CN111726943A - Method for manufacturing PCB precise circuit diagram by adopting laser lithography and full-plate electroplating - Google Patents

Method for manufacturing PCB precise circuit diagram by adopting laser lithography and full-plate electroplating Download PDF

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Publication number
CN111726943A
CN111726943A CN202010771785.8A CN202010771785A CN111726943A CN 111726943 A CN111726943 A CN 111726943A CN 202010771785 A CN202010771785 A CN 202010771785A CN 111726943 A CN111726943 A CN 111726943A
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semi
finished product
plating
electroplating
photoetching
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张祖琼
罗肖宁
杨浩
常稳
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Henan Aibiaihe New Material Co ltd
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Henan Aibiaihe New Material Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention provides a method for manufacturing a PCB precise circuit diagram by adopting laser lithography and full-plate electroplating, which adopts a process for manufacturing the PCB diagram by replacing the traditional PCB diagram manufacturing process by adopting photosensitive film materials to manufacture the PCB diagram. The method can not only reduce the cost, but also reduce the pollution to the environment in the process of manufacturing the PCB graph, and can not only save the materials such as a film negative film, a photosensitive dry film, photosensitive ink and the like, but also avoid the wet manufacturing procedures such as developing, film stripping and the like, thereby reducing the use of various chemical agents.

Description

Method for manufacturing PCB precise circuit diagram by adopting laser lithography and full-plate electroplating
Technical Field
The invention belongs to the technical field of electronic manufacturing, and particularly relates to a method for manufacturing a PCB precise circuit diagram by adopting laser photoetching and full-plate electroplating.
Background
Printed circuit boards (PCB for short) have been developed, but the graphic fabrication process of PCB has been mainly wet process, such as tent, Sap, msp, Amsap, Ets and Coreless, wherein photosensitive ink, photosensitive dry film, film negative and various liquid medicines (applied in the lines such as developing line, etching line and stripping line) are used, which are expensive and seriously polluted.
Disclosure of Invention
The invention aims to solve the technical problems of high cost and serious pollution caused by wet manufacturing adopted by the conventional PCB pattern manufacturing, and provides a method for manufacturing a PCB precise circuit diagram by adopting laser photoetching and full-plate electroplating.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a method for manufacturing a PCB precise circuit diagram by adopting laser photoetching and full-plate electroplating comprises the following steps:
s1, preparing a PCB semi-finished product, and marking the PCB semi-finished product as a semi-finished product A.
The thickness of the copper foil on the surface of the semi-finished product A is 1-70 mu m; the semi-finished product A is required to be a semi-finished product without the working procedures of electroplating and circuit graphics, and the semi-finished product needing PTH is a semi-finished product which is subjected to the working procedures of drilling, glue removal and copper deposition; including a common multi-layer PCB core and a partially finished PCB (e.g., drilling, de-gluing, and copper deposition).
S2, if the semi-finished product A does not need to be electroplated, the step S6 is performed, and if the semi-finished product A needs to be electroplated, the step S3 is performed.
S3, if the line width of the circuit designed by the lithography data is not larger than the predetermined value, proceed to step S5, otherwise proceed to step S4.
And S4, carrying out flash plating on the semi-finished product A, and carrying out step S6 after the flash plating.
The flash plating is slight plating of PTH holes on the semi-finished product A by adopting gantry plating or VCP plating, and the plating thickness is 3-10 mu m; the purpose of flash plating is to protect the copper in the hole (because the thickness of the copper obtained by the copper deposition process on the hole wall is very thin, the copper needs to be thickened by flash plating so as to achieve the purpose of protection), and the reliability of the hole copper in the processing process is improved. The technological parameters of flash plating are determined according to the plating thickness (3-10 μm), including changing micro-etching into acid washing, current density (10ASF-30ASF), plating time (30-50 min), pumping frequency (20-60 Hz), and whether to start ultrasonic wave, etc.
And S5, electroplating the whole plate before photoetching.
The full-plate electroplating is full-plate hole filling electroplating (the hole filling electroplating is generally drilled by laser) or full-plate common electroplating which is carried out by gantry electroplating or VCP electroplating, and the electroplating thickness is 12-60 mu m.
The technological parameters of the whole plate electroplating process are determined according to the electroplating thickness (12-60 μm), wherein the technological parameters comprise that a micro-etching groove is changed into acid cleaning, the current density (10ASF-60ASF), the electroplating time (30-100 min), the pumping frequency (20-60 Hz), whether ultrasonic waves are started or not and the like. The purpose of electroplating is to plate copper with a certain thickness on the surface and in the hole of the PCB semi-finished product.
S6, if the thickness of the copper on the surface of the semi-finished product A is larger than the set value, the step S7 is performed, otherwise, the step S8 is performed.
And S7, performing surface treatment on the semi-finished product A to obtain the semi-finished product A with the copper surface roughness improved.
And performing surface treatment on the copper surface of the semi-finished product A by browning, blackening or browning to obtain the semi-finished product A with the copper surface roughness Rz of 0.5-1.5 mu m, so as to improve the roughness of the copper surface and further improve the laser absorption rate of the copper foil.
When the surface is browned, part of key process parameters of the process are the line body speed of 3-6m/min, the spraying pressure of 1-4kg/cm, the microetching amount of 1-3 μm, the content of the activating agent of 10-30ml/L, the content of MS-100 of 50-150ml/L, H2SO4Content 100-2O230-50ml/L, drying temperature of 70-100 deg.C, etc. (the values are the reference values of the browning process, and the process parameters are different when the blackening or browning process is adopted, but can be corrected properly according to the actual production conditions of each company).
S8, the CAM data of the designed circuit pattern is imported into the laser photoetching machine.
And S9, laser photoetching and patterning.
Carrying out photoetching on the semi-finished product A at least once by using a laser photoetching machine; the lightAnd the etching is to adopt laser to engrave the copper foil on the surface of the PCB semi-finished product so as to make a required circuit pattern. And the laser photoetching machine is UV laser photoetching machine or fiber laser photoetching machine or CO2Provided is a laser photoetching machine. And the photoetching times are increased as much as possible in the photoetching process so as to reduce the heat accumulation generated on the copper surface by the laser energy.
When CO is used2When the laser photoetching machine is used for photoetching, the key technological parameters include pulse width of 2-40 μm, speed of 100-2And the repetition times are 1-6 times (the process parameters are mainly determined according to the copper thickness), and the like.
When the UV laser photoetching machine or the fiber laser photoetching machine is adopted, the process parameters are different, and the correction can be properly carried out according to the actual production conditions of various companies.
S10, if the substrate is exposed at the photo-etching position, go to step S11, otherwise go to step S12.
If the substrate is exposed at the photoetching position, the substrate of the semi-finished product A may be slightly burned by laser to generate glue residue and carbon powder, and the step S11 is required to remove the residue; if a certain amount of residual copper (the residual copper thickness is controlled within the range of 0.5-2.5 μm) is remained at the lithography position without exposing the substrate, step S12 is performed.
And S11, removing the glue.
And (3) carrying out degumming and carbon powder removal on the photoetching semi-finished product A by adopting Plasma cleaning (Plasma), wherein part of key parameters of a Plasma degumming procedure comprise power of 2-10w, segment time of 1-24min, gas flow of 2-3L/min, temperature of 50-90 ℃ and the like (the numerical values are reference values, and can be properly corrected according to actual production conditions of various companies).
And S12, etching.
And the etching is to remove the residual copper and copper teeth at the line distance position after photoetching by adopting acid etching solution or alkaline etching solution, wherein the etching amount is 1-10 mu m.
Wherein, aiming at the thick copper plate before photoetching (the thickness of the surface copper exceeds 18 μm, the number is a reference value, and can be corrected properly according to the actual production condition of each company, and the thick copper plate can be manufactured by matching photoetching and etching)It is recommended that a copper thickness of 1-2 μm remain at the post-lithography line pitch location and then be removed by etching to better protect the underlying substrate. In addition, part of key parameters of the etching process are spraying pressure of 1-4kg/cm2Linear speed 1-4m/min, etching bath swinging frequency 40Hz, etching temperature 20-40 deg.C and drying temperature 70-100 deg.C (the numerical values are reference values, and can be corrected properly according to actual production conditions of various companies).
For flash plating products, the etching amount is strictly controlled according to the residual copper thickness and the copper tooth size of the line spacing position, and the copper in the flash plating hole is protected from being damaged by etching (namely, the hole breakage is avoided by adjusting the parameters), so that the etching amount and the flash plating thickness are mutually referred and compensated.
And S13, carrying out photoetching and full-plate pattern electroplating on the photoetching semi-finished product A needing electroplating.
The full-plate pattern electroplating is pattern hole filling electroplating (common drilling hole filling electroplating adopts laser drilling) or pattern common electroplating which is carried out by adopting gantry electroplating or VCP electroplating.
The technological parameters of the pattern electroplating process are determined according to the electroplating thickness (12-60 μm), including micro-etching amount of 0.25-0.45 μm, current density (10ASF-60ASF), electroplating time (30-100 min), pumping frequency (20-60 Hz), whether ultrasonic wave is started or not, etc. The purpose of electroplating is to plate copper with a certain thickness on the surface and in the hole of the PCB semi-finished product.
The semi-finished product A after photoetching and needing electroplating comprises a PCB semi-finished product (a part needing PTH holes) after photoetching and a product needing secondary electroplating, wherein the line width designed for photoetching data is larger than a set value (40 mu m is a reference value and can be properly corrected according to the actual production condition of each company), but the step can be omitted for products without electroplating (such as inner core boards of common multilayer PCBs).
The invention adopts the laser photoetching process and the full-plate electroplating to directly manufacture the PCB precise circuit pattern, and the process of introducing the laser photoetching pattern can manufacture the line width and line distance pattern with the range of 5-100 mu m. The invention can replace the traditional process of manufacturing the PCB graph by adopting the photosensitive film material to manufacture the PCB graph. The scheme of the invention can not only reduce the cost, but also reduce the pollution to the environment in the process of manufacturing the PCB graph, because the invention can not only save the use of photosensitive materials such as a film negative film, a photosensitive dry film, sightseeing printing ink and the like, and also does not need wet manufacturing procedures such as developing, film stripping and the like, thereby reducing the use of various chemical agents.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a process flow diagram of the present invention.
FIG. 2 is a laser-lithographic CAM data map of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Example 1:
a method for manufacturing PCB fine pattern circuit by adopting laser photoetching and full-plate electroplating is disclosed, as shown in figure 1, the circuit precision to be prepared is 5 μm/5 μm-40 μm/40 μm (line width/line distance), the steps are:
and S1, preparing a PCB semi-finished product.
The semi-finished product of the PCB is marked as a semi-finished product A, the thickness of the copper foil of the semi-finished product A is 1-12 mu m, and the semi-finished product is required to be not subjected to the processes of electroplating and circuit patterning, wherein the semi-finished product required to be subjected to PTH hole is required to be subjected to the processes of drilling, glue removal and copper deposition.
S2, if the semi-finished product A does not need to be electroplated, the step S4 is carried out, and if the semi-finished product A needs to be electroplated, the step S3 is carried out.
And S3, electroplating the whole plate before photoetching.
The PCB semi-finished product is subjected to full-board electroplating before photoetching so as to improve the thickness of hole copper and surface copper, avoid serious mushroom-shaped circuit appearance and improve the reliability of the circuit.
The full-plate electroplating is full-plate hole filling electroplating or full-plate common electroplating which is carried out by adopting gantry electroplating or VCP electroplating; the technological parameters of the whole plate electroplating process are determined according to the electroplating thickness (12-60 μm), wherein the technological parameters comprise that a micro-etching groove is changed into acid cleaning, the current density (10ASF-60ASF), the electroplating time (30-100 min), the pumping frequency (20-60 Hz), whether ultrasonic waves are started or not and the like. The purpose of the full-plate electroplating is to plate copper with a certain thickness on the surface and in the hole of the PCB semi-finished product.
S4, if the thickness of the single-side copper (i.e. surface copper) of the semi-finished product a to be photoetched is larger than 6 μm (the value here is a reference value, and can be corrected properly according to the actual production conditions of each company), go to step S5, otherwise go to step S6.
S5, performing surface treatment on the PCB semi-finished product to be photoetched;
the copper foil of the PCB semi-finished product to be photoetched is subjected to surface treatment by adopting a browning, blackening or browning process, so that the roughness of the copper surface is improved, and the laser absorption rate of the copper foil is further improved. Wherein some key process parameters of the browning process are line speed of 3-6m/min, spray pressure of 1-4kg/cm, microetching amount of 1-3 μm, activator content of 10-30ml/L, MS-100 content of 50-150ml/L, and H2SO4Content 100-2O230-50ml/L, drying temperature of 70-100 deg.C, etc. (the numerical value is the reference value of browning process, the technological parameters of blackening or browning process can be different, and can be corrected properly according to the actual production conditions of various companies).
S6, the CAM data of the designed circuit pattern is imported into the laser photoetching machine.
