JP2005336552A - Method for producing metal etching product, and metal etching product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a metal etching product, and the metal etching product having high aspect ratio in the opening hole parts and high precise etching cross sectional shape. <P>SOLUTION: This producing method includes: (1) a process for making a corrosion resistant metal film having the opening hole pattern on the surface of the metal plate; (2) a process for forming the first opening hole part by performing the first etching; (3) a process for making the resist film having the opening hole pattern part in the first opening hole part with a development after exposing the whole surface by applying a positive electrodeposition photoresist; (4) a process for forming the second opening hole part by performing the second etching; and (5) a process for peeling off the resist film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for producing a metal etched product obtained by patterning a metal material having a smooth surface using a photoetching method, and a metal etched product, and in particular, the etched portion has a high aspect ratio. Metal etching product manufacturing method and metal etching product, specifically, high-definition metal etching product manufacturing method and metal etching product such as metal wiring of high-density printed circuit board, shadow mask, lead frame, FED anode grid, perforated plate About.

  In the case of forming a metal-etched part using a conventional wet etching method, an alkali-soluble photoresist film is formed in a desired pattern on an iron-based or copper-based metal material, and an acidic ferric chloride etchant or chloride chloride is formed. The metal part exposed from the photoresist is etched using a dicopper etchant. In such wet etching, the etching proceeds isotropically from the opening of the photoresist to directly under the photoresist, so side etching directly under the photoresist becomes a problem. Side etching means isotropic etching under the surface of the photoresist film. In order to make the etched portion of a metal etching product have a high aspect ratio, the pitch between adjacent patterns cannot be reduced. Occur.

  In order to solve this problem, for example, Japanese Patent Laid-Open No. 1-188700 discloses an unnecessary portion of an etching target layer by electrolytic etching again after protecting a side surface of a portion half-etched with an etching solution with an insulating protective film. A technique for forming a high-density pattern by removing the film is disclosed (see Patent Document 1).

  Also, for example, in Japanese Patent Publication No. 58-15537, a resist mask formed by primary etching is used as a photomask, and a positive photoresist coated again on the primary etching surface is exposed and developed, and side walls by primary etching are used. A technique for forming a high-density pattern by forming a resist pattern and removing unnecessary portions of the layer to be etched by secondary etching is disclosed (see Patent Document 2).

  Also, for example, in Japanese Examined Patent Publication No. 62-37713, the half-etched surface formed by primary etching is filled with a low-molecular-weight solvent-based adhesive and then dried to bond the softened resist film to the half-etched surface. And a technique for forming a high-density pattern by removing unnecessary portions of the layer to be etched by secondary etching (see Patent Document 3).

  Further, JP-A-4-99185 discloses that a half-etched surface formed by primary etching is coated with an electrodeposition resist, a photomask is aligned, exposed and developed to form a resist pattern, A technique for forming a high-density pattern by removing unnecessary portions of an etching target layer by etching is disclosed (see Patent Document 4).

  However, in the technique described in Patent Document 1, an insulating protective film is formed on the entire surface of the half-etched portion (opening portion), and then the insulating protective film on the bottom of the opening portion that has been half-etched is used as an acid solution. Dissolve with spray. For this reason, if the flow of the acidic liquid sprays varies within the plane of the metal plate, the protective film within the half-etching tends to vary in dimensions, and in particular, a high-definition pattern with a narrow pitch between adjacent patterns. If it becomes a fatal problem.

In addition, in a high-definition pattern, there is a problem that all of the insulating protective film is removed because the amount of side etching is small and the wrinkles of the primary photoresist are minute. Further, in a pattern with a deep half-etching and a large amount of half-etching, there is a problem that only the bottom of the opening portion of the insulating protective film cannot be removed, so that the etching proceeds as a whole by secondary etching.

Further, in the technique described in Patent Document 2, if even a portion of the photoresist wrinkle formed by primary etching is chipped or drooped, the deformation is transferred to the shape of the resist pattern for secondary etching, which is sharp. A shape cannot be obtained, which is not suitable for forming a fine pattern, and becomes a fatal problem particularly in the case of a high-definition pattern having a narrow pitch with an adjacent pattern.
In addition, a high-definition pattern or a pattern with a deep half-etching and a large amount of half-etching cannot cope with the half-etching formed by the primary etching uniformly because the secondary-etching photoresist is difficult to coat.

Further, in the technique described in Patent Document 3, the resist component of the primary etching resist dissolved in the adhesive liquid remains sparsely at the bottom of the half etching, and the secondary etching does not uniformly enter, and the resist is swollen with the adhesive liquid. The problem that the sharp shape cannot be reproduced in the drying process occurs.
These problems are fatal problems that cause variations in in-plane etching dimensions. In addition, since a high-definition pattern has a very small primary etching resist wrinkle, only the adhesive is evaporated and no effect is obtained. Even when trying to obtain a high aspect ratio, the side etching can be stopped only at the ridges, so that the half etching is deep and the pattern having a large etching amount cannot be handled.

  Further, in the technique described in Patent Document 4, in order to align the mask when exposing the positive electrodeposition photoresist, it is necessary to previously form an alignment mark serving as a reference for mask positioning on the substrate. . In addition, it is necessary to make the alignment mark recognizable even after the application of the positive electrodeposition photoresist, and there is a problem that the process becomes complicated.

In addition, when the mask is misaligned, the bottom of the opening portion formed by the primary etching is curved, so that the opening of the electrodeposition resist is opened so as to cover the bottom and the side wall. As a result, the secondary etching is performed. Proceeds in a direction inclined obliquely rather than perpendicularly to the opening, and actually causes a distortion larger than the amount of displacement of the mask, causing a defect in which the shape of the aperture, particularly the cross-sectional shape, becomes distorted ( (See FIG. 7). Therefore, higher accuracy is required for mask alignment.
JP-A-1-188700 Japanese Patent Publication No.58-15537 Japanese Patent Publication No.62-37713 Japanese Patent Laid-Open No. 4-99185

  An object of the present invention is to provide a method for producing a metal-etched part having a high aspect ratio and a high-definition etching cross-sectional shape, and a metal-etched part, which are impossible with the conventional technique.

The present invention provides a method for producing a metal-etched product having a through-hole portion formed by a plurality of etchings.
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) Applying a positive electrodeposition photoresist on the entire surface of the metal plate, using the corrosion-resistant metal film having the opening pattern portion as a photomask, and developing the entire surface in the first aperture by developing after the entire surface exposure with parallel light. Providing a resist film having an opening pattern portion corresponding to the opening pattern portion;
4) performing a second etching on the metal plate (first opening portion bottom) exposed in the opening pattern portion of the resist film having the opening pattern portion to form a second opening portion;
5) A step of stripping a resist film having an opening pattern portion;
It is a manufacturing method of the metal etching product characterized by comprising at least.

Further, the present invention provides a method for producing a metal-etched product having a through-hole portion formed by a plurality of etchings.
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) Applying a positive electrodeposition photoresist on the entire surface of the metal plate, using the corrosion-resistant metal film having the opening pattern portion as a photomask, and developing the entire surface in the first aperture by developing after the entire surface exposure with parallel light. Providing a resist film having an opening pattern portion corresponding to the opening pattern portion;
4) performing a second etching on the metal plate (first opening portion bottom) exposed in the opening pattern portion of the resist film having the opening pattern portion to form a second opening portion;
5) A positive electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above in the i-th hole portion by development after the entire surface exposure with parallel light. A step of providing a resist film having an opening pattern portion corresponding to the opening pattern portion (i ≧ 2), and 6) a metal plate exposed at the opening pattern portion of the resist film having the opening pattern portion (bottom of the i-th opening portion) Performing the (i + 1) th etching step and forming the (i + 1) th opening (i ≧ 2) at least once;
7) A step of stripping a resist film having an opening pattern portion,
It is a manufacturing method of the metal etching product characterized by comprising at least.

Further, the present invention provides a method for producing a metal-etched product having a through-hole portion formed by a plurality of etchings.
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) A negative electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above-mentioned inside the first opening portion by development after the entire surface exposure with parallel light. Providing a resist film having a pattern portion corresponding to the opening pattern portion;
4) covering the entire inner surface of the first opening portion with a corrosion-resistant metal film, removing the resist film having the pattern portion, and forming a corrosion-resistant metal film having an opening pattern portion corresponding to the opening pattern portion;
5) performing a second etching on the metal plate exposed at the opening pattern part of the corrosion-resistant corrosion-resistant metal film having the opening pattern part (first opening part bottom part) to form a second opening part;
It is a manufacturing method of the metal etching product characterized by comprising at least.

Further, the present invention provides a method for producing a metal-etched product having a through-hole portion formed by a plurality of etchings.
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) A negative electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above-mentioned inside the first opening portion by development after the entire surface exposure with parallel light. Providing a resist film having a pattern portion corresponding to the opening pattern portion;
4) covering the entire inner surface of the first opening portion with a corrosion-resistant metal film, removing the resist film having the pattern portion, and forming a corrosion-resistant metal film having an opening pattern portion corresponding to the opening pattern portion;
5) performing a second etching on the metal plate (first opening portion bottom) exposed in the opening pattern portion of the corrosion-resistant metal film having the opening pattern portion to form a second opening portion;
6) A negative electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above in the i-th opening portion by development after the entire surface exposure with parallel light. A step of providing a resist film having a pattern portion corresponding to the opening pattern portion (i ≧ 2), and 7) covering the entire inner wall of the i-th opening portion with a corrosion-resistant metal film, and removing the resist film having the pattern portion, A step of forming a corrosion-resistant metal film having an opening pattern portion corresponding to the opening pattern portion (i ≧ 2), and 8) a metal plate (first plate) exposed in the opening pattern portion of the corrosion-resistant metal film having the opening pattern portion. (i + 1) etching on the bottom of the i-opening portion) and the step of forming the (i + 1) -th opening portion (i ≧ 2) is repeated at least once.
It is a manufacturing method of the metal etching product characterized by comprising at least.

  Moreover, this invention is manufactured using the manufacturing method of the metal etching product of any one of Claims 1-4, The metal etching product characterized by the above-mentioned.

  Moreover, the present invention is the metal etching product according to the above invention, wherein the etching factor of the opening portion of the metal etching product is 2.6 or more.

  According to the metal etching product manufacturing method and the metal etching product according to the present invention, it is possible to perform etching in the depth direction only on the bottom portion while preventing side etching on the side wall of the opening portion. An etching cross-sectional shape can be formed. In addition, the multi-stage etching that repeatedly forms the opening portion enables deep etching to a thick metal material. Further, after the second etching, since a photomask that requires alignment for exposure of the electrodeposition resist is not used, finer holes can be processed.

For example, in a photoresist pattern having a photoresist opening diameter of 10 μm or more, side etching proceeds in the vicinity of the surface of the metal plate immediately under the photoresist only by the first etching, and therefore the etching factor is about 2.6 at the maximum.
However, according to the metal etching product manufacturing method and the metal etching product according to the present invention, an etching factor of 6.9 was confirmed by the second etching using a corrosion-resistant metal film with a photoresist opening diameter pattern of 260 μm.
Conventionally, in the case of one-side etching, the limit of the etching hole diameter is about 200% of the plate thickness. However, according to the present invention, the hole can be formed at 40 to 160% of the plate thickness at a plate thickness of 0.01 to 5 mm. . In the case of double-sided etching, the etching hole diameter is limited to about 100% of the plate thickness. However, according to the present invention, the hole can be formed at 20 to 80% of the plate thickness at a plate thickness of 0.05 to 10 mm.

  Further, in the conventional two-stage etching, when the resolution limit of the resist is 10 μm, the general alignment accuracy of the exposure apparatus is ± 10 μm. In order to align with the bottom, an opening with a margin of 10 μm or more on one side (which becomes larger depending on the film thickness of the electrodeposition resist applied to the side wall of the aperture) is necessary from the alignment accuracy. The processing limit is 50 μm, and when performing multi-stage etching, it is necessary to further widen the opening width because of the effect of accumulation of misregistration amounts. In practice, however, processing of patterns of about 80 to 100 μm is the limit. In the present invention, since alignment is not required, it becomes possible to process a pattern of about 20 to 30 μm by adding a side etching width to the resolution limit of the resist. Much influence not to be processing limit is increasing the number of stages of the quenching.

  Embodiments of a method for producing a metal etching product according to the present invention will be described below. The metal plate in the present invention is a metal plate that can be etched, such as an Fe-based alloy 50 alloy or 47 alloy. Although the thickness is not particularly limited, a thick plate exceeding 1 mm can also be used.

The step of forming a corrosion-resistant metal film having a desired opening pattern portion on the surface of the metal plate is based on a subtractive method in which the opening pattern portion is removed by etching using a photoresist after covering the surface of the metal plate with a corrosion-resistant metal film. Process,
Alternatively, the metal plate surface is completely covered with a photoresist, exposed and developed through a photomask having the shape of the opening pattern portion to provide an opening pattern portion with the resist, and the exposed metal plate surface is a corrosion-resistant metal film. A semi-additive method of removing the resist in the opening pattern after covering with
Alternatively, an opening pattern portion is provided on the surface of the metal plate with a photoresist, and after the metal plate surface is covered with a corrosion-resistant metal film by chemical plating, only the corrosion-resistant metal film on the resist is removed together with the resist of the opening pattern portion. A process using a lift-off method is conceivable.
At this time, the film thickness of the corrosion-resistant metal film needs to be strong enough to prevent the film from being broken by etching, which will be described later, and is preferably 5 μm or more.

When patterning a corrosion-resistant metal film having an opening pattern portion on a smooth metal plate surface by a semi-additive method, first, using a photomask on which a pattern having the shape of a desired opening pattern portion is formed, A resist layer having an opening pattern of about 10 μm is formed.
As the photoresist, a naphthoquinone azide-based or novolak resin-based positive photoresist, a dichromic acid-based, polycinnamate vinyl-based, or a cyclized rubber azide-based negative photoresist can be used.

  For the coating of the liquid photoresist, a commonly used photoresist coating method such as a spin coater, a roll coater or a dip coater is used. If a dry film resist is used, a laminator is used. Further, the printing resist may be pattern printed. Of course, an electrodeposition photoresist may be used.

  Next, the step of covering the surface of the metal plate with the corrosion-resistant metal film takes a method of depositing the corrosion-resistant metal film to a desired thickness on the exposed portion of the metal plate surface by electrolytic plating on the metal material. Next, the resist in the opening pattern portion is stripped to form a corrosion-resistant metal film having a desired opening pattern portion.

Here, the corrosion-resistant metal film is a material that does not corrode with an etching solution used in etching described later, and is particularly limited as long as it can be formed on the surface of a metal material by electrolytic plating or chemical plating. is not. For example, when a ferric chloride solution is used as the etchant in the second etching, Cr or the like can be considered as the corrosion resistant metal film.

  In the step of forming the first opening portion, the first opening portion is formed by performing first etching (half etching) on the metal plate with an etching solution that does not attack the corrosion-resistant metal film. At this time, since the width of the first opening portion increases in the width direction as well as in the depth direction due to the progress of the side etching, the width becomes wider than the opening pattern portion provided in the corrosion-resistant metal film. 1 It becomes bowl-shaped on the upper surface of the opening.

  The positive electrodeposition photoresist is applied by applying a positive or negative charge to the metal plate in which the first aperture is formed, and dipping the positive electrodeposition photoresist tank having a negative or positive charge. A positive electrodeposition photoresist layer is formed. This is because when a normal liquid photoresist is applied, the photoresist liquid tends to accumulate in the opening portion, and a photoresist having a uniform film thickness cannot be formed. In addition, the dry film resist has a problem that it does not adhere to the opening.

  The film thickness of the electrodeposited photoresist can be controlled by the dielectric constant of the material itself and the electrodeposition conditions, but a film thickness of 2 μm or more is preferable to prevent the grown plating from running on the photoresist, and a high-definition pattern is formed. Is preferably 10 μm or less. Note that the electrodeposited photoresist refers to a resist that is adsorbed by charges of different signs because the resist has a positive or negative charge.

  The resist film having the opening pattern portion is formed by applying parallel light to the positive electrodeposition photoresist formed with a uniform film thickness on the surface of the first opening portion formed by the first etching and on the surface of the corrosion-resistant metal film. Is developed by exposing the entire surface to light and developing. Corrugation of the corrosion-resistant metal film generated by the first etching acts as a photomask, and an electrodeposition resist is formed only on the side wall of the first opening that is not exposed, and the opening pattern portion of the corrosion-resistant metal film used for the first etching The opening pattern portion of the electrodeposition resist having the same shape as that is formed at the bottom of the first opening portion.

The step of forming the second aperture is performed by performing second etching on the bottom of the first aperture. The etchant used here may be the same etchant as the first etch. In the second etching, side etching on the surface of the metal plate is prevented and anisotropic etching is performed in the depth direction to form a high aspect ratio through hole, thereby forming a high aspect ratio and high definition metal pattern. .
That is, it is possible to prevent the progress of side etching and perform anisotropic etching that selectively etches in the depth direction to form a metal etching product having a high aspect ratio.

  Further, in the invention according to claim 2, the step of providing a resist film having an opening pattern portion as shown in 3) in the first aspect of the invention, and the second etching shown in 4) as shown in FIG. By repeating the step of forming 2 apertures, it is possible to form through holes having a higher aspect ratio in the depth direction.

  Further, the invention according to claim 3 is the first opening portion surface and the corrosion-resistant metal film in which the negative electrodeposition resist is formed by the first etching instead of using the positive electrodeposition resist after the second etching. A uniform film thickness is formed on the surface, exposed to the entire surface with parallel light, developed, and a resist film having a pattern corresponding to the opening pattern portion is provided at the bottom of the first opening portion to expose the exposed first opening. After covering the inner wall of the hole with an anticorrosive metal film by electrolytic plating, the resist film having the above pattern at the bottom of the first opening is removed, and then the anticorrosive metal film is applied to the side wall of the first opening by a semi-additive method. It is a manufacturing method of the metal etching product formed in this.

In this manufacturing method, the same effect as the manufacturing method shown in claim 1 can be obtained, and further, it is possible to prevent the occurrence of defects in which portions other than the design are etched due to the film reduction of the electrodeposition resist or pinholes. I can do it.
According to a fourth aspect of the present invention, there is provided a method for producing a metal-etched product, wherein a through-hole having a higher aspect ratio can be formed in the depth direction by repeating the second and subsequent etching.

Further, in the experiments by the inventors, in the opening pattern portion having an opening diameter of 10 μm or more of the photoresist, the side etching directly under the photoresist proceeds only by the first etching, so that the etching factor is about 2.6 at the maximum. .
In the experiment using the manufacturing method according to the present invention, an etching factor of 6.9 was confirmed by the second etching with the pattern of the opening diameter of the corrosion-resistant metal film being 260 μm.

  Here, the etching factor (hereinafter referred to as EF) will be described. A side etch amount obtained by halving the dimensional difference between the opening size of the metal plate half-etched by the first etching and the opening size of the photoresist applied to the opening portion ( SE) and the half-etched depth dimension (hereinafter ED) are defined as shown in Equation 1.

以下に実施例により本発明を詳細に説明する。実施例１には、金属板の両面からエッチングして、ほぼ垂直な貫通孔の作製方法を示している。また実施例２には、金属箔を非エッチング性の基板に貼り付けた金属箔の片側からエッチングして、高アスペクト比を有する金属配線パターンを形成することを示したが、両面付けの金属箔を両面同時にエッチングすることもできる。
実施例１と比較するための実施例３には、従来の一段エッチングによる金属板の両面からのエッチングを示した。実施例１と比較して分かるように、同じピッチでエッチングするには、板厚を半分以下にする必要がある。

Hereinafter, the present invention will be described in detail by way of examples. Example 1 shows a method for producing a substantially vertical through hole by etching from both surfaces of a metal plate. In Example 2, it was shown that the metal foil was etched from one side of the metal foil attached to the non-etching substrate to form a metal wiring pattern having a high aspect ratio. Can be simultaneously etched on both sides.
In Example 3 for comparison with Example 1, etching from both sides of a metal plate by conventional one-stage etching was shown. As can be seen from the comparison with Example 1, in order to perform etching at the same pitch, it is necessary to make the plate thickness half or less.

1 and 2 are partial cross-sectional views illustrating the steps of the manufacturing method of the first embodiment.
A 42 metal plate (111), which is an iron-based metal material having a thickness of 500 μm, was alkali degreased, and a positive photoresist PMER P-RH300PM (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was coated on both sides to a thickness of 10 μm. Next, ultraviolet light was exposed through a photomask having a pitch of 350 × 1000 μm and a 260 × 860 μm slot pattern shielded from light, and a positive photoresist pattern (112) having the same dimensions as the photomask was formed by spray development of an alkaline aqueous solution. (FIG. 1 (1)).

  Next, after forming a Cr film with a thickness of 5 μm on the surface of the 42 metal plate not coated with the positive photoresist by electrolytic plating (FIG. 1 (2)), it was immersed in a 3 wt% aqueous solution of caustic soda. The mold photoresist pattern was stripped, and a corrosion-resistant metal film (Cr film) (141) having an opening pattern portion was provided (FIG. 1 (3)).

  As the first etching, a ferric chloride etching solution was spray-etched at 50 ° C. and 0.3 MPa until SE progressed to 20 μm to form the first opening (K1) (FIG. 1 (4)).

Next, a positive electrodeposition photoresist (131) having negative charge (131) Sonne EDUV P-600SA (manufactured by Kansai Paint Co., Ltd.) was coated on the metal plate with a thickness of 8 μm while applying a positive charge (FIG. 2 (1)). )). Subsequently, the whole surface was exposed with parallel light of 150 mJ / cm ² , and then 35
The resist film (131 ′) having an opening pattern portion was provided by spray development with an aqueous sodium carbonate solution at 1 ° C. at 1 ° C. (FIG. 2 (2)).

  Further, as the second etching, a ferric chloride etchant was spray-etched at 50 ° C. and 0.3 MPa to form the second aperture (K2) (FIG. 2 (3)). After rinsing with water, it is immersed in a 3 wt% sodium hydroxide aqueous solution at 60 ° C., and the resist film (131 ′) having an opening pattern portion is peeled off to form an EF of 6.9 on one side. A through hole (151) having a slot pattern was produced (FIG. 2 (4)).

4 and 5 are partial cross-sectional views illustrating the steps of the manufacturing method of the second embodiment.
A glass epoxy substrate (313) obtained by adhering a copper metal foil (311) having a thickness of 18 μm from both sides of an insulating glass epoxy substrate is degreased with alkali, and a positive photoresist PMER P-RH300PM (Tokyo Ohka Kogyo Co., Ltd.) Co., Ltd.) was coated on both sides to a film thickness of 10 μm. Next, ultraviolet rays were exposed through a photomask in which a slit pattern of line / space = 20/10 μm was shielded from light, and a positive photoresist pattern (312) having the same dimensions as the photomask was formed by spray development of an alkaline aqueous solution. (FIG. 4 (1), the following figure omits one side).

  Next, after forming a Cr film with a thickness of 5 μm on the surface of the copper-based metal foil (311) that is not coated with the positive photoresist by electrolytic plating (FIG. 4 (2)), the temperature is 60 ° C. and 3 wt%. It was immersed in an aqueous caustic soda solution, the positive photoresist pattern was peeled off, and a corrosion-resistant metal film (Cr film) (341) having an opening pattern portion was provided (FIG. 4 (3)).

  As the first etching, a ferric chloride etching solution was spray-etched at 50 ° C. and 0.3 MPa until SE progressed to 2.5 μm, thereby forming a first opening (K1) (FIG. 4 (4)).

Next, a positive electrodeposition photoresist (331) having negative charge (331) Sonne EDUV P-600SA (manufactured by Kansai Paint Co., Ltd.) was coated on the surface of the metal plate with a film thickness of 6 μm while applying a positive charge (FIG. 5 ( 1)). Next, the entire surface is exposed to 150 mJ / cm ^{2 with} parallel light, and after heat treatment at 140 ° C. for 15 min, spray development is performed with an aqueous solution of sodium carbonate at 35 ° C. and 1 wt% to provide an electrodeposition resist film (331 ′) having an opening pattern portion. (FIG. 5 (2)).

  Further, as the second etching, a ferric chloride etchant was spray-etched at 50 ° C. and 0.3 MPa to form the second opening (K2) (FIG. 5 (3)). After rinsing with water, the film is immersed in a 3 wt% sodium hydroxide aqueous solution at 60 ° C., and the electrodeposition resist film (331 ′) having an opening pattern portion is peeled off, and a film thickness of 18 μm having a vertical aspect ratio formed with an EF of 6.9. Then, a copper wiring (351) having a slit pattern of line / space = 15/15 μm was prepared (FIG. 5 (4)).

  FIG. 3 is a partial cross-sectional view for explaining the steps of the manufacturing method of the third embodiment for comparison with the first embodiment. A 42 metal plate (211), which is an iron-based metal material having a thickness of 200 μm, was degreased with alkali, and a positive photoresist PMER P-RH300PM (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was coated on both sides to a thickness of 10 μm. Next, ultraviolet light is exposed through a photomask having holes of 260 × 860 μm with a pitch of 350 × 1000 μm and a positive photoresist pattern (212) having the same dimensions as the photomask is formed by spray development of an alkaline aqueous solution. (FIG. 3 (1)).

As the first etching, a ferric chloride etching solution is spray-etched at 50 ° C. and 0.3 MPa until SE progresses to 20 μm (FIG. 3 (2)), and after rinsing with water, it is immersed in a 3 wt% sodium hydroxide aqueous solution at 60 ° C. The positive type photoresist pattern was stripped, and a through hole (231) having a plate thickness of 200 μm and a 300 × 900 μm slot pattern formed with an EF of 2.6 on one side was produced (FIG. 3 (3)).
Thus, the conventional manufacturing method can only produce a thin plate.

6 is a partial cross-sectional view illustrating the steps of the manufacturing method of Example 4 for comparison with Example 2. FIG.
A glass epoxy substrate (413) obtained by bonding a copper metal foil (411) having a thickness of 7 μm from both sides of an insulating glass epoxy substrate is degreased with alkali, and a positive photoresist PMER P-RH300PM (Tokyo Ohka Kogyo ( Co., Ltd.) was coated on both sides to a film thickness of 10 μm. Next, ultraviolet rays were exposed through a photomask having a slit pattern of line / space = 20/10 μm, and a positive photoresist pattern (412) having the same dimensions as the photomask was formed by spray development of an alkaline aqueous solution. (FIG. 6 (1), hereinafter, one side is omitted).

As the first etching, a ferric chloride etching solution is spray-etched at 50 ° C. and 0.3 MPa until SE progresses to 20 μm (FIG. 6 (2)), and after being washed with water, immersed in a 3 wt% sodium hydroxide aqueous solution at 60 ° C. Then, the positive photoresist pattern was peeled off, and a copper wiring with a slit pattern of 7 μm thickness and line / space = 15/15 μm formed with an EF of 2.6 was produced (FIG. 6 (3)).
Thus, the conventional manufacturing method can only produce a thin plate.

  In the above Example 1 and Example 2, the process up to the second etching using the positive electrodeposition photoresist film is shown only once, but it can be repeated as many times as necessary, and the film thickness (plate thickness) It can also be applied to thick metal materials.

(1)-(4) is a fragmentary sectional view explaining the process of the manufacturing method of Example 1. FIG. (1)-(4) is a fragmentary sectional view explaining the process of the manufacturing method of Example 1. FIG. (1)-(3) is a fragmentary sectional view explaining the process of the manufacturing method of Example 3. FIG. (1)-(4) is a fragmentary sectional view explaining the process of the manufacturing method of Example 2. FIG. (1)-(4) is a fragmentary sectional view explaining the process of the manufacturing method of Example 2. FIG. (1)-(3) is a fragmentary sectional view explaining the process of the manufacturing method of Example 4. FIG. It is explanatory drawing where the cross-sectional shape of an opening part becomes distorted when the position shift of a mask generate | occur | produces.

Explanation of symbols

111, 211, 511... 42 metal plates 112, 212, 312, 412... Positive photoresist pattern 131, 331... Positive electrodeposition photoresist 131 '. Films 141, 341... Corrosion-resistant metal film (Cr film) having an opening pattern portion
151, 231... Slot pattern through-holes 311, 411... Copper metal foil 313, 413... Glass epoxy substrate 351, 431. Slit pattern copper wiring 513. ... Bottom part 525 of opening part by primary etching ... Electrodeposition resist K1 ... First opening part K2 ... Second opening part

Claims (6)

In the method for producing a metal-etched product having a through-hole formed by multiple times of etching,
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) Applying a positive electrodeposition photoresist on the entire surface of the metal plate, using the corrosion-resistant metal film having the opening pattern portion as a photomask, and developing the entire surface in the first aperture by developing after the entire surface exposure with parallel light. Providing a resist film having an opening pattern portion corresponding to the opening pattern portion;
4) performing a second etching on the metal plate (first opening portion bottom) exposed in the opening pattern portion of the resist film having the opening pattern portion to form a second opening portion;
5) A step of stripping a resist film having an opening pattern portion;
The manufacturing method of the metal etching product characterized by including at least. In the method for producing a metal-etched product having a through-hole formed by multiple times of etching,
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) Applying a positive electrodeposition photoresist on the entire surface of the metal plate, using the corrosion-resistant metal film having the opening pattern portion as a photomask, and developing the entire surface in the first aperture by developing after the entire surface exposure with parallel light. Providing a resist film having an opening pattern portion corresponding to the opening pattern portion;
4) performing a second etching on the metal plate (first opening portion bottom) exposed in the opening pattern portion of the resist film having the opening pattern portion to form a second opening portion;
5) A positive electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above in the i-th hole portion by development after the entire surface exposure with parallel light. A step of providing a resist film having an opening pattern portion corresponding to the opening pattern portion (i ≧ 2), and 6) a metal plate exposed at the opening pattern portion of the resist film having the opening pattern portion (bottom of the i-th opening portion) Performing the (i + 1) th etching step and forming the (i + 1) th opening (i ≧ 2) at least once;
7) A step of stripping a resist film having an opening pattern portion,
The manufacturing method of the metal etching product characterized by including at least. In the method for producing a metal-etched product having a through-hole formed by multiple times of etching,
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) A negative electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above-mentioned inside the first opening portion by development after the entire surface exposure with parallel light. Providing a resist film having a pattern portion corresponding to the opening pattern portion;
4) covering the entire inner surface of the first opening portion with a corrosion-resistant metal film, removing the resist film having the pattern portion, and forming a corrosion-resistant metal film having an opening pattern portion corresponding to the opening pattern portion;
5) performing a second etching on the metal plate exposed at the opening pattern part of the corrosion-resistant corrosion-resistant metal film having the opening pattern part (first opening part bottom part) to form a second opening part;
The manufacturing method of the metal etching product characterized by including at least. In the method for producing a metal-etched product having a through-hole formed by multiple times of etching,
1) providing a corrosion-resistant metal film having an opening pattern on the surface of the metal plate;
2) performing a first etching on the surface of the metal plate exposed in the opening pattern portion to form a first opening portion;
3) A negative electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above-mentioned inside the first opening portion by development after the entire surface exposure with parallel light. Providing a resist film having a pattern portion corresponding to the opening pattern portion;
4) covering the entire inner surface of the first opening portion with a corrosion-resistant metal film, removing the resist film having the pattern portion, and forming a corrosion-resistant metal film having an opening pattern portion corresponding to the opening pattern portion;
5) performing a second etching on the metal plate (first opening portion bottom) exposed in the opening pattern portion of the corrosion-resistant metal film having the opening pattern portion to form a second opening portion;
6) A negative electrodeposition photoresist is applied to the entire surface of the metal plate, and the corrosion-resistant metal film having the opening pattern portion is used as a photomask to develop the above in the i-th opening portion by development after the entire surface exposure with parallel light. A step of providing a resist film having a pattern portion corresponding to the opening pattern portion (i ≧ 2), and 7) covering the entire inner wall of the i-th opening portion with a corrosion-resistant metal film, and removing the resist film having the pattern portion, A step of forming a corrosion-resistant metal film having an opening pattern portion corresponding to the opening pattern portion (i ≧ 2), and 8) a metal plate (first plate) exposed in the opening pattern portion of the corrosion-resistant metal film having the opening pattern portion. (i + 1) etching on the bottom of the i-opening portion) and the step of forming the (i + 1) -th opening portion (i ≧ 2) is repeated at least once.
The manufacturing method of the metal etching product characterized by including at least.   A metal-etched product manufactured using the method for manufacturing a metal-etched product according to claim 1.   The metal etching product according to claim 5, wherein an etching factor of an opening portion of the metal etching product is 2.6 or more.

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