CN112867286A - Preparation method of embedded large copper plate back plate - Google Patents
Preparation method of embedded large copper plate back plate Download PDFInfo
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- CN112867286A CN112867286A CN202011586813.5A CN202011586813A CN112867286A CN 112867286 A CN112867286 A CN 112867286A CN 202011586813 A CN202011586813 A CN 202011586813A CN 112867286 A CN112867286 A CN 112867286A
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- copper plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention belongs to the technical field of printed circuit board manufacturing, and discloses a preparation method of an embedded large copper plate back plate, wherein a groove is formed in the copper at the position of dense holes by depth control of a numerical control machine according to the hole distribution condition of a product; according to the connection condition of the holes and the copper plate, pre-drilling the copper plate to realize the isolation requirement of the copper plate and the metal holes; and filling the blind grooves and the pre-drilled holes by using a high-gel-content prepreg glue filling mode, and laminating the core plate and the copper plate to form the back plate. The preparation method of the large copper plate embedded back plate provided by the invention can avoid the problems that a small hole cannot be drilled through and a cutter cannot be broken due to too thick copper plate when the small hole is drilled for the copper plate with the thickness of more than or equal to 1.0mm, and solves the problems of the design and the manufacture of mutual connection or isolation between the copper plate with the thickness of more than or equal to 1.0m and a through hole.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a preparation method of an embedded large copper plate back plate.
Background
The PCB backplane, also known as a motherboard, has the main task of carrying the daughter board and distributing power to the functional devices for electrical connection and signal transmission. The method is characterized by high thickness-diameter ratio, high-density wiring, large size and thickness, and special back drilling and copper embedding processes; and the power used by part of the back plates is larger, and the heat generated by operation is more and not easy to dissipate, so that the reliability defects of increased temperature rise of the PCB, reduced performance of the whole machine, frequency drift, increased noise and the like are overcome, and particularly in a high-power and large current-carrying module, the defect of failure caused by local overheating is particularly obvious, so that the back plate product with large current carrying and high heat dissipation performance is gradually required. At present, the manufacturing process has the characteristics of large current carrying and high heat dissipation.
Thick copper back plate: a thick copper core plate is used in the high-power layer, a COER structure and a COER structure are adopted, a plurality of prepregs are used between the COER structure and the COER structure, and one-time or multiple-time press molding is carried out, as shown in FIG. 8;
embedding a copper block back plate: because of the problem that the small holes are difficult to manufacture on the copper block, the semi-buried/full-buried copper block is only designed beside the high-power device/circuit and is pressed and molded once or for multiple times, as shown in figure 9.
However, when the existing thick copper back plate is pressed, the inner layer copper thickness is too thick, the number of prepregs needed between layers is too large, the interlayer dislocation is easy to occur, the filling is insufficient, the cavities and other quality problems are caused, the copper-containing substrate with the thickness of more than 6OZ is less in application in the market, the price is high, and the matched material is difficult to find when the copper thickness is thicker; the local copper-burying mode has complex process flow, large limitation and high manufacturing cost.
Through the above analysis, the problems and defects of the prior art are as follows:
(1) the existing thick copper back plate has the problems that when the inner layer copper is too thick during pressing, too many prepregs are needed between layers, the interlaminar dislocation is easy to occur, the filling is insufficient, the cavities and the like, and copper-containing substrates with the thickness of more than 6OZ are less in application in the market and expensive in price, and the thicker the copper is, the more difficult the matched materials are to be found.
(2) The existing method for locally burying copper has the disadvantages of complex process flow, large limitation and high manufacturing cost.
The difficulty in solving the above problems and defects is:
(1) in order to meet the requirement of interlayer filling, more prepregs need to be used, interlayer dislocation is easily caused, and the dislocation problem cannot be solved by reducing the use of the prepregs in the structural design of the type.
(2) The local processing that overflows gluey after satisfying the key technique of copper mould of burying and lie in buying of copper billet is difficult to once only use machine or liquid medicine at the gluey at copper billet edge and is handled totally, still needs the manual work to inspect and repaiies, consumes a large amount of manpower and materials, destroys the product easily during manual work is maintained, and this is unavoidable.
(3) For copper plates with a thickness of 1.0mm or more, small holes cannot be made.
The significance of solving the problems and the defects is as follows: the risk of insufficient glue filling between the copper plate and the core plate is avoided, and the problem of layer offset caused by the pressing of a plurality of prepregs is avoided; meanwhile, small holes are formed in the copper plate, the problem that residual glue is difficult to remove in the local copper embedding design is solved, and the whole copper embedded plate is better than the local copper embedding in the aspect of heat dissipation performance.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a preparation method of an embedded large copper plate back plate.
