02-01 | 中国电子科技集团公司第二十九研究所 | Mixed-lamination metal-based microwave printed board and design method thereof |
| CN106376172B (en) * | 2016-11-29 | 2019-02-12 | 中国电子科技集团公司第二十九研究所 | A kind of mixed pressure Metal Substrate microwave printed board and design method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104780702B (en) | A kind of forming method of quick heat radiating high frequency mixed pressure wiring board | |
| CN102683220B (en) | A kind of method making multilayer organic lcd Polymers plate structure | |
| CN105491822B (en) | Multilayer printed circuit board integrates liquid cold passage preparation method | |
| CN103152987A (en) | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board | |
| CN101107891A (en) | Multilayer printed wiring board | |
| CN204634152U (en) | A kind of quick heat radiating high frequency mixed pressure wiring board | |
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| WO2015078345A1 (en) | Boss-type metal-based sandwich rigid-flex board and preparation method therefor | |
| CN112867286A (en) | Preparation method of embedded large copper plate back plate | |
| CN102800598B (en) | The substrate of embedding active element and embedding method | |
| CN103781283A (en) | Circuit-board manufacturing method | |
| US20140123487A1 (en) | Printed circuit board manufacturing method | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| CN206977798U (en) | Heat radiating type thickness copper coin | |
| CN100596255C (en) | Making method and structure for high power thin line carrier board | |
| CN107734859B (en) | PCB manufacturing method and PCB | |
| CN102365006A (en) | Processing method of multi-layer circuit board | |
| CN213028680U (en) | Embedded 5G rigid-flex board structure with high heat dissipation of copper blocks | |
| KR20080030366A (en) | Multi-layered and combined pcb with aluminum for thermal-conduction | |
| CN102427679A (en) | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board | |
| CN202335070U (en) | Flexible printed circuit board with embedded bump interconnection structure | |
| CN209731684U (en) | A kind of copper base of the radium-shine blind hole of band | |
| CN202310269U (en) | Multi-layer circuit board | |
| CN110881240A (en) | High-heat-dissipation and low-loss PCB and manufacturing method thereof | |
| CN207766643U (en) | A kind of high-speed high frequency circuit board with SHD figure layers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |