CN115119416A - Method for solving NPTH hole side line oil thinness in PCB resistance welding process - Google Patents
Method for solving NPTH hole side line oil thinness in PCB resistance welding process Download PDFInfo
- Publication number
- CN115119416A CN115119416A CN202210669005.8A CN202210669005A CN115119416A CN 115119416 A CN115119416 A CN 115119416A CN 202210669005 A CN202210669005 A CN 202210669005A CN 115119416 A CN115119416 A CN 115119416A
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- npth
- pcb
- hole
- holes
- solving
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000003466 welding Methods 0.000 title claims abstract description 11
- 238000007639 printing Methods 0.000 claims abstract description 29
- 238000005553 drilling Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 238000005406 washing Methods 0.000 claims description 13
- 238000011010 flushing procedure Methods 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 230000003628 erosive effect Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005530 etching Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Abstract
The invention discloses a method for solving the problem of thin oil of NPTH hole side line in a PCB (printed circuit board) resistance welding process, which comprises the following steps of: determining hole positions, and determining the positions of the NPTH holes on the PCB according to the drilling tape data; manufacturing an outer layer circuit; silk-screen printing ink, namely silk-screen printing ink on the PCB to form an ink layer; windowing the printing ink, and sequentially carrying out exposure and development treatment on the printing ink layer; and drilling the NPTH hole position. The ink on the NPTH hole position side has weak fluidity, and can uniformly cover a circuit to avoid the oil at the circuit from being thin; drilling on the NPTH hole site on the printing ink layer, can effectively avoid NPTH hole limit to hinder and weld printing ink side erosion, and then avoid the chemical nickel gold that sinks in-process, the metal hinders to weld side erosion edge reaction growth and NPTH hole limit line connection along hindering, leads to short circuit behind the customer's weldment.
Description
Technical Field
The invention relates to a circuit board production process, in particular to a method for solving the problem of thin oil of NPTH hole side lines in a PCB (printed circuit board) resistance welding process.
Background
In the production and manufacturing process of the PCB, after the outer layer circuit is manufactured, a solder mask layer needs to be manufactured in an area outside an NPTH hole on the surface of the board body for protecting the circuit on the board surface. When a solder mask is manufactured on a PCB, NPTH holes and outer-layer circuits are generally manufactured on the PCB, and then silk-screen printing, exposure and development are sequentially carried out. There is the line design at the NPTH hole limit of part PCB board, especially the circuit between a plurality of NPTH holes, and the NPTH hole is very close to the circuit, printing ink after the silk screen printing has stronger mobility, there is the difference in height in the circuit on NPTH hole and edge, printing ink on the circuit flows to the low place (because the existence in NPTH hole, printing ink can flow in NPTH is downthehole for a small part, cause printing ink on the circuit to flow to the low place in succession), cause the thin phenomenon of solder mask oil on the NPTH hole sideline, in addition the solder mask oil on this NPTH hole limit also can appear the undercut after the development, so at the surface treatment chemical immersion nickel in-process, the metal is along the solder mask undercut edge reaction growth and NPTH hole limit line connection, lead to short circuit behind the customer's weldment.
Disclosure of Invention
In view of the above, there is a need to provide a method for solving the problem of thin circuit oil at the NPTH hole edge in the PCB solder mask process, and solve the problem of the prior art that the circuit oil is thin near the NPTH hole and the problem of short circuit of the circuit due to the occurrence of side etching of the solder resist at the NPTH hole edge after development.
In order to achieve the technical purpose, the technical scheme of the invention provides a method for solving the problem of NPTH hole side line oil thinness in a PCB (printed circuit board) resistance welding process, which comprises the following steps of:
s1: determining hole positions, and determining the positions of the NPTH holes on the PCB according to the drilling tape data;
s2: manufacturing an outer layer circuit;
s3: silk-screen printing ink, namely silk-screen printing ink on the PCB to form an ink layer;
s4: windowing the printing ink, and sequentially carrying out exposure and development treatment on the printing ink layer;
s5: and drilling the NPTH hole position.
Further, step S1 includes: manufacturing partial NPTH holes, wherein the partial NPTH holes meet the following conditions: when the thickness of the outer layer circuit is less than 2oz, the distance between the partial NPTH holes and the outer layer circuit is more than 0.2 mm; when the thickness of the outer layer line is more than or equal to 2oz, the distance between the NPTH holes and the outer layer line is more than 0.25 mm.
Further, in step S5: making another part of NPTH holes, wherein the another part of NPTH holes meet the following conditions: when the thickness of the outer layer circuit is less than 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is less than or equal to 0.2 mm; when the thickness of the outer layer line is more than or equal to 2oz, the distance between the NPTH holes of the other part and the outer layer line is less than or equal to 0.25 mm.
Further, step S4 specifically includes:
step S41: exposing the pre-cured ink, wherein the exposure step adopts exposure energy of 260-360mj/cm 2;
step S42: flushing the ink layer by using a developer, wherein the flushing pressure of 1.8-2.2kg/cm2 is adopted in the developing step;
step S43: and removing the ink in the part of the NPTH holes.
Further, in step S42: the force of the developer for washing the ink layer is uniformly increased.
Further, step S43 specifically includes:
step S431, washing the ink in the partial NPTH holes by water, wherein the washing pressure is 2.5-8kg/cm 2;
step S432, drying the PCB;
and step S433, ablating residual ink in the partial NPTH holes by using a laser beam.
Further, in step S431: the force of washing the partial NPTH pores with water is uniformly increased.
Further, in step S432: the PCB surface is dewatered and air-dried for 10s by using natural wind, and then dried for 19s by using hot wind at 80 ℃.
Further, in step S433: the diameter of the laser beam spot is 70-80 μm.
Further, in step S433: the distance between the center of a light spot of the laser beam and the wall of the NPTH hole is 5-10 mu m.
Compared with the prior art, the invention has the beneficial effects that: determining the position of the NPTH hole on the PCB according to the drilling tape data, manufacturing an outer layer circuit, printing ink in a silk screen mode, and drilling the NPTH hole; by the arrangement mode, the ink fluidity of the NPTH hole position edge is weakened, and a circuit can be uniformly covered, so that the oil at the circuit is prevented from being thin; drilling on the NPTH hole site on the printing ink layer, can effectively avoid the resistance of NPTH hole limit circuit department to weld printing ink side erosion, and then avoid the chemical nickel gold that sinks in-process, the metal is along hindering the edge reaction growth that welds and NPTH hole limit circuit connection, leads to customer weldment back short circuit.
Drawings
Fig. 1 is a schematic partial cross-sectional view of a PCB according to embodiment 1 of the present invention;
fig. 2 is a partial sectional structure view of a PCB panel according to comparative example 1 of the present invention.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and together with the description, serve to explain the principles of the invention and not to limit the scope of the invention.
Example 1
The embodiment provides a method for solving the problem of thin oil on NPTH hole side lines in a PCB (printed circuit board) resistance welding process, which sequentially comprises the following operation steps of:
(1) determining the hole site: and determining the position of the PCB where the NPTH hole is positioned according to the drilling strip data.
(2) And manufacturing the outer layer circuit in a positive process mode.
(3) Printing ink by silk screen: and uniformly screen-printing ink on the PCB to form an ink layer.
(4) Windowing the printing ink: and sequentially carrying out exposure and development treatment on the ink layer on the PCB.
(5) Manufacturing NPTH holes: and drilling holes at the NPTH hole positions covered by the ink layer.
In the technical scheme of the embodiment, the NPTH holes are not manufactured before the printing ink is printed, and the printing ink on the sides of the NPTH holes is weak in fluidity and can uniformly cover the circuit, so that the oil at the circuit is prevented from being thin; windowing the ink layer in the modes of exposure and development, and drilling holes at NPTH hole sites covered by the ink layer, so that the NPTH hole edges can be effectively prevented from welding ink side etching, and further the chemical nickel gold deposition process is avoided, and the metal is connected with NPTH hole edge lines along the edge reaction growth of welding side etching, so that the short circuit is caused behind the welding piece of a client (see figure 1).
