CN105657992A - Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design - Google Patents
Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design Download PDFInfo
- Publication number
- CN105657992A CN105657992A CN201610049729.7A CN201610049729A CN105657992A CN 105657992 A CN105657992 A CN 105657992A CN 201610049729 A CN201610049729 A CN 201610049729A CN 105657992 A CN105657992 A CN 105657992A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- mode
- multilayer circuit
- stamping process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
Abstract
The invention discloses a direct stamping process for a PCB (Printed Circuit Board) with a copper-plated half-hole design. The direct stamping process comprises the following steps of: manufacturing an inner-layer line of multi-layer plates, laminating, drilling, electroplating, covering with a dry film, carrying out second copper plating, electroplating tin, removing the film, carrying out alkaline etching, solder masking, printing and stamping. The direct stamping process disclosed by the invention has the beneficial effects that for the mode of producing copper-plated half holes, the traditional operation mode of using a half-hole plate for drilling and then scraping residual copper wires manually is not used, and the copper-plated half hole is stamped out by directly adopting a one-step stamping mode, so that the drilling process is omitted and the time cost is saved; the copper-plated half hole is stamped out by a stamping mode, the direct stamping process is more effective than the manual scraping of the copper wires, and the effect of eliminating the residual copper wires is more obvious; and by adoption of the direct stamping process, on one hand, the production process is simplified, on the other hand, the production efficiency is improved, and furthermore, the rate of good products is increased.
Description
Technical field
The present invention relates to pcb board technical field, be specifically related to the direct stamping technique of pcb board of a kind of copper facing half bore design.
Background technology
Printed circuit board (PCB) becomes PCB (Printedcircuitboard) plate, with insulation board for base material, it is cut into certain size, at least with a conductive pattern on it, and cloth porose (entering component hole, fastener hole, plated through-hole etc.), it is used for replacing the chassis of conventional device electronic devices and components, and realizes being connected with each other between electronic devices and components.
In prior art, for the half bore design that the copper facing hole on pcb board is intersected with profile, the slotted eye directly getting out required size can produce a lot of copper wire, therefore, the operation in a drill flute hole must be carried out before the etch, again through etching, most copper wire is removed, and remaining fraction copper wire is accomplished by manually striking off. In the process manually scraping residue copper wire, as easy as rolling off a log situation scratch pcb board occur, and inefficiency, quality also fails to be guaranteed.
Summary of the invention
In order to solve the problem existing for prior art above, the present invention provides a kind of can save cost, improve the direct stamping technique of pcb board of the copper facing half bore design of production efficiency.
The technical solution used in the present invention is: a kind of copper facing half bore design the direct stamping technique of pcb board, including step as follows:
(1) make multiple-plate internal layer circuit: the substrate cut is formed line pattern by image transfer mode on substrate Copper Foil, again through chemical reaction method, the Copper Foil of not part is removed, so as to form required loop figure;
(2) pressing: the substrate surface carrying out internal layer circuit in multilamellar spreads film and Copper Foil, makes multilamellar carry out the base plate bonding of internal layer circuit together into multilayer circuit board by High Temperature High Pressure;
(3) boring: by using the groove cutter of different size, get out the slotted eye of required size on multilayer circuit board;
(4) plating: by plated with copper in the mode of the chemical reaction outer surface at multilayer circuit board and slotted eye, make slotted eye to turn between the layers;
(5) dry film: cover lid layer dry film at the multilayer circuit board outer surface with copper, forms circuit image by the mode of image transfer at the multilayer circuit board outer surface with copper;
(6) secondary copper facing: required circuit and slotted eye are being carried out secondary copper facing thickening with on the multilayer circuit board outer surface of dry film;
(7) electrotinning: at the multilayer circuit board outer surface electrotinning after secondary copper coating step;
(8) striping: dry film is removed by the mode of chemical reaction, the copper of multilayer circuit board outer surface comes out;
(9) alkali etching: by the mode of chemical reaction, useless Copper Foil is removed thus obtaining the outer-layer circuit of independent completion;
(10) anti-welding: by the mode of printing at multilayer circuit board outer surface lid last layer ink;
(11) lettering: by the mode corresponding symbol under multilayer circuit board outer surface prints printed;
(12) stamp: adopt the mode of direct stamping stamp out copper facing half bore and the multilayer circuit board of full wafer is removed useless frame, become the shape specification of regulation again through Chemical cleaning Final finishing.
