CN112672546A - Processing method for printing multilayer board by ultra-thick copper foil - Google Patents
Processing method for printing multilayer board by ultra-thick copper foil Download PDFInfo
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- CN112672546A CN112672546A CN202011586830.9A CN202011586830A CN112672546A CN 112672546 A CN112672546 A CN 112672546A CN 202011586830 A CN202011586830 A CN 202011586830A CN 112672546 A CN112672546 A CN 112672546A
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- copper foil
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- circuit
- prepreg
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 148
- 239000011889 copper foil Substances 0.000 title claims abstract description 111
- 238000007639 printing Methods 0.000 title claims abstract description 19
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000005530 etching Methods 0.000 claims abstract description 30
- 238000003825 pressing Methods 0.000 claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000007797 corrosion Effects 0.000 claims abstract description 4
- 238000005260 corrosion Methods 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 230000002265 prevention Effects 0.000 abstract description 3
- 230000007812 deficiency Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 41
- 238000010586 diagram Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 238000007650 screen-printing Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to the technical field of printed circuit board manufacturing, and discloses a processing method for printing a multilayer board by using an ultra-thick copper foil, which comprises the following steps: transferring the circuit pattern of the copper foil with each layer thickness to the copper foil without the base material by adopting a copper foil pitting method; firstly, carrying out primary pressing on the structures of the copper foil, the prepreg and the copper foil to form a double-sided board, etching the double-sided board formed after pressing again, and keeping the width and the position of the formed circuit pattern consistent with the width and the position of a protruding circuit formed when the copper foil is subjected to pitting corrosion; and pressing the etched double-sided boards into 1 multi-layer board, and etching the outer layer circuit to finally realize the product laminated structure. The invention can avoid the quality problems of glue deficiency and cavities caused by filling higher gaps among circuits at one time for the multilayer ultra-thick copper foil printed board with the thickness of more than or equal to 6OZ, and solves the problem that the ultra-thick copper foil printed board with the outer copper thickness of more than 6OZ is difficult to manufacture in a welding prevention way.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a processing method for printing a multilayer board by using an ultra-thick copper foil.
Background
At present, thick copper and ultra-thick copper printed boards are collectively called thick copper printed boards, and since the appearance of the thick copper printed boards, the application field of PCBs is spanned into a new industrial product field, namely power electronic products. At present, the traditional process in the industry has the following points:
1) most of the complex circuit multilayer thick copper printed boards are pressed and molded once by adopting a copper-containing substrate and a prepreg, the technology has higher requirement on the residual copper rate, the technology is mature in the field of copper thickness less than or equal to 6OZ, and the pressing structure is shown in figure 9.
2) For the design of low residual copper rate, the structure of a copper-containing substrate, a prepreg and a waste copper foil is usually adopted to carry out first pressing, then the waste copper foil is etched, and then secondary pressing is carried out to realize the product laminated structure; the process flow of this technique is complicated, and the press structure is shown in fig. 10.
3) Part of products are designed to be divided into large and small power areas, the small power areas still adopt a structure of a copper-containing substrate and a prepreg, the large power areas are pressed and molded in a copper block embedding mode, but the copper blocks in the large power areas can only realize simple circuits, the process flow is complex, and the manufacturing cost is high; the press fit configuration is shown in fig. 11.
In the prior art, the copper-containing substrate with the thickness of more than 6OZ is less applied in the market and is expensive; the multilayer board has less processing experience, and the outer layer is too thick due to the fact that copper is thick, ink is difficult to scrape into the line space of the outer layer in a screen printing mode, so that welding prevention is difficult to process; the problem of quality such as interlaminar dislocation, insufficient filling and cavities easily occurs because the number of prepregs required between layers is too large when the copper thickness of the inner layer is too thick; the method for inlaying the copper block/copper plate has complex process flow, large limitation and high manufacturing cost. Therefore, a new method for printing a multi-layer board with ultra-thick copper foil is needed.
Through the above analysis, the problems and defects of the prior art are as follows:
(1) most of the complex circuit multilayer thick copper printed boards are pressed and molded once in a copper-containing substrate and prepreg mode, and the technology has high requirements on the residual copper rate; meanwhile, the copper-containing substrate with the thickness of more than 6OZ is less applied in the market and is expensive.
(2) The multilayer board has less processing experience, and the outer layer is too thick because of the copper thickness, and the printing ink is difficult to scrape into the outer layer line interval through the mode of silk screen printing and leads to the solder mask to be difficult to process.
(3) The inner layer copper is too thick, and the needed PP between layers is too much, so that the quality problems of interlayer dislocation, insufficient filling rubber, holes and the like are easily caused.