Example 2
The embodiment provides a method for solving the problem of thin oil on NPTH hole side lines in a PCB (printed circuit board) resistance welding process, which sequentially comprises the following operation steps of:
(1) determining the hole site: and determining the position of the PCB where the NPTH hole is positioned according to the drilling strip data.
(2) Making partial NPTH holes: the holes are drilled at the determined part of the NPTH hole positions.
The partial NPTH pores need to satisfy the following conditions: when the thickness of the outer layer circuit is less than 2oz, the distance between the partial NPTH holes and the outer layer circuit is more than 0.2 mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the NPTH holes and the outer layer circuit is more than 0.25 mm.
(3) And manufacturing the outer layer circuit in a positive process mode.
(4) Printing ink by silk screen: and uniformly screen-printing ink on the PCB to form an ink layer.
(5) Windowing the printing ink: and sequentially carrying out exposure, development and hole ink removal treatment on the ink layer of the PCB.
(51) Exposure: exposing the cured ink layer by adopting 260-360mj/cm 2 Exposure energy of (1).
(51) And (3) developing: when the ink layer is washed by developer, 1.8-2.2kg/cm is adopted 2 The flushing pressure and the flushing force of the ink layer are uniformly increased.
(53) Removing ink from the portions of the NPTH pores.
It can be understood that, because made partial NPTH hole earlier, printing ink gets into partial NPTH hole very easily, if not get rid of in time, can lead to the downthehole printing ink residue of product, causes the aperture to be littleer, influences customer's plug-in components.
(531) Cleaning: and washing the ink in the partial NPTH holes by water, wherein the washing pressure is 2.5-8kg/cm2, and the washing force is uniformly increased in order to avoid large impact on the PCB in the washing process.
(532) And (3) drying: and (3) carrying out dewatering and air drying on the surface of the PCB for 10s by using natural wind, and then carrying out drying treatment on the PCB for 19s by using hot wind at the temperature of 80 ℃.
(533) Laser hole burning: and ablating residual ink in the NPTH holes by using laser beams, wherein the diameter of a light spot of each laser beam is 70-80 mu m, and the distance between the center of the light spot of each laser beam and the hole wall of each NPTH hole is 5-10 mu m. The spot diameter of the optional laser beam is 75 μm, and the distance between the center of the spot of the laser beam and the wall of the NPTH hole is 7.5 μm, so as to ensure that the laser beam only ablates residual ink without damaging the PCB.
(6) Making another part of NPTH holes: and drilling holes at the NPTH hole positions of the other parts covered by the ink layer.
The other part of NPTH pores should satisfy the following condition: when the thickness of the outer layer circuit is less than 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is less than or equal to 0.2 mm; when the thickness of the outer layer line is more than or equal to 2oz, the distance between the NPTH holes of the other part and the outer layer line is less than or equal to 0.25 mm.
In the technical scheme of the embodiment, partial NPTH holes are manufactured before the ink is printed, and the distance between the partial NPTH holes and the outer layer circuit is greater than 0.2mm or greater than 0.25mm, so that the ink which is 0.2mm or 0.25mm away from the NPTH holes is ensured to have weaker fluidity, the circuit can be uniformly covered, and the oil at the circuit is prevented from being thin; and then, the ink layer is windowed in an exposure and development mode, and holes are drilled in NPTH hole sites of the other part covered by the ink layer, so that the side etching of the NPTH hole can be effectively avoided, and further, the situation that in the chemical nickel gold immersion process, metal reacts and grows along the side etching edge of the solder resist and is connected with a NPTH hole edge line, and short circuit is caused behind a client weldment is avoided.
Comparative example 1
(1) Determining the hole site: and determining the position of the PCB where the NPTH hole is positioned according to the drilling strip data.
(2) NPTH holes are made.
(3) And manufacturing the outer layer circuit in a positive process mode.
(4) Printing ink by silk screen: and uniformly screen-printing ink on the PCB to form an ink layer.
(5) Windowing the printing ink: and exposing and developing the ink layer of the PCB in sequence to form a solder mask.
