CN115119416B - Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process - Google Patents
Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process Download PDFInfo
- Publication number
- CN115119416B CN115119416B CN202210669005.8A CN202210669005A CN115119416B CN 115119416 B CN115119416 B CN 115119416B CN 202210669005 A CN202210669005 A CN 202210669005A CN 115119416 B CN115119416 B CN 115119416B
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- npth
- ink
- pcb
- kong
- bianxian
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Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 238000005553 drilling Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 10
- 238000005406 washing Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000011010 flushing procedure Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 239000003814 drug Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000003628 erosive effect Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 238000007650 screen-printing Methods 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Abstract
The application discloses a method for solving the problem of NPTH Kong Bianxian path oil thinning of a PCB solder mask process, which comprises the following steps: determining hole positions, and determining the position of the PCB where the NPTH holes are positioned according to the drilling band data; manufacturing an outer layer circuit; printing ink by silk screen, namely printing the ink on a PCB board to form an ink layer; opening a window by using ink, and sequentially exposing and developing the ink layer; and drilling the NPTH hole site. The ink on the NPTH hole site side has weak fluidity, and can uniformly cover a circuit so as to avoid the thin oil at the circuit; and the NPTH hole site of the ink layer is drilled, so that the side erosion of the NPTH Kong Bianzu welding ink can be effectively avoided, and further, the situation that metal is connected with the NPTH Kong Bianxian path along the reaction growth of the side erosion edge of the welding resistance in the electroless nickel-plating process, so that the post-short circuit of a client weldment is caused is avoided.
Description
Technical Field
The application relates to a circuit board production process, in particular to a method for solving the problem of NPTH Kong Bianxian path oil thinning of a PCB solder mask process.
Background
In the production and manufacturing process of the PCB, after the outer layer circuit is manufactured, a solder mask layer is required to be manufactured in the area outside the NPTH holes on the surface of the PCB body for protecting the circuit on the PCB surface. When a solder mask layer is manufactured on a PCB, NPTH holes and outer-layer circuits are generally manufactured on the PCB, and then silk-screen printing, exposure and development are sequentially performed. The NPTH hole edge of part PCB board exists the circuit design, especially the circuit between a plurality of NPTH holes, and the NPTH hole is very near to the circuit, and the printing ink after the silk screen printing has stronger mobility, the NPTH hole exists the difference in height with the circuit on edge, and the printing ink on the circuit flows to the low (because the existence of NPTH hole, printing ink can a small part flow to the NPTH hole in, causes the printing ink on the circuit to flow to the low in succession), causes the phenomenon of the solder resist thin on NPTH Kong Bianxian, and in addition the side erosion also can appear in the solder resist on this NPTH hole edge after developing, so in the surface treatment chemistry heavy nickel gold in-process, metal along the side erosion edge reaction growth with NPTH Kong Bianxian way is connected, leads to the short circuit behind the customer weldment.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a method for solving the problem of thin circuit oil in the NPTH Kong Bianxian solder resist process of the PCB board, and the problem of short circuit caused by side etching of the solder resist oil at the edge of the NPTH hole after development.
In order to achieve the technical purpose, the technical scheme of the application provides a method for solving the problem of NPTH Kong Bianxian path oil thinning of a PCB solder mask process, which comprises the following steps:
s1: determining hole positions, and determining the position of the PCB where the NPTH holes are positioned according to the drilling band data;
s2: manufacturing an outer layer circuit;
s3: printing ink by silk screen, namely printing the ink on a PCB board to form an ink layer;
s4: opening a window by using ink, and sequentially exposing and developing the ink layer;
s5: and drilling the NPTH hole site.
Further, in step S1, the method further includes: and (3) making partial NPTH holes, wherein the partial NPTH holes are required to meet the following conditions: when the thickness of the outer layer circuit is smaller than 2oz, the distance between the part of NPTH holes and the outer layer circuit is larger than 0.2mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the part of NPTH holes and the outer layer circuit is more than 0.25mm.
Further, in step S5: making a further portion of NPTH wells, said further portion of NPTH wells satisfying the following conditions: when the thickness of the outer layer circuit is smaller than 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is smaller than or equal to 0.2mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the NPTH hole of the other part and the outer layer circuit is less than or equal to 0.25mm.
Further, in step S4, specifically, the method includes:
step S41: exposing the pre-cured ink, wherein the exposure step adopts exposure energy of 260-360mj/cm < 2 >;
step S42: flushing the ink layer by using a developing liquid, wherein the developing step adopts a flushing pressure of 1.8-2.2kg/cm < 2 >;
step S43: and (3) removing the ink in the part of the NPTH holes.
Further, in step S42: the force of developing liquid medicine to flush the ink layer is evenly increased.
Further, in step S43, specifically, the method includes:
step S431, washing the ink in the partial NPTH holes by water, wherein the washing pressure is 2.5-8kg/cm < 2 >;
step S432, drying the PCB;
and S433, ablating residual ink in the partial NPTH hole by using a laser beam.
Further, in step S431: the strength of washing the part of NPTH holes is evenly increased.
Further, in step S432: firstly, the surface of the PCB is dehydrated and air-dried by using natural wind for 10s, and then the PCB is dried by using 80 ℃ hot wind for 19s.
Further, in step S433: the spot diameter of the laser beam is 70-80 mu m.
Further, in step S433: the distance between the spot center of the laser beam and the hole wall of the NPTH hole is 5-10 mu m.
Compared with the prior art, the application has the beneficial effects that: determining the position of the PCB where the NPTH holes are positioned according to the drilling band data, manufacturing an outer layer circuit, screen printing ink, and drilling the NPTH holes; by the arrangement mode, the flowability of the ink at the edges of the NPTH holes is weakened, and the circuit can be uniformly covered, so that the thin oil at the circuit can be avoided; and the NPTH hole site of the ink layer is drilled, so that the side corrosion of the solder resist ink at the side line of the NPTH hole can be effectively avoided, and further, the situation that metal is connected with the NPTH Kong Bianxian path along the reaction growth of the side corrosion edge of the solder resist in the process of electroless nickel-plating, and the post-short circuit of a client weldment is caused is avoided.
Drawings
Fig. 1 is a schematic view of a partial cross-sectional structure of a PCB board according to embodiment 1 of the present application;
fig. 2 is a schematic view showing a partial sectional structure of a PCB board according to comparative example 1 of the present application.
Detailed Description
The following detailed description of preferred embodiments of the application is made in connection with the accompanying drawings, which form a part hereof, and together with the description of the embodiments of the application, are used to explain the principles of the application and are not intended to limit the scope of the application.
Example 1
The embodiment provides a method for solving the problem of NPTH Kong Bianxian path oil thinning of a PCB solder mask process, which sequentially comprises the following operation steps:
(1) Determining hole sites: and determining the position of the PCB where the NPTH hole is located according to the drilling band data.
(2) And manufacturing an outer layer circuit by a positive process.
(3) Silk screen printing ink: and uniformly screen printing ink on the PCB to form an ink layer.
(4) Ink windowing: and sequentially exposing and developing the ink layer on the PCB.
(5) Making NPTH holes: holes are drilled at the NPTH holes covered by the ink layer.
In the technical scheme of the embodiment, no NPTH hole is formed before the silk-screen printing ink, and the ink at the edge of the NPTH hole has weak fluidity, so that a circuit can be uniformly covered, and further, the thin oil at the circuit is avoided; the ink layer is windowed in a mode of exposure and development, and holes are drilled at the NPTH hole sites covered by the ink layer, so that the side corrosion of the NPTH Kong Bianzu welding ink can be effectively avoided, and further, the metal is connected with the NPTH Kong Bianxian path along the reaction growth of the side corrosion edge of the welding resistance in the process of chemically depositing nickel and gold, and the post-welding short circuit of a client weldment is caused (see figure 1).
Example 2
The embodiment provides a method for solving the problem of NPTH Kong Bianxian path oil thinning of a PCB solder mask process, which sequentially comprises the following operation steps:
(1) Determining hole sites: and determining the position of the PCB where the NPTH hole is located according to the drilling band data.
(2) Making part of NPTH holes: drilling the determined portion of the NPTH hole at the determined portion.
The partial NPTH hole needs to satisfy the following conditions: when the thickness of the outer layer circuit is smaller than 2oz, the distance between the part of NPTH holes and the outer layer circuit is larger than 0.2mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the part of NPTH holes and the outer layer circuit is more than 0.25mm.
(3) And manufacturing an outer layer circuit by a positive process.
(4) Silk screen printing ink: and uniformly screen printing ink on the PCB to form an ink layer.
(5) Ink windowing: and exposing, developing and removing Kong Mo the ink layer of the PCB in sequence.
(51) Exposure: exposing the cured ink layer to light of 260-360mj/cm 2 Is used for the exposure energy of the substrate.
(51) Developing: when the ink layer is washed with developer solution, 1.8-2.2kg/cm is used 2 And the force of flushing the ink layer is uniformly increased.
(53) And removing the ink in the part of the NPTH holes.
It can be appreciated that, since the partial NPTH holes are first formed, ink can easily enter the partial NPTH holes, and if the ink is not removed in time, ink residues in the product holes can be caused, so that the hole diameter is smaller, and the customer plug-in is affected.
(531) Cleaning: the ink in the NPTH holes is washed by water, the washing pressure is 2.5-8kg/cm < 2 >, and the washing force is uniformly increased in order to avoid larger impact on the PCB in the washing process.
(532) And (3) drying: and (3) carrying out water removal and air drying on the surface of the PCB for 10 seconds by using natural wind, and then drying the PCB for 19 seconds by using 80 ℃ hot wind.
(533) Laser hole burning: and ablating residual ink in the partial NPTH hole by using a laser beam, wherein the spot diameter of the laser beam is 70-80 mu m, and the distance between the spot center of the laser beam and the hole wall of the NPTH hole is 5-10 mu m. The optional laser beam has a spot diameter of 75 μm and a spot center of the laser beam is 7.5 μm from the wall of the NPTH hole to ensure that the laser beam ablates only residual ink without damaging the PCB.
(6) Making additional portions of NPTH wells: drilling holes at the other part of the NPTH holes covered by the ink layer.
The further portion of NPTH wells is required to satisfy the following conditions: when the thickness of the outer layer circuit is smaller than 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is smaller than or equal to 0.2mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the NPTH hole of the other part and the outer layer circuit is less than or equal to 0.25mm.
In the technical scheme of the embodiment, a part of NPTH holes are manufactured before the silk-screen printing ink, the distance between the part of NPTH holes and an outer layer circuit is larger than 0.2mm or larger than 0.25mm, so that the ink which is 0.2mm or 0.25mm away from the NPTH holes is ensured to have weaker fluidity, and the circuit can be uniformly covered to avoid the thin oil at the circuit; then, the ink layer is windowed in a mode of exposure and development, and holes are drilled on other parts of NPTH holes covered by the ink layer, so that the side corrosion of the NPTH Kong Bianzu welding ink can be effectively avoided, and further, the metal is connected with the NPTH Kong Bianxian path along the reaction growth of the side corrosion edge of the welding resistance in the chemical nickel-plating process, and the post-short circuit of a client weldment is caused.
Comparative example 1
(1) Determining hole sites: and determining the position of the PCB where the NPTH hole is located according to the drilling band data.
(2) NPTH holes were made.
(3) And manufacturing an outer layer circuit by a positive process.
(4) Silk screen printing ink: and uniformly screen printing ink on the PCB to form an ink layer.
(5) Ink windowing: and exposing and developing the ink layer of the PCB in sequence to form a solder mask layer.
In the technical scheme of the comparative example, the NPTH hole is formed before the silk-screen printing ink, the ink within 0.2mm or 0.25mm from the NPTH hole has strong fluidity, at the moment, the ink cannot uniformly cover a circuit, and the circuit is thin in oil; by exposing and developing the ink layer, undercutting occurs at the ink position at the NPTH hole edge (see figure 2), so that metal grows along the undercut position in the surface treatment electroless nickel-gold plating process, and short circuit is caused.
What is not described in detail in this specification is all that is known to those skilled in the art.
The present application is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present application are intended to be included in the scope of the present application.
Claims (8)
1. The method for solving the problem of NPTH Kong Bianxian path oil thinning of the PCB solder mask process is characterized by comprising the following steps:
s1: determining hole positions, and determining the position of the PCB where the NPTH holes are positioned according to the drilling band data;
s2: manufacturing an outer layer circuit;
s3: printing ink by silk screen, namely printing the ink on a PCB board to form an ink layer;
s4: opening a window by using ink, and sequentially exposing and developing the ink layer;
s5: drilling NPTH hole sites;
step S1 further includes: and (3) making partial NPTH holes, wherein the partial NPTH holes are required to meet the following conditions: when the thickness of the outer layer circuit is smaller than 2oz, the distance between the part of NPTH holes and the outer layer circuit is larger than 0.2mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the part of NPTH holes and the outer layer circuit is more than 0.25mm;
in step S5: making a further portion of NPTH wells, said further portion of NPTH wells satisfying the following conditions: when the thickness of the outer layer circuit is smaller than 2oz, the distance between the NPTH holes of the other part and the outer layer circuit is smaller than or equal to 0.2mm; when the thickness of the outer layer circuit is more than or equal to 2oz, the distance between the NPTH hole of the other part and the outer layer circuit is less than or equal to 0.25mm.
2. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of the PCB of claim 1, wherein in step S4, specifically comprising:
step S41: exposing the pre-cured ink to light in an exposure step of 260-360mj/cm 2 Exposure energy of (2);
step S42: washing the ink layer with a developer solution, wherein the developing step is 1.8-2.2kg/cm 2 Is used for the flushing pressure of the water pump;
step S43: and (3) removing the ink in the part of the NPTH holes.
3. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of PCB according to claim 2, wherein in step S42: the force of developing liquid medicine to flush the ink layer is evenly increased.
4. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of PCB according to claim 2, wherein in step S43, specifically comprising:
step S431, washing the ink in the partial NPTH holes with water at a pressure of 2.5-8kg/cm 2 ；
Step S432, drying the PCB;
and S433, ablating residual ink in the partial NPTH hole by using a laser beam.
5. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of PCB of claim 4, wherein in step S431: the strength of washing the part of NPTH holes is evenly increased.
6. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of PCB of claim 4, wherein in step S432: firstly, the surface of the PCB is dehydrated and air-dried by using natural wind for 10s, and then the PCB is dried by using 80 ℃ hot wind for 19s.
7. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of PCB of claim 4, wherein in step S433: the spot diameter of the laser beam is 70-80 mu m.
8. The method for solving the problem of oil thinning of NPTH Kong Bianxian path in the solder mask process of PCB of claim 4, wherein in step S433: the distance between the spot center of the laser beam and the hole wall of the NPTH hole is 5-10 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210669005.8A CN115119416B (en) | 2022-06-14 | 2022-06-14 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210669005.8A CN115119416B (en) | 2022-06-14 | 2022-06-14 | Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process |
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| CN115119416A CN115119416A (en) | 2022-09-27 |
| CN115119416B true CN115119416B (en) | 2023-11-21 |
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| CN116940002B (en) * | 2023-06-13 | 2024-03-29 | 湖北龙腾电子科技股份有限公司 | Manufacturing method of circuit board |
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| CN115119416A (en) | 2022-09-27 |
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