The invention has the beneficial effects as follows: in the mode producing copper facing half bore, pass through manually to strike off the operating type of residual copper wire after not using traditional half-pore plate boring, a stamping mode is directly adopted to stamp out copper facing half bore, eliminate flow process of once holing, save time cost, and stamp out copper facing half bore by the mode of stamping, more more effective than manually striking off copper wire, and the effect eliminating residual copper wire becomes apparent from, simplify production procedure on the one hand, improve production efficiency on the other hand, be again just to increase the yields of product.
Accompanying drawing explanation
Fig. 1 is the process chart of the present invention.
Detailed description of the invention
With reference to shown in Fig. 1, the direct stamping technique of pcb board of a kind of copper facing half bore design, including step as follows:
(1) make multiple-plate internal layer circuit: the substrate cut is formed line pattern by image transfer mode on substrate Copper Foil, again through chemical reaction method, the Copper Foil of not part is removed, so as to form required loop figure.
(2) pressing: the substrate surface carrying out internal layer circuit in multilamellar spreads film and Copper Foil, makes multilamellar carry out the base plate bonding of internal layer circuit together into multilayer circuit board by High Temperature High Pressure. It is fixed that the level of wiring board is that the number according to Copper Foil comes, a single sided board just only Copper Foil, and dual platen just has two Copper Foils, and three ply board just has three Copper Foils, and so on. And the determination of the number of plies of wiring board can require according to actual production and determine.
(3) boring: by using the groove cutter of different size, get out the slotted eye of required size on multilayer circuit board. Under accurate condition, the mode of digital control hole drilling can being adopted to carry out, borehole accuracy requires height very, it is necessary to ensure that the position of slotted eye is accurate.
(4) plating: in order to make slotted eye to turn between the layers, must be filled with copper in slotted eye, by plated with copper in the mode of the chemical reaction outer surface at multilayer circuit board and slotted eye, makes slotted eye to turn between the layers.
(5) dry film: cover lid layer dry film at the multilayer circuit board outer surface with copper, forms circuit image by the mode of image transfer at the multilayer circuit board outer surface with copper.
(6) secondary copper facing: required circuit and slotted eye are being carried out secondary copper facing thickening with on the multilayer circuit board outer surface of dry film.
(7) electrotinning: at the multilayer circuit board outer surface electrotinning after secondary copper coating step, when being beneficial to etch, the copper of multilayer circuit board outer surface is protected.
(8) striping: dry film is removed by the mode of chemical reaction, the copper of multilayer circuit board outer surface comes out;
(9) alkali etching: by the mode of chemical reaction, useless Copper Foil is removed thus obtaining the outer-layer circuit of independent completion;
(10) anti-welding: by the mode of printing at multilayer circuit board outer surface lid last layer ink, in order to protect copper face circuit, it is prevented that aoxidize and insulate.
(11) lettering: by the mode corresponding symbol under multilayer circuit board outer surface prints printed, it is simple to distinguish when subsequent installation part.
(12) stamp: adopt the mode of direct stamping stamp out copper facing half bore and the multilayer circuit board of full wafer is removed useless frame, become the shape specification of regulation again through Chemical cleaning Final finishing.
The present invention is in the mode producing copper facing half bore, pass through manually to strike off the operating type of residual copper wire after not using traditional half-pore plate boring, a stamping mode is directly adopted to stamp out copper facing half bore, eliminate flow process of once holing, save time cost, and stamp out copper facing half bore by the mode of stamping, more more effective than manually striking off copper wire, and the effect eliminating residual copper wire becomes apparent from, simplify production procedure on the one hand, improve production efficiency on the other hand, be again just to increase the yields of product.
Above-described embodiment is only that the ultimate principle of the present invention, principal character and advantage have been shown and described. Skilled person will appreciate that of the industry; the present invention is not restricted to the described embodiments; described in above-described embodiment and description is that principles of the invention is described; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements both fall within the claimed scope of the invention.
Claims (1)
1. the direct stamping technique of pcb board of a copper facing half bore design, it is characterised in that: the step included is as follows:
(1) make multiple-plate internal layer circuit: the substrate cut is formed line pattern by image transfer mode on substrate Copper Foil, again through chemical reaction method, the Copper Foil of not part is removed, so as to form required loop figure;
(2) pressing: the substrate surface carrying out internal layer circuit in multilamellar spreads film and Copper Foil, makes multilamellar carry out the base plate bonding of internal layer circuit together into multilayer circuit board by High Temperature High Pressure;
(3) boring: by using the groove cutter of different size, get out the slotted eye of required size on multilayer circuit board;
(4) plating: by plated with copper in the mode of the chemical reaction outer surface at multilayer circuit board and slotted eye, make slotted eye to turn between the layers;
(5) dry film: cover lid layer dry film at the multilayer circuit board outer surface with copper, forms circuit image by the mode of image transfer at the multilayer circuit board outer surface with copper;
(6) secondary copper facing: required circuit and slotted eye are being carried out secondary copper facing thickening with on the multilayer circuit board outer surface of dry film;
(7) electrotinning: at the multilayer circuit board outer surface electrotinning after secondary copper coating step;
(8) striping: dry film is removed by the mode of chemical reaction, the copper of multilayer circuit board outer surface comes out;
(9) alkali etching: by the mode of chemical reaction, useless Copper Foil is removed thus obtaining the outer-layer circuit of independent completion;
(10) anti-welding: by the mode of printing at multilayer circuit board outer surface lid last layer ink;
(11) lettering: by the mode corresponding symbol under multilayer circuit board outer surface prints printed;
(12) stamp: adopt the mode of direct stamping stamp out copper facing half bore and the multilayer circuit board of full wafer is removed useless frame, become the shape specification of regulation again through Chemical cleaning Final finishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610049729.7A CN105657992A (en) | 2016-01-25 | 2016-01-25 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610049729.7A CN105657992A (en) | 2016-01-25 | 2016-01-25 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105657992A true CN105657992A (en) | 2016-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610049729.7A Pending CN105657992A (en) | 2016-01-25 | 2016-01-25 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
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| CN (1) | CN105657992A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660069A (en) * | 2017-09-07 | 2018-02-02 | 江门市君业达电子有限公司 | A kind of PCB plate production method with half bore |
| CN108012451A (en) * | 2017-11-20 | 2018-05-08 | 东莞联桥电子有限公司 | A kind of circuit board machining process of band B2B connections tank |
| CN109743839A (en) * | 2018-12-17 | 2019-05-10 | 智恩电子(大亚湾)有限公司 | A kind of method of non-metallic half-pore plate |
| CN111031684A (en) * | 2019-12-23 | 2020-04-17 | 奥士康科技股份有限公司 | Semi-pore plate processing method |
| CN112739000A (en) * | 2020-11-04 | 2021-04-30 | 智恩电子(大亚湾)有限公司 | PCB (printed circuit board) half-hole plate processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009032957A (en) * | 2007-07-27 | 2009-02-12 | Samsung Electro Mech Co Ltd | Printed-circuit board and method for manufacturing the same |
| CN101547569B (en) * | 2009-04-24 | 2010-08-18 | 深圳市博敏电子有限公司 | Technology for processing semi-hole of PCB board |
| CN102573289A (en) * | 2010-12-15 | 2012-07-11 | 相互股份有限公司 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
| CN203697139U (en) * | 2014-01-20 | 2014-07-09 | 景旺电子科技(龙川)有限公司 | Die for punching half holes |
| CN104853544A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | Method for making metalized half hole |
-
2016
- 2016-01-25 CN CN201610049729.7A patent/CN105657992A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009032957A (en) * | 2007-07-27 | 2009-02-12 | Samsung Electro Mech Co Ltd | Printed-circuit board and method for manufacturing the same |
| CN101547569B (en) * | 2009-04-24 | 2010-08-18 | 深圳市博敏电子有限公司 | Technology for processing semi-hole of PCB board |
| CN102573289A (en) * | 2010-12-15 | 2012-07-11 | 相互股份有限公司 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
| CN203697139U (en) * | 2014-01-20 | 2014-07-09 | 景旺电子科技(龙川)有限公司 | Die for punching half holes |
| CN104853544A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | Method for making metalized half hole |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660069A (en) * | 2017-09-07 | 2018-02-02 | 江门市君业达电子有限公司 | A kind of PCB plate production method with half bore |
| CN108012451A (en) * | 2017-11-20 | 2018-05-08 | 东莞联桥电子有限公司 | A kind of circuit board machining process of band B2B connections tank |
| CN109743839A (en) * | 2018-12-17 | 2019-05-10 | 智恩电子(大亚湾)有限公司 | A kind of method of non-metallic half-pore plate |
| CN111031684A (en) * | 2019-12-23 | 2020-04-17 | 奥士康科技股份有限公司 | Semi-pore plate processing method |
| CN112739000A (en) * | 2020-11-04 | 2021-04-30 | 智恩电子(大亚湾)有限公司 | PCB (printed circuit board) half-hole plate processing method |
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Application publication date: 20160608 |