The line pattern of the CAM data of the laser lithography machine is in a negative relationship with the actual line, and the line pattern of the CAM data is shown in FIG. 2.
And S7, laser photoetching and patterning.
Using CO2And the laser photoetching machine or the optical fiber laser photoetching machine or the UV laser photoetching machine carries out photoetching on the PCB semi-finished product to be photoetched at least once. The purpose of multiple photolithography is to reduce the thermal stress effect caused by the accumulation of laser energy on the surface of the copper foil. Wherein the laser energy and the repetition times are controlled, so that the aim of photoetching to remove copper without damaging a base material can be achieved.
In addition, for the thick copper plate before photoetching (the thickness of the surface copper exceeds 18 μm, which is a reference value and can be properly corrected according to the actual production conditions of various companies), the copper thickness of 1-2 μm is remained at the line distance position after photoetching and then removed by an etching method so as to better protect the substrate below the copper surface.
When CO is used2The key parameters of the laser photoetching machine are 2-40 μm in pulse width, 1000mm/s in speed of 100-2And repetition times of 1-6 times (determined mainly on the basis of copper thickness), etc. (the value here is CO)2The reference value of the laser photoetching machine has different technological parameters when the optical fiber or UV laser photoetching machine is adopted, and can be properly corrected according to the actual production conditions of various companies).
S8, if the substrate is exposed at the photo-etching position, there is a possibility that the substrate is slightly burned by the laser to generate the glue residue and the carbon powder, then the step S9 is performed to process, if the photo-etching position retains a certain residual copper (the residual copper thickness is controlled within the range of 0.5-2.5 μm), but the substrate is not exposed, then the step S10 is performed.
And S9, removing the glue.
The cleaning is carried out by plasma cleaning and other methods, and the aim is to remove the colloid and the carbon powder by adopting a plasma cleaning mode. Wherein, part of key parameters of the Plasma degumming procedure comprise power of 2-10w, segment time of 1-24min, gas flow of 2-3L/min, temperature of 50-90 ℃, and the like (the numerical values are reference values, and can be corrected properly according to the actual production conditions of various companies).
S10, acid etch or alkaline etch.
The purpose of the etching is to remove the lithographic pitchThe rest copper and copper teeth at the position are etched by 1-10 μm. In addition, part of key parameters of the etching process are spraying pressure of 1-4kg/cm2Linear speed 1-4m/min, etching bath swinging frequency 40Hz, etching temperature 20-40 deg.C and drying temperature 70-100 deg.C (the numerical values are reference values, and can be corrected properly according to actual production conditions of various companies).
And S11, electroplating the whole board pattern after photoetching.
The product which needs to be plated for the second time is plated in a full-plate pattern, but the step can be omitted for the product which does not need to be plated (such as the inner core board of a common multilayer PCB). The full-plate pattern electroplating is pattern hole filling electroplating (common drilling hole filling electroplating adopts laser drilling) or pattern common electroplating which is carried out by adopting gantry electroplating or VCP electroplating.
The technological parameters of the pattern electroplating process are determined according to the electroplating thickness (12-60 μm), including micro-etching amount of 0.25-0.45 μm, current density (10ASF-60ASF), electroplating time (30-100 min), pumping frequency (20-60 Hz), whether ultrasonic wave is started or not, etc. The purpose of electroplating is to plate copper with a certain thickness on the surface and in the hole of the PCB semi-finished product.
The purpose of manufacturing the PCB pattern by laser lithography and full-board electroplating is already finished by completing the steps, the traditional procedures of solder mask technology, surface treatment, board routing technology and the like are carried out on the product with the manufactured PCB pattern, and the product is specifically selected according to different product designs, so that the manufacture of the PCB board can be finished.
Example 2:
a method for manufacturing a single-panel PCB circuit diagram by adopting laser photoetching and full-plate electroplating is disclosed, as shown in figure 1, the circuit to be prepared has the precision of 5 mu m/5 mu m-100 mu m/100 mu m (line width/line distance), and the steps are as follows:
s1, preparing the single-panel PCB semi-finished product.
The thickness of the copper foil of the single-panel PCB semi-finished product is 1-70 mu m, the single-panel PCB can be an aluminum substrate, electroplating is not needed, and film coating protection is needed to be carried out on the surface, which is not provided with a pattern, of the single-panel PCB.
S2, if the thickness of the single-side copper (surface copper) of the single-panel PCB semi-finished product to be photoetched is larger than 6 μm (the value is a reference value, and can be corrected properly according to the actual production condition of each company), the step S3 is performed, otherwise, the step S4 is performed.
