CN109743839A - A kind of method of non-metallic half-pore plate - Google Patents
A kind of method of non-metallic half-pore plate Download PDFInfo
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- CN109743839A CN109743839A CN201811543481.5A CN201811543481A CN109743839A CN 109743839 A CN109743839 A CN 109743839A CN 201811543481 A CN201811543481 A CN 201811543481A CN 109743839 A CN109743839 A CN 109743839A
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- text
- circuit board
- halftone
- stamping
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Abstract
The present invention provides a kind of method of non-metallic half-pore plate, which comprises the following steps: preceding process → drilling → PTH → outer-layer circuit → graphic plating → etching → anti-welding → text → stamping → rear process.The present invention is by being transformed into half bore data on exterior mold, the process for eliminating gong half bore before etching after figure electricity, reduce scratch hidden danger, anti-welding subsidiary qualitative effects caused by also improving because of half bore, due to being plate Internal hole positioning, mold one-pass molding, half hole precision, which has been effectively ensured, can reach within ± 0.05mm.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of method of non-metallic half-pore plate.
Background technique
With the continuous development of PCB, client designs half-pore plate, half-pore plate belongs to meet different matching requirements
Non-conventional design plate, manufacturing procedure is more, traditional non-metallic half-pore plate processing flow: preceding process → drilling → PTH → outer
Sandwich circuit → graphic plating → gong half bore → etching → anti-welding → text → stamping → rear process.
Process above process is that industry generallys use, and half bore first passes through drilling and drills out entire hole, is fabricated into figure electricity
Unwanted part gong is fallen by CNC after the completion, remaining to be just needed half bore, this technique has the following problems: 1.
Process flow is long to be increased, and cost is increased；2. two bore after figure electricity, it is easy to scratch tin face, opens a way after leading to etching；3. gong is at half bore
Afterwards, easy ink enters hole when anti-welding printing and the poly- oil of hole edge is bad, when four sides are all half bore designs, can not carry out printed on both sides；
4. pair gong machine required precision is high, aperture is applicable in for 1.0mm or more, when the half bore gong machine precision of 0.8mm is not achieved, gong is come out
Half hole shape missing.
Summary of the invention
In view of this, the present invention provides a kind of method of non-metallic half-pore plate, the present invention is by converting half bore data
Onto exterior mold, the process for eliminating the preceding gong half bore of etching after figure electricity reduces scratch hidden danger, also improves because half bore causes
Anti-welding subsidiary qualitative effects, due to being plate Internal hole positioning, mold one-pass molding, be effectively ensured half hole precision can reach ±
Within 0.05mm.
The technical solution of the present invention is as follows: a kind of method of non-metallic half-pore plate, which comprises the following steps:
Preceding process → drilling → PTH → outer-layer circuit → graphic plating → etching → anti-welding → text → stamping → rear process.
Further, in the die process, above the mold specially half bore Data Design to stamping, 120 are selected
Ton or more stamping equipment, disposably obtain half bore in stamping.Further, the stamping is positioned using location hole in plate.
Disposal molding can effectively ensure that half hole precision, while there will not be residual burr and existing.
In the present invention, since half bore is just completed the process to rear process, effectively improves anti-solder ink and enter hole and the poly- oil of hole edge
It is bad, printed on both sides is not influenced, can guarantee machining accuracy within ± 0.05mm the half bore that aperture is 0.8mm.
Further, it in the text technique, specifically includes:
There is provided a substrate to text printout, which includes an at least first circuit board, an at least second circuit board and at least
One spacer region between first circuit board and second circuit board；One text printout halftone, including at least one first net are provided
Version area, at least one second halftone area and at least one spaced openings between the first halftone area and the second halftone area, the first net
Version area and the second halftone area are respectively formed with pattern openings；The text printout halftone is bonded with the base plate alignment, makes
One halftone area corresponds to first circuit board, and the second halftone area corresponds to second circuit board, and spaced openings correspond to spacer region；It is printed in text
Text ink is coated on brush halftone, so that text ink is formed in first circuit board and second circuit board table by pattern openings
Face is formed in spacer region by spaced openings；Text printout halftone and substrate are separated, the base that surface printing has text ink is obtained
Plate.
