CN102958279B - The engraving method of PCB and PCB are in making sheet - Google Patents
The engraving method of PCB and PCB are in making sheet Download PDFInfo
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- CN102958279B CN102958279B CN201110244583.9A CN201110244583A CN102958279B CN 102958279 B CN102958279 B CN 102958279B CN 201110244583 A CN201110244583 A CN 201110244583A CN 102958279 B CN102958279 B CN 102958279B
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- pcb
- layer gold
- dry film
- making sheet
- copper foil
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Abstract
The invention provides the engraving method of a kind of PCB and PCB in making sheet, method comprises: etch cover anti-etching dry film in the layer gold of PCB after.Present invention also offers a kind of PCB in making sheet, described PCB covers layer gold on the metal level on making sheet surface, and described layer gold covers dry film.Owing to covering dry film after etching in layer gold, dry film can prevent etching solution from penetrating on the nickel dam layer gold from layer gold surface, avoids nickel dam to be corroded by etching solution.Follow-uply, closely can to weld together with electronic device because nickel dam is not corroded by etching solution when layer gold surface soldered electronic device, the impact that the electronic device performance in welding can not be welded.
Description
Technical field
The present invention relates to PCB manufacturing technology field, in particular to the engraving method of a kind of PCB and PCB in making sheet.
Background technology
In the PCB manufacture process of correlation technique, need to dodge layer gold in the patterned surface plating of PCB.Dodge layer gold and typically refer to thickness the layer gold of 0.05 ~ 0.08 μm, the circuit on PCB can be made, or between the device that PCB connects, there is good electrical connectivity.Nickel coating on metal level that the technique of layer gold is usually included in PCB is dodged in plating, and on nickel dam, layer gold is dodged in plating.Thinner owing to dodging layer gold, follow-up dodge layer gold welds electronic device time, dodge layer gold and at high temperature melt, electronic device is welded together with the nickel dam dodged under layer gold.
The manufacturing process of the line pattern on PCB generally includes: cover dry film on the metal layer, by Graphic transitions on dry film, the figure of dry film plates sudden strain of a muscle layer gold, dry film around removal sudden strain of a muscle layer gold is to expose metal level to the open air, etch using described sudden strain of a muscle layer gold as resistant layer, etch away the metal level dodged around layer gold, thus make metal level form line pattern.Inventor finds, because electrogilding deposition velocity is very fast, layer gold lattice is comparatively large, so dodge in the process of layer gold surrounding metal in etching, etching solution easily penetrates into the nickel dam of lower one deck from sudden strain of a muscle layer gold surface, there is the problem of corrosion nickel dam., in follow-up welding electronic device process, there is the untight phenomenon of welding, cause the electronic device performance of welding to be affected in the nickel dam be corroded.
Summary of the invention
The present invention aims to provide the engraving method of a kind of PCB and PCB in making sheet, can penetrate into the nickel dam of lower one deck to solve etching solution from sudden strain of a muscle layer gold surface, thus corrosion nickel dam, the problem of impact welding.
In an embodiment of the present invention, provide the engraving method of a kind of PCB, described method comprises: in the layer gold of making sheet, cover anti-etching dry film at described PCB; Described PCB is etched in making sheet.
Further, also comprised before described etching a pneumatics membrane process is at least performed to described dry film.
Further, comprise further after the described dry film of covering: adopt the exposure guide rule intensity of 7 ~ 8 grades to expose described dry film.
Further, before described covering, washing and air-dry described PCB in making sheet.
Further, the thickness of described layer gold is 0.05 ~ 0.08 μm.
Further, in the layer gold of making sheet, cover taking a step forward of anti-etching dry film at described PCB to comprise: by the Graphic transitions of circuit to the copper foil surface of described PCB in making sheet, according to the figure of described transfer, described copper foil surface forms nickel dam, described nickel dam forms described layer gold.
Further, the dry film of described covering is narrower than described layer gold, and differs 1mil ~ 1.5mil apart from the outer rim of the figure of described layer gold.
In an embodiment of the present invention, provide a kind of PCB in making sheet, described PCB covers layer gold on the metal level on making sheet surface, and described layer gold covers dry film.
Further, described dry film is narrower than layer gold, and differs 1mil ~ 1.5mil apart from the figure outer rim of described layer gold.
Further, described metal level comprises the nickel dam of described PCB on the copper foil layer and described copper foil layer of making sheet; The region that described layer gold covers is included in the region of the line pattern that described copper foil layer shifts.