And S3, performing surface treatment on the single-panel PCB semi-finished product to be photoetched.
The copper foil of the single-sided PCB semi-finished product to be photoetched is subjected to surface treatment by adopting a browning, blackening or browning process, so that the roughness of the copper surface is improved, and the laser absorption rate of the copper foil is further improved.
Wherein some key process parameters of the browning process are line speed of 3-6m/min, spray pressure of 1-4kg/cm, microetching amount of 1-3 μm, activator content of 10-30ml/L, MS-100 content of 50-150ml/L, and H2SO4Content 100-2O230-50ml/L, drying temperature of 70-100 deg.C, etc. (the numerical value is the reference value of browning process, the technological parameters of blackening or browning process can be different, and can be corrected properly according to the actual production conditions of various companies).
S4, the CAM data of the designed circuit pattern is imported into the laser photoetching machine.
The line pattern of the CAM data of the laser lithography machine is in a negative relationship with the actual line, and the line pattern of the CAM data is shown in FIG. 2.
And S5, laser photoetching and patterning.
Using CO2And the laser photoetching machine or the optical fiber laser photoetching machine or the UV laser photoetching machine carries out photoetching on the single-panel PCB semi-finished product to be subjected to photoetching at least once. The purpose of multiple photolithography is to reduce the thermal stress effect caused by the accumulation of laser energy on the surface of the copper foil. Wherein the laser energy and the repetition times are controlled, so that the aim of photoetching to remove copper without damaging a base material can be achieved.
In addition, for the thick copper plate before photoetching (the thickness of the surface copper exceeds 18 μm, which is a reference value and can be properly corrected according to the actual production conditions of various companies), the copper thickness of 1-2 μm is remained at the line distance position after photoetching and then removed by an etching method so as to better protect the substrate below the copper surface.
When CO is used2Laser lightSome key technological parameters of photoetching of the etching machine include pulse width of 2-40 microns, speed of 100-1000mm/s and energy density of 2-100mj/cm2And repetition times of 1-6 times (determined mainly on the basis of copper thickness), etc. (the value here is CO)2The reference value of the laser photoetching machine has different technological parameters when the optical fiber or UV laser photoetching machine is adopted, and can be properly corrected according to the actual production conditions of various companies).
S6, if the substrate is exposed at the photo-etching position, there is a possibility that the substrate is slightly burned by the laser to generate the glue residue and the carbon powder, then the step S7 is performed to process, if the photo-etching position retains a certain residual copper (the residual copper thickness is controlled within the range of 0.5-2.5 μm), but the substrate is not exposed, then the step S8 is performed.
And S7, removing the glue.
The cleaning is carried out by plasma cleaning and other methods, and the aim is to remove the colloid and the carbon powder by adopting a plasma cleaning mode. Wherein, part of key parameters of the Plasma degumming procedure comprise power of 2-10w, segment time of 1-24min, gas flow of 2-3L/min, temperature of 50-90 ℃, and the like (the numerical values are reference values, and can be corrected properly according to the actual production conditions of various companies).
S8, acid etch or alkaline etch.
The purpose of etching is to remove the residual copper and copper teeth at the line distance position after photoetching, and the etching amount ranges from 1 to 10 mu m. Part of key parameters of the etching process are spraying pressure of 1-4kg/cm2Linear speed 1-4m/min, etching bath swinging frequency 40Hz, etching temperature 20-40 deg.C and drying temperature 70-100 deg.C (the numerical values are reference values, and can be corrected properly according to actual production conditions of various companies).
And S9, performing photoetching and full-plate electroplating.
The product which needs to be electroplated is subjected to full-plate electroplating, for example, the product with the copper thickness of the surface added is needed, but the step can be omitted for the product which does not need to be electroplated (for example, the inner core plate of the common multilayer PCB). Wherein the electroplating can adopt gantry electroplating or VCP electroplating. The technological parameters of the whole plate pattern electroplating process are determined according to the electroplating thickness (12-60 μm), wherein the technological parameters comprise micro-etching amount of 0.25-0.45 μm, current density (10ASF-60ASF), electroplating time (30-100 min), pumping frequency (20-60 Hz), whether ultrasonic wave is started or not and the like. The purpose of the plating is to increase the copper thickness of the wiring plane.