(4) The existing copper block/copper plate inlaying mode has the disadvantages of complex process flow, large limitation and high manufacturing cost.
The difficulty in solving the above problems and defects is: the outer copper thickness is too thick, and in the outer circuit interval was scraped into to printing ink was difficult to through the mode of silk screen printing, because copper thickness was too big with the substrate drop when carrying out the silk screen printing, only on few partial printing ink can flow to the substrate, many times printing industry can cause the circuit lateral wall bottom to contain a large amount of bubbles, volatilizees after toasting and causes green oil to float and leave. The inlayer copper is thick too thick, and the prepreg of use is many, can take place the slide dislocation at the pressfitting process, and is difficult to manage and control the finished board thickness after using many prepregs.
The significance of solving the problems and the defects is as follows: the drop height between the surface of the copper foil and the base material can be greatly reduced under the condition of not reducing the thickness of the outer copper foil, so that the printing ink can be completely covered at one time without the problem of bubbles, meanwhile, the use of inner prepregs can be reduced, and the problem of plate thickness can be effectively controlled.
Disclosure of Invention
The problems existing in the prior art are solved: 1) an outer layer circuit and an anti-welding process flow of the ultra-thick copper foil printed board and a manufacturing method; 2) an inner layer process flow design and manufacturing method of an ultra-thick copper foil printed board. The invention provides a processing method for printing a multilayer board by using an ultra-thick copper foil.
The invention is realized in such a way that the processing method for printing the multilayer board by the ultra-thick copper foil comprises the following steps:
(1) transferring the circuit pattern of the copper foil with each layer thickness to the copper foil without the base material by adopting a copper foil pitting method;
(2) firstly, carrying out primary pressing on the structures of the copper foil, the prepreg and the copper foil to form a double-sided board, etching the double-sided board formed after pressing again, and keeping the width and the position of the formed circuit pattern consistent with the width and the position of a protruding circuit formed when the copper foil is subjected to pitting corrosion;
(3) and pressing the etched double-sided boards into 1 multi-layer board, and etching the outer layer circuit to finally realize the product laminated structure.
Further, in the step (2), the lamination mode before lamination is as follows: the copper foil is arranged with a groove inward, and the groove is close to the structure of the prepreg.
Further, in the step (3), the width and the position of the circuit pattern formed by etching the outer layer circuit are kept consistent with those of the protruding circuit formed by the copper foil during the concave etching; the protruding thickness of the outer layer circuit is only 50-100um higher than that of the base material, and the silk screen printing adopts the conventional process.
Further, the processing method for printing the multilayer board by the ultra-thick copper foil comprises the following steps:
firstly, decomposing a core board with a circuit copper foil more than 6OZ in a product lamination, and manufacturing by adopting a structure of a copper foil, a prepreg and a copper foil;
step two, pre-etching the copper foil obtained in the step one to form a local boss and a local groove, wherein the contour of the formed boss is consistent with the width and the position of a drawing line;
step three, the copper foil subjected to the step two is pressed by adopting a structure of a copper foil, a prepreg and the copper foil, and the required core board is formed by the pressed structure;
step four, etching the core plate formed in the step three again to obtain residual copper, wherein the width and the position of the dry film pattern are consistent with those of the boss outline in the step one, and forming a required circuit;
step five, riveting each layer of core board in the step four, and then laminating for two times to form a required multilayer printed circuit board structure, wherein required prepregs are manufactured according to a conventional design;
and sixthly, performing outer layer drilling and hole metallization processes on the printed circuit board subjected to twice pressing, wherein the outer layer circuit pattern needs to be consistent with the contour width and position of the boss in the first step, and performing surface treatment and molding to manufacture the required multilayer ultra-thick copper foil printed circuit board.
Further, in the step one, the structure manufacturing by using the copper foil, the prepreg and the copper foil includes:
and (3) transferring a dry film pattern on one surface of the 300-micron thick copper foil, and protecting the other surface by adopting a dry film.
Further, in the second step, the film needs to be removed during the etching.
Further, in the second step, the depth of the groove is 200-250um, and the thickness of 50-100um is remained without etching.
Further, in the third step, the prepreg is of a thin glass fiber structure and a non-blocking prepreg; the plate stacking mode is as follows: the copper foil recess is inwards, and the recess is close to the fine prepreg of thin glass, and the just prepreg of doing harm to is between two fine prepregs of thin glass.
Further, in the fifth step, the thickness of the line protruding from the inner layer of the multilayer printed circuit board structure is only 50-100 um.