In the technical scheme of the comparative example, NPTH holes are manufactured before printing ink is printed, the printing ink within 0.2mm or 0.25mm of the NPTH holes has strong fluidity, at the moment, the printing ink can not uniformly cover the circuit, and the oil at the circuit is thin; when the ink layer is windowed through exposure and development, lateral erosion (see fig. 2) occurs at the ink at the edge of the NPTH hole, and thus, in the process of chemically depositing nickel and gold by surface treatment, metal grows along the position where the lateral erosion occurs, resulting in short circuit of the circuit.
Those not described in detail in this specification are well within the skill of the art.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (10)
1. A method for solving the problem of thin oil of NPTH hole side lines in a PCB resistance welding process is characterized by comprising the following steps:
s1: determining hole positions, and determining the positions of the NPTH holes on the PCB according to the drilling tape data;
s2: manufacturing an outer layer circuit;
s3: silk-screen printing ink, namely silk-screen printing ink on the PCB to form an ink layer;
s4: windowing the printing ink, and sequentially carrying out exposure and development treatment on the printing ink layer;
s5: and drilling the NPTH hole position.
2. The method for solving the NPTH hole-side line oil thinness in the PCB solder mask process of claim 1, wherein the step S1 further comprises: manufacturing partial NPTH holes, wherein the partial NPTH holes meet the following conditions: when the thickness of the outer layer circuit is less than 2oz, the distance between the partial NPTH holes and the outer layer circuit is more than 0.2 mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the NPTH holes and the outer layer circuit is more than 0.25 mm.
3. The method for solving the NPTH hole-side line oil thinness in the PCB solder mask process of claim 2, wherein in step S5: making another part of NPTH holes, wherein the another part of NPTH holes meet the following conditions: when the thickness of the outer layer circuit is less than 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is less than or equal to 0.2 mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is less than or equal to 0.25 mm.
4. The method for solving the problem of the NPTH hole-side line oil thinness in the PCB solder mask process as claimed in claim 2, wherein the step S4 specifically comprises:
step S41: exposing the pre-cured printing ink, wherein the exposing step adopts 260- 2 Exposure energy of (a);
step S42: washing the ink layer with developer solution, wherein the developing step adopts 1.8-2.2kg/cm 2 The flushing pressure of (a);
step S43: and removing ink from the part of the NPTH holes.
5. The method for solving the NPTH hole-side line oil thinness in the PCB solder mask process of claim 4, wherein in step S42: the force of the developer for washing the ink layer is uniformly increased.
6. The method for solving the problem of the NPTH hole-side line oil thinness in the PCB solder mask process of claim 4, wherein the step S43 specifically comprises the following steps:
step S431, washing the ink in the partial NPTH holes by water, wherein the washing pressure is 2.5-8kg/cm 2 ；
Step S432, drying the PCB;
and step S433, ablating residual ink in the partial NPTH holes by using a laser beam.
7. The method for solving the NPTH hole-side line oil thinness in the PCB solder mask process of claim 6, wherein in step S431: the force of washing the partial NPTH pores with water is uniformly increased.
8. The method for solving the problem of the NPTH hole side line oil thinness in the PCB solder mask process of claim 6, wherein in step S432: the PCB surface is dewatered and air-dried for 10s by using natural wind, and then dried for 19s by using hot wind at 80 ℃.
9. The method for solving the NPTH hole-side line oil-thinness in the PCB-board solder mask process of claim 6, wherein in step S433: the diameter of the laser beam spot is 70-80 μm.
10. The method for solving the NPTH hole-side line oil-thinness in the PCB-board solder mask process of claim 6, wherein in step S433: the distance between the center of a light spot of the laser beam and the wall of the NPTH hole is 5-10 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210669005.8A CN115119416B (en) | 2022-06-14 | 2022-06-14 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210669005.8A CN115119416B (en) | 2022-06-14 | 2022-06-14 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
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| CN115119416A true CN115119416A (en) | 2022-09-27 |
| CN115119416B CN115119416B (en) | 2023-11-21 |
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Cited By (1)
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|---|---|---|---|---|
| CN116940002A (en) * | 2023-06-13 | 2023-10-24 | 湖北龙腾电子科技股份有限公司 | Manufacturing method of circuit board |
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| CN115119416B (en) | 2023-11-21 |
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