The purpose of manufacturing the PCB pattern by laser lithography and full-board electroplating is already finished by completing the steps, the traditional procedures of solder mask technology, surface treatment, board routing technology and the like are carried out on the product with the manufactured PCB pattern, and the product is specifically selected according to different product designs, so that the manufacture of the PCB board can be finished.
Example 3:
a precise circuit pattern for manufacturing a Flexible Printed Circuit (FPC) by adopting laser photoetching and electroplating processes is shown in figure 1, a copper-filled electroplated high-end circuit board can be manufactured, and the circuit precision can be prepared to be 5 mu m/5 mu m-100 mu m/100 mu m (line width/line distance), and the steps are as follows:
and S1, preparing an FPC semi-finished product, and marking as a semi-finished product A.
The thickness of the copper foil of the FPC semi-finished product is 1-70 mu m, and the semi-finished product is required to be not subjected to electroplating and circuit pattern processes, wherein the semi-finished product required to be subjected to PTH hole is required to be subjected to drilling (the product filled with copper and electroplated needs to be subjected to laser drilling), glue removal and black hole processing.
S2, if the semi-finished product A does not need to be electroplated, the step S6 is carried out, and if the semi-finished product A needs to be electroplated, the step S3 is carried out;
s3, if the line width designed by the photoetching data is not more than 40 μm (the value is the reference value, and can be corrected properly according to the actual production condition of each company), then proceed to step S5, otherwise proceed to step S4;
and S4, carrying out flash plating, and then carrying out S6.
If the line width of the lithography data design is greater than 40 μm (the value is a reference value and can be corrected appropriately according to the actual production conditions of each company), the flash plating is performed on the semi-finished product a, and then the step S6 is performed.
Wherein the flash plating aims at improving the reliability of the hole copper in the processing process, and the flash plating thickness is 3-10 mu m; the technological parameters of flash plating are determined according to the plating thickness (3-10 μm), including changing micro-etching into acid washing, current density (10ASF-30ASF), plating time (30-50 min), pumping frequency (20-60 Hz), and whether to start ultrasonic wave, etc.
And S5, electroplating the whole plate before photoetching.
The FPC semi-finished product is subjected to full-board electroplating before photoetching so as to improve the thickness of hole copper and surface copper, avoid serious mushroom-shaped circuit appearance and improve the reliability of the circuit.
The full-plate electroplating is full-plate hole filling electroplating or full-plate common electroplating which is carried out by adopting gantry electroplating or VCP electroplating; the technological parameters of the whole plate electroplating process are determined according to the electroplating thickness (12-60 μm), wherein the technological parameters comprise that a micro-etching groove is changed into acid cleaning, the current density (10ASF-60ASF), the electroplating time (30-100 min), the pumping frequency (20-60 Hz), whether ultrasonic waves are started or not and the like. The purpose of the full-plate electroplating is to plate copper with a certain thickness on the surface and in the hole of the FPC semi-finished product.
S6, if the thickness of the copper on the single surface (i.e. the surface copper) of the FPC semi-finished product to be photoetched is larger than 6 μm (the value here is a reference value, and can be corrected properly according to the actual production conditions of each company), go to step S7, otherwise go to step S8.
And S7, performing surface treatment on the FPC semi-finished product to be photoetched.
The copper foil of the FPC semi-finished product to be photoetched is subjected to surface treatment by adopting a browning, blackening or browning process, so that the roughness of the copper surface is improved, and the laser absorption rate of the copper foil is further improved.
Wherein some key process parameters of the browning process are line speed of 3-6m/min, spray pressure of 1-4kg/cm, microetching amount of 1-3 μm, activator content of 10-30ml/L, MS-100 content of 50-150ml/L, and H2SO4Content 100-2O230-50ml/L, drying temperature of 70-100 deg.C, etc. (the numerical value is the reference value of browning process, the technological parameters of blackening or browning process can be different, and can be corrected properly according to the actual production conditions of various companies).
S8, the CAM data of the designed circuit pattern is imported into the laser photoetching machine.
The line pattern of the CAM data of the laser lithography machine is in a negative relationship with the actual line, and the line pattern of the CAM data is shown in FIG. 2.
And S9, laser photoetching and patterning.
Using CO2And the laser photoetching machine or the optical fiber laser photoetching machine or the UV laser photoetching machine carries out photoetching for at least one time on the FPC semi-finished product to be subjected to photoetching. The purpose of multiple photolithography is to reduce the thermal stress effect caused by the accumulation of laser energy on the surface of the copper foil. Wherein the laser energy and the repetition times are controlled, so that the aim of photoetching to remove copper without damaging a base material can be achieved.
