CN108617104B - Method for manufacturing printed circuit board with thickened copper local pattern - Google Patents
Method for manufacturing printed circuit board with thickened copper local pattern Download PDFInfo
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- CN108617104B CN108617104B CN201810410460.XA CN201810410460A CN108617104B CN 108617104 B CN108617104 B CN 108617104B CN 201810410460 A CN201810410460 A CN 201810410460A CN 108617104 B CN108617104 B CN 108617104B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a method for manufacturing a local pattern copper thickness of a printed circuit board, which comprises the following steps: a material feeding step; drilling and counter boring; a first board electric step; a first dry film pasting step; a first exposure and first development step; a local electroplating step; a first film removing step; a second secondary plate electric step; spraying and printing etching-resistant ink; a second dry film pasting step; a second exposure and a second development step; etching; the second film removing step avoids the situation that step copper is etched due to incompact dry film pressing caused by the step height during local thickening, so that the substrate has a local copper thickness thickening area with thicker thickness; in addition, the printed circuit board of the embodiment of the application can be obtained only by local thickening once, the local thick copper manufacturing process is shortened, and the production efficiency is improved.
Description
Technical Field
The invention relates to a manufacturing method for thickening the copper thickness of a local graph of a printed circuit board.
Background
With the development of electronic products, the design and application of printed circuit boards are becoming more specialized, for example, some printed circuit boards require a thick copper layer (generally greater than 70 μm) in the pattern area because a large current needs to be passed locally.
The traditional method for manufacturing the printed circuit board with the local thick copper adopts the procedures of dry film, exposure, development and electroplating of the local thick copper area, for example, the method for manufacturing the PCB with the local thick copper, disclosed in the Chinese patent application 201510811568.6, comprises the steps of firstly manufacturing a whole board pattern, then pasting the dry film, exposing, developing and electroplating the local thick copper area; according to the requirement of thick copper, the process is repeated ", although the method can realize the local thick copper manufacture of the printed circuit board, the method has some defects: if the local thickened copper is too thick, a step is formed with an area which does not need to be thickened, the step is higher and higher along with the increase of the repeated electroplating times, a dry film cannot be attached to the step, and a copper layer at the step can be etched during etching, so that the method cannot manufacture the ultra-thick copper; in addition, due to the exposure precision, the upper side and the lower side of the step can be deviated along with the increase of the exposure times, so that the region which does not need to be thickened with copper thickness is thickened.
Disclosure of Invention
The invention aims to provide a manufacturing method for local pattern copper thickness thickening of a printed circuit board, which aims to solve the technical problem that the non-tight part is etched because a dry film is difficult to be tightly attached to a step position formed at the edge of a copper thickness thickening area in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: provides a manufacturing method for thickening the copper thickness of a local graph of a printed circuit board, which comprises the following steps,
providing a substrate;
processing a hole to be a PTH in the substrate;
forming first copper layers on both sides of the substrate and on walls of the holes;
coating a first dry film on the surfaces of the first copper layers on the two sides of the substrate;
sequentially carrying out first exposure and first development on the first dry film so as to form a preset local copper thickness thickening pattern on the surface of the first copper layer;
forming an electroplated copper layer with a preset thickness on the preset local copper thickness thickening pattern on the surface of the first copper layer; the surface of the first copper layer is provided with a first subregion surrounding the electroplated copper layer, and the edge of the surface of the electroplated copper layer is provided with a second subregion;
removing the first dry film;
forming second copper layers on the surfaces of the first copper layers on the two sides of the substrate, the surface of the electroplated copper layer and the surface of the first copper layer on the wall of the hole;
coating an etching-resistant ink layer in the area corresponding to the first subregion and the second subregion on the surface of the second copper layer;
coating a second dry film on the surfaces of the second copper layers on the two sides of the substrate;
sequentially carrying out second exposure and second development on the second dry film so as to form a preset pattern on the surface of the second copper layer;
sequentially removing the second copper layer and the first copper layer along the predetermined pattern to obtain a circuit pattern;
and removing the second dry film.
The invention has the beneficial effects that: compared with the prior art, the method realizes the manufacture of thickening the copper thickness of the local graph, and avoids the situation that the copper at the step position is etched due to incompact dry film pressing caused by the step position height during local thickening, so that the substrate has a local copper thickness thickening area with thicker thickness; in addition, the printed circuit board of the embodiment of the application can be obtained only by local thickening once, the local thick copper manufacturing process is shortened, and the production efficiency is improved.
Drawings
FIG. 1 is a flow chart of a method for forming a local pattern of copper thickness in a printed circuit board according to an embodiment of the present invention;
FIG. 2a is a schematic cross-sectional view of a circuit board during a feeding step of a manufacturing method according to an embodiment of the invention;
FIG. 2b is a schematic cross-sectional view of the circuit board during the drilling and countersinking step of the method of making an embodiment of the present invention;
FIG. 2c is a schematic cross-sectional view of the circuit board in the first sub-board electrical step of the method of fabricating an embodiment of the present invention;
FIG. 2d is a schematic cross-sectional view of the circuit board during the first dry film pasting step of the manufacturing method according to the embodiment of the invention;
FIG. 2e is a schematic cross-sectional view of the circuit board during the first exposure and development step of the fabrication method of the embodiment of the present invention;
FIG. 2f is a schematic cross-sectional view of the circuit board during the copper layer electroplating step of the method of the present invention;
FIG. 2g is a schematic cross-sectional view of the circuit board in the first step of film stripping of the manufacturing method according to the embodiment of the invention;
FIG. 2h is a schematic cross-sectional view of the circuit board in the second sub-board electrical step of the method of fabricating an embodiment of the present invention;
FIG. 2i is a schematic cross-sectional view of the circuit board during the step of printing the etching-resistant ink according to the manufacturing method of the embodiment of the invention;
fig. 2j is a schematic cross-sectional view of the circuit board in the second dry film pasting step of the manufacturing method according to the embodiment of the invention;
FIG. 2k is a schematic cross-sectional view of the circuit board during the second exposure and second development steps of the method of fabrication of an embodiment of the present invention;
fig. 2l is a schematic cross-sectional view of the circuit board in the etching step and the second film stripping step of the manufacturing method according to the embodiment of the invention.
Description of the main elements
1: substrate 1 a: hole(s)
1b predetermined pattern 1c Circuit Pattern
2: first copper layer 2 a: first sub-region
3 the first dry film 3a presets a local copper thickness thickening figure
4: copper electroplating layer 4 a: second sub-area
5: second copper layer
6: etching-resistant ink layer
7: second dry film
S1: feeding step S2: drilling and counter-boring steps
S3: first sub-board electrical step S4: the first dry film pasting step
S5: first exposure and development step S6: local electroplating step
S7: a first film removing step S8: second secondary plate electrical step
S9: step S10 of printing etching resist ink: the second dry film pasting step
S11: second exposure and development step S12: etching step
S13: the second film removing step
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
In order to make the technical solutions of the present invention better understood by those skilled in the art, the following detailed description of the implementations of the present invention is provided with reference to the accompanying drawings.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one.
Fig. 1 shows a preferred embodiment of the present invention.
The method for manufacturing the local pattern copper thickness of the printed circuit board provided by the embodiment comprises the following steps: s1, providing a feeding step of the substrate 1; s2, a step of drilling and countersinking a hole 1a to be a PTH in the substrate 1; s3, a first sub-board electrical step of forming a first copper layer 2 on both sides of the substrate 1 and on the hole walls of the holes 1 a; s4, coating a first dry film 3 on the surfaces of the first copper layers 2 on the two sides of the substrate 1; s5, sequentially performing a first exposure and a first development on the first dry film 3 to form a pattern 3a with a predetermined local copper thickness on the surface of the first copper layer 2; s6, forming a local electroplating step of an electroplated copper layer 4 with a preset thickness on the preset local copper thickness thickening pattern 3a on the surface of the first copper layer 2; the surface of the first copper layer 2 is provided with a first subregion 2a which is surrounded outside the electroplated copper layer 4, and the surface edge of the electroplated copper layer 4 is provided with a second subregion 4 a; s7, a first film stripping step for removing the first dry film 3; s8, a second sub-board electrical step of forming a second copper layer 5 on the surface of the first copper layer 2 on both sides of the substrate 1, on the surface of the copper electroplating layer 4, and on the surface of the first copper layer 2 of the hole wall of the hole 1 a; s9, coating the etching-resistant ink layer 6 in the area corresponding to the first sub-area 2a and the second sub-area 4a on the surface of the second copper layer 5; s10, coating a second dry film 7 on the surfaces of the second copper layers 5 on the two sides of the substrate 1; s11, a second exposure and a second development step of sequentially performing a second exposure and a second development on the second dry film 7 to form a predetermined pattern 1b on the surface of the second copper layer 5; s12, an etching step for removing the second copper layer 5 and the first copper layer 2 along the predetermined pattern 1b to obtain a circuit pattern 1 c; and S13, removing the second dry film 7.
The manufacturing method comprises a first board electrical step, a first dry film pasting step, a first exposure and development step, a copper layer electroplating step, a first film removing step, a second board electrical step, a second dry film pasting step, a second exposure and second development step, an etching step and a second film removing step, so that the copper thickness of the local graph is thickened, the condition that the copper of the step position is etched due to incompact dry film pressing caused by the step position height during local thickening is avoided, and the substrate 1 has a local copper thickness thickening area with thicker thickness; in addition, the printed circuit board of the embodiment of the application can be obtained only by local thickening once, the local thick copper manufacturing process is shortened, and the production efficiency is improved.
The method for forming the copper thickness in the local pattern of the printed circuit board according to the present invention will be described in detail with reference to fig. 2a to 2 l.
Referring to fig. 2a, in step S1, a substrate 1 is provided, and the substrate 1 of the pcb is a single-layer, double-layer or multi-layer board, in this embodiment, a predetermined local copper thickness thickening pattern 3a and a step area pattern are formed by a circuit board software (such as genetics 2000 software) before step S1.
Referring to fig. 2b, in step S2, a Hole 1a to be a PTH (plated Through Hole) is processed in the substrate 1, and the process includes:
drilling, namely, machining a functional hole 1a on the substrate 1 by using drilling equipment, wherein the machined functional hole 1a penetrates through two surfaces (a surface and an opposite surface) of the substrate 1;
the electroless copper plating is a process of chemically depositing or plating a conductive copper metal layer on the hole wall of the functional hole 1a of the motherboard substrate 1 by the principle of oxidation-reduction to impart conductivity to the hole wall and form a PTH.
Referring to fig. 2c, in step S3, first copper layers 2 are formed on both sides of the substrate 1 and on the hole walls of the hole 1a, and in the present embodiment, copper plating is performed twice on both sides of the substrate 1 and on the hole walls of the hole 1a to be the PTH by electrodeposition to a prescribed thickness to form the first copper layers 2, the thickness of the first copper layers 2 being 4 to 8 μm for subsequent electroplating thickening.
Referring to fig. 2d, in step S4, the first dry film 3 is coated on the surfaces of the first copper layers 2 on both sides of the substrate 1, that is, the first dry film 3 is coated on the entire surfaces of the first copper layers 2 except the surfaces of the first copper layers 2 formed on the upper hole walls, and in this embodiment, the dry films are applied to both sides of the substrate 1 by pressure bonding using a laminator under a predetermined pressure so as to be closely attached to the surfaces of the first copper layers 2 of the substrate 1. It is worth mentioning that a gap is left between the edge of the first dry film 3 and the edge of the substrate 1, the width of the gap is 8 mm-12 mm, preferably 10mm, that is, a non-film-sticking area is reserved on the edge of the two side surfaces of the substrate 1, and the non-film-sticking area is used as a clamping plate position in local electroplating.
Referring to fig. 2e, in step S5, the first dry film 3 is sequentially exposed and developed for a first time to form a pattern 3a with a predetermined local copper thickness on the surface of the first copper layer 2, the process includes:
a first exposure in which the substrate 1 coated with the first dry film 3 is exposed to ultraviolet rays (UV light) to expose and harden film portions of regions where thick copper plating is not required;
and (3) first developing, namely, immersing the exposed substrate 1 into a developing solution, and removing the uncured film part by using the developing solution, so as to obtain an etching area (namely the preset local copper thickness thickening pattern 3a) in which the first dry film 3 is removed and a non-etching area in which the first dry film 3 is not removed on the surface of the first copper layer 2.
Referring to fig. 2f, in step S6, a copper electroplating layer 4 with a predetermined thickness is formed on the predetermined local copper thickness increasing pattern 3a on the surface of the first copper layer 2, in this embodiment, the predetermined local copper thickness increasing pattern 3a is copper-plated with a predetermined thickness by an electrodeposition method to form a locally increased copper electroplating layer 4, the thickness of the copper electroplating layer 4 is greater than that of the first copper layer 2, and the thickness of the copper electroplating layer 4 is 35 μm to 105 μm. It is worth mentioning that the surface of the first copper layer 2 has a first sub-area 2a surrounding the electroplated copper layer 4, and the edge of the surface of the electroplated copper layer 4 has a second sub-area 4 a; the first sub-region 2a and the second sub-region 4a are connected in projection on the substrate 1 in the thickness direction of the substrate 1, and constitute the above-described step region pattern.
In particular, the width of the surface of the electroplated copper layer 4 in the first sub-area 2a is 1mm to 3mm, preferably 2 mm; the width of the second partial region 4a on the surface of the first copper layer 2 is 1mm to 3mm, preferably 2 mm.
Referring to fig. 2g, in step S7, the first dry film 3 is removed, and the first dry film 3 on the substrate 1 is removed by using a film removing solution, which is a conventional sodium hydroxide solution at a normal film removing speed of 3-5 m/min.
Referring to fig. 2h, in step S8, second copper layers 5 are formed on the surfaces of the first copper layers 2 on both sides of the substrate 1, the surface of the copper plating layer 4 and the surface of the first copper layer 2 on the wall of the hole 1 a. in this embodiment, in order to reduce the step gradient and facilitate the second dry film application, copper plating is again performed on the surface of the substrate 1 after the above-mentioned film removal by electrodeposition on both sides of the substrate 1 (on the surface of the first copper layer 2 and on the surface of the copper plating layer 4) and on the surface of the wall of the hole by a prescribed thickness to form the second copper layers 5 having a thickness greater than that of the first copper layers 2, the thickness of the second copper layers 5 being 10 to 20 μm.
Referring to fig. 2i, in step S9, an etching-resistant ink layer 6 is coated on the surface of the second copper layer 5 in the areas corresponding to the first sub-area 2a and the second sub-area 4a, in this embodiment, the etching-resistant ink layer 6 is formed by inkjet printing on the surface of the second copper layer 5 at the positions corresponding to the first sub-area 2a and the second sub-area 4a (i.e., the step area pattern) in the thickness direction, and the etching-resistant ink layer 6 is a UV curable inkjet ink, such as a UV cured acrylic hybrid ink, and can be resistant to acid etching. It should be noted that the etching-resistant ink layer 6 covers the area corresponding to the first sub-area 2a and the area corresponding to the second sub-area 4a on the surface of the second copper layer 5, and the area corresponding to the sidewall of the second copper layer 5 and the electroplated copper layer 4, so that the step edge formed by the electroplated copper layer 4 is wrapped in the etching-resistant ink layer 6, and thus, the etching-resistant ink layer 6 is formed by spray printing, thereby preventing the copper layer at the step from being etched during etching due to step height during the second dry film pasting and incompact second dry film 7, and protecting the copper layer at the line step.
Referring to fig. 2j, in step 10, a second dry film 7 is coated on the surfaces of the second copper layers 5 on both sides of the substrate 1, the second dry film 7 covers the etching-resistant ink layer 6 and substantially covers the second copper layers 5, and in this embodiment, a film laminator is used to apply the dry film to both sides of the substrate 1 by pressing according to a predetermined pressure so as to be closely attached to the surfaces of the second copper layers 5 and the etching-resistant ink layers 6 of the substrate 1. It is worth mentioning that a space is left between the edge of the second dry film 7 and the edge of the substrate 1, the width of the space is 8 mm-12 mm, preferably 10mm, that is, a non-film-sticking area is reserved on the edges of the two side surfaces of the substrate 1, and the non-film-sticking area is used as a clamping plate position in local electroplating
Referring to fig. 2k, in step 11, the second dry film 7 is sequentially exposed and developed for a second time to form a predetermined pattern 1b on the surface of the second copper layer 5, which comprises:
a second exposure step of exposing the substrate 1 coated with the second dry film 7 to ultraviolet rays (UV light) to expose and harden film portions in areas where thick copper plating is not required;
and (3) second developing, namely, immersing the exposed substrate 1 into a developing solution, and removing the uncured film part by using the developing solution, thereby obtaining an etching area (namely the predetermined pattern 1b) where the second dry film 7 is removed and a non-etching area where the second dry film 7 is not removed on the surface of the second copper layer 5.
Referring to fig. 2l, in step 12, the second copper layer 5 and the first copper layer 2 are sequentially removed along the predetermined pattern 1b by chemical etching using an etching solution to obtain a circuit pattern 1c, and the non-etched region is protected from etching by the second dry film 7 and the etching-resistant ink layer 6.
Referring to fig. 2l, in step S13, the second dry film 7 is removed, and the second dry film 7 on the substrate 1 is removed by using a film stripping solution, in this embodiment, the film stripping solution is an organic film stripping solution, the main component of which is ethanolamine, and the film stripping speed is 1/4-1/3 of the film stripping speed of the common dry film.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A method for manufacturing a local pattern copper thickness of a printed circuit board is characterized by comprising the following steps,
providing a substrate;
processing a hole to be a PTH in the substrate;
forming first copper layers on both sides of the substrate and on walls of the holes;
coating a first dry film on the surfaces of the first copper layers on the two sides of the substrate, wherein a gap is reserved between the edge of the first dry film and the edge of the substrate;
sequentially carrying out first exposure and first development on the first dry film so as to form a preset local copper thickness thickening pattern on the surface of the first copper layer;
forming an electroplated copper layer with a preset thickness on the preset local copper thickness thickening pattern on the surface of the first copper layer, wherein the thickness of the electroplated copper layer is 35-105 micrometers; the surface of the first copper layer is provided with a first subregion surrounding the electroplated copper layer, and the edge of the surface of the electroplated copper layer is provided with a second subregion;
removing the first dry film;
forming second copper layers on the surfaces of the first copper layers on the two sides of the substrate, the surface of the electroplated copper layer and the surface of the first copper layer on the wall of the hole, wherein the thickness of the second copper layers is 10-20 microns, and the thickness of the second copper layers is greater than that of the first copper layers;
printing an etching-resistant ink layer in the area corresponding to the first subregion and the second subregion on the surface of the second copper layer through an ink-jet printer;
coating a second dry film on the surfaces of the second copper layers on the two sides of the substrate;
sequentially carrying out second exposure and second development on the second dry film so as to form a preset pattern on the surface of the second copper layer;
sequentially removing the second copper layer and the first copper layer along the predetermined pattern to obtain a circuit pattern;
and removing the second dry film by adopting an organic film stripping liquid.
2. The manufacturing method according to claim 1, wherein the width of the first sub-region on the surface of the electroplated copper layer is 1mm to 3 mm; the width of the second sub-area on the surface of the first copper layer is 1 mm-3 mm.
3. The method of claim 1, wherein the etch-resistant ink layer is inkjet printed by an inkjet printer.
4. The method of making according to claim 1, the etch-resistant ink layer being formed of a UV curable inkjet ink.
5. The method of claim 1, wherein the gap has a width of 8mm to 12 mm.
6. The method of claim 1, wherein the first copper layer has a thickness of 4 μm to 8 μm.
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| CN110996540B (en) * | 2019-12-31 | 2022-02-08 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN114080108A (en) * | 2020-08-18 | 2022-02-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114501801A (en) * | 2020-10-28 | 2022-05-13 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN112423478B (en) * | 2020-10-30 | 2023-09-15 | 常州安泰诺特种印制板有限公司 | Manufacturing method of PCB mesh type plug hole air guide plate |
| CN114615811B (en) * | 2020-12-07 | 2024-08-09 | 深南电路股份有限公司 | Processing method of high-precision circuit and high-precision circuit board |
| WO2022126451A1 (en) * | 2020-12-16 | 2022-06-23 | 深南电路股份有限公司 | Localized thick copper structure processing method, localized thick copper circuit board, and processing method |
| CN113141726B (en) * | 2021-03-17 | 2022-06-17 | 东莞联桥电子有限公司 | Manufacturing method of circuit board with locally thickened plating layer |
| CN113473738B (en) * | 2021-07-02 | 2022-12-20 | 深圳市新宇腾跃电子有限公司 | Local copper plating method for FPC (flexible printed circuit) with power line |
| CN115787018A (en) * | 2021-09-10 | 2023-03-14 | 健鼎（无锡）电子有限公司 | Plate etching method and plate semi-finished product structure |
| CN115103522B (en) * | 2022-02-22 | 2023-06-23 | 深圳市八达通电路科技有限公司 | Composite copper thick substrate and manufacturing method thereof |
| CN115515340A (en) * | 2022-10-11 | 2022-12-23 | 江西弘信柔性电子科技有限公司 | Method for manufacturing multilayer copper PCB with line pitch smaller than 30 mu m |
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| CN102651946B (en) * | 2012-04-05 | 2014-06-25 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN203407095U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Etching tool for PCB with copper thickness difference |
| CN107124830A (en) * | 2017-07-07 | 2017-09-01 | 台山市精诚达电路有限公司 | A kind of preparation method of FPC soft boards circuit |
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