Further, in the sixth step, the thickness of the etching base copper of the outer layer circuit is 50-100um, and the silk-screen solder resist is manufactured according to a conventional process.
By combining all the technical schemes, the invention has the advantages and positive effects that: the processing method for printing the multilayer board by the ultra-thick copper foil can avoid the quality problems of glue deficiency and cavities caused by filling higher gaps among circuits at one time for the multilayer ultra-thick copper foil printed board with the thickness of more than or equal to 6OZ, and solves the problem that the ultra-thick copper foil printed board with the thickness of more than 6OZ on the outer layer is difficult to manufacture in a welding prevention manner; the materials used in the technical scheme are conventional consumable materials, and the problem that a multilayer ultra-thick copper foil printed board with the copper thickness of the inner layer and the outer layer larger than 6OZ cannot be manufactured due to the lack of copper-containing substrate materials is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a method for printing a multi-layer board by using an ultra-thick copper foil according to an embodiment of the invention.
Fig. 2 is a schematic diagram of an inner layer pattern provided by an embodiment of the invention.
Fig. 3 is a schematic diagram of an inner layer copper foil being etched back (without removing the dry film) according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of the first pressing of L1-L2 according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a dry film pattern of an inner core board according to an embodiment of the invention.
FIG. 6 is a schematic diagram of an inner layer etch provided by an embodiment of the present invention.
Fig. 7 is a schematic view of a 2-time pressing structure provided in the embodiment of the present invention.
FIG. 8 is a schematic diagram of an outer layer pattern etching process provided by an embodiment of the invention.
Fig. 9 is a schematic view of a one-time press-fit structure provided by the prior art.
Fig. 10 is a schematic diagram of a secondary pressing structure provided in the prior art.
Fig. 11 is a schematic view of a copper-clad lamination structure provided in the prior art.
Fig. 12 is a diagram showing the effect of etching the copper foil according to the embodiment of the present invention.
Fig. 13 is an effect diagram of laminating the copper foil, the prepreg, and the copper foil to form a core board according to an embodiment of the invention.
Fig. 14 is a diagram illustrating the effect of pressing the formed core boards again to form a multi-layer board according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Aiming at the problems in the prior art, the invention provides a processing method for printing a multilayer board by using an ultra-thick copper foil, and the invention is described in detail below by combining the attached drawings.
As shown in fig. 1, the processing method for printing a multilayer board with an ultra-thick copper foil provided by the embodiment of the invention comprises the following steps:
s101, decomposing a core board with circuit copper foil more than 6OZ in product lamination, and manufacturing by adopting a structure of copper foil, prepreg and copper foil;
s102, pre-etching the copper foil subjected to the S101 to form a local boss and a local groove, wherein the contour of the formed boss is consistent with the width and the position of a drawing line;
s103, pressing the copper foil subjected to the S102 by adopting a structure of a copper foil, a prepreg and a copper foil, and forming a required core board by the pressed structure;
s104, etching the residual copper of the S101 again by the core plate formed in the step S103, keeping the width and the position of the dry film pattern consistent with the contour of the boss of the S101, and forming a required circuit;
s105, riveting each layer of core board passing through S104, and then pressing for two times to form a required multilayer printed circuit board structure, wherein required prepregs are manufactured according to a conventional design;
and S106, carrying out outer layer drilling and hole metallization processes on the printed circuit board subjected to twice pressing, wherein the outer layer circuit pattern needs to be consistent with the contour width and position of the boss of the S101, and carrying out surface treatment and molding to manufacture the required multilayer ultra-thick copper foil printed circuit board.
Transferring the circuit pattern of the copper foil with each layer thickness to the copper foil without the base material by adopting a copper foil pitting method; and then carrying out one-time lamination on the structures of the copper foil, the prepreg and the copper foil to form a double-sided board, wherein the lamination mode before lamination is as follows: the copper foil is inwards provided with a groove close to the structure of the prepreg; etching the double-sided board formed after pressing again, wherein the width and the position of the formed circuit pattern are consistent with those of the protruding circuit formed during the copper foil concave etching; finally, pressing the etched double-sided boards into 1 multilayer board, and then etching the outer layer circuit, wherein the width and the position of the formed circuit pattern are consistent with those of the protruding circuit formed when the copper foil is subjected to pitting corrosion; at the moment, the protruding thickness of the outer layer circuit is only 50-100um higher than that of the base material, and the silk screen printing is carried out by adopting a conventional process; finally, the laminated structure of the product is realized.