Further, in the text technique, the method for coating text ink is spraying, brushing or spin coating.
It further, further comprise being done at hardening to text ink after coating text ink in the text technique
The step of reason.
The present invention is by being transformed into half bore data on exterior mold, the process for eliminating the preceding gong half bore of etching after figure electricity,
Reduce scratch hidden danger, anti-welding subsidiary qualitative effects caused by also improving because of half bore, due to being plate Internal hole positioning, mold is primary
Molding, half hole precision, which has been effectively ensured, can reach within ± 0.05mm.
By the method for the invention, scratch ratio can decline 10%, and anti-welding improved efficiency 15%, anti-welding Yield lmproved 5% subtracts
A few gong half bore process, saves production cycle about 6-12H.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment 1
A kind of method of non-metallic half-pore plate, which comprises the following steps: preceding process → drilling → PTH → outer layer
Route → graphic plating → etching → anti-welding → text → stamping → rear process.
Further, in the die process, above the mold specially half bore Data Design to stamping, 120 are selected
The stamping equipment of ton, disposably obtains half bore in stamping.Further, the stamping is positioned using location hole in plate.Disposably
Molding can effectively ensure that half hole precision, while there will not be residual burr and existing.
In the present embodiment, since half bore is just completed the process to rear process, effectively improving anti-solder ink, to enter hole and hole edge poly-
Oil is bad, does not influence printed on both sides, can guarantee machining accuracy within ± 0.05mm the half bore that aperture is 0.8mm.
Further, it in the text technique, specifically includes:
There is provided a substrate to text printout, which includes an at least first circuit board, an at least second circuit board and at least
One spacer region between first circuit board and second circuit board；One text printout halftone, including at least one first net are provided
Version area, at least one second halftone area and at least one spaced openings between the first halftone area and the second halftone area, the first net
Version area and the second halftone area are respectively formed with pattern openings；The text printout halftone is bonded with the base plate alignment, makes
One halftone area corresponds to first circuit board, and the second halftone area corresponds to second circuit board, and spaced openings correspond to spacer region；It is printed in text
Text ink is coated on brush halftone, so that text ink is formed in first circuit board and second circuit board table by pattern openings
Face is formed in spacer region by spaced openings；Text printout halftone and substrate are separated, the base that surface printing has text ink is obtained
Plate.
Further, in the text technique, the method for coating text ink is spraying.
It further, further comprise being done at hardening to text ink after coating text ink in the text technique
The step of reason.
The present embodiment eliminates the work of the preceding gong half bore of etching after figure electricity by the way that half bore data is transformed on exterior mold
Sequence reduces scratch hidden danger, anti-welding subsidiary qualitative effects caused by also improving because of half bore, due to being plate Internal hole positioning, mold
One-pass molding, half hole precision, which has been effectively ensured, can reach within ± 0.05mm.
Method through this embodiment, scratch ratio can decline 10%, anti-welding improved efficiency 15%, anti-welding Yield lmproved 5%,
It reduces by a gong half bore process, saves production cycle about 6-12H.
Embodiment 2
A kind of method of non-metallic half-pore plate, which comprises the following steps: preceding process → drilling → PTH → outer layer
Route → graphic plating → etching → anti-welding → text → stamping → rear process.
Further, in the die process, above the mold specially half bore Data Design to stamping, 140 are selected
The stamping equipment of ton, disposably obtains half bore in stamping.Further, the stamping is positioned using location hole in plate.Disposably
Molding can effectively ensure that half hole precision, while there will not be residual burr and existing.
