CN114945253A - PCB copper block burying method and PCB - Google Patents
PCB copper block burying method and PCB Download PDFInfo
- Publication number
- CN114945253A CN114945253A CN202210754206.8A CN202210754206A CN114945253A CN 114945253 A CN114945253 A CN 114945253A CN 202210754206 A CN202210754206 A CN 202210754206A CN 114945253 A CN114945253 A CN 114945253A
- Authority
- CN
- China
- Prior art keywords
- copper
- pcb
- copper foil
- prepreg
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 129
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 57
- 239000010949 copper Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000011889 copper foil Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 6
- 238000003475 lamination Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
The invention provides a method for embedding copper blocks in a PCB (printed circuit board) and the PCB, wherein the method comprises the steps of pressing two copper foils into a positive and negative copper double-face plate through a first semi-curing sheet, protecting the upper part of one copper foil by a dry film, etching the copper foil of an unprotected area, and removing the film to obtain a positive and negative copper substrate with a heat dissipation copper block; slotting a core plate and a second prepreg, wherein the size of the slot is larger than that of the heat dissipation copper block; and taking a third prepreg and a piece of copper foil, and sequentially laminating the cathode copper substrate, the anode copper substrate, the cathode copper substrate, the core plate, the third prepreg and the piece of copper foil, wherein the open groove corresponds to the radiating copper block. The copper block is fixed in position by firstly manufacturing the male and female copper substrates, then etching the thick copper surface, then slotting the middle core plate and the PP, and finally pressing, so that the position deviation of the copper block can be effectively avoided, the normal transmission of signals on an inner layer circuit is ensured, the manufacturing yield of the PCB embedded copper block is improved, the production cost is reduced, and the timeliness is improved.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a PCB copper block burying method and a PCB.
Background
The research on the heat dissipation mode of the embedded copper block of the PCB mainly focuses on the problems of glue flowing, flatness and wrinkles, but the dislocation of the embedded position is not negligible reliability abnormity, which can cause the problems of on-off of circuits in the PCB and the like.
At present, the problem of embedding dislocation often occurs in the copper block embedding process, accurate pressing parameters are usually needed for control, but the parameters need to be adjusted for many times based on the variation factors such as plate thickness, copper block size and lamination composition, time and labor are wasted, and the PCB yield needs to be sacrificed in the early stage parameter grabbing process, so that the manufacturing cost is increased.
In the existing copper block embedding mode, grooves are formed in all PP and core plates before lamination, and then the prepared copper blocks are matched and pressed with the PP and the core plates to remove surface glue overflow. In the pressing process, the copper block can shift due to the filling difference of the rubber content around the copper block.
Disclosure of Invention
The invention provides a PCB (printed circuit board) copper block burying method and a PCB, which are used for solving the problems that the copper block is easy to deviate and the product yield is reduced in the conventional PCB quick-milk-pain mode.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a method for embedding a copper block in a PCB (printed circuit board), which comprises the following steps of:
pressing the two copper foils into a male and female copper double-face plate through a first semi-curing sheet, protecting the upper part of one copper foil by a dry film, etching the copper foil of the unprotected area, and removing the film to obtain a male and female copper substrate with a heat dissipation copper block;
slotting a core plate and a second prepreg, wherein the size of the slot is larger than that of the heat dissipation copper block;
and taking a third prepreg and a piece of copper foil, and sequentially laminating the cathode and anode copper substrates, the second prepreg, the core plate, the third prepreg and the piece of copper foil, wherein the groove corresponds to the heat dissipation copper block.
Further, the one copper foil is a thicker copper foil of the two copper foils.
Further, the thickness of thicker copper foil is 100um, and the thickness of another copper foil is 1 mm.
Furthermore, the core board is formed by laminating two copper foils through prepregs, and the two copper foils have the same thickness.
Further, the prepreg is glass cloth resin.
Further, the size of the slot satisfies:
the size of the slot is equal to the size of the copper block +0.2 mm.
