JP2015180505A - Hemispherical shell die for extrusion granulation and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive hemispherical shell die mounted to an extrusion screw type extrusion granulator to produce granules for molding a tablet having an average particle diameter of 100-600 μm.SOLUTION: A hemispherical shell die, which is produced from at least two same-shaped blank materials having at least three notches at equal intervals, is produced by: producing tabular developed porous original plates from blank materials by boring a large number of holes by double-sided etching; integrating the developed porous original plates by aligning hole positions by diffusion bonding to produce a tabular developed porous plate; molding the tabular developed porous plate into a hemispherical shell shape by press molding, and joining butt joint parts by TIG welding or laser welding.

Description

  The present invention relates to a hemispherical shell die for producing wet granulated powder by extruding wet raw material powder from a large number of small holes and a method for producing the same.

  In recent years, a continuous process has attracted attention because it is easy to develop quality assurance based on scientific grounds in the pharmaceutical field. The continuous process has the advantage that, unlike the batch process, it is not necessary to prepare multiple machines of a size suitable for the production volume because the production volume can be easily adjusted by changing the operation time. .

  The mainstream of solid dosage forms is tablets. In order to produce tablets of good quality from the raw material powder, it is indispensable to first uniformly fill the raw material powder into the mold. However, powders generally have adhesiveness and poor fluidity, making it difficult to perform uniform filling. Therefore, as a pre-molding process, granulation is used in which the powder is made into granules and the apparent mass of the particles is increased to improve fluidity.

  The tableting granules should yield tablets with proper drug content uniformity, hardness, disintegration time, and friability. The average particle diameter is preferably about 100 to 600 μm close to the lower limit showing good fluidity and narrow in particle size distribution. In addition, batch-type agitation granulators and fluidized bed granulators have been widely used for granulation, but there are no continuous granulators that can be easily replaced with batch-type granulators. .

  The extrusion granulator is capable of continuous processing. In particular, the pre-extrusion screw-type extrusion granulator for fine granules (see Patent Document 1) can produce granules having a particle size of 300 to 600 μm, so that tablet formation is possible. It has the potential as a continuous granulator to produce granules for use. However, the obtained granule has high hardness, it is difficult to obtain a tablet of good quality, and it is not suitable for molding.

  The reason why the hardness of the granule is high is that the number of holes opened in the hemispherical die used in the granulator is small, that is, the opening ratio is small and the extrusion pressure is high. Here, the aperture ratio is the ratio of the total aperture area of a large number of holes opened to the hemispherical shell die to the surface area of the die, and is a value expressed as a percentage.

  Conventionally, a hemispherical die provided with a large number of holes having a hole diameter of 0.6 mm or less is a thin plate blank provided with notches 2 at at least three locations at equal intervals as shown in FIG. The plate 1 is perforated by double-sided etching to produce a flat plate-like developed perforated plate, the flat plate-like developed perforated plate is formed into a hemispherical shell by press molding, and the butt joint 6 is welded as shown in FIG. It is manufactured by joining (see Patent Document 2). In welding of the butt joint 6, a gap of about 1 mm may be partially generated in the joint 6. Therefore, TIG welding that can fill the gap using a filler rod is employed.

  In addition, as a method of manufacturing a metal flat plate with a large number of holes having a diameter smaller than the plate thickness, several metal flat plates thinner than the target plate thickness are etched to make holes, and then these several metal plates are made. A method is known in which flat plates are stacked and diffusion-bonded to form a metal flat plate having a target thickness (see Patent Document 3).

Japanese Patent Publication No. 7-29038 Japanese Patent Publication No. 7-61443 Japanese Patent No. 3409153

  In the manufacturing of a hemispherical shell die, the basic process is that the “minimum hole diameter and the minimum space between holes are the same as the plate thickness”. However, considering the incidence of defective products during TIG welding, the plate thickness of the developed perforated plate must be 0.4 mm even if the hole diameter is less than 0.4 mm. That is, the hole interval had to be based on the plate thickness of 0.4 mm. Incidentally, the maximum value of the aperture ratio in a conventional hemispherical die having a plate thickness, a hole interval of 0.4 mm, and a hole diameter of 0.3 mm is 16.7%.