Owing to covering dry film after etching in layer gold, dry film can prevent etching solution from penetrating on the nickel dam layer gold from layer gold surface, avoids nickel dam to be corroded by etching solution.Follow-uply, closely can to weld together with electronic device because nickel dam is not corroded by etching solution when layer gold surface soldered electronic device, the impact that the electronic device performance in welding can not be welded.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, and form a application's part, schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows in the embodiment of the present invention partial schematic diagram of the PCB being coated with layer gold;
Fig. 2 shows the flow chart that in the embodiment of the present invention, PCB makes;
Fig. 3 shows the PCB partial schematic diagram covering dry film in the embodiment of the present invention in layer gold;
Fig. 4 shows in the embodiment of the present invention partial schematic diagram after etching PCB.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
Embodiments of the invention comprise:
Step 1: cover anti-etching dry film at PCB in the layer gold of making sheet;
Step 2: PCB is etched in making sheet.
Owing to covering dry film after etching in layer gold, dry film can prevent etching solution from penetrating on the nickel dam layer gold from layer gold surface, avoids nickel dam to be corroded by etching solution.Follow-uply, closely can to weld together with electronic device because nickel dam is not corroded by etching solution when layer gold surface soldered electronic device, the impact that the electronic device performance in welding can not be welded.
Preferably, see Fig. 1, embodiment comprises:
S21: clean gold-plated PCB;
See the partial schematic diagram of the PCB after gold-plated in Fig. 2.PCB has copper foil layer 11, copper foil layer 11 is coated with layer gold 12.
Adopt pure water cleaning PCB, after cleaning, air-dry PCB.In cleaning process, if production line has volcanic ash polish-brush, should be closed, be avoided golden face of wearing and tearing.If production line has pickling, microetch section, should close, avoid acid gilding face.
Preferably, in the layer gold of making sheet, cover taking a step forward of anti-etching dry film at described PCB to comprise:
The Graphic transitions of circuit is surperficial at the copper foil layer 11 of making sheet to described PCB, according to the figure of described transfer, form nickel dam on the surface at described copper foil layer 11, nickel dam is formed described layer gold 12.
S22: cover dry film on the surface in the layer gold of PCB;
See Fig. 3, paste dry film 13 on the surface in the layer gold of PCB.
Preferably, after pasting dry film 13, at least a pneumatics membrane process is performed to described dry film 13, the adhesive strength of dry film on layer gold surface can be increased.
Preferably, comprise further after the described dry film of covering: according to the figure of layer gold on PCB 12, the dry film 13 pasted is exposed, the exposure guide rule of exposure sources is arranged on 7 ~ 8 grades, described dry film 13 is exposed.Exposure level, 7 ~ 8 grades time, can increase dry film 13 adhesive strength in layer gold.
Preferably, exposure figure on dry film 13, on dry film 13, the figure of transfer is slightly less than the figure of the layer gold formation designed in advance, and equals mil apart from outer most edge difference 1mil ~ 1.5mil, 1mil (mil) on described layer gold surface.Reserved layer gold edge, can avoid the skew due to exposure, and dry film 13 covers needs etched Copper Foil, causes part Copper Foil not have etched, reduces the graphical quality of PCB.
S23: developing process is performed to dry film, and etches PCB.
Developing process is performed to the dry film on PCB.After development, wash the dry film around layer gold 12 on Copper Foil 11 off.Alkali etching PCB, see Fig. 4, etches away the Copper Foil of layer gold 12 surrounding logicalnot circuit, exposes dielectric layer 10.
S24: remove the dry film on PCB.
After etched figure terminates, remove the dry film 13 in the layer gold 12 of PCB.
Owing to covering dry film after etching in layer gold, dry film can prevent etching solution from the nickel dam that layer gold surface penetrates into layer gold, is particularly the sudden strain of a muscle layer gold of 0.05 ~ 0.08 μm for the thickness of layer gold, can effectively avoids nickel dam to be corroded by etching solution.Follow-uply, closely can to weld together with electronic device because nickel dam is not corroded by etching solution when layer gold surface soldered electronic device, the impact that the electronic device performance in welding can not be welded.
Embodiments of the invention also provide a kind of PCB in making sheet, comprising: cover the layer gold on the metal level of PCB, and described layer gold is coated with dry film.
Preferably, the dry film of covering is formed in described layer gold through pneumatics, exposure technology, and metal level comprises the nickel dam of PCB on the copper foil layer and copper foil layer of making sheet, and layer gold covers PCB on the copper foil layer of making sheet by nickel dam.