For thick copper plate before photoetching (the thickness of surface copper exceeds 18 μm, which is a reference value and can be properly corrected according to the actual production condition of each company), it is recommended that the copper thickness of 1-2 μm is remained at the line distance position after photoetching and then removed by etching so as to better protect the substrate under the copper surface.
When CO is used2The key parameters of the laser photoetching machine are 2-40 μm in pulse width, 1000mm/s in speed of 100-2And repetition times of 1-6 times (determined mainly on the basis of copper thickness), etc. (the value here is CO)2The reference value of the laser photoetching machine has different technological parameters when the optical fiber or UV laser photoetching machine is adopted, and can be properly corrected according to the actual production conditions of various companies).
S10, if the substrate is exposed at the photo-etching position, there is a possibility that the substrate is slightly burned by the laser to generate the glue residue and the carbon powder, then the step S11 is performed to process, if the photo-etching position retains a certain residual copper (the residual copper thickness is controlled within the range of 0.5-2.5 μm), but the substrate is not exposed, then the step S12 is performed.
And S11, removing the glue.
The cleaning is carried out by plasma cleaning and other methods, and the aim is to remove the colloid and the carbon powder by adopting a plasma cleaning mode.
Wherein, part of key parameters of the Plasma degumming procedure comprise power of 2-10w, segment time of 1-24min, gas flow of 2-3L/min, temperature of 50-90 ℃, and the like (the numerical values are reference values, and can be corrected properly according to the actual production conditions of various companies).
S12, acid etch or alkaline etch.
The purpose of etching is to remove the residual copper and copper teeth at the line distance position after photoetching, and the etching amount ranges from 1 to 10 mu m. For flash plating products, the etching amount in the etching process needs to be strictly controlled according to the residual copper thickness and the copper tooth size at the wire distance position, and the copper flash plated in the hole needs to be protected from being damaged by etching (namely, the hole breakage is avoided by adjusting the parameters), so that the etching amount and the flash plating thickness need to be mutually referred and compensated.
In addition, part of key parameters of the etching process are spraying pressure of 1-4kg/cm2Linear speed 1-4m/min, etching bath swinging frequency 40Hz, etching temperature 20-40 deg.C and drying temperature 70-100 deg.C (the numerical values are reference values, and can be corrected properly according to actual production conditions of various companies).
And S13, electroplating the whole board pattern after photoetching.
The product which needs to be electroplated is subjected to full-plate pattern electroplating, wherein the full-plate pattern electroplating comprises a photoetching FPC (the part needing to be plated with PTH) semi-finished product (the part needing to be plated with PTH) and a product needing to be plated with secondary plating, wherein the line width designed by photoetching data is more than 40 mu m (the numerical value is a reference value and can be properly corrected according to the actual production condition of each company), but the step can be omitted for the product which does not need to be plated (such as an inner core plate of a common multilayer FPC).
The pattern electroplating is pattern hole filling electroplating (hole filling electroplating is generally drilled by laser) or pattern common electroplating which is carried out by gantry electroplating or VCP electroplating. The technological parameters of the pattern electroplating process are determined according to the electroplating thickness (12-60 μm), including micro-etching amount of 0.25-0.45 μm, current density (10ASF-60ASF), electroplating time (30-100 min), pumping frequency (20-60 Hz), whether ultrasonic wave is started or not, etc. The purpose of electroplating is to plate copper with a certain thickness on the surface and in the hole of the FPC semi-finished product.
After the steps are completed, the purpose of manufacturing the FPC pattern by laser lithography and full-board electroplating is already completed, the traditional processes of film pasting, surface treatment, stamping and the like are carried out on the product with the manufactured FPC pattern, and the selection is specifically carried out according to different product designs, so that the manufacture of the FPC board can be completed.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention by equivalent replacement or change according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.