The technical scheme of the invention is as follows:
1) decomposing a core plate with circuit copper foil more than 6OZ in the product lamination (the invention is explained by using 300um copper foil), manufacturing by adopting the structure of the copper foil, a prepreg and the copper foil, firstly transferring a dry film pattern on one surface of the 300um thick copper foil, and protecting the other surface by adopting a dry film (see figure 2);
2) pre-etching the copper foil subjected to the step 1) to form a local boss and a local groove, wherein the depth of the groove is 200-250 mu m, the thickness of 50-100 mu m is reserved, etching is not carried out, and the contour of the formed boss is consistent with the width and position of a drawing line; etching the film to be stripped (see fig. 3);
3) the copper foil in the step 2) is pressed by adopting a structure of a copper foil, a prepreg and a copper foil, the prepreg selects a thin glass fiber structure and a harmless prepreg, the laminating mode is that the copper foil is inwards in a groove, the groove is close to the thin glass fiber prepreg, the harmless prepreg is arranged between two thin glass fiber prepregs, and the pressing structure (shown in figure 4) forms a required core plate;
4) the residual copper and dry film patterns of the core plate formed in the step 3) and obtained in the step 1) are etched again, and the width and the position of the boss outline in the step 1) are kept consistent (see figure 5); forming the desired wiring (see fig. 6);
5) riveting each layer of core board obtained in the step 4), and then pressing for 2 times to form a required multilayer printed circuit board structure (see fig. 7), wherein the thickness of the circuit protruding from the inner layer is only 50-100um, and the required prepreg is manufactured according to the conventional design;
6) and (3) carrying out outer layer drilling and hole metallization processes on the printed circuit board subjected to 2 times of pressing, wherein the outer layer circuit graph needs to be consistent with the contour width and the position of the boss in the step 1), as shown in fig. 8, the etching base copper thickness of the outer layer circuit is 50-100 microns, the silk-screen solder mask can be manufactured according to a conventional process, and the required multilayer ultra-thick copper foil printed circuit board is manufactured after surface treatment and molding.
The above description is only for the purpose of illustrating the present invention and the appended claims are not to be construed as limiting the scope of the invention, which is intended to cover all modifications, equivalents and improvements that are within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The processing method for printing the multilayer board by the ultra-thick copper foil is characterized by comprising the following steps of:
(1) transferring the circuit pattern of the copper foil with each layer thickness to the copper foil without the base material by adopting a copper foil pitting method;
(2) firstly, carrying out primary pressing on the structures of the copper foil, the prepreg and the copper foil to form a double-sided board, etching the double-sided board formed after pressing again, and keeping the width and the position of the formed circuit pattern consistent with the width and the position of a protruding circuit formed when the copper foil is subjected to pitting corrosion;
(3) and pressing the etched double-sided boards into a multilayer board, and etching the outer layer circuit to finally realize the product laminated structure.
2. The method for processing the ultra-thick copper foil printed multi-layer board according to claim 1, wherein in the step (2), the laminating manner before pressing is as follows: the copper foil is arranged with a groove inward, and the groove is close to the structure of the prepreg.
3. The method for processing a printed multilayer board with ultra-thick copper foil according to claim 1, wherein in the step (3), the width and position of the circuit pattern formed by etching the outer layer circuit are consistent with those of the protruding circuit formed by the copper foil when being etched; the protruding thickness of the outer layer circuit is only 50-100um higher than that of the base material.
4. The method for processing the printed multilayer board with the ultra-thick copper foil according to claim 1, wherein the method for processing the printed multilayer board with the ultra-thick copper foil comprises the following steps:
firstly, decomposing a core board with a circuit copper foil more than 6OZ in a product lamination, and manufacturing by adopting a structure of a copper foil, a prepreg and a copper foil;
pre-etching the copper foil to form a local boss and a local groove, wherein the contour of the formed boss is consistent with the width and the position of a drawing line;
thirdly, pressing the copper foil by adopting a structure of copper foil, prepreg and copper foil, and forming a required core board by pressing the structure;
etching the residual copper of the first step on the formed core plate, wherein the width and the position of the dry film pattern are consistent with those of the boss outline of the first step, and forming a required circuit;
step five, riveting each layer of core board, and then laminating for two times to form a required multilayer printed circuit board structure, wherein the required prepreg is manufactured according to a conventional design;
and sixthly, performing outer layer drilling and hole metallization processes on the printed circuit board subjected to twice pressing, wherein the outer layer circuit pattern needs to be consistent with the contour width and position of the boss in the first step, and performing surface treatment and molding to manufacture the required multilayer ultra-thick copper foil printed circuit board.