In the present embodiment, since half bore is just completed the process to rear process, effectively improving anti-solder ink, to enter hole and hole edge poly-
Oil is bad, does not influence printed on both sides, can guarantee machining accuracy within ± 0.05mm the half bore that aperture is 0.8mm.
Further, it in the text technique, specifically includes:
There is provided a substrate to text printout, which includes an at least first circuit board, an at least second circuit board and at least
One spacer region between first circuit board and second circuit board；One text printout halftone, including at least one first net are provided
Version area, at least one second halftone area and at least one spaced openings between the first halftone area and the second halftone area, the first net
Version area and the second halftone area are respectively formed with pattern openings；The text printout halftone is bonded with the base plate alignment, makes
One halftone area corresponds to first circuit board, and the second halftone area corresponds to second circuit board, and spaced openings correspond to spacer region；It is printed in text
Text ink is coated on brush halftone, so that text ink is formed in first circuit board and second circuit board table by pattern openings
Face is formed in spacer region by spaced openings；Text printout halftone and substrate are separated, the base that surface printing has text ink is obtained
Plate.
Further, in the text technique, the method for coating text ink is to brush.
It further, further comprise being done at hardening to text ink after coating text ink in the text technique
The step of reason.
The present embodiment eliminates the work of the preceding gong half bore of etching after figure electricity by the way that half bore data is transformed on exterior mold
Sequence reduces scratch hidden danger, anti-welding subsidiary qualitative effects caused by also improving because of half bore, due to being plate Internal hole positioning, mold
One-pass molding, half hole precision, which has been effectively ensured, can reach within ± 0.05mm.
Method through this embodiment, scratch ratio can decline 10%, anti-welding improved efficiency 15%, anti-welding Yield lmproved 5%,
It reduces by a gong half bore process, saves production cycle about 6-12H.
Embodiment 3
A kind of method of non-metallic half-pore plate, which comprises the following steps: preceding process → drilling → PTH → outer layer
Route → graphic plating → etching → anti-welding → text → stamping → rear process.
Further, in the die process, above the mold specially half bore Data Design to stamping, 180 are selected
The stamping equipment of ton, disposably obtains half bore in stamping.Further, the stamping is positioned using location hole in plate.Disposably
Molding can effectively ensure that half hole precision, while there will not be residual burr and existing.
In the present embodiment, since half bore is just completed the process to rear process, effectively improving anti-solder ink, to enter hole and hole edge poly-
Oil is bad, does not influence printed on both sides, can guarantee machining accuracy within ± 0.05mm the half bore that aperture is 0.8mm.
Further, it in the text technique, specifically includes:
There is provided a substrate to text printout, which includes an at least first circuit board, an at least second circuit board and at least
One spacer region between first circuit board and second circuit board；One text printout halftone, including at least one first net are provided
Version area, at least one second halftone area and at least one spaced openings between the first halftone area and the second halftone area, the first net
Version area and the second halftone area are respectively formed with pattern openings；The text printout halftone is bonded with the base plate alignment, makes
One halftone area corresponds to first circuit board, and the second halftone area corresponds to second circuit board, and spaced openings correspond to spacer region；It is printed in text
Text ink is coated on brush halftone, so that text ink is formed in first circuit board and second circuit board table by pattern openings
Face is formed in spacer region by spaced openings；Text printout halftone and substrate are separated, the base that surface printing has text ink is obtained
Plate.
Further, in the text technique, the method for coating text ink is spin coating.
It further, further comprise being done at hardening to text ink after coating text ink in the text technique
The step of reason.
The present embodiment eliminates the work of the preceding gong half bore of etching after figure electricity by the way that half bore data is transformed on exterior mold
Sequence reduces scratch hidden danger, anti-welding subsidiary qualitative effects caused by also improving because of half bore, due to being plate Internal hole positioning, mold
One-pass molding, half hole precision, which has been effectively ensured, can reach within ± 0.05mm.