Claims (10)

1. A method for manufacturing a PCB precise circuit diagram by adopting laser photoetching and full-plate electroplating is characterized by comprising the following steps:
s1, preparing a PCB semi-finished product, wherein the PCB semi-finished product is marked as a semi-finished product A;
s2, if the semi-finished product A does not need to be electroplated, the step S6 is carried out, and if the semi-finished product A needs to be electroplated, the step S3 is carried out;
s3, if the line width of the circuit designed by the photoetching data is not larger than the set value, go to step S5, otherwise go to step S4;
s4, carrying out flash plating on the semi-finished product A, and then carrying out S6;
s5, electroplating the whole board before photoetching;
s6, if the thickness of the surface copper of the semi-finished product A is larger than the set value, the step S7 is carried out, otherwise, the step S8 is carried out;
s7, performing surface treatment on the semi-finished product A to obtain the semi-finished product A with the copper surface roughness improved;
s8, importing the CAM data of the designed circuit pattern into a laser photoetching machine;
s9, laser photoetching patterns;
carrying out photoetching on the semi-finished product A at least once by using a laser photoetching machine;
s10, if the substrate is exposed at the photoetching position, performing step S11, otherwise, performing step S12;
s11, removing glue;
s12, etching;
and S13, carrying out photoetching and full-plate pattern electroplating on the photoetching semi-finished product A needing electroplating.
2. The method for fabricating a precise layout of a PCB according to claim 1, wherein the surface copper foil of the semi-finished product A has a thickness of 1-70 μm in step S1.
3. The method of claim 2, wherein the semi-finished product A is a semi-finished product without plating and circuit patterning process, and the semi-finished product with PTH holes is a semi-finished product with drilling, glue removing and copper depositing process.
4. The method for fabricating fine circuit pattern of PCB according to claim 1 wherein said flash plating is a light plating of PTH hole on semi-finished product A by gantry plating or VCP plating with plating thickness of 3-10 μm at step S4.
5. The method for fabricating a precise layout of a PCB according to claim 1, wherein the full-plate plating is full-plate via filling plating or full-plate general plating using gantry plating or VCP plating, and the plating thickness is 12-60 μm in step S5.
6. The method for fabricating a precise layout of a PCB according to claim 1, wherein the semi-finished product A is surface-treated by browning, blackening or browning to obtain a semi-finished product A with a roughness Rz of copper surface between 0.5 μm and 1.5 μm in step S7.
7. The method for fabricating PCB fine layout using laser lithography and full-plate electroplating as claimed in claim 1, wherein in step S9, the laser lithography machine is UV laser lithography machine or fiber laser lithography machine or CO2Provided is a laser photoetching machine.
8. The method for fabricating a precise layout of a PCB according to claim 1, wherein the photoresist of the semi-finished product A after the photolithography is removed by plasma cleaning in step S11.
9. The method for fabricating a precise layout of a PCB by using laser lithography and full-plate electroplating as claimed in claim 1, wherein in step S12, the etching is to remove the remaining copper and copper teeth at the line distance position after the lithography by using acid etching solution or alkaline etching solution, and the etching amount is 1-10 μm.
10. The method for fabricating a precise layout of a PCB according to claim 1, wherein the full-plate pattern plating is a pattern-filling hole plating or a pattern-general plating using a gantry plating or VCP plating, and the plating thickness is 12-60 μm in step S13.
CN202010771785.8A 2020-08-04 2020-08-04 Method for manufacturing PCB precise circuit diagram by adopting laser lithography and full-plate electroplating Pending CN111726943A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115135043A (en) * 2022-07-18 2022-09-30 东莞市国盈电子有限公司 Sensor circuit board and manufacturing process thereof

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Publication number Priority date Publication date Assignee Title
US20170265300A1 (en) * 2016-03-08 2017-09-14 Shunsin Technology (Zhong Shan) Limited Double-sided printed circuit board and method for manufacturing same
CN110213895A (en) * 2019-06-10 2019-09-06 深圳市鼎盛电路技术有限公司 A kind of PCB circuit manufacturing method and PCB
CN110572945A (en) * 2019-08-23 2019-12-13 惠州中京电子科技有限公司 Line laser etching method applied to PCB circuit manufacturing process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170265300A1 (en) * 2016-03-08 2017-09-14 Shunsin Technology (Zhong Shan) Limited Double-sided printed circuit board and method for manufacturing same
CN110213895A (en) * 2019-06-10 2019-09-06 深圳市鼎盛电路技术有限公司 A kind of PCB circuit manufacturing method and PCB
CN110572945A (en) * 2019-08-23 2019-12-13 惠州中京电子科技有限公司 Line laser etching method applied to PCB circuit manufacturing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115135043A (en) * 2022-07-18 2022-09-30 东莞市国盈电子有限公司 Sensor circuit board and manufacturing process thereof
CN115135043B (en) * 2022-07-18 2023-03-07 东莞市国盈电子有限公司 Sensor circuit board and manufacturing process thereof

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