The invention is realized in such a way that the preparation method of the embedded large copper plate back plate comprises the following steps:
step one, referring to the distribution situation of product holes, routing grooves of copper at dense hole positions by using a numerical control machine tool to control depth;
step two, pre-drilling the copper plate according to the connection condition of the hole and the copper plate to realize the isolation requirement of the copper plate and the metal hole;
and step three, filling the blind grooves and the pre-drilled holes in a manner of filling glue into the prepregs with high glue content, and laminating the core plate and the copper plate to form the back plate.
In one embodiment, in the step one, the residual thickness is 50-150um, the single-hole position adopts a large-hole depth control drill, the residual thickness is 50-150um, and the depth control drill is 0.6mm larger than the hole diameter.
In one embodiment, in the first step, the core board circuit needs to be designed normally according to the requirements of the drawing, and is manufactured by adopting LDI; and (4) preprocessing the copper plate on the via hole according to a product drawing.
In one embodiment, the pre-processing of the copper plate on the via hole according to the product drawing comprises:
(1) adopting core plate expansion and contraction to gong blind grooves at the positions of the dense holes by adopting a conventional depth control gong groove mode, wherein the residual thickness is 50-150 um;
(2) drilling out the position of the single hole connected with the copper plate by adopting a large hole depth control drilling mode, wherein the residual thickness is 50-150 um;
(3) and for the hole which is not more than 0.8mm and is not communicated with the copper plate, directly drilling through the hole by using a drill bit which is 0.6mm larger than the aperture of the through hole.
In one embodiment, the manner of enlarging the hole depth control drill is as follows: firstly, drilling holes by using a 130-degree drill cutter twice, and then finishing by using a 180-degree straight angle cutter with the same size.
In one embodiment, in step two, the pre-drilled hole is 0.6mm larger than the hole diameter.
In one embodiment, in step two, blind vias and pre-drilled holes are filled through press fit using a non-woven prepreg and FR-4 copper-free substrate.
In one embodiment, a method of performing press-fit leveling includes:
(1) windowing the high-temperature PI adhesive tape according to the blind grooves, the blind holes and the through holes of the processed copper plate, wherein the size of the window is 0.5mm larger than the single side of the blind grooves, the blind holes and the through holes on the copper plate;
(2) adhering the windowed high-temperature PI adhesive tapes to two surfaces of the copper plate;
(3) and pressing the non-woven prepreg and the copper plate, if the blind groove is large, filling the blind groove by pressing the semi-solidified glass-carrying fiber and copper-free FR-4 substrate, and tearing off the PI high-temperature adhesive tape.
In one embodiment, in the third step, a ceramic plate grinding machine is used for grinding the resin overflowing from the surface and remaining on the surface flat, the resin is pressed with the core plate to form a multilayer plate, and the drilling tape is produced according to the expansion and contraction value.
By combining all the technical schemes, the invention has the advantages and positive effects that:
1. for the copper plate with the thickness of more than or equal to 1.0mm, the problems that the copper plate cannot be drilled through and the cutter is broken due to too thick copper plate when a small hole is drilled can be avoided.
2. The design and manufacture problems of the mutual connection or isolation of the copper plate with the diameter of more than or equal to 1.0m and the via hole are solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing an embedded large copper plate backplane according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a copper plate groove provided by the embodiment of the invention.
Fig. 3 is a schematic diagram of a depth control drill according to an embodiment of the present invention.
Fig. 4 is a schematic view of the copper plate after processing according to the embodiment of the present invention.
Fig. 5 is a schematic view of attaching a high-temperature adhesive tape to a copper plate according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of filling glue into blind grooves, blind holes, and through holes according to an embodiment of the present invention.
Fig. 7 is a schematic view of a hole drilled after the copper plate and the core plate are laminated according to an embodiment of the present invention.
Figure 8 is a schematic diagram of a thick copper backplane provided by the prior art.
Fig. 9 is a schematic diagram of a copper-embedded backplane provided by the prior art.
Fig. 10 is a diagram illustrating the manufacturing effect of the embedded large copper plate back plate according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Aiming at the problems in the prior art, the invention provides a preparation method of an embedded large copper plate back plate, and the invention is described in detail below with reference to the accompanying drawings.