5. The method for printing a multilayer board with an ultra-thick copper foil according to claim 4, wherein in the step one, the manufacturing of the structure with the copper foil, the prepreg and the copper foil comprises the following steps:
and (3) transferring a dry film pattern on one surface of the 300-micron thick copper foil, and protecting the other surface by adopting a dry film.
6. The method for processing the printed multilayer board with the ultra-thick copper foil as claimed in claim 4, wherein in the second step, the film needs to be removed during etching.
7. The method for processing the printed multilayer board with the ultra-thick copper foil as claimed in claim 4, wherein in the second step, the depth of the groove is 200-250um, and the thickness of 50-100um is remained without etching.
8. The method for processing the printed multilayer board with the ultra-thick copper foil as claimed in claim 4, wherein in the third step, the prepreg is selected from a thin glass fiber structure and an unhindered prepreg; the plate stacking mode is as follows:
the copper foil recess is inwards, and the recess is close to the fine prepreg of thin glass, and the just prepreg of doing harm to is between two fine prepregs of thin glass.
9. The method for processing the printed multilayer board with the ultra-thick copper foil as claimed in claim 4, wherein in the fifth step, the thickness of the protruded line on the inner layer of the multilayer printed circuit board structure is 50-100 um.
10. The method for processing the ultra-thick copper foil printed multilayer board according to claim 4, wherein in the sixth step, the etching base copper thickness of the outer layer circuit is 50 to 100 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011586830.9A CN112672546A (en) | 2020-12-28 | 2020-12-28 | Processing method for printing multilayer board by ultra-thick copper foil |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011586830.9A CN112672546A (en) | 2020-12-28 | 2020-12-28 | Processing method for printing multilayer board by ultra-thick copper foil |
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| CN202011586830.9A Pending CN112672546A (en) | 2020-12-28 | 2020-12-28 | Processing method for printing multilayer board by ultra-thick copper foil |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490349A (en) * | 2021-07-21 | 2021-10-08 | 深圳市普林电路有限公司 | Preparation process of multilayer thick-copper large-size back plate |
| CN113630990A (en) * | 2021-10-09 | 2021-11-09 | 惠州市兴顺和电子有限公司 | Combined pressing plate process for inner thin core plate and multiple layers of prepregs |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180215B1 (en) * | 1999-07-14 | 2001-01-30 | Intel Corporation | Multilayer printed circuit board and manufacturing method thereof |
| WO2012031522A1 (en) * | 2010-09-08 | 2012-03-15 | Tian Xianping | Method for manufacturing thick copper foil pcb |
| CN103533741A (en) * | 2013-10-29 | 2014-01-22 | 景旺电子科技(龙川)有限公司 | Double-side thick copper plate and manufacturing method thereof |
| CN111988918A (en) * | 2020-09-15 | 2020-11-24 | 四川英创力电子科技股份有限公司 | Manufacturing method of thick copper circuit board |
-
2020
- 2020-12-28 CN CN202011586830.9A patent/CN112672546A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180215B1 (en) * | 1999-07-14 | 2001-01-30 | Intel Corporation | Multilayer printed circuit board and manufacturing method thereof |
| WO2012031522A1 (en) * | 2010-09-08 | 2012-03-15 | Tian Xianping | Method for manufacturing thick copper foil pcb |
| CN102404942A (en) * | 2010-09-08 | 2012-04-04 | 田先平 | Method of manufacturing thick copper foil PCB (Printed Circuit Board) |
| CN103533741A (en) * | 2013-10-29 | 2014-01-22 | 景旺电子科技(龙川)有限公司 | Double-side thick copper plate and manufacturing method thereof |
| CN111988918A (en) * | 2020-09-15 | 2020-11-24 | 四川英创力电子科技股份有限公司 | Manufacturing method of thick copper circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490349A (en) * | 2021-07-21 | 2021-10-08 | 深圳市普林电路有限公司 | Preparation process of multilayer thick-copper large-size back plate |
| CN113490349B (en) * | 2021-07-21 | 2022-07-22 | 深圳市普林电路有限公司 | Preparation process of multilayer thick-copper large-size backboard |
| CN113630990A (en) * | 2021-10-09 | 2021-11-09 | 惠州市兴顺和电子有限公司 | Combined pressing plate process for inner thin core plate and multiple layers of prepregs |
| CN113630990B (en) * | 2021-10-09 | 2022-02-11 | 惠州市兴顺和电子有限公司 | Combined pressing plate process for inner thin core plate and multiple layers of prepregs |
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Application publication date: 20210416 |