  In order to further increase the hole area ratio, the hole shape needs to be a polygon, for example, a regular hexagon. If the plate thickness is large, a long etching time is required. As a result, the hole shape is rounded and nearly circular. As a result, it was impossible to produce a polygonal hole.

  Therefore, an object of the present invention is to provide an inexpensive hemispherical shell die for producing granules for tableting having an average particle diameter of about 100 to 600 μm by being attached to a pre-extrusion screw type extrusion granulator.

  In order to achieve the above object, the first hemispherical die for extrusion granulation in the present invention has at least three notched portions at equal intervals, and has a protruding portion with a slight width on one side of the notched portion. A hemispherical die manufactured from a blank material provided, which is half the plate thickness of the overhang portion at the same time as the drilling of a large number of holes by double-sided etching, and the plate thickness of the portion overlapping the overhang portion during press molding Is removed from the blank material to produce a flat plate-like developed perforated plate, the developed perforated plate is formed into a hemispherical shell by press molding, and the welded portion and the overlapping portion are joined by laser welding. It is manufactured by joining.

  Here, in the hemispherical die for extrusion granulation of the present invention, the blank material has a plate thickness of less than 0.4 mm, the shape of the numerous holes is circular, and the diameter thereof is less than 0.4 mm, and the hole area ratio is It is preferable that it is 16.7% or more. Moreover, the plate | board thickness of the said blank material is less than 0.4 mm, the shape of the said many holes is a polygon, the diameter of the inscribed circle is less than 0.4 mm, and a hole area ratio is 18.3% or more. Is preferred.

  The second hemispherical die for extrusion granulation according to the present invention for achieving the above object has at least three notched portions at equal intervals, and has a protruding portion having a slight width on one side of the notched portion. A hemisphere manufactured from at least one blank material provided with a retracting portion having a slight width on the other side and at least one blank material having notched portions having no overhanging portions and no retracting portions at at least three positions at equal intervals. It is a shell die, a large number of holes are drilled by double-sided etching to produce flat plate-shaped developed porous original plates from the respective blank materials, and the developed porous plate original plates are aligned by hole bonding by diffusion bonding. Are integrated into a hemispherical shell by press molding, and the joint portion overlapping the overhanging portion is joined by laser welding.

  Here, in the hemispherical die for extrusion granulation of the present invention, the blank material has a plate thickness of 0.3 mm or less, the shape of the numerous holes is circular, and its diameter is 0.6 mm or less, and the open area ratio is It is preferable that it is 22.7% or more. Further, in the hemispherical shell die for extrusion granulation according to the present invention, the blank material has a plate thickness of 0.3 mm or less, the numerous holes are polygonal, and the diameter of the inscribed circle is 0.6 mm or less. It is preferable that the open area ratio is 25.0% or more.

  In order to achieve the above object, the third hemispherical die for extrusion granulation according to the present invention has at least two blanks of the same shape having notched portions having no overhang portions and no pull-in portions at at least three equal intervals. Is a hemispherical shell die manufactured from the above, and a plurality of holes are drilled by double-sided etching to produce a flat developed porous base plate from the above blank material, and the above-mentioned developed porous is aligned by hole bonding by diffusion bonding The plate base plate is integrated to produce a flat developed porous plate, the developed porous plate is formed into a hemispherical shell by press molding, and the butt joint is joined by TIG welding or laser welding.

  Here, in the hemispherical shell die for extrusion granulation according to the present invention, the blank material has a plate thickness of 0.3 mm or less, the spread porous plate has a plate thickness of 0.4 mm or more, and the shape of the numerous holes is circular. It is preferable that the diameter is 0.6 mm or less and the hole area ratio is 22.7%. Further, in the hemispherical shell die for extrusion granulation according to the present invention, the blank material has a plate thickness of 0.3 mm or less, the spread porous plate has a plate thickness of 0.4 mm or more, and the shape of the numerous holes is polygonal. It is preferable that the diameter of the inscribed circle is 0.6 mm or less and the hole area ratio is 25.0% or more.

  In order to achieve the above object, a first method for producing a hemispherical shell die for extrusion granulation in the present invention has at least three notches at regular intervals, and has a slight width on one side of the notch. The process of manufacturing the blank material provided with the overhanging part, the half of the plate thickness of the overhanging part simultaneously with the drilling of a large number of holes by double-sided etching, and the half of the plate thickness of the overhanging part and the overlapping part during press molding From the step of removing and manufacturing a flat plate-shaped developed porous plate, the step of forming the developed porous plate into a hemispherical shell by press molding, and the step of joining the joint between the overhanging portion and the overlapping portion by laser welding It will be.

  In order to achieve the above object, the second production method of the hemispherical shell die for extrusion granulation in the present invention has at least three notches at regular intervals, and has a slight width on one side of the notch. Produced at least one blank material with at least one blank part with a protruding part and a retracting part with a slight width on the other side, and at least one blank part having notched parts with no protruding part and a retracting part at equal intervals. A step of drilling a large number of holes by double-sided etching to manufacture a flat developed porous base plate from each of the blank materials, and aligning the hole positions by diffusion bonding to integrate the developed porous plate base plate And manufacturing a flat plate-shaped development porous plate, forming the development porous plate into a hemispherical shell by press molding, and joining a joint portion overlapping the overhanging portion by laser welding. Than is.

  In order to achieve the above object, a third method for producing a hemispherical shell die for extrusion granulation according to the present invention includes at least two identically-shaped hemispherical die having at least three notched portions with protruding portions and retracting portions. The process of manufacturing a blank material of the above, the process of making a large number of holes by double-sided etching process, the process of manufacturing a flat plate-shaped developed porous base plate from the blank material, the position of the developed porous plate base by aligning the hole position by diffusion bonding It consists of a step of integrating the plates to produce a flat developed perforated plate, a step of pressing the developed perforated plate into a hemispherical shell, and a step of joining the butt joints by TIG welding or laser welding.

  According to the first hemispherical shell die for extrusion granulation in the present invention, a gap is generated in the joint portion by providing an overlapping portion in the joint portion when the flat plate-shaped development perforated plate is formed in a hemispherical shell shape. Can be prevented. Therefore, welding work for filling the gap is not necessary, and laser welding can be employed. Furthermore, since the plate | board thickness of the blank material matched with the hole diameter can be selected, the space | interval of a hole can be made small and a hole area ratio can be increased. As a result, it is possible to reduce the hardness of the granules in extrusion granulation, and it is possible to produce granules for tableting having an average particle diameter of about 100 to 400 μm.

  According to the second hemispherical shell die for extrusion granulation in the present invention, a gap is generated in the joint portion by providing an overlapping portion in the joint portion when the flat plate-like expanded perforated plate is formed into a hemispherical shell shape. Can be prevented. Therefore, welding work for filling the gap is not necessary, and laser welding can be employed. Furthermore, since the plate | board thickness of a blank material can be selected irrespective of a hole diameter, the space | interval of a hole can be made small and a hole area ratio can be increased. As a result, it is possible to reduce the hardness of the granules in extrusion granulation, and it is possible to produce granules for tableting having an average particle diameter of about 100 to 600 μm. If you want to increase the strength of the hemispherical shell die or increase the hardness of the granules, increase the number of sheets to be laminated while keeping the plate thickness and open area ratio of the blank material constant, and increase the thickness of the expanded perforated plate. Just do it.

  According to the third hemispherical shell die for extrusion granulation in the present invention, the plate thickness of the blank material can be selected regardless of the hole diameter, so that the interval between the holes can be reduced and the open area ratio is increased. be able to. As a result, it is possible to reduce the hardness of the granules in extrusion granulation, and it is possible to produce granules for tableting having an average particle diameter of about 100 to 600 μm. If you want to increase the strength of the hemispherical shell die or increase the hardness of the granules, increase the number of sheets to be laminated while keeping the plate thickness and open area ratio of the blank material constant, and increase the thickness of the expanded perforated plate. Just do it.

  According to the first manufacturing method of the hemispherical shell die for extrusion granulation according to the present invention, when the flat plate-shaped developed perforated plate is formed into a hemispherical shell, there is a gap in the joint by providing an overlapping portion in the joint. Occurrence can be prevented. Therefore, welding work for filling the gap is not necessary, and laser welding can be employed. As a result, the incidence of defective hemispherical shell dies in the process of welding the joints can be reduced, and the manufacturing cost can be reduced.

  According to the second method for producing a hemispherical shell die for extrusion granulation in the present invention, a gap is formed in the joint portion by providing an overlapping portion in the joint portion when the flat plate-shaped developed perforated plate is formed into a hemispherical shell shape. Occurrence can be prevented. Therefore, welding work for filling the gap is not necessary, and laser welding can be employed. As a result, it is possible to reduce the incidence of defective hemispherical shell dies in the process of welding the joint. Further, since the thickness of the blank material can be selected regardless of the thickness of the developed perforated plate, a hemispherical die having a large open area which has been impossible until now can be manufactured. Furthermore, for example, if you want to increase the strength of the hemispherical shell die or increase the hardness of the granules, increase the number of sheets to be laminated while keeping the plate thickness and open area ratio of the blank material constant, and increase the plate thickness of the expanded perforated plate. What is necessary is just to increase, and it has the softness | flexibility which can match the board | plate thickness of a blank material, the board | plate thickness of an expansion | deployment perforated board, and the aperture ratio to the change of the characteristic of raw material powder.

  According to the third manufacturing method of the hemispherical shell die for extrusion granulation in the present invention, the thickness of the blank material can be selected regardless of the thickness of the expanded porous plate, which has been impossible until now. A hemispherical die having an open area can be produced. Furthermore, for example, if you want to increase the strength of the hemispherical shell die or increase the hardness of the granules, increase the number of sheets to be laminated while keeping the plate thickness and open area ratio of the blank material constant, and increase the plate thickness of the expanded perforated plate. What is necessary is just to increase, and it has the softness | flexibility which can match the board | plate thickness of a blank material, the board | plate thickness of an expansion | deployment perforated board, and the aperture ratio to the change of the characteristic of raw material powder.

It is a top view of the blank material of the hemispherical shell die in the conventional manufacturing method. It is sectional drawing of the junction part of the hemispherical shell die by the conventional manufacturing method. It is a top view of the blank material of the hemispherical shell die in the 1st manufacturing method of the present invention. It is sectional drawing of the junction part of the hemispherical shell die by the 1st manufacturing method of this invention. It is a top view of one blank material of the hemispherical shell die in the second manufacturing method of the present invention. It is another top view of the blank material of the hemispherical shell die in the second manufacturing method of the present invention, and the blank material of the hemispherical shell die in the third manufacturing method of the present invention. It is sectional drawing of the junction part of the hemispherical shell die by the 2nd manufacturing method of this invention. It is sectional drawing of the junction part of the hemispherical shell die by the 3rd manufacturing method of this invention.

  Next, embodiments for carrying out the present invention will be described with reference to the drawings.

  As shown in FIG. 3, double-side etching is performed on the blank 10 in which the overhang portions 40 are provided in the notches 2 provided at three equal intervals, and a large number of holes are formed in the perforated region 3 at the same time. A developed perforated plate provided with a portion 5 from which half of t has been removed is manufactured. Next, the developed perforated plate is press-molded to form a hemispherical shell in which the portion 5 from which half of the plate thickness t has been removed is overlapped, and the overlapping joint 6 is laser welded. Finally, finish the inner surface smoothly to complete the hemispherical die.

  If the plate thickness of the expanded perforated plate is 0.3 mm, the hole arrangement is an equilateral triangle arrangement, and the hole diameter and hole interval is 0.3 mm, for example, a hemispherical die having a hole area ratio of 22.7% can be obtained. . Further, with the progress of etching technology, the minimum interval between holes can be made smaller than the plate thickness. If the interval between holes is 0.25 mm, for example, a hemispherical shell die having an aperture ratio of 27.0%. Is obtained. The material of the hemispherical die is, for example, SUS316.

  As shown in FIG. 5, double-side etching is performed on the blank material 100 in which the overhanging portion 400 and the drawing-in portion 700 are provided in the notch portions 2 provided at three equal intervals, and a large number of holes are formed in the perforated region 3. At least one of the developed perforated plate base plate is manufactured. Further, as shown in FIG. 6, at least one developed perforated plate base plate in which a blank material 1 ′ having the same outer shape as that of the conventional blank material 1 is subjected to double-sided etching and a large number of holes are formed in the perforated region 3. To manufacture. Next, these spread porous plate base plates are diffusion-bonded with their respective hole positions accurately aligned and integrated to produce a spread porous plate. Thereafter, the developed perforated plate is press-molded to form a hemispherical shell shape in which the overhanging portion 400 and the drawing-in portion 700 abut each other, and the joint portion 6 is laser-welded as shown in FIG. Finally, finish the inner surface smoothly to complete the hemispherical die.

  Further, as shown in FIG. 6, at least two developed perforated plate base plates in which a blank material 1 ′ having the same outer shape as that of the conventional blank material 1 is subjected to double-side etching and a large number of holes are formed in the perforated region 3 are provided. Make a sheet. Next, these spread porous plate base plates are diffusion-bonded with their respective hole positions accurately aligned and integrated to produce a spread porous plate. Thereafter, the developed perforated plate is press-molded to form a hemispherical shell shape in which the joint portion 6 is abutted, and the joint portion 6 is TIG welded using a conventional technique as shown in FIG. Finally, finish the inner surface smoothly to complete the hemispherical die.

  If the plate thickness of the developed perforated plate is 0.3 mm, for example, one plate is formed, the hole arrangement is an equilateral triangle arrangement, the hole diameter is 0.6 mm, and the hole interval is 0.3 mm, for example, 40. A hemispherical shell die with an open area of 3% is obtained. Further, with the progress of etching technology, it is possible to make the minimum hole interval less than the plate thickness. If the hole interval is, for example, 0.25 mm, a hemispherical shell die having a hole area ratio of 45.2%. Is obtained. In a conventional product having a developed perforated plate thickness of 0.6 mm, the maximum aperture ratio is 22.7%. Similarly, if the plate thickness of the developed perforated plate base plate is 0.15 mm, for example, each is configured as one piece, the hole arrangement is an equilateral triangle arrangement, the hole diameter is 0.2 mm, and the hole interval is 0.15 mm, A hemispherical shell die with an opening rate of 29.6% is obtained. The material of the hemispherical die is, for example, SUS316.

  Further, the thickness of the developed perforated plate base plate is set to be, for example, 0.15 mm, each is configured as a single plate, the hole arrangement is a regular triangle arrangement, and the hole shape is a regular hexagon having an inscribed circle diameter of, for example, 0.25 mm. If the hole interval is 0.15 mm, for example, a hemispherical die having a hole area ratio of 30.9% can be obtained. Further, if the plate thickness is reduced, the etching time can be shortened, so that the corner R of the hexagon can be made smaller, and it can be approximated to an accurate regular hexagon.

1, 1 ′, 10, 100 Hemispherical die blank 2 Notch 3 Drilling area 6 Joint 40, 400 Overhang 50 A portion 700 where half the plate thickness is removed by etching 700 Pull-in 800 Diffusion joint t Blank Thickness of material

Claims (4)

  A hemispherical shell die manufactured from at least two blanks of the same shape having notches with no overhangs and no lead-in portions at at least three locations at equal intervals, and a number of holes are drilled by double-sided etching. To produce a flat plate-shaped developed perforated plate base plate from the blank material, align the hole position by diffusion bonding, produce the flat plate-shaped developed perforated plate as a unit, and develop the above-mentioned by press molding A hemispherical shell die for extrusion granulation, characterized in that the perforated plate has a hemispherical shell shape and is manufactured by joining butt joints by TIG welding or laser welding.   The blank material has a plate thickness of 0.3 mm or less, the unfolded porous plate has a plate thickness of 0.4 mm or more, the numerous holes have a circular shape and a diameter of 0.6 mm or less, and a hole area ratio is 22. The hemispherical shell die for extrusion granulation according to claim 1, wherein the die is 7% or more.   The blank material has a plate thickness of 0.3 mm or less, the spread porous plate has a plate thickness of 0.4 mm or more, the numerous holes are polygonal, and the diameter of the inscribed circle is 0.6 mm or less. The hemispherical shell die for extrusion granulation according to claim 1, wherein the porosity is 25.0% or more.   A process for producing at least two blanks of the same shape having notches with no overhanging portions and no lead-in portions at at least three locations at equal intervals, and by drilling a large number of holes by double-sided etching, A step of producing a flat plate-shaped developed porous base plate, a step of aligning the holes by diffusion bonding and integrating the above-described developed porous base plate to produce a flat plate-shaped developed porous plate, and a step of forming the developed porous plate into a hemispherical shell A process for producing a hemispherical shell die for extrusion granulation, comprising a step of welding a butt joint by TIG welding or laser welding.

Images