The preparation method of the embedded large copper plate back plate provided by the embodiment of the invention comprises the following steps: according to the distribution condition of product holes, routing grooves in copper at dense hole positions by using a numerical control machine tool to control depth, wherein the residual thickness is 50-150um, and the residual thickness is 50-150um when a single hole position is drilled by adding a large hole to control depth, and the depth-controlled drilling is 0.6mm larger than the hole diameter; according to the connection condition of the holes and the copper plate, pre-drilling the copper plate to realize the isolation requirement of the copper plate and the metal holes, wherein the pre-drilling hole is 0.6mm larger than the aperture; and filling the hollow positions by using a high-gel-content prepreg filling mode, and pressing the core plate and the copper plate to form the back plate.
As shown in fig. 1, the method for manufacturing an embedded large copper plate backplane according to the embodiment of the present invention includes the following steps:
s101, routing grooves of copper at dense hole positions by using a numerical control machine tool to control depth according to the distribution condition of product holes;
s102, pre-drilling the copper plate according to the connection condition of the hole and the copper plate to realize the isolation requirement of the copper plate and the metal hole;
s103, filling the blind grooves and the pre-drilled holes in a high-gel-content prepreg glue filling mode, and pressing the core plate and the copper plate to form the back plate.
Normally designing a core board circuit according to drawing requirements, and manufacturing by adopting LDI; preprocessing the copper plate on the via hole according to a product drawing; filling and leveling the blind grooves and the holes by pressing by using a non-woven prepreg and an FR-4 copper-free substrate; using a ceramic plate grinding machine to grind the surface overflow and residual resin to be flat; and pressing the core plate and the drilling tape to form a multilayer plate, and producing the drilling tape according to the expansion and contraction value.
The present invention will be further described with reference to the following examples.
The invention provides a technical scheme for drilling small holes in a copper plate, which comprises the following steps: according to the distribution condition of product holes, routing grooves in copper at dense hole positions by using a numerical control machine tool to control depth, wherein the residual thickness is 50-150um, and the residual thickness is 50-150um when a single hole position is drilled by adding a large hole to control depth, and the depth-controlled drilling is 0.6mm larger than the hole diameter; according to the connection condition of the holes and the copper plate, pre-drilling the copper plate to realize the isolation requirement of the copper plate and the metal holes, wherein the pre-drilling hole is 0.6mm larger than the aperture; and filling the hollow positions by using a high-gel-content prepreg filling mode, and pressing the core plate and the copper plate to form the back plate.
(1) Normally designing a core board circuit according to drawing requirements, and manufacturing by adopting LDI;
(2) according to the product drawing, the via holes passing through the copper plate are preprocessed as follows:
1) routing blind grooves in the dense hole positions by adopting a conventional depth control routing mode by adopting core plate expansion and contraction, wherein the residual thickness is 50-150um, as shown in figure 2;
2) drilling a single hole at the position connected with the copper plate by adopting a large hole depth control drilling mode, wherein the residual thickness is 50-150 mu m, and the depth control hole is 0.6mm larger than the via hole, namely, drilling twice by using a 130-degree drill cutter, and then trimming by using a 180-degree flat angle cutter with the same size, as shown in figure 3;
3) a hole which is less than or equal to 0.8mm and is not communicated with the copper plate is directly drilled through by using a drill bit which is 0.6mm larger than the aperture of the through hole, as shown in figure 4;
(3) using a non-woven prepreg and FR-4 copper-free substrate to fill and level the blind grooves and the holes through pressing, specifically as follows;
1) windowing the high-temperature PI adhesive tape according to the blind grooves, blind holes and through holes of the processed copper foil, wherein the size of the window is 0.5mm larger than that of the single side of the blind grooves, blind holes and through holes on the copper plate;
2) adhering the windowed high-temperature PI adhesive tapes to two sides of the copper plate as shown in figure 5;
3) laminating the non-woven prepreg and the copper plate, if the blind groove is large, laminating and filling the blind groove by using the glass fiber prepreg and the copper-free FR-4 substrate, and tearing off the PI high-temperature adhesive tape, as shown in FIG. 6;
using a ceramic plate grinding machine to grind the surface overflow and residual resin to be flat;
and pressing the core plates to form a multilayer plate, and producing the drilling tape according to the expansion and contraction values, as shown in figure 7.