Preferably, outer rim 1mil ~ the 1.5mil of the line pattern that the outer rim of dry film shows apart from layer gold, namely the layer gold edge reserving 1mil ~ 1.5mil not cover by dry film, the skew due to exposure can be avoided like this, dry film covers needs etched Copper Foil, causes part Copper Foil not etched thus the problem of reduction PCB graphical quality.
Preferably, described metal level comprises the nickel dam of described PCB on the copper foil layer and described copper foil layer of making sheet;
The region that described layer gold covers is included in the region of the line pattern that described copper foil layer shifts.
Preferably, the thickness of layer gold is 0.05 ~ 0.08 μm.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. an engraving method of PCB, is characterized in that, described method comprises:
By the Graphic transitions of circuit to the copper foil surface of described PCB in making sheet, according to the figure of described transfer, described copper foil surface forms nickel dam, described nickel dam forms layer gold;
Described layer gold covers anti-etching dry film;
A pneumatics membrane process is at least performed to described dry film;
Described PCB is etched in making sheet, the Copper Foil of logicalnot circuit figure around layer gold is etched away;
The dry film in described layer gold is removed after etching terminates.
2. method according to claim 1, is characterized in that, after the described dry film of covering, to described PCB before making sheet etches, comprises further:
The exposure guide rule intensity of 7 ~ 8 grades is adopted to expose described dry film.
3. method according to claim 1, is characterized in that, covering described dry film before, washing and air-dry described PCB in making sheet.
4. method according to claim 1, is characterized in that, the thickness of described layer gold is 0.05 ~ 0.08 μm.
5. method according to claim 1, is characterized in that, the dry film of described covering is narrower than described layer gold, and described dry film is apart from the figure outer rim difference 1mil ~ 1.5mil of described layer gold.
6. a PCB is in making sheet, it is characterized in that, described PCB covers layer gold on the metal level on making sheet surface, described layer gold covers anti-etching dry film, wherein, after covering described dry film, a pneumatics membrane process is at least performed to described dry film, and described PCB is etched in making sheet, the Copper Foil of logicalnot circuit figure around layer gold is etched away, after etching terminates, removes the dry film in described layer gold.
7. PCB, in making sheet, is characterized in that according to claim 6, and described metal level comprises the nickel dam of described PCB on the copper foil layer and described copper foil layer of making sheet;
Wherein, the region that described layer gold covers is the region of the line pattern in described copper foil layer surface transfer.
8. PCB, in making sheet, is characterized in that according to claim 7, and described dry film is narrower than described layer gold, and described dry film is apart from the figure outer rim difference 1mil ~ 1.5mil of described layer gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110244583.9A CN102958279B (en) | 2011-08-23 | 2011-08-23 | The engraving method of PCB and PCB are in making sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110244583.9A CN102958279B (en) | 2011-08-23 | 2011-08-23 | The engraving method of PCB and PCB are in making sheet |
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| Publication Number | Publication Date |
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| CN102958279A CN102958279A (en) | 2013-03-06 |
| CN102958279B true CN102958279B (en) | 2016-03-16 |
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| CN201110244583.9A Active CN102958279B (en) | 2011-08-23 | 2011-08-23 | The engraving method of PCB and PCB are in making sheet |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684265B (en) * | 2013-12-02 | 2018-01-26 | 深南电路有限公司 | A kind of circuit board surface electric plating method |
| CN106852024A (en) * | 2017-02-15 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of outer-layer circuit preparation method of Rigid Flex |
| CN109743847A (en) * | 2018-11-27 | 2019-05-10 | 惠州市金百泽电路科技有限公司 | A kind of pcb board antiseepage depositing process |
| CN112235960B (en) * | 2020-10-28 | 2022-05-17 | 惠州市特创电子科技股份有限公司 | Gold immersion circuit board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE10106399C1 (en) * | 2001-02-12 | 2002-09-05 | Siemens Ag | Process for the production of circuit carriers with coarse conductor structures and at least one area with fine conductor structures |
| KR100463434B1 (en) * | 2001-12-04 | 2004-12-23 | 삼성전기주식회사 | Printed Circuit Board with Buried Resistors and Manufacturing Method Thereof |
| KR100499003B1 (en) * | 2002-12-12 | 2005-07-01 | 삼성전기주식회사 | A package substrate for electrolytic leadless plating, and its manufacturing method |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
| CN101868125A (en) * | 2010-05-25 | 2010-10-20 | 深圳市深联电路有限公司 | Method for preventing processed PCB board nickel-gold layer from being eroded |
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Effective date of registration: 20220628 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |