CN109743847A - A kind of pcb board antiseepage depositing process - Google Patents
A kind of pcb board antiseepage depositing process Download PDFInfo
- Publication number
- CN109743847A CN109743847A CN201811427707.5A CN201811427707A CN109743847A CN 109743847 A CN109743847 A CN 109743847A CN 201811427707 A CN201811427707 A CN 201811427707A CN 109743847 A CN109743847 A CN 109743847A
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- China
- Prior art keywords
- pcb board
- dry film
- hot pressing
- antiseepage
- rumble
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Rectangular inner groove PCB motherboard is in press mold in the prior art; since interior slot position does not stress vacantly when hot pressing rumble squeezes; hot pressing rumble has upward active force when leaving the side in inside groove area; causing dry film to be stretched causes to be deteriorated with copper face binding force, and being deteriorated when plating thickeies copper by liquid medicine attack dry film protection will lead to the generation of plating.The present invention provides a kind of pcb board antiseepage depositing process, the technical solution allows the dry film of interior trough rim to be well combined in copper face, the phenomenon that loosening, floating off is not had before outer-layer circuit etching, is particularly suitable for the pcb board that there is rectangular metal milling elongated slot, trough rim to have fine and closely woven bonding wire bonding disk.
Description
Technical field
The present invention relates to PCB manufacturing fields, and in particular to a kind of rectangular inner groove PCB motherboard line pattern processing quality changes
Kind method.
Background technique
5G high-frequency high-speed equipment needs integrate more products in smaller dimensional space and often use inside groove mother baby plate
Structure design, the width of IC develops to 3~4mil or so from the pad of 8mil or more, therefore the connection between mother baby plate can only
Using the method for bonding.Rectangular inner groove motherboard carries out groove milling after piercing, and strip rectangular inner groove is pressing dry meeting shape in film time slot
At vacantly causing the dry film of surrounding not press tightly, since bonding route is very tiny therefore is easy plating, the prior art in plating
Scheme is to prevent the generation of plating by improving route pre-treatment, electro-coppering thickness uniformity, liquid medicine characteristic etc., and the present invention mentions
The technical solution of confession prevents the generation of plating by the binding force of dry film and copper face around improvement bonding region.
Summary of the invention
Technical solution of the present invention is suitable for being provided with the PCB motherboard of metallization rectangular inner groove, particular technique of the invention
Scheme is as follows: a kind of pcb board antiseepage depositing process, comprising the following steps:
S1:PCB plate routine pre-treatment, including sawing sheet, pressing, drilling, groove milling and heavy copper, process on pcb board and are formed in rectangle
Slot, rectangular inner groove are arranged on pcb board in rectangular；
S2: it is dried after cleaning copper face；
S3: dry film is pasted using hot pressing rumble, hot pressing rumble temperature is 110 DEG C~120 DEG C, and pressure is 5.5~6.0kg/cm2, and speed is
0.7~0.8m/min, dry film are bonded pcb board along the longitudinal direction of rectangular inner groove；
S4: the dry film on hot pressing rumble is taken out, and opposite direction carries out without dry film pneumatics pcb board along S3, and hot pressing rumble temperature is
110 DEG C~120 DEG C, pressure is 5.5~6.0kg/cm2, speed is 0.7~0.8m/min；
S5: it stands and is no less than 30min；
S6: processing is exposed to the pcb board；
S7: it stands and is no less than 30min；
S8: developing to pcb board and moves back film.
Preferably, hot pressing rumble temperature is 115 DEG C in S3, pressure 6.0kg/cm2, speed 0.7m/min.
Preferably, hot pressing rumble temperature is 115 DEG C in S4, pressure 6.0kg/cm2, speed 0.7m/min.
Further, carrying out press mold twice makes the dry film inside groove both ends sufficiently combine closely with copper sheet, after resisting it can
Continue the attack of electroplating liquid medicine after moving back film.
Further, no less than 30min is stood after no dry film pneumatics ensured that dry film liquid medicine is sufficiently engaged with plate face layers of copper,
Pcb board is allowed to be cooled to room temperature to ensure to have better exposure effect.
Rectangular inner groove PCB motherboard is in press mold in the prior art, since interior slot position does not stress vacantly when hot pressing rumble squeezes, heat
Pressure reel has upward active force when leaving the side in inside groove area, and causing dry film to be stretched causes to be deteriorated with copper face binding force,
Being deteriorated when plating thickeies copper by liquid medicine attack dry film protection will lead to the generation of plating.Technical solution provided by the invention allows inside groove
The dry film on side is well combined in copper face, is not had the phenomenon that loosening, floating off before outer-layer circuit etching, is particularly suitable for square
Shape metal milling elongated slot, trough rim have the pcb board of fine and closely woven bonding wire bonding disk.
Detailed description of the invention
The invention will be further described for attached drawing, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention.
Fig. 1 is the PCB production process of the prior art.
Fig. 2 is that the pcb board of the prior art pastes dry film process.
Fig. 3 is that the pcb board that one embodiment of the invention provides pastes dry film process.
Fig. 4 is the structural schematic diagram for the pcb board for being provided with rectangular inner groove that one embodiment of the invention provides.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
As shown in Fig. 1~2, a part that dry film 10 is PCB production process is pasted in the prior art, in the pressing of PCB outer layer, is bored
It needs first to mill out inside groove using the method for machining behind hole, is likely to that inside groove is allowed to form good metallization of radiating in heavy copper
Slot needs not needing copper-plated position using patch dry film process 101 to protect before outer layer figure is electric, dry film is exposed, is developed,
Figure electricity can be turned after film, inspection by, which moving back, carries out plating thickening, etching process to required outer circuit figure layers of copper, ultimately forms
Outer graphics.
As shown in figures 1 and 3, a kind of pcb board antiseepage depositing process 102 that invention provides can be replaced existing patch dry film work
Skill 101 is applied in existing PCB production process.
Embodiment 1
A kind of pcb board antiseepage depositing process includes the following steps:
S1:PCB plate routine pre-treatment, including sawing sheet, pressing, drilling, groove milling and heavy copper, process on pcb board a and are formed in rectangle
Slot, as shown in figure 4, rectangular inner groove b is arranged on pcb board a in rectangular；
S2: it needs to carry out pre-treatment to the surface pcb board a before pad pasting, is dried after cleaning copper face, remove the impurity or oxide on surface
And surface is carried out to sting binding force of the erosion to increase copper face and dry film, hot pressing rumble surface is checked whether there is or not residue glue, dirt, and surface is whether
It is smooth, there are non-notch, scratch etc. bad, checks whether temperature-sensing probe is in close contact with hot pressing rumble up and down；
S3: parameter setting, hot pressing rumble temperature are 110 DEG C, pressure 5.5kg/cm2, speed 0.7m/min；
S4: pasting dry film using hot pressing rumble, pastes dry film direction along the longitudinal direction of rectangular inner groove b and is bonded pcb board a from right to left；
S5: the dry film on hot pressing rumble is taken out；
S6: parameter setting, hot pressing rumble temperature are 110 DEG C DEG C, pressure 5.5kg/cm2, speed 0.7m/min；
S7: pcb board a is carried out without dry film pneumatics using hot pressing rumble, direction is pressed from left to right for the longitudinal direction along rectangular inner groove b
Pcb board a
S8: standing 30min, and dry film can be reacted after by hot pressing with pcb board a, and it is closer that standing allows dry film to be bonded with pcb board a；
S9: processing is exposed to pcb board a；
S10: 30min is stood, dry film is allowed sufficiently to sting the copper face of tight pcb board a；
S11: developing to pcb board and moves back film.
Embodiment 2
A kind of pcb board antiseepage depositing process includes the following steps:
S1:PCB plate routine pre-treatment, including sawing sheet, pressing, drilling, groove milling and heavy copper, process on pcb board a and are formed in rectangle
Slot, as shown in figure 4, rectangular inner groove b is arranged on pcb board a in rectangular；
S2: it needs to carry out pre-treatment to the surface pcb board a before pad pasting, is dried after cleaning copper face, remove the impurity or oxide on surface
And surface is carried out to sting binding force of the erosion to increase copper face and dry film, hot pressing rumble surface is checked whether there is or not residue glue, dirt, and surface is whether
It is smooth, there are non-notch, scratch etc. bad, checks whether temperature-sensing probe is in close contact with hot pressing rumble up and down；
S3: parameter setting, hot pressing rumble temperature are 120 DEG C, pressure 6.0kg/cm2, speed 0.8m/min；
S4: pasting dry film using hot pressing rumble, pastes dry film direction along the longitudinal direction of rectangular inner groove b and is bonded pcb board a from right to left；
S5: the dry film on hot pressing rumble is taken out；
S6: parameter setting, hot pressing rumble temperature are 120 DEG C, pressure 6.0kg/cm2, speed 0.8m/min；
S7: pcb board a is carried out without dry film pneumatics using hot pressing rumble, direction is pressed from left to right for the longitudinal direction along rectangular inner groove b
Pcb board a
S8: standing 30min, and dry film can be reacted after by hot pressing with pcb board a, and it is closer that standing allows dry film to be bonded with pcb board a；
S9: processing is exposed to pcb board a；
S10: 30min is stood, dry film is allowed sufficiently to sting the copper face of tight pcb board a；
S11: developing to pcb board and moves back film.
Embodiment 3
A kind of pcb board antiseepage depositing process includes the following steps:
S1:PCB plate routine pre-treatment, including sawing sheet, pressing, drilling, groove milling and heavy copper, process on pcb board a and are formed in rectangle
Slot, as shown in figure 4, rectangular inner groove b is arranged on pcb board a in rectangular；
S2: it needs to carry out pre-treatment to the surface pcb board a before pad pasting, is dried after cleaning copper face, remove the impurity or oxide on surface
And surface is carried out to sting binding force of the erosion to increase copper face and dry film, hot pressing rumble surface is checked whether there is or not residue glue, dirt, and surface is whether
It is smooth, there are non-notch, scratch etc. bad, checks whether temperature-sensing probe is in close contact with hot pressing rumble up and down；
S3: parameter setting, hot pressing rumble temperature are 115 DEG C, pressure 6.0kg/cm2, speed 0.7m/min；
S4: pasting dry film using hot pressing rumble, pastes dry film direction along the longitudinal direction of rectangular inner groove b and is bonded pcb board a from right to left；
S5: the dry film on hot pressing rumble is taken out；
S6: parameter setting, hot pressing rumble temperature are 115 DEG C, pressure 6.0kg/cm2, speed 0.7m/min；
S7: pcb board a is carried out without dry film pneumatics using hot pressing rumble, direction is pressed from left to right for the longitudinal direction along rectangular inner groove b
Pcb board a
S8: standing 30min, and dry film can be reacted after by hot pressing with pcb board a, and it is closer that standing allows dry film to be bonded with pcb board a；
S9: processing is exposed to pcb board a；
S10: 30min is stood, dry film is allowed sufficiently to sting the copper face of tight pcb board a；
S11: developing to pcb board and moves back film.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (3)
1. a kind of pcb board antiseepage depositing process, which comprises the following steps:
S1:PCB plate routine pre-treatment, including sawing sheet, pressing, drilling, groove milling and heavy copper, process on pcb board and are formed in rectangle
Slot, the rectangular inner groove are arranged on the pcb board in rectangular；
S2: it is dried after cleaning copper face；
S3: dry film is pasted using hot pressing rumble, hot pressing rumble temperature is 110 DEG C~120 DEG C, and pressure is 5.5~6.0kg/cm2, speed is
0.7~0.8m/min, the dry film are bonded the pcb board along the longitudinal direction of the rectangular inner groove；
S4: the dry film on the hot pressing rumble is taken out, and opposite direction carries out without dry film pneumatics the pcb board along the S3,
Hot pressing rumble temperature is 110 DEG C~120 DEG C, and pressure is 5.5~6.0kg/cm2, speed is 0.7~0.8m/min；
S5: it stands and is no less than 30min；
S6: processing is exposed to the pcb board；
S7: it stands and is no less than 30min；
S8: developing to the pcb board and moves back film.
2. a kind of pcb board antiseepage depositing process according to claim 1, it is characterised in that: hot pressing rumble temperature is 115 in the S3
DEG C, pressure 6.0kg/cm2, speed 0.7m/min.
3. a kind of pcb board antiseepage depositing process according to claim 1, it is characterised in that: hot pressing rumble temperature is 115 in the S4
DEG C, pressure 6.0kg/cm2, speed 0.7m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811427707.5A CN109743847A (en) | 2018-11-27 | 2018-11-27 | A kind of pcb board antiseepage depositing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811427707.5A CN109743847A (en) | 2018-11-27 | 2018-11-27 | A kind of pcb board antiseepage depositing process |
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| CN109743847A true CN109743847A (en) | 2019-05-10 |
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| CN201811427707.5A Pending CN109743847A (en) | 2018-11-27 | 2018-11-27 | A kind of pcb board antiseepage depositing process |
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Citations (5)
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|---|---|---|---|---|
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN102958279A (en) * | 2011-08-23 | 2013-03-06 | 北大方正集团有限公司 | PCB (printed circuit board) etching method and work-in-process PCB |
| CN103338595A (en) * | 2013-07-09 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Heavy-copper step circuit board and preparation method thereof |
| CN204649137U (en) * | 2015-03-31 | 2015-09-16 | 广州美维电子有限公司 | For the size detection fixture of pcb board |
| CN106852024A (en) * | 2017-02-15 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of outer-layer circuit preparation method of Rigid Flex |
-
2018
- 2018-11-27 CN CN201811427707.5A patent/CN109743847A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102958279A (en) * | 2011-08-23 | 2013-03-06 | 北大方正集团有限公司 | PCB (printed circuit board) etching method and work-in-process PCB |
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN103338595A (en) * | 2013-07-09 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Heavy-copper step circuit board and preparation method thereof |
| CN204649137U (en) * | 2015-03-31 | 2015-09-16 | 广州美维电子有限公司 | For the size detection fixture of pcb board |
| CN106852024A (en) * | 2017-02-15 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of outer-layer circuit preparation method of Rigid Flex |
Non-Patent Citations (2)
| Title |
|---|
| 丁明军: "《PCB制图与制版实训》", 31 March 2015 * |
| 成都地区印制电路技术情报网: "《印制电路技术》", 31 December 1984 * |
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Application publication date: 20190510 |
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