The above description is only for the purpose of illustrating the present invention and the appended claims are not to be construed as limiting the scope of the invention, which is intended to cover all modifications, equivalents and improvements that are within the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. The preparation method of the large copper plate embedded back plate is characterized by comprising the following steps of:
step one, referring to the distribution situation of product holes, routing grooves of copper at dense hole positions by using a numerical control machine tool to control depth;
step two, pre-drilling the copper plate according to the connection condition of the hole and the copper plate to realize the isolation requirement of the copper plate and the metal hole;
and step three, filling the blind grooves and the pre-drilled holes in a manner of filling glue into the prepregs with high glue content, and laminating the core plate and the copper plate to form the back plate.
2. The method for preparing the large-copper-plate-embedded back plate according to claim 1, wherein in the step one, the residual thickness is 50-150 μm, the position of a single hole is provided with a large hole depth control drill, the residual thickness is 50-150 μm, and the depth control drill is 0.6mm larger than the hole diameter.
3. The method for manufacturing the large copper plate-embedded backplane according to claim 1, wherein in the first step, the core board circuit is required to be normally designed according to the drawing requirements, and is manufactured by LDI; and (4) preprocessing the copper plate on the via hole according to a product drawing.
4. The method for manufacturing the large copper plate-embedded backplane according to claim 3, wherein the pre-processing of the copper plate on the via hole according to the production drawing comprises:
(1) adopting core plate expansion and contraction to gong blind grooves at the positions of the dense holes by adopting a conventional depth control gong groove mode, wherein the residual thickness is 50-150 um;
(2) drilling out the position of the single hole connected with the copper plate by adopting a large hole depth control drilling mode, wherein the residual thickness is 50-150 um;
(3) and for the hole which is not more than 0.8mm and is not communicated with the copper plate, directly drilling through the hole by using a drill bit which is 0.6mm larger than the aperture of the through hole.
5. The method for manufacturing the large copper plate-embedded back plate according to claim 4, wherein the manner of enlarging the hole and controlling the depth drilling is as follows: firstly, drilling holes by using a 130-degree drill cutter twice, and then finishing by using a 180-degree straight angle cutter with the same size.
6. The method for manufacturing an embedded large copper plate back plate as claimed in claim 1, wherein in step two, the pre-drilling is 0.6mm larger than the hole diameter.
7. The method for manufacturing the large copper plate-embedded backplane according to claim 1, wherein in the second step, the blind grooves and the pre-drilled holes are filled and leveled by pressing using a non-woven prepreg and an FR-4 copper-free substrate.
8. The method for manufacturing an embedded large copper plate back plate as claimed in claim 7, wherein the method for implementing press-fit leveling comprises:
(1) windowing the high-temperature PI adhesive tape according to the blind grooves, the blind holes and the through holes of the processed copper plate, wherein the size of the window is 0.5mm larger than the single side of the blind grooves, the blind holes and the through holes on the copper plate;
(2) adhering the windowed high-temperature PI adhesive tapes to two surfaces of the copper plate;
(3) and pressing the non-woven prepreg and the copper plate, if the blind groove is large, filling the blind groove by pressing the semi-solidified glass-carrying fiber and copper-free FR-4 substrate, and tearing off the PI high-temperature adhesive tape.
9. The method for manufacturing an embedded large copper plate back plate as claimed in claim 1, wherein in the third step, the resin overflowing from the surface and remaining on the surface is ground flat by a ceramic plate grinder, and the resin is pressed with the core plate to form a multi-layer plate, and the drilling tape is drilled according to the expansion and contraction value.
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| CN202011586813.5A CN112867286B (en) | 2020-12-28 | 2020-12-28 | Preparation method of backboard embedded with large copper plate |
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| CN202011586813.5A CN112867286B (en) | 2020-12-28 | 2020-12-28 | Preparation method of backboard embedded with large copper plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113490349A (en) * | 2021-07-21 | 2021-10-08 | 深圳市普林电路有限公司 | Preparation process of multilayer thick-copper large-size back plate |
| CN113923900A (en) * | 2021-10-12 | 2022-01-11 | 中国电子科技集团公司第十四研究所 | Method for preparing microwave multilayer board by using thermoplastic bonding sheet |
| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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| CN113923900A (en) * | 2021-10-12 | 2022-01-11 | 中国电子科技集团公司第十四研究所 | Method for preparing microwave multilayer board by using thermoplastic bonding sheet |
| CN113923900B (en) * | 2021-10-12 | 2023-10-13 | 中国电子科技集团公司第十四研究所 | Method for preparing microwave multilayer board by using thermoplastic bonding sheet |
| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN112867286B (en) | 2023-09-08 |
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