Method through this embodiment, scratch ratio can decline 10%, anti-welding improved efficiency 15%, anti-welding Yield lmproved 5%,
It reduces by a gong half bore process, saves production cycle about 6-12H.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (6)
1. a kind of method of non-metallic half-pore plate, which comprises the following steps: preceding process → drilling → PTH → outer
Sandwich circuit → graphic plating → etching → anti-welding → text → stamping → rear process.
2. a kind of method of non-metallic half-pore plate according to claim 1, which is characterized in that in the die process,
Above mold specially half bore Data Design to stamping, 120 tons or more of stamping equipment is selected, is disposably obtained in stamping
Obtain half bore.
3. a kind of method of non-metallic half-pore plate according to claim 2, which is characterized in that the stamping uses in plate
Location hole positioning.
4. a kind of method of non-metallic half-pore plate according to claim 1, which is characterized in that in the text technique,
It specifically includes:
There is provided a substrate to text printout, which includes an at least first circuit board, an at least second circuit board and at least
One spacer region between first circuit board and second circuit board；One text printout halftone, including at least one first net are provided
Version area, at least one second halftone area and at least one spaced openings between the first halftone area and the second halftone area, the first net
Version area and the second halftone area are respectively formed with pattern openings；The text printout halftone is bonded with the base plate alignment, makes
One halftone area corresponds to first circuit board, and the second halftone area corresponds to second circuit board, and spaced openings correspond to spacer region；It is printed in text
Text ink is coated on brush halftone, so that text ink is formed in first circuit board and second circuit board table by pattern openings
Face is formed in spacer region by spaced openings；Text printout halftone and substrate are separated, the base that surface printing has text ink is obtained
Plate.
5. a kind of method of non-metallic half-pore plate according to claim 4, which is characterized in that in the text technique,
The method for coating text ink is spraying, brushing or spin coating.
6. a kind of method of non-metallic half-pore plate according to claim 5, which is characterized in that in the text technique,
It further comprise the step of doing cure process to text ink after coating text ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811543481.5A CN109743839A (en) | 2018-12-17 | 2018-12-17 | A kind of method of non-metallic half-pore plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811543481.5A CN109743839A (en) | 2018-12-17 | 2018-12-17 | A kind of method of non-metallic half-pore plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109743839A true CN109743839A (en) | 2019-05-10 |
Family
ID=66360412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811543481.5A Pending CN109743839A (en) | 2018-12-17 | 2018-12-17 | A kind of method of non-metallic half-pore plate |
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| CN (1) | CN109743839A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115119416A (en) * | 2022-06-14 | 2022-09-27 | 湖北龙腾电子科技股份有限公司 | Method for solving NPTH hole side line oil thinness in PCB resistance welding process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318400A (en) * | 2007-06-08 | 2008-12-10 | 富葵精密组件(深圳)有限公司 | Character screen printing plate and method for manufacturing circuit board employing the same |
| CN203697139U (en) * | 2014-01-20 | 2014-07-09 | 景旺电子科技(龙川)有限公司 | Die for punching half holes |
| CN105657992A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
-
2018
- 2018-12-17 CN CN201811543481.5A patent/CN109743839A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318400A (en) * | 2007-06-08 | 2008-12-10 | 富葵精密组件(深圳)有限公司 | Character screen printing plate and method for manufacturing circuit board employing the same |
| CN203697139U (en) * | 2014-01-20 | 2014-07-09 | 景旺电子科技(龙川)有限公司 | Die for punching half holes |
| CN105657992A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115119416A (en) * | 2022-06-14 | 2022-09-27 | 湖北龙腾电子科技股份有限公司 | Method for solving NPTH hole side line oil thinness in PCB resistance welding process |
| CN115119416B (en) * | 2022-06-14 | 2023-11-21 | 湖北龙腾电子科技股份有限公司 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190510 |
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| RJ01 | Rejection of invention patent application after publication |