Furthermore, the sequential pressing adopts a pin lam mode.
Further, the thickness of the third cured sheet is the sum of the first cured sheet thickness and the second cured sheet thickness.
And further, after the sequential lamination, forming the PCB through processes of drilling, electroplating and outer layer pattern.
A second aspect of the invention provides a PCB board made according to the method of the embodiment.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
1. according to the invention, the position of the copper block is fixed by manufacturing the male and female copper substrates, etching the thick copper surface, slotting the middle core plate and the PP, and finally pressing, so that the position deviation of the copper block can be effectively avoided, the normal transmission of signals on an inner layer circuit is ensured, the manufacturing yield of the PCB embedded copper block is improved, the production cost is reduced, and the timeliness is improved.
2. When slotting, the slotting size is larger than the size of the heat dissipation copper block, the difference of the density of the copper block and the core plate is considered, space is reserved for glue overflow, and warping of the PCB is avoided.
3. The thickness of the third solidified sheet is the sum of the thickness of the first solidified sheet and the thickness of the second solidified sheet, and the medium thickness between the first layer of copper foil L1 and the second layer of copper foil L2 is ensured to be the same as that between the third layer of copper foil L3 and the fourth layer of copper foil L4, so that the PCB is ensured to be symmetrical.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic flow diagram of an embodiment of the method of the present invention;
FIG. 2 is a schematic diagram illustrating the manufacturing process of step S1 in the embodiment of the method of the present invention;
FIG. 3 is a schematic diagram illustrating the manufacturing process of step S2 in the embodiment of the method of the present invention;
FIG. 4 is a schematic diagram illustrating the manufacturing process of step S3 in the embodiment of the method of the present invention;
in the figure, 1 a cathode and anode copper substrate, 11 a heat dissipation copper block, 13 a dry film, 2 a core board, 21 a first prepreg, 22 a second prepreg, 24 slots, 221 a prepreg, 23 a third prepreg, L1 a first copper foil, L2 a second copper foil, L3 a third copper foil, and L4 a fourth copper foil.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
As shown in fig. 1, a method for burying a copper block in a PCB according to an embodiment of the present invention includes the following steps:
s1, pressing the two copper foils into a yin-yang copper double-face plate through a first semi-curing sheet 21, protecting partial area on one copper foil by a dry film 13, etching the copper foil of the unprotected area, and removing the film to obtain a yin-yang copper substrate 1 with a heat dissipation copper block 11;
s2, grooving the core plate 2 and the second prepreg 22, wherein the size of the groove 24 is larger than that of the heat dissipation copper block;
and S3, taking a third prepreg 23 and a piece of copper foil, and sequentially laminating the cathode and anode copper substrate 1, the second prepreg 22, the core plate 2, the third prepreg 23 and the piece of copper foil, wherein the open groove 24 corresponds to the heat dissipation copper block 11.
As shown in fig. 2, in step S1, the one copper foil is a thicker copper foil of the two copper foils.
The thickness of thicker copper foil is 100um, and the thickness of another copper foil is 1 mm. The thicker copper foil is the heat sink copper foil 11 shown in the drawing, and the other copper foil is the fourth-layer copper foil L4 shown in the drawing.
As shown in fig. 3, in step S2, the core board 2 is formed by laminating two copper foils through the prepreg 221, and the two copper foils have the same thickness and the thickness is smaller than 100 um. The two copper foils are respectively a second layer copper foil L2 and a third layer copper foil L3.
The prepreg 221 is glass cloth resin.
The size of the slot 24 satisfies:
the size of the slot is equal to the size of the copper block plus 0.2 mm.
In the formula, the size of the single side of the groove is 0.1mm larger than that of the single side of the copper block when the thickness is 0.2mm, and the first prepreg/the second prepreg/the third prepreg overflows to fill the prepreg. Because the density difference between the heat dissipation copper block 11 and the core plate 2 is large, the deformation amount is different during lamination, a space needs to be reserved for glue overflow in advance, otherwise, the PCB has a warping risk.
As shown in fig. 4, in step S3, the sequential stitching adopts a pin lam method.
The thickness of the third cured sheet is the sum of the first cured sheet thickness and the second cured sheet thickness. The higher the gel content, the greater the thickness of the prepreg.
The thickness of the third solidified sheet is the sum of the thickness of the first solidified sheet and the thickness of the second solidified sheet, and the medium thickness between the first layer of copper foil L1 and the second layer of copper foil L2 is ensured to be the same as that between the third layer of copper foil L3 and the fourth layer of copper foil L4, so that the PCB is ensured to be symmetrical.
And after the sequential lamination, forming the PCB through the processes of drilling, electroplating and outer layer pattern. The specific process flow is as follows: pressing → drilling → copper deposition → electroplating → outer layer pattern → solder mask → character → molding → electric measurement → OSP → final inspection → shipment.
The embodiment of the invention also provides a PCB which is manufactured by the method mentioned in the embodiment.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (10)
1. A method for embedding a copper block in a PCB is characterized by comprising the following steps:
pressing the two copper foils into a yin-yang copper double-face plate through a first semi-curing sheet, protecting the upper part of one copper foil by a dry film, etching the copper foil of the unprotected area, and removing the film to obtain a yin-yang copper substrate with a heat dissipation copper block;
taking a core plate and a second prepreg to open a groove, wherein the size of the groove is larger than that of the heat dissipation copper block;
and taking a third prepreg and a piece of copper foil, and sequentially laminating the cathode copper substrate, the anode copper substrate, the cathode copper substrate, the core plate, the third prepreg and the piece of copper foil, wherein the open groove corresponds to the radiating copper block.
2. The method of claim 1, wherein the one copper foil is a thicker copper foil of two copper foils.
3. The method of claim 2, wherein the thicker copper foil has a thickness of 100um and the other copper foil has a thickness of 1 mm.
4. The method of claim 1, wherein the core is formed by laminating two copper foils with a prepreg, and the two copper foils have the same thickness.
5. The PCB imbedding method according to claim 4, wherein the prepreg is a glass cloth resin.
6. The PCB copper block burying method as recited in claim 1, wherein the size of the slot satisfies:
the size of the slot is equal to the size of the copper block +0.2 mm.
7. The method for burying a copper block in a PCB as recited in claim 1, wherein said sequential press-fitting is performed in a pin lam manner.
8. The method of claim 1, wherein the thickness of the third cured sheet is the sum of the thickness of the first cured sheet and the thickness of the second cured sheet.
9. The method of claim 1, wherein the PCB is formed by drilling, electroplating and patterning the outer layer after the sequential lamination.
10. A PCB board, characterized in that it is manufactured by the method of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210754206.8A CN114945253A (en) | 2022-06-29 | 2022-06-29 | PCB copper block burying method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210754206.8A CN114945253A (en) | 2022-06-29 | 2022-06-29 | PCB copper block burying method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114945253A true CN114945253A (en) | 2022-08-26 |
Family
ID=82910533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210754206.8A Withdrawn CN114945253A (en) | 2022-06-29 | 2022-06-29 | PCB copper block burying method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114945253A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115250586A (en) * | 2022-09-21 | 2022-10-28 | 四川英创力电子科技股份有限公司 | Copper-embedded printed circuit board processing method and copper-embedded printed circuit board |
-
2022
- 2022-06-29 CN CN202210754206.8A patent/CN114945253A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115250586A (en) * | 2022-09-21 | 2022-10-28 | 四川英创力电子科技股份有限公司 | Copper-embedded printed circuit board processing method and copper-embedded printed circuit board |
| CN115250586B (en) * | 2022-09-21 | 2022-12-06 | 四川英创力电子科技股份有限公司 | Copper-embedded printed circuit board processing method and copper-embedded printed